JP3257551B2 - Method for chamfering substrate, device for chamfering substrate and production of liquid crystal device - Google Patents

Method for chamfering substrate, device for chamfering substrate and production of liquid crystal device

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Publication number
JP3257551B2
JP3257551B2 JP2000035191A JP2000035191A JP3257551B2 JP 3257551 B2 JP3257551 B2 JP 3257551B2 JP 2000035191 A JP2000035191 A JP 2000035191A JP 2000035191 A JP2000035191 A JP 2000035191A JP 3257551 B2 JP3257551 B2 JP 3257551B2
Authority
JP
Japan
Prior art keywords
chamfering
substrate
wheels
ridge line
liquid crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000035191A
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Japanese (ja)
Other versions
JP2000199893A (en
Inventor
一男 井口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
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Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2000035191A priority Critical patent/JP3257551B2/en
Publication of JP2000199893A publication Critical patent/JP2000199893A/en
Application granted granted Critical
Publication of JP3257551B2 publication Critical patent/JP3257551B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a process for producing a liquid crystal display device which is capable of greatly ameliorating the processing variations and improving the efficiency and man-hours in a production process by rotating wheels by the side of the center of rotation and pressing two ridge line parts toward the side of the wheels, thereby chamfering the two ridge line parts. SOLUTION: The V-groove shaped diamond wheels 9 are arranged to face the ridge line parts 4 and 5 of the electrode terminal 3 of the liquid crystal display device and are so set as to maintain the positions of A and B. The angle of fine chamfering is made settable arbitrarily by the angle 10 of the V shape so as to be regulated to various angles. The diamond wheels 9 are so arranged that the distances A and B from the reference plane of the glass substrates 1 and 2 to the center of rotation of the diamond wheels 9 existing nearer both ends always have the relation A<B. This arrangement is extremely important to progress the processing gradually at the ridge line 4 and 5 of the electrode terminal 3 and to prevent the exertion of overload and cutting heat on the glass substrates 1 and 2.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、基板の面取り方法
に関する。また、基板の面取り装置に関する。より具体
的には液晶表示装置の製造方法に係わり、特に該液晶表
示装置に用いる基板稜線の面取りを行う工程に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for chamfering a substrate. The present invention also relates to a substrate chamfering device. More specifically, the present invention relates to a method of manufacturing a liquid crystal display device, and more particularly to a step of chamfering a ridge line of a substrate used for the liquid crystal display device.

【0002】[0002]

【従来の技術】従来の液晶表示装置の製造方法は、ガラ
ス基板1,ガラス基板2によって構成されている液晶表
示装置の電極端子3にコネクトピン,ヒートシール,F
PC等を配設する。この際に前記コネクトピン等の導電
部材が当接する電極端子3の該基板端子部の稜線部4,
5に糸面取りを実施している。尚、この糸面取りを実施
する理由としては、前記導電部材と電極端子との当接時
の導電信頼性をより一層高めるためである。この際の方
法としては、例えば、図8,図9に示すようにベルトサ
ンダー等を用い、該ベルトサンダーに配置された砥粒,
レジン等から構成されるエンドレスベルト14にて、該
稜線部4,5をハンドワークにて糸面取りを施すという
製造方法が知られている。
2. Description of the Related Art A conventional method of manufacturing a liquid crystal display device is such that a connect pin, a heat seal, and an F pin are connected to an electrode terminal 3 of the liquid crystal display device composed of a glass substrate 1 and a glass substrate 2.
A PC etc. will be installed. At this time, the ridge line portion 4 of the substrate terminal portion of the electrode terminal 3 with which the conductive member such as the connect pin abuts,
5, the thread chamfering is performed. The reason for performing the thread chamfering is to further enhance the conductive reliability at the time of contact between the conductive member and the electrode terminal. As a method at this time, for example, as shown in FIGS. 8 and 9, a belt sander or the like is used, and abrasive grains placed on the belt sander are used.
A manufacturing method is known in which the edge lines 4, 5 are chamfered by handwork using an endless belt 14 made of a resin or the like.

【0003】[0003]

【発明が解決しようとする課題】しかし、前述の従来技
術では、電極端子基板の稜線部を糸面取りする際に、ベ
ルトサンダー等を用いハンドワークにて実施するため
に、面取り量、角度に著しいバラツキを示し、品質的に
不安定であり、かつ、ハンドワーク処理である故に効率
も悪く、工数的にもかなりの時間を費やすという問題を
有している。そこで、本発明はこのような問題を鑑み、
電極端子基板の稜線部糸面取りを行う方法として、複数
のダイヤモンドホイールを用いて、連続的な糸面取り加
工を施すことにより、製造工程での加工バラツキ、効
率、工数を著しく向上させる液晶表示装置の製造方法を
提供することを目的とする。
However, in the above-mentioned prior art, when the edge of the electrode terminal board is chamfered by a thread using a belt sander or the like, the chamfering amount and angle are remarkable. There is a problem that it shows variation, is unstable in quality, is inefficient due to handwork processing, and consumes considerable time in man-hours. Therefore, the present invention has been made in view of such a problem,
As a method of chamfering the ridge portion of the electrode terminal substrate, a continuous yarn chamfering process is performed by using a plurality of diamond wheels, thereby significantly improving processing variations, efficiency, and man-hours in a manufacturing process. It is intended to provide a manufacturing method.

【0004】[0004]

【課題を解決するための手段】本発明の基板の面取り方
法は、端部に2稜線を有する基板を前記稜線の方向に沿
って搬送し、側方が窪んでなる複数のホイールの前記側
方に前記2稜線を順次押し当てることによって前記2稜
線を面取りする基板の面取り方法であり、各前記ホイー
ルの回転中心と該各ホイールに面取りされる前記稜線と
の距離は、前記基板が搬送される方向に沿って短くなっ
ていくことを特徴とする。本発明の基板の面取り装置
は、端部に2稜線を有する基板を該稜線の方向に沿って
搬送する手段、 回転中心の側方が窪んでなる複数のホ
イール、を具備し、各前記ホイールの回転中心と前記各
ホイールに面取りされる前記稜線との距離が、前記基板
が搬送される方向に沿って短くなるように前記複数のホ
イールを配置してなることを特徴とする。本発明の液晶
装置の製造方法は、一対の基板を対向配置してなり、少
なくとも一方の前記基板の稜線近傍には電極端子が形成
された液晶装置の製造方法において、前記一方の基板を
該稜線の方向に沿って搬送し、回転中心の側方が窪んで
なる複数のホイールの前記側方に前記稜線を順次押し当
てることによって前記稜線を面取りする工程を有し、各
前記ホイールの回転中心と該各ホイールに面取りされる
前記稜線との距離は、前記基板が搬送される方向に沿っ
て短くなっていくことを特徴とする。
According to the method for chamfering a substrate of the present invention, a substrate having two ridges at an end is conveyed along the direction of the ridges, and a plurality of wheels having concave sides are formed on the sides. A chamfering method for a substrate, in which the two ridge lines are chamfered by sequentially pressing the two ridge lines on the substrate. It is characterized by becoming shorter along the direction. The substrate chamfering apparatus according to the present invention includes: means for transporting a substrate having two ridges at an end along the direction of the ridges; and a plurality of wheels whose side of the rotation center is depressed. The plurality of wheels are arranged such that a distance between a center of rotation and the ridge line chamfered by each wheel becomes shorter along a direction in which the substrate is transported. In a method for manufacturing a liquid crystal device according to the present invention, in the method for manufacturing a liquid crystal device, a pair of substrates are arranged to face each other, and an electrode terminal is formed near a ridge line of at least one of the substrates. Conveying along the direction of, having a step of chamfering the ridge line by sequentially pressing the ridge line to the side of the plurality of wheels whose side of the rotation center is depressed, the rotation center of each wheel and The distance between the ridge line chamfered by each wheel is reduced along the direction in which the substrate is transported.

【0005】[0005]

【実施例】〔実施例1〕そこで、以下に本発明の詳細を
実施例に基づいて説明する。図1,図2,図3は、本実
施例での液晶表示装置の製造方法を示す外観図である。
先ず、製造方法について説明する。ガラス基板1,ガラ
ス基板2によって構成されている液晶表示装置の電極端
子3の稜線部4,5の各稜線について、円板形状である
ダイヤモンドホイール6が複数個一体化しており、対向
する側にダイヤモンドホイール7が設置されている。該
ダイヤモンドホイール6,7の回転方向は、各々図示し
てある矢印の方向に回転することが望ましい。(図2参
照)その後に、ガラス基板1,2から構成される液晶表
示装置を矢印の方向に搬送ベルト等により搬送する。上
記搬送時には、電極端子3の稜線部4、5へ均等に応力
分布するようにダイヤモンドホイール6,7へ押し当て
るようにする。ダイヤモンドホイール部を液晶表示装置
が通過した後には、電極端子3の稜線部4,5は共に、
糸面取り加工が施される。尚、ダイヤモンドホイールの
特徴としては、下記事項が例挙される。第1としてはガ
ラス基板の基準面より両端に位置するダイヤモンドホイ
ールの回転中心との距離A,Bは、A<Bの関係を必ず
有しているように配置されていること。(図1参照)こ
れは電極端子3の稜線部4,5において、徐々に加工が
進行し、ガラス基板に対して過負荷及び、切削熱を加わ
らせないためには、極めて重要である。表1に切削実験
結果を示す。ダイヤモンドホイール種類,メタルボンド
法,メッシュ♯700,集中度75,硬度中程度のダイ
ヤモンドホイールを使用し、表1の条件にて糸面取りを
実施し、ホイール1枚当たりの切込量と切削品質の関係
を総合的に判定したものである。切込量=C0.06に
て最も切削面の状態が好ましいといえる。C0.20ま
で切削した場合については、面粗さ、マイクロクラッ
ク、チッピング等のパラメータにて、不具合の生じる可
能性が高くなる。したがって、C0.08までの切削量
にて管理すれば、糸面取りの品質は保たれることがわか
る。
[Embodiment 1] The details of the present invention will be described below based on an embodiment. 1, 2 and 3 are external views showing a method for manufacturing a liquid crystal display device according to the present embodiment.
First, the manufacturing method will be described. A plurality of disc-shaped diamond wheels 6 are integrated with each ridge of the ridges 4 and 5 of the electrode terminal 3 of the liquid crystal display device composed of the glass substrate 1 and the glass substrate 2. A diamond wheel 7 is provided. The rotation direction of the diamond wheels 6, 7 is desirably rotated in the directions of the arrows shown in the drawings. Then, the liquid crystal display device composed of the glass substrates 1 and 2 is transported by a transport belt or the like in the direction of the arrow. At the time of the transfer, the diamond terminals 6 and 7 are pressed against the ridges 4 and 5 of the electrode terminal 3 so that stress is evenly distributed. After the liquid crystal display device has passed through the diamond wheel portion, the ridge portions 4 and 5 of the electrode terminal 3 are both
Yarn chamfering is performed. The features of the diamond wheel include the following. First, the distances A and B to the rotation centers of the diamond wheels located at both ends from the reference plane of the glass substrate are arranged so as to always have a relationship of A <B. (See FIG. 1) This is extremely important in order to prevent the overload and the cutting heat from being applied to the glass substrate by gradually processing the ridges 4 and 5 of the electrode terminals 3. Table 1 shows the cutting test results. Diamond wheel type, metal bond method, mesh # 700, degree of concentration 75, medium hardness use a diamond wheel, the yarn chamfering was carried out under the conditions of Table 1, the cutting amount per wheel and cutting quality The relationship is comprehensively determined. It can be said that the state of the cut surface is most preferable when the cutting amount = C0.06. In the case of cutting to C0.20, there is a high possibility that a defect will occur due to parameters such as surface roughness, micro cracks, and chipping. Therefore, it can be understood that the quality of the yarn chamfering can be maintained by controlling the cutting amount up to C0.08.

【0006】[0006]

【表1】 尚、前記データは乾式加工での場合であり、湿式加工
(注水処理有)でのデータでは、乾式に比べて2〜3倍
程度、切削しても同等のレベルを維持できるものであ
る。しかるに、前記マイクロクラックとは、ガラス基板
の糸面取りを施した面において、表面より200〜50
0μm程度のガラスのヒビのことを称す。該マイクロク
ラックは、コネクトピンの挿入及び、ヒートシール、F
PCの圧着時にかかる応力や熱衝撃により急激に進行す
る、したがって電極端子の導通不良を誘発する要因とし
て危険性の高いパラメータである。第2としては、図4
の(a),(b)に示すように、糸面取り角度を変化さ
せることができる。これは、図1のホイール軸間8を狭
くすることによりθ1を大きくでき、反対に該ホイール
軸間8を広くすることによりθ2を小さくすることがで
きる。故に、糸面取り角度、量(切込量を可変)が自由
自在に選択処理できるものであり、幅広い用途への対応
も可能である。例えば、コネクトピンでの液晶表示装置
の場合のθは、θ=45±20゜であることも実験結果
により得られている。稜線部4,5の糸面取り有、無に
ついても、任意対応が出来る。また、表1の実験では5
枚/軸のホイールを同一メッシュとして選定している。
これは、要求される糸面取り面の面精度にも依るが、#
1000にメッシュ微細化すれば、クラック、面精度
は、極めて著しい向上をとげる。さらに、高速処理を実
現するためには、#300×2枚+#700×3枚、あ
るいは、#400〜#800までの#100/枚毎微細
化することにより実現可能となることも、実験結果より
得られている。 〔実施例2〕実施例2について説明する。図5,図6は
本実施例での液晶表示装置の製造方法を示す外観図であ
る。V溝形状ダイヤモンドホイールを用いて、液晶表示
装置の電極端子3の稜線部4,5について、該V溝形状
ダイヤモンドホイール9を実施例1と同様に配置すし、
A,Bの位置を保つようにセッティングする。ホイール
は、複数V溝形状ダイヤモンドホイールを配し、ホイー
ル回転方向は矢印の向きとする。(図5参照)尚、切削
方法,効果については前実施例と同様であり、連続糸面
取り加工ができるものである。糸面取りの角度について
は、V形状角度10により、狭広の調整も任意設定でき
ることはいうまでもない。 〔実施例3〕実施例3について説明する。図7は、本実
施例での製造方法を示す斜視図である。本実施例では、
円筒形状ダイヤモンドホイール11を用いることによっ
て、電極端子3の稜線部4,5について、円筒形状ダイ
ヤモンドホイール11,12を図示の通り配置し、矢印
の方向に回転を与え該稜線部4,5に糸面取りを施すも
のである。尚、該円形形状ダイヤモンドホイール11,
12は、各々相対する複数のホイールを有し、連続加工
が可能である。しかるに、液晶表示装置を矢印の方向へ
移動させる場合には、各々ホイールの稜線部4,5に対
するホイール切込量は、実施例1と同様であることが望
ましい。前記ホイールの特徴としては、円筒形の中心部
にホール13が空いており、仮想上ホイール停止部が存
在しない。逆にホール13が存在しない場合は、前稜線
部4,5に大幅な負荷が加わりガラスへのダメージが懸
念される。故に、上記方法によれば、前記実施例と同様
の糸面取り状態を維持できるものである。
[Table 1] Note that the above data is for the case of dry machining, and the data for wet machining (with water injection treatment) is about 2 to 3 times that of dry machining, and can maintain the same level even after cutting. However, the micro-crack means that the surface of the glass substrate on which the yarn chamfering is performed is 200 to 50 mm from the surface.
It refers to a glass crack of about 0 μm. The micro cracks were formed by inserting a connect pin and heat sealing.
It is a parameter that is highly dangerous as a factor that rapidly progresses due to stress or thermal shock applied when the PC is crimped, and thus induces poor conduction of the electrode terminals. Second, FIG.
(A) and (b), the yarn chamfering angle can be changed. This is because θ1 can be increased by reducing the distance 8 between the wheel axes in FIG. 1, and θ2 can be reduced by increasing the distance 8 between the wheel axes. Therefore, the yarn chamfering angle and amount (variable cutting amount) can be freely selected and processed, and it is possible to cope with a wide range of applications. For example, in the case of a liquid crystal display device using a connect pin, θ is 45 ± 20 °, which is also obtained from experimental results. Regarding the presence or absence of the thread chamfering of the ridge portions 4 and 5, any response can be made. In the experiment of Table 1, 5
Wheels / axle are selected as the same mesh.
This depends on the required surface accuracy of the chamfered surface.
If the mesh size is reduced to 1000, cracks and surface accuracy can be significantly improved. In order to realize high-speed processing, it can be realized by miniaturizing each of # 300 × 2 sheets + # 700 × 3 sheets or # 100 / # 100 to # 800. It is obtained from the results. Embodiment 2 Embodiment 2 will be described. 5 and 6 are external views showing a method for manufacturing a liquid crystal display device according to this embodiment. Using a V-groove-shaped diamond wheel, the V-groove-shaped diamond wheel 9 is arranged in the same manner as in Example 1 at the ridgelines 4 and 5 of the electrode terminals 3 of the liquid crystal display device,
Set so that the positions of A and B are maintained. As the wheel, a diamond wheel having a plurality of V-grooves is arranged, and the direction of wheel rotation is the direction of the arrow. (See FIG. 5) The cutting method and effect are the same as in the previous embodiment, and continuous yarn chamfering can be performed. As for the angle of the yarn chamfering, it goes without saying that the narrowing and widening can be arbitrarily set by the V-shaped angle 10. Third Embodiment A third embodiment will be described. FIG. 7 is a perspective view illustrating the manufacturing method in the present embodiment. In this embodiment,
By using the cylindrical diamond wheel 11, the cylindrical diamond wheels 11, 12 are arranged as shown in the figure with respect to the ridge lines 4, 5 of the electrode terminal 3, and rotation is performed in the direction of the arrow to apply thread to the ridge lines 4, 5. It is to be chamfered. The circular diamond wheel 11,
12 has a plurality of wheels facing each other, and is capable of continuous processing. However, when the liquid crystal display device is moved in the direction of the arrow, it is desirable that the wheel cutting amounts with respect to the ridge portions 4 and 5 of the wheels are the same as in the first embodiment. The feature of the wheel is that a hole 13 is opened at the center of the cylinder, and there is virtually no wheel stop. Conversely, when the hole 13 does not exist, a large load is applied to the front ridge portions 4 and 5, and there is a concern that the glass may be damaged. Therefore, according to the above method, the same thread chamfering state as in the above embodiment can be maintained.

【0007】[0007]

【発明の効果】以上説明してきたように本発明は、 側
方が窪んでなるホイールを回転させ、ホイールの側方に
2稜線を押し当てることによって、2稜線を面取りす
る。ので、基板の2稜線を一度に面取りできる。また、
各ホイールの回転中心と各ホイールに面取りされる稜線
との距離は、基板が搬送される方向に沿って短くなって
いくので、面取り加工が徐々に進行する。そのため、基
板に過負荷または切削により発生する熱が加わるのを防
止することができる。本発明の基板の面取り方法を液晶
装置の製造方法に利用した場合にあっては、ガラス基板
が面取り加工時において破損することを極力防止できる
ため製造歩留まりが向上する。
As described above, according to the present invention, the two ridges are chamfered by rotating the wheel whose side is depressed and pressing the two ridges against the sides of the wheel. Therefore, two ridge lines of the substrate can be chamfered at one time. Also,
Since the distance between the center of rotation of each wheel and the ridge line chamfered by each wheel decreases along the direction in which the substrate is conveyed, the chamfering process gradually proceeds. Therefore, it is possible to prevent the heat generated by overload or cutting from being applied to the substrate. In the case where the substrate chamfering method of the present invention is used for a method of manufacturing a liquid crystal device, the glass substrate can be prevented from being damaged during the chamfering process as much as possible, thereby improving the manufacturing yield.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例を示す概略図。FIG. 1 is a schematic diagram showing one embodiment of the present invention.

【図2】本発明の一実施例を示す概略図。FIG. 2 is a schematic diagram showing one embodiment of the present invention.

【図3】本発明の一実施例を示す概略図。FIG. 3 is a schematic view showing one embodiment of the present invention.

【図4】(a),(b)は本実施例での加工後の液晶表
示装置を示す図。
FIGS. 4A and 4B are views showing a liquid crystal display device after processing in the embodiment.

【図5】本実施例での製造方法を示す概略図。FIG. 5 is a schematic view showing a manufacturing method in the present embodiment.

【図6】本実施例での製造方法を示す概略図。FIG. 6 is a schematic view showing a manufacturing method in the present embodiment.

【図7】他実施例での製造方法を示す概略図。FIG. 7 is a schematic view showing a manufacturing method according to another embodiment.

【図8】従来の製造方法を示す概略図。FIG. 8 is a schematic view showing a conventional manufacturing method.

【図9】従来の製造方法を示す概略図。FIG. 9 is a schematic view showing a conventional manufacturing method.

【符号の説明】[Explanation of symbols]

1 ガラス基板 2 ガラス基板 3 電極端子 4 稜線部 5 稜線部 6 ダイヤモンドホイール 7 ダイヤモンドホイール 8 ホイール軸間 9 V溝形状ダイヤモンドホイール 10 V形状角度 11 円筒形状ダイヤモンドホイール 12円筒形状ダイヤモンドホイール 13 ホール 14 エンドレスベルト DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Glass substrate 3 Electrode terminal 4 Ridge part 5 Ridge part 6 Diamond wheel 7 Diamond wheel 8 Wheel axis 9 V-groove diamond wheel 10 V shape angle 11 Cylindrical diamond wheel 12 Cylindrical diamond wheel 13 Hole 14 Endless belt

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) G02F 1/1333 G02F 1/13 101 G09F 9/00 - 9/46 ──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. 7 , DB name) G02F 1/1333 G02F 1/13 101 G09F 9/00-9/46

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】端部に2稜線を有する基板を該稜線の方向
に沿って搬送し、回転中心の側方が窪んでなる複数のホ
イールの前記側方に前記2稜線を順次押し当てることに
よって前記2稜線を面取りする基板の面取り方法であ
り、 各前記ホイールの回転中心と前記各ホイールに面取りさ
れる前記稜線との距離は、前記基板が搬送される方向に
沿って短くなっていくことを特徴とする基板の面取り方
法。
1. A substrate having two ridges at an end thereof is conveyed along the direction of the ridges, and the two ridges are sequentially pressed against the sides of a plurality of wheels whose sides are depressed at the center of rotation. A method of chamfering a substrate that chamfers the two ridges, wherein a distance between a rotation center of each of the wheels and the ridges chamfered by each of the wheels decreases in a direction in which the substrate is conveyed. Characteristic substrate chamfering method.
【請求項2】端部に2稜線を有する基板を該稜線の方向
に沿って搬送する手段、 回転中心の側方が窪んでなる
複数のホイール、を具備し、 各前記ホイールの回転中心と前記各ホイールに面取りさ
れる前記稜線との距離が、前記基板が搬送される方向に
沿って短くなるように前記複数のホイールを配置してな
ることを特徴とする基板の面取り装置。
2. A means for transporting a substrate having two ridges at an end thereof along the direction of the ridges, a plurality of wheels having a side with a rotation center depressed, wherein the rotation center of each of the wheels and the rotation center The substrate chamfering device, wherein the plurality of wheels are arranged such that a distance between the ridge line chamfered by each wheel is shortened along a direction in which the substrate is conveyed.
【請求項3】一対の基板を対向配置してなり、少なくと
も一方の前記基板の稜線近傍には電極端子が形成された
液晶装置の製造方法において、 前記一方の基板を該稜線の方向に沿って搬送し、回転中
心の側方が窪んでなる複数のホイールの前記側方に前記
稜線を順次押し当てることによって前記稜線を面取りす
る工程を有し、 各前記ホイールの回転中心と前記各ホイールに面取りさ
れる前記稜線との距離は、前記基板が搬送される方向に
沿って短くなっていくことを特徴とする液晶装置の製造
方法。
3. A method of manufacturing a liquid crystal device, comprising: a pair of substrates arranged opposite to each other, wherein an electrode terminal is formed near a ridge line of at least one of the substrates. Conveying, comprising a step of chamfering the ridge line by sequentially pressing the ridge line against the side of the plurality of wheels having a depressed side of the rotation center, and chamfering the rotation center of each wheel and each wheel. The method of manufacturing a liquid crystal device according to claim 1, wherein a distance from the ridge line decreases along a direction in which the substrate is transported.
JP2000035191A 2000-01-01 2000-02-14 Method for chamfering substrate, device for chamfering substrate and production of liquid crystal device Expired - Fee Related JP3257551B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000035191A JP3257551B2 (en) 2000-01-01 2000-02-14 Method for chamfering substrate, device for chamfering substrate and production of liquid crystal device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000035191A JP3257551B2 (en) 2000-01-01 2000-02-14 Method for chamfering substrate, device for chamfering substrate and production of liquid crystal device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP04037591A Division JP3312914B2 (en) 1991-03-07 1991-03-07 Electrode terminal substrate chamfering method, electrode terminal substrate chamfering device, and liquid crystal device manufacturing method

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JP2000199893A JP2000199893A (en) 2000-07-18
JP3257551B2 true JP3257551B2 (en) 2002-02-18

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