JP3257609B2 - Mold mark forming method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a mark on a mold, and more particularly, to a method for forming a mark to be transferred to a glass article simultaneously with the molding of the glass article.

[0002]

2. Description of the Related Art For example, a glass article for a cathode ray tube, such as a panel or a funnel, produced by a glass maker is sent to a tube maker, where it is finally manufactured as a cathode ray tube through a manufacturing process there. However, during the manufacturing process of the tube manufacturer, or even after the cathode ray tube is completed, defects such as breakage may occur in panels and funnels. It is necessary to retroactively investigate the glass production time. Further, in production management and inventory management, it is necessary to quickly and surely know items required for management of individual glass articles.

Therefore, conventionally, such marks such as numbers, symbols, or characters are formed on a glass article in a molding die, and the marks are transferred onto the surface of the glass article at the same time as the molding of the glass article, whereby individual marks are formed. We manage glass articles.

By the way, usually, the molding surface of a mold is coated with chromium plating for releasability from glass.
As a conventional mark forming method for a mold, as shown in FIG. 3, a mark is directly engraved on a molding surface 10 'of a mold 10 by etching or an engraving machine, and a chromium plating layer is formed thereon by plating. C, or after forming a chromium plating layer C on the molding surface 10 'of the mold 10 as shown in FIG. 4, a mark is engraved by sandblasting.

[0005]

However, in the above-described conventional mark forming method, the mark is engraved on the molding surface of the mold itself. Is re-ground and a new mark is formed thereon, and by repeating this, there arises a problem that the dimensional accuracy of the mold gradually deteriorates. In particular, for temporary marks such as the date of manufacture, etc., the mark is frequently updated, so if the dimensional accuracy deteriorates due to the grinding of the mold, the glass article for a cathode ray tube, which requires high molding accuracy, is stabilized. Since molding cannot be performed and repair work for recovering the dimensional accuracy of the mold must be frequently performed, there is a problem that labor and cost for the work are required.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for forming a mark in a mold, which can form a mark without deteriorating the dimensional accuracy of the mold regardless of the renewal of the mark.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems and objects, and has a masking tape attached to a molding surface of a mold and an electrolyte storage tank frame provided thereon. A method for forming a mark on a mold, characterized in that a current is applied to an electrolytic solution injected into a storage tank frame to deposit a plating layer on a portion not covered with a masking tape.

[0008]

According to the mark forming method of the present invention, the electrolytic solution in the electrolytic solution storage tank frame provided on the molding surface is energized to deposit a plating layer in a portion not covered by the masking tape. A desired mark is formed on the molding surface of the mold.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for forming a mark on a mold according to the present invention will be described with reference to embodiments.

FIG. 1 is an enlarged sectional view for explaining the mark forming method of the present embodiment, and FIG. 2 is an enlarged perspective view of a molding surface of a mold on which marks are formed.

[0011] 10 is a mold, 11 is a masking tape, 1
2 is an electrolyte storage tank frame, 13 is an electrolyte, and 14 is an anode rod. On the molding surface 10 'of the mold 10, a chromium plating layer C having a thickness of 15 to 40 [mu] m is formed for mold releasability from glass.

First, on a molding surface 10 'of a mold 10 for forming a mark, in this embodiment, a chromium plating layer C, a masking tape 11 cut out from a mark required for management of numerals, symbols, characters, etc. At the same time, the electrolyte storage tank frame 12 is set on the masking tape 11 so as to surround the mark forming part.
The electrolyte 13 is injected into the inside. When the electrolyte storage tank frame 12 is installed, the adhesive tape 15 is interposed between the electrolyte storage tank frame 12 and the contact surface of the molding surface 10 ′ with the chromium plating layer C so that the electrolyte 13 does not leak. Seal. In the present embodiment, nickel chloride (200 g /
1) and a plating solution mainly containing hydrochloric acid (100 ml / l). Subsequently, the anode rod 14 is immersed in the electrolytic solution 13 to form a DC circuit using the mold 10 as a cathode.
A current of 1.5 to 2.5 V, 0.3 to 1.0 A is applied for 10 to 15 minutes, and a nickel plating layer N is formed on the chromium plating layer C on the molding surface 10 ′ at a portion not covered with the masking tape 11. To form As a result, the molding surface 10 'of the mold 10
A desired mark is formed on the chromium plating layer C of FIG.

When the mark is to be updated, the mark may be formed again after grinding the plating layer forming the mark of the mold, and the molding surface of the mold itself need not be ground. Therefore, the mark can be formed on the mold without deteriorating the dimensional accuracy of the mold.

[0014]

As described above, according to the mold mark forming method of the present invention, the dimensional accuracy of the mold is not deteriorated even if the mark is frequently formed on the mold by updating the mark. Mark formation can be performed with good quality.

[Brief description of the drawings]

FIG. 1 is an enlarged cross-sectional view for explaining a method of forming a mark of a mold according to the present invention.

FIG. 2 is an enlarged perspective view of a molding surface of a mold on which marks are formed.

FIG. 3 is an explanatory view of a conventional mold mark forming method.

FIG. 4 is an explanatory view of a conventional mark forming method of a mold.

[Explanation of symbols]

 Reference Signs List 10 Mold 11 Masking tape 12 Electrolyte storage tank frame 13 Electrolyte 14 Anode rod 15 Adhesive tape C Chrome plating layer N Nickel plating layer

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-103792 (JP, A) JP-A-2-104693 (JP, A) JP-A-1-75695 (JP, A) JP-A-5-105 106079 (JP, A) JP-A-5-106063 (JP, A) JP-A-4-293795 (JP, A) JP-A-6-270198 (JP, A) JP-A-4-276096 (JP, A) JP-A-1-149989 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) C25D 5/02

Claims (1)

(57) [Claims] 1. A masking tape is stuck on a molding surface of a mold, and an electrolyte storage tank frame is placed thereon. Electricity is supplied to the electrolyte injected into the storage tank frame, and a portion not covered with the masking tape is applied. A method for forming a mark on a mold, comprising depositing a plating layer at a place.