JP3260452B2 - Mounting device for solid-state imaging device in image reading device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image reading apparatus for reading an optical image using a solid-state image pickup device, in which the solid-state image pickup device can be mounted so as to be adjustable. It is used as a reading unit.

[0002]

2. Description of the Related Art Generally, an image reading apparatus is provided with an optical system for reading an optical image using a solid-state image sensor. In this case, in order to accurately read the optical image, the solid-state image sensor is located at a position where the optical image is formed. Need to be positioned accurately. As an apparatus for reading an optical image using a solid-state imaging device, FIG.
As shown in (1), while illuminating the image on the original 1 for each scanning line, the image is read by forming an image on the solid-state imaging device 3 by the imaging lens 2.

[0003] The solid-state image sensor includes a single line in which a plurality of minute photoelectric conversion elements (hereinafter, referred to as pixels) are arranged in a line, and a red, blue, and green spectral element for reading a color image. Pixels having peaks in sensitivity and three lines arranged in three rows for red, blue, and green are used.

In such an image reading apparatus, the optical characteristics of a line image formed by the image forming lens 2 are read with a predetermined accuracy. Therefore, in a one-line solid-state imaging device, X and Y shown in FIG. , Z, β, and γ, it is necessary to perform fine adjustment in the direction of the five axes to perform positioning. In a solid-state imaging device having three lines of pixels, in addition to the above-described adjustment in the five-axis direction, α
Axial adjustment is also required, and positioning must be performed by adjusting a total of six axial directions.

Various devices have been proposed as means for adjusting the position of the solid-state imaging device in an image reading device. However, these devices require a configuration in which a plurality of members and a complicated adjusting mechanism are combined, and furthermore, such devices are required. Not only is the adjustment of the adjustment mechanism cumbersome, but also reading the image requires a large number of parts for the adjustment mechanism that is not necessary for its original function, which increases the cost and increases the cost of this type of equipment. Is one of the causes.

[0006]

SUMMARY OF THE INVENTION In view of the above, the present invention relates to a method of setting the position of a solid-state image sensor in an image reading apparatus to X,
When adjusting in six directions of Y, Z, β, γ, α,
It is an object of the present invention to provide a means which mainly uses one position adjustment board, and which can be realized with extremely simple components and a simple structure and with a small number of components.

[0007]

According to the present invention, in order to achieve the above object, the present invention provides a method in which a mounting base capable of positioning and supporting an imaging lens and a holding substrate on which a solid-state imaging device is mounted are provided. A position adjusting board having a horizontal engagement surface and a vertical surface bent by the bent portion is disposed, and the bent portion is provided with a cutout for separating the horizontal engagement surface and the vertical surface, and a connection portion of the bent portion is provided. The rotation direction α about the horizontal axis by adjusting the angle at
The horizontal engagement surface can be adjusted in the rotation direction β about the optical axis by a broken line portion in a direction parallel to the optical axis, and the vertical surface is parallel to the vertical axis. The turning direction γ about the vertical axis can be adjusted by the polygonal line portion in a different direction.

According to the present invention, in the above structure, the position adjusting board can be adjusted in the horizontal axis direction X by displacement of the position adjusting board in the left-right direction with respect to the mounting base. The vertical axis Z can be adjusted by the displacement.

[0009]

According to the structure of the present invention, the position adjustment to which the solid-state image pickup device holding substrate is attached is such that the angle at the connection portion of the position adjustment substrate, the horizontal engagement surface and the vertical surface are each displaced in advance. When mounting the substrate on the mounting substrate, adjust the displaceable surface of the horizontal engagement surface to adjust in the β direction, and adjust the reference position on the vertical surface, that is, adjust the angle in the α direction by adjusting the angle of the connection portion. Is performed, and further, the vertical displacement surface can be adjusted to perform adjustment in the γ direction.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view for easy understanding of the solid-state image pickup device mounting device in the image reading apparatus of the present invention, and FIG. 2 shows a state where the solid-state image pickup device mounting device of the present invention is assembled. FIG.

According to the present invention, as shown in FIG. 1, an image forming lens 2 can be positioned and mounted in front, and a position adjusting plate can be mounted in the rear as a positioning means for the solid-state image pickup device 3. A position adjustment board 5 having a base 4, a horizontal engagement face plate 5a attached to a horizontal attachment portion 4a of the attachment base 4, and a vertical face plate 5b for attaching a holding board 6 to which the solid-state imaging device 3 is attached; 5 vertical face plates 5
b.

First, the mounting base 4 has an opening 7 formed at the center position for forming an optical path from the imaging lens 2 to the solid-state imaging device 3. A lens holding hole 8 to which the lens 2 can be attached is formed. The imaging lens 2 can be adjusted in the Y-axis direction in the lens holding hole 8, and the position of the imaging lens 2 in the Y-axis direction is adjusted. The tip of a screw 10 inserted into a tap hole 9 provided in front of the horizontal mounting portion 4a of the mounting base 4 engages with the lens barrel of the imaging lens 2 and is fixed to the mounting base 4.

Next, the configuration of the position adjustment board 5 will be described. The position adjustment substrate 5 is formed of a steel plate having elasticity. The shape of the position adjustment board 5 is the horizontal engagement face plate 5a.
And the vertical face plate 5b at the bent portion 5c. The bent portion 5c is horizontally displaceable surface 5 from the horizontal reference plane 5a ₁ end of the horizontal engaging surface plate 5a to be described later
to position A in the vicinity of the end portion of a _2, notches 20 and the separating portion 5c ₂ provided with, made from a connected connecting portion 5c ₁ Metropolitan horizontal displaceable surface 5a ₂ end side to the A position.

On the horizontal mounting portion 4a of the mounting base 4, a horizontal engaging face plate 5a of the position adjusting board 5 is mounted. Therefore, the one end portion of each side of the horizontal mounting portion 4a, the supporting surface 4a ₁ is provided for supporting the horizontal reference plane 5a ₁ of the horizontal engaging surface plate 5a of the positioning substrate 5, the support surface 4a the tap hole 11 provided in the _1, via a long hole 12 formed on the horizontal reference surface 5a ₁ of the horizontal engaging surface plate 5a, the screw 13 is inserted and fixed, the horizontal reference surface 5a by the screw 13
₁ is attached to a support surface 4a ₁ of the horizontal mounting portion 4a. The surface of the support surface 4a ₁ is from the surface of the other horizontal attachment portion 4a, somewhat higher construction height, thereby enabling the displacement of the horizontal displaceable surface 5a ₂ of the horizontal engaging surface plate 5a.

Normally, the entire surface of the horizontal engaging face plate 5a serves as a horizontal reference plane in relation to the mounting base 4, but in the present invention, the horizontal engaging face plate 5a is used as a part of FIG.
To allow solid adjustment of the imaging device 3 in the β direction shown in, the end position is separated from the vertical faceplate 5b, provided a horizontal reference plane 5a _1, the end of the horizontal reference plane 5a ₁ A bent line 21 which is a thin line portion is formed at a position B which is a position, and a horizontally displaceable surface 5a ₂ is formed through the broken line 21.
Is connected. Applying pressure to the free end side of the horizontal displaceable surface 5a _2, a line 21 of the B position as a starting point,
Horizontal displaceable surface 5a ₂ can change the angle to the horizontal reference plane 5a _1.

[0016] In embodiments, when attaching the alignment substrate 5 to the mounting base 4, starting from the fold line 21 of the B position of the horizontal reference plane 5a _1, the horizontal displaceable surface 5a ₂ an angle β
₁ is set bent 0.5-1 degrees in a direction away from the horizontal mounting portion 4a of the mounting base 4 (upper side in Figure 3 (b)).

For this reason, at the other end of both sides of the horizontal mounting portion 4a, the horizontal engagement face plate 5 of the position adjustment substrate 5 is provided.
At the end of the horizontal displaceable surface 5a ₂ of a, horizontally elongated holes 15
Are formed. A tap hole 14 is formed at the position of the horizontal mounting portion 4a corresponding to the elongated hole 15, and a screw 16 is screwed into the tap hole 14 through the elongated hole 15, and as a result, the horizontal engagement face plate 5a Horizontal displacement surface 5a
₂ can be displaced in the β direction about the polygonal line 21 in the β direction, and can be adjusted in the β direction.

The vertical plate 5b is connected to the horizontal engagement plate 5a by a bent portion 5c having a substantially right angle.
The vertical face plate 5b is adjusted in the γ direction. Therefore, it said vertical face plate 5b is, gamma direction through a line 22 consists configured whereby a vertical reference plane 5b ₁ and the vertical displaceable surface 5b _2, a vertical surface plate 5b of the mounting base 4 vertical mounting portion 4b In order to position the mounting base 4, a horizontally long slot 17 is provided in the vertical reference surface 5 b ₁ , and the adjusting screw 18 is inserted into the tap hole 19 formed in the vertical mounting portion 4 b of the mounting base 4 via the long hole 17. Screwed. The adjusting screw 18 is for adjusting the α direction as described below.

Then, the adjustment in the α direction is performed at the position of the bent portion 5c. The angle of the bent portion 5c is
Determined by the _first bend angle, this angle alpha ₁ is set to the normal 90 degrees, for the present invention, which is used for adjustment to alpha direction of the solid-state imaging device 3 in FIG. 4, the position adjusting substrate 5 When attaching to the mounting base 4, this angle α ₁
As shown in FIG.
The angle is set at a slightly large angle of about 5 to 1 degree. As adjusting means for the α direction of the solid-state imaging device 3, as described above, the vertical mounting portion of the mounting base 4 via the long hole 17 of the adjusting screw 18 is formed on the end position of the vertical reference plane 5b ₁ 4b
The screw hole is screwed into the tap hole 19 formed in the above.

Next, in the configuration of the vertical face plate 5b, FIG.
To enable γ direction of adjustment of the solid-state imaging device 3 shown in, on the side connected via the connecting portion 5c ₁ and horizontal displaceable surface 5a _2, a vertical reference plane 5b ₁ are provided, the connecting portion the intersection a between 5c ₁ and the separating portion 5c _2, broken line 22 is formed a thin-walled line portion, via the fold line 22 is vertical displaceable surface 5b ₂ are connected. Therefore, when a force to the free end side of the vertical displaceable surface 5b _2, starting from the fold line 22 of the A position, the vertical displaceable surface 5b ₂ can change the angle to the vertical reference plane 5b _1.

[0021] In embodiments, when attaching the alignment substrate 5 to the mounting base 4, starting from the fold line 22 of the A position of the vertical reference surface 5b _1, the vertical displaceable surface 5b ₂ angle γ
₁ is a direction approaching the vertical mounting portion 4b of the mounting base 4 (FIG. 3).
It is set to be bent one or two times to the lower side in (c).

[0022] As means for adjusting the γ direction of the solid-state imaging device 3, the free end position of the vertical displaceable surface 5b _2, tap holes 23 for the γ direction of adjustment are formed, engaging into the tapped hole 23 by operating the screw 24 for engagement, the vertical displaceable surface 5b ₂ can be displaced in the γ direction a line 22 as a starting point. By adjusting the position of the position adjustment board 5, the adjustment in the X-axis direction in FIG. 4 can be performed. Therefore, the shapes of the mounting long holes 12, 15, and 17 with respect to the mounting base 4 are respectively adjusted in the X-axis direction. It has an elongated shape.

A notch hole 25 for forming an optical path from the imaging lens 2 is provided substantially at the center of the vertical face plate 5b of the position adjustment substrate 5, and the solid-state imaging device 3 is arranged at the position of the notch hole 25. The holding substrate 6 to which the solid-state imaging device 3 is attached is attached to the vertical face plate 5b by attaching screws 27 through elongated holes 26 formed at four corners of the holding substrate 6. For this reason, a tap hole 28 is provided at a position around the notch hole 25 facing the vertical face plate 5 b, and the mounting screw 2 is provided between the tap hole 28 and the holding substrate 6 via a spacer 29.
7 is screwed. In this case, the elongated hole 26 formed in the holding substrate 6 is a hole extending in the Z-axis direction, and when the holding substrate 6 is mounted on the vertical face plate 5b of the position adjustment substrate 5, While adjusting the position,
b.

In the present invention having the above structure, X
The adjustment in each direction of the axis, the Y axis, and the Z axis is performed by loosening the imaging lens 2 into the lens holding hole 8 of the mounting base 4, and then adjusting the position of the position adjustment substrate 5 with respect to the mounting base 4. The adjustment in the X-axis direction is performed by adjusting the horizontal slots 12 and 15 formed in the adjustment substrate 5, and the position of the holding substrate 6 is held with respect to the vertical face plate 5 b of the position adjustment substrate 5. By adjusting the vertical holes 20 formed in the substrate 6,
The adjustment in the Z-axis direction is performed, and the adjustment in the Y-axis direction can be performed by moving the position of the imaging lens 2 with respect to the lens holding hole 8.

The adjustment in each of the X-axis, Y-axis, and Z-axis directions includes adjusting the center position of the light receiving surface of the solid-state imaging device 3 attached to the center of the holding substrate 6 (0,0, which is the origin in FIG. 4). , 0) can be relatively easily performed using an appropriate chart and an oscilloscope capable of monitoring the detection output from the solid-state imaging device 3 so that the three axes intersect. it can.

[0026] Then, the inclination relative to the axes of the light-receiving surface portion of a solid state image pickup device 3 alpha, beta, for gamma, vertical faceplate 5b which is larger than the predetermined 90 degrees, provided at the free end of the vertical reference plane 5b ₁ Screw 1 for α-direction adjustment through the elongated hole 17
By screwing the 8 to the tap hole 19 can be rotated adjusting around the connecting portion 5c ₁ of the bent portion 5c to an angle to be perpendicular to the optical axis.

Further, starting from the fold line 21 of the B position of the horizontal reference plane 5a _1, horizontal displaceable surface 5a ₂ are rotated on the upper side, beta through the long hole 15 formed in the free end portion By screwing the direction adjusting screw 16 into the tap hole 14, it is rotated counterclockwise about the broken line 21 and adjusted and fixed so that the arrangement of the light receiving surface portion of the solid-state imaging device 3 matches the direction of the scanning light. , Β direction can be adjusted.

The adjustment of the γ direction, starting from the fold line 22 to the vertical reference plane 5b ₁ of the vertical faceplate 5b, vertical displaceable surface 5
Since the free end of the b ₂ it is is previously formed so as to approach the vertical mounting portion 4b side of the mounting base 4, a vertical displaceable surface 5
By screwing the γ-direction adjusting screw 24 into the tap hole 23 formed on the free end side of the b ₂ , the vertically displaceable surface 5 b ₂ is rotated about the broken line 22, and the vertically displaceable surface 5
b ₂ is adjusted to be perpendicular to the optical axis. As a result, the adjustment in the γ direction is completed.

[0029]

According to the structure of the present invention, in the relation among the three of the mounting base, the position adjustment board, and the solid-state imaging device holding board,
By forming the position adjustment substrate in a special shape, there is an effect that adjustment in the α, β, and γ directions can be easily performed in a single position adjustment substrate.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing a state where the embodiment of FIG. 1 is assembled.

FIG. 3 is a view showing a position adjustment board according to the present invention, in which α ₁ (a) and β ₁ (b) are preset before being mounted on a mounting base to enable adjustment in α, β, and γ directions. , Γ ₁ (c).

FIG. 4 is a schematic perspective view illustrating a relationship between a solid-state imaging device having pixel lines, an image of a document, and an adjustment direction.

[Explanation of symbols]

2 imaging lens 3 solid-state imaging device 4 mounting base 5 position adjustment board 5a horizontal engagement surface plate 5a ₁ horizontal reference surface 5a ₂ horizontally displaceable surface 5b vertical surface plate 5b ₁ vertical reference surface 5b ₂ vertically displaceable surface 5c bent portion 5c ₁ Connection part 5c ₂ Separation part 6 Solid-state image sensor holding substrate 20 Cut 21 Bent line in β direction 22 Bent line in γ direction

Claims (2)

(57) [Claims] 1. A position having a horizontal engaging surface and a vertical surface bent by a bent portion between a mounting base capable of positioning and supporting an imaging lens and a holding substrate on which a solid-state imaging device is mounted. An adjustment board is arranged, and the bent portion is provided with a cut portion for separating a horizontal engagement surface and a vertical surface, and by adjusting an angle at a connection portion of the bent portion, a rotation direction α about a horizontal axis is provided. Can be adjusted, and the horizontal engagement surface has a turning direction β around the optical axis by a broken line portion in a direction parallel to the optical axis.
Solid state image pickup device in an image reading apparatus, wherein the vertical plane has a polygonal line portion in a direction parallel to the vertical axis, and the rotation direction γ about the vertical axis can be adjusted. Mounting device. 2. A horizontal axis direction X can be adjusted by a horizontal displacement of the position adjustment substrate with respect to the mounting base, and a vertical axis direction Z can be adjusted by a vertical displacement of the solid-state imaging device holding substrate with respect to the position adjustment substrate. 2. A mounting device for a solid-state imaging device in an image reading device according to claim 1, wherein adjustment is possible.