JP3258495B2 - High frequency semiconductor mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for mounting a high-frequency semiconductor device using a package on which a high-frequency semiconductor device is mounted.

[0002]

2. Description of the Related Art FIGS. 4 (a) to 4 (c) show high frequency coaxial terminals capable of directly fitting and connecting coaxial pins, which are components of a high frequency coaxial connector, on one outer wall surface of four package frames. It is a perspective view which shows the conventional structural example at the time of configuring a high frequency semiconductor mounting apparatus using the high frequency semiconductor element mounting package arrange | positioned one by one. FIG. 4 (b)
FIG. 4C is a perspective view illustrating a configuration of a high-frequency semiconductor mounting device showing a connection relationship between a metal housing for mounting the high-frequency semiconductor element mounted package illustrated in FIG. 4A and a high-frequency coaxial connector plug and the like, and FIG. FIG. 3 is a schematic diagram showing a cross-sectional structure at the center of a high-frequency semiconductor mounting device. In this conventional high-frequency semiconductor mounting device, a gap is provided between the wall surfaces by cutting out each of the four tops where the housing wall surface of the metal housing 18 intersects. Further, on the wall surface of the metal housing 18, a high frequency coaxial connector plug mounting screw hole 1 of the high frequency coaxial connector plug 14 is provided at a position facing the high frequency coaxial terminal 3 of the package.
2 and a high-frequency coaxial terminal center conductor 4 is provided on the inner wall of the metal housing 18 so that the high-frequency coaxial terminal center conductor 4 does not hit the side wall of the housing when the high-frequency semiconductor element-mounted package 6 is mounted on the metal housing 18. Coaxial terminal center conductor passage groove 11
Is formed. In the assembling procedure of this mounting apparatus, first, the package 6 on which the high-frequency semiconductor element is mounted is arranged on the bottom of the metal housing 18. Then, high frequency coaxial connector plug 1
A coaxial pin 13 having a mechanism for connecting to the high-frequency coaxial terminal center conductor 4 projecting from the center of the four high-frequency coaxial connector plug mounting screw holes 12 to which the center conductor 4 is attached by spring pressure is fitted. Finally, the high-frequency coaxial connector plug 14 is screwed into the high-frequency coaxial connector plug mounting screw hole 12, and fixed to the outer wall of the package 6 on which the high-frequency semiconductor element is mounted so that the high-frequency coaxial connector plug 14 comes into close contact with the package. As described above, in the conventional high-frequency semiconductor mounting device, the input / output terminals of the high-frequency signal are
Since the coaxial connector is directly connected to a package having a coaxial terminal shape into which the coaxial pin 13 that is a component of the high-frequency coaxial connector can be directly fitted, the number of connection points is reduced and the transmission path length is reduced. Be shortened. As a result, the high-frequency performance of the high-frequency semiconductor mounting device is greatly improved, and the mounting device can be downsized.
Further, in assembling the mounting apparatus, the package 6 on which the high-frequency semiconductor element has been mounted is fixed only by tightening the high-frequency coaxial connector plug 14 via the metal housing 18, so that the assembly is extremely easy and the removal is easy. It is simple and the metal housing 18 can be reused repeatedly. Further, the coaxial pin 13 is a fitting connection by spring pressure, and the axial stress on the high-frequency coaxial terminal center conductor 4 is relieved.
There is no need to select a material that is very close to the thermal expansion coefficient of the package, and a metal material that is inexpensive and has excellent workability can be used.

[0003]

As described above, a package for mounting a high-frequency semiconductor element provided with a high-frequency coaxial terminal capable of directly fitting and connecting coaxial pins, which are components of a high-frequency coaxial connector, is provided. The conventional high-frequency semiconductor mounting device configured using the above-described device has many advantages in terms of improvement of high-frequency performance, downsizing of the device, ease of mounting, and the like. However, the conventional high-frequency semiconductor mounting apparatus using the high-frequency semiconductor element mounting package in which the high-frequency coaxial terminals are arranged in four directions has the following disadvantages. That is, in the high-frequency semiconductor mounting device shown in the conventional example, all four housing side walls of the metal housing for supporting and fixing the high-frequency coaxial connector plug are integrally formed. Since each of the metal housings has a processing dimension tolerance, the center axis of the high-frequency coaxial connector plug mounting screw hole formed on each of the four housing side walls and the high-frequency coaxial The center axis of the terminal does not always match. Therefore, when the package on which the high-frequency semiconductor element is mounted is arranged on the bottom of the metal housing and the high-frequency coaxial connector plug is screwed into each of the four-direction high-frequency coaxial connector plug mounting screw holes, the high-frequency coaxial connector plug mounting screw holes are removed. A problem arises in that a shear stress is applied to the high-frequency coaxial terminal center conductor that does not coincide with the center axis, and the high-frequency coaxial terminal is damaged.

An object of the present invention is to solve the above-mentioned problems in the conventional high-frequency semiconductor mounting device. It is an object of the present invention to directly fit and connect coaxial pins which are components of a high-frequency coaxial connector. Wherein the high-frequency coaxial terminal is configured using a high-frequency semiconductor element mounting package disposed on the outer wall surface of the package frame in two or three or four orthogonal directions. Even if there is a processing dimension tolerance in each of the element mounting package and the metal housing, the central axis of the high frequency coaxial connector plug mounting screw hole formed on the housing side wall and the high frequency semiconductor element mounting package are disposed. The center axis of the high-frequency coaxial terminal, and apply shear stress to the center conductor of the high-frequency coaxial terminal due to misalignment. As not to provide a high-frequency semiconductor mounting device which can ensure a reliable connection.

[0005]

In order to achieve the object of the present invention, the present invention provides a plurality of high-frequency coaxial terminals capable of directly fitting and connecting coaxial pins which are components of a high-frequency coaxial connector. A high-frequency semiconductor element mounting package disposed on an outer wall surface of the package frame, such that a central axis of one or more coaxial terminals is orthogonal to a central axis of another coaxial terminal. In a high-frequency semiconductor mounting device comprising a package and a metal housing for supporting and fixing the high-frequency coaxial connector plug, the metal housing is formed of an upper housing block and a lower housing block having a U-shaped vertical cross-sectional shape. A high-frequency coaxial connector plug, which is an external input / output terminal of a high-frequency signal, is provided on the side wall of both housing blocks at a position facing the high-frequency coaxial terminal of the package. The mounting screw holes are provided so that the two housing blocks sandwich the package in a space formed by assembling the housing blocks vertically so as to be orthogonal to each other and to face the U-shaped recess. And a coaxial pin, which is a component of the high-frequency coaxial connector, is directly fitted and connected to the high-frequency coaxial terminal of the package, and further, the high-frequency coaxial connector plug is connected to the upper housing block and the lower housing block. A high-frequency semiconductor mounting device having a structure in which the connector plug is in close contact with the package without supporting and fixing the connector plug on each side wall.

[0006]

The specific structure of the high-frequency semiconductor mounting device according to the present invention has a plurality of high-frequency coaxial terminals, the center axis of which is orthogonal to the center axis of another coaxial terminal. A high-frequency semiconductor element mounting apparatus, comprising: a package for mounting a high-frequency semiconductor element disposed on an outer wall surface of a package frame; and a metal housing for supporting and fixing the package and the high-frequency coaxial connector plug,
The metal housing comprises an upper housing block having a U-shaped vertical cross-sectional shape, and a lower housing block having a U-shaped vertical cross-sectional shape fitted into the U-shaped concave portion of the upper housing block. A mounting portion for the high-frequency coaxial connector plug is provided on the side wall of the both housing blocks at a position facing the high-frequency coaxial terminal of the package, and the two housing blocks are orthogonal to each other and have a U-shaped concave portion. The package is opposed to each other, and is disposed so as to sandwich the package in the space defined by the U-shaped concave portions of the two housing blocks. The coaxial pins are directly fitted to the high-frequency coaxial terminals of the package. The high frequency coaxial connector plug is connected and further supported and fixed by the side walls of the two housing blocks, so that the connector plug is in close contact with the package. With such a structure, even if there is a processing dimensional tolerance in each of the high-frequency semiconductor element mounting package and the metal housing, the center axis of the high-frequency coaxial connector plug mounting screw hole formed on the housing side wall,
The center axis of the high-frequency coaxial terminal provided on the high-frequency semiconductor element mounting package can be aligned with the center axis, and shear stress is generated at the fitting connection between the high-frequency coaxial terminal center conductor and the coaxial pin due to axial misalignment. Therefore, damage to the high-frequency coaxial terminal can be prevented, and a highly reliable high-frequency semiconductor mounting device can be realized. According to a second aspect of the present invention, there is provided a high-frequency semiconductor mounting apparatus according to the second aspect, wherein coaxial terminals are disposed on all four side walls of the package, and external electrode leads for direct current supply are disposed diagonally. A highly reliable high-frequency semiconductor mounting device capable of mounting a semiconductor element mounting package and preventing damage to the high-frequency coaxial terminal can be obtained.
In addition, a package in which high-frequency coaxial terminals and external electrode leads for direct current supply are alternately arranged on eight side surfaces of the package as described in claim 3, or a package as described in claim 4, A high-frequency coaxial terminal is provided on all of the two side walls, and a package in which the DC supply terminal is arranged on the lower surface of the package can be mounted. A mounting device is obtained.

[0007]

Embodiments of the present invention will be described below in more detail with reference to the drawings. <Embodiment 1> FIGS. 1A to 1D are schematic views showing an assembling structure of a high-frequency semiconductor mounting device exemplified in this embodiment. FIG. 1A shows a structure of an upper housing block. FIG. 1B is a perspective view showing a configuration of a package on which a high-frequency semiconductor element is mounted, FIG. 1C is a perspective view showing a configuration of a lower housing block, and FIG. FIG.
It is a schematic diagram which shows the center longitudinal cross-sectional structure of the high frequency semiconductor mounting apparatus comprised by the assembly of (a), (b), (c). In this embodiment, coaxial terminals are provided on all four side walls of the package on which the high-frequency semiconductor element is mounted,
In addition, a case is shown in which a package in which external electrode leads for direct current supply are arranged diagonally is mounted. In the high-frequency semiconductor mounting device of the present embodiment, the respective side walls of the lower housing block 9 having a U-shaped cross section with the concave portion facing upward and the upper housing block 10 having the U-shaped cross section with the concave portion facing downward. At a position facing the high-frequency coaxial terminal 3 of the package,
When the high frequency coaxial connector plug mounting screw hole 12 is provided and the high frequency semiconductor element mounted package 6 is mounted between the lower housing block 9 and the upper housing block 10, the high frequency coaxial terminal center conductor 4 A high-frequency coaxial terminal center conductor passage groove 11 is formed on the inner wall surface of the lower housing block 9 and the upper housing block 10 so as not to hit the side wall. Further, when the lower housing block 9 and the upper housing block 10 are combined, a gap is formed for drawing out the DC supply external electrode leads 5 arranged diagonally to the package 6 on which the high-frequency semiconductor element is mounted. ,
The corners of the inner walls of each housing block are chamfered. The assembling procedure of the mounting apparatus is as follows. First, the high-frequency semiconductor element-mounted package 6 is arranged at the bottom of the lower housing block 9 and projects into the high-frequency coaxial connector plug mounting screw hole 12 in FIG.
The coaxial pin 13 is fitted to the X direction coaxial terminal center conductor 4 shown in FIG. Next, the high-frequency coaxial connector plug 14 is screwed into the high-frequency coaxial connector plug mounting screw hole 12 and fixed to the outer wall of the package 6 on which the high-frequency semiconductor element is mounted so that the high-frequency coaxial connector plug 14 comes into close contact with the outer wall. Subsequently, the upper housing block 10 is arranged so as to be orthogonal to the lower housing block 9 and the U-shaped concave portion is directed downward, and protrudes into the high-frequency coaxial connector plug mounting screw hole 12 in FIG. (A) The coaxial pin 13 is fitted to the Y direction high frequency coaxial terminal center conductor 4.
Finally, the high-frequency coaxial connector plug 14 is screwed into the high-frequency coaxial connector plug mounting screw hole 12 and fixed so that the high-frequency coaxial connector plug 14 comes into close contact with the outer wall of the package 6 on which the high-frequency semiconductor element is mounted. As described above, in the high-frequency semiconductor mounting apparatus illustrated in the present embodiment, the X direction and the Y direction of the package 6 on which the high-frequency semiconductor element is mounted are separately supported by the lower housing block 9 and the upper housing block 10, respectively. Since it is fixed, even if there is a deviation in processing dimensions between the package and the housing block, the center axis of the high-frequency connector plug mounting screw hole 12 formed on each housing block side wall and the package are arranged. The center axis of the high-frequency coaxial terminal 3 can be easily matched with the center axis. Therefore, the fitting connection between the high-frequency coaxial terminal center conductor 4 and the coaxial pin 13 which is a problem in the conventional high-frequency semiconductor mounting device in which all four side walls of the metal housing are integrally formed, is a problem. Part 1
5, the occurrence of shear stress is suppressed, so that damage to the high-frequency coaxial terminal 3 can be prevented, and a highly reliable connection can be secured. In the structure of this embodiment, advantages such as improvement of high-frequency characteristics, downsizing of the device, ease of assembly, and cost reduction described in the conventional example are not impaired.
In this embodiment, the case where the package in which the high-frequency coaxial terminals 3 are disposed on all four side walls of the package and the external electrode leads 5 for direct current supply are disposed diagonally are mounted is illustrated. Even when a package in which two high-frequency coaxial terminals 3 are arranged orthogonal to each other or a package in which three high-frequency coaxial terminals 3 are arranged in three directions is mounted, the lower housing block 9 and the upper housing It is not necessary to change the configuration of the mounting device that combines the block 10 at all, and the formation of the high-frequency coaxial connector plug mounting screw hole 12 on the side wall of the housing block facing the surface on which the high-frequency coaxial terminal 3 is not provided is omitted. Is fine.

<Embodiment 2> FIGS. 2A to 2C are perspective views showing an assembling structure of a high-frequency semiconductor mounting device exemplified in this embodiment. FIG. 2A is an upper housing block. FIG. 2B is a perspective view showing a configuration of a package on which a high-frequency semiconductor element is mounted, and FIG. 2C is a perspective view showing a configuration of a lower housing block. In the example, a case is shown in which a package in which high-frequency coaxial terminals and DC supply external electrode leads are alternately arranged on eight package outer surfaces is mounted. The metal housing of the high-frequency semiconductor mounting device of the present embodiment is composed of a lower housing block 9 and an upper housing block 10 having a U-shaped cross section as in the first embodiment. Is the same octagon as the planar shape of the package. by this,
When the U-shaped concave portion of the lower housing block 9 and the U-shaped concave portion of the upper housing block 10 are combined, a gap for drawing out the DC supply external electrode lead 5 is formed.
This eliminates the need for chamfering the inner wall angle of each housing block required in the first embodiment. The procedure for assembling the high-frequency semiconductor mounting device in the present embodiment is the same as that in the first embodiment, and a description thereof will be omitted. In this embodiment, as in the case of the first embodiment, a high-frequency semiconductor mounting device having a highly reliable connection was obtained.

<Embodiment 3> FIGS. 3A to 3D are schematic views showing an assembling structure of a high-frequency semiconductor mounting device exemplified in this embodiment. That is, FIG. 3A is a perspective view showing a configuration of an upper housing block, FIG. 3B is a perspective view showing a configuration of a package on which a high-frequency semiconductor element is mounted, and FIG.
FIG. 3C is a perspective view showing a configuration of a lower housing block, and FIG. 3D is a view showing a plurality of signal line portions of the mounting device configured by FIGS. 3A to 3C. It is a schematic diagram which shows the longitudinal cross-sectional structure of one and one of several DC supply terminals, In this example, the high frequency coaxial terminal is arrange | positioned at all the four side walls of a package, This shows a case where a package having terminals arranged on the lower surface of the package is mounted. The metal housing of the high-frequency semiconductor mounting device according to the present embodiment includes a lower housing block 9 having a U-shaped cross section and an upper housing block 10 as in the first embodiment. A through hole 17 is provided at the bottom of the package so that the DC supply terminal 16 disposed on the lower surface of the package can be drawn out of the high-frequency semiconductor mounting device. As described above, since the DC supply terminal 16 is drawn downward in the high-frequency semiconductor mounting device, it is not necessary to chamfer the corners of the inner wall of each housing block. The procedure for assembling the high-frequency semiconductor mounting device was performed in the same manner as in the first embodiment, and a description thereof will not be repeated. In this embodiment, as in the case of the first embodiment, a high-frequency semiconductor mounting device having a highly reliable connection was obtained.

[0010]

As described in detail above, the present invention is configured such that a package having a high-frequency coaxial terminal which can be directly connected to a high-frequency coaxial connector is sandwiched between two vertically divided metal casings. The high-frequency semiconductor device mounting device prevents the high-frequency coaxial terminal from being damaged due to the concentration of shear stress on the high-frequency coaxial terminal of the package, which was a drawback of the conventional device using an integrated metal housing. Thus, a high-frequency semiconductor mounting device having highly reliable connection can be realized.

[Brief description of the drawings]

FIG. 1 is a schematic diagram illustrating a configuration of a high-frequency semiconductor mounting device exemplified in a first embodiment of the present invention.

FIG. 2 is a schematic view illustrating a configuration of a high-frequency semiconductor mounting device exemplified in a second embodiment of the present invention.

FIG. 3 is a schematic diagram illustrating a configuration of a high-frequency semiconductor mounting device exemplified in a third embodiment of the present invention.

FIG. 4 is a schematic view showing an example of a conventional high-frequency semiconductor mounting device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Package frame 2 ... Seal cap 3 ... High frequency coaxial terminal 4 ... High frequency coaxial terminal center conductor 5 ... DC supply external electrode lead 6 ... Package with high frequency semiconductor element mounted 7 ... High frequency semiconductor element 8 ... Connection means such as gold wire 9 ... Lower housing block 10 ... Upper housing block 11 ... High frequency coaxial terminal center conductor passage groove 12 ... High frequency coaxial connector plug mounting screw hole 13 ... Coaxial pin 14 ... High frequency coaxial connector plug 15 ... Fitting connection part 16 ... DC supply terminal 17 ... through hole 18 ... metal housing

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01P 5/08

Claims (4)

(57) [Claims] 1. A high-frequency coaxial terminal, which is a component of a high-frequency coaxial connector, has a plurality of high-frequency coaxial terminals to which a coaxial pin can be directly fitted and connected, and a central axis of the coaxial terminal and a central axis of another coaxial terminal. A high-frequency semiconductor element mounting apparatus comprising: a high-frequency semiconductor element mounting package disposed on an outer wall surface of a package frame at right angles to a package; and a metal housing for supporting and fixing the package and the high-frequency coaxial connector plug. The housing is composed of an upper housing block having a U-shaped vertical cross-sectional shape, and a lower housing block having a U-shaped vertical cross-sectional shape fitted into the U-shaped concave portion of the upper housing block, A mounting portion for the high-frequency coaxial connector plug is provided on a side wall of both housing blocks at a position facing the high-frequency coaxial terminal of the package, and the two housing blocks are orthogonal to each other. And, the U-shaped concave portions are combined so as to face each other, and the package is disposed so as to sandwich the package in the space defined by the U-shaped concave portions of the two housing blocks. The coaxial pins are directly fitted and connected, and the high-frequency coaxial connector plug is supported and fixed on the side walls of the two housing blocks. The connector plug is in close contact with the package. High frequency semiconductor mounting equipment. 2. A high frequency semiconductor device mounting package according to claim 1, wherein coaxial terminals are disposed on all four side walls of the package, and external electrode leads for direct current supply are disposed diagonally. A high-frequency semiconductor mounting device characterized by the above-mentioned. 3. The high-frequency semiconductor mounting device according to claim 1, wherein a package having high-frequency coaxial terminals and DC supply external electrode leads alternately mounted on eight side surfaces of the package. 4. The high-frequency semiconductor mounting apparatus according to claim 1, wherein a high-frequency coaxial terminal is provided on all four side walls of the package, and a package in which a DC supply terminal is provided on a lower surface of the package is mounted. .