JP3250460B2 - Method for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device in which a semiconductor element is sealed with a sealing resin, and more particularly to a method of releasing a molded product from a mold of a sealing device.

[0002]

2. Description of the Related Art In recent years, in order to manufacture a resin-sealed semiconductor device at low cost, a molding method using a sealing resin and a method of mounting a semiconductor element on a resin molded product have been used.

Hereinafter, as a conventional method for manufacturing a semiconductor device, a method for releasing a molded product from a mold will be described.
FIG. 2 is a partial sectional process view showing a conventional method for manufacturing a semiconductor device.

FIG. 2A shows a state in which a support such as a lead frame on which a semiconductor element is mounted is sealed with a sealing resin, and a molded article 1 includes an upper mold 2 and a lower mold of a sealing device. It is sandwiched between the mold 3. The upper mold 2 is provided with an upper ejector pin 4, and the lower mold 3 is provided with a lower ejector pin 5.

[0005] Then, as shown in FIG. 2 (b), after the molding is completed, the upper ejector pin 4 descends while the upper mold 2 rises, and the molded product 1 is pushed down. At this time, the upper surface of the molded product 1 is released from the upper mold 2.

Next, as shown in FIG. 2C, the upper mold 2 is further raised, and the upper mold 2 and the lower mold 3 are in an open state.

Then, as shown in FIG. 2 (d), with the upper and lower dies open, the lower ejector pin 5 of the lower die 3 rises to push up the molded product 1, and the lower surface of the molded product 1 is lowered. Mold 3
Release from mold. There is also a method of lowering the lower mold 3 when releasing the lower mold from the lower surface of the molded article 1.

Through the above steps, the molded product is released from the molding die of the sealing device, and the semiconductor device is manufactured.

[0009]

However, in recent years, in order to improve the reliability of a semiconductor device, a sealing resin having a high adhesion strength to another metal component (such as a lead frame) constituting the semiconductor device has recently been used. Since it has been used, the adhesion between a molded product whose outer periphery is sealed with a sealing resin and a molding die is also improved, and it is difficult for the molded product to be released from the mold. Therefore, in the conventional method of manufacturing a semiconductor device, when the molded product is released from the mold, a large stress is applied to the molded product, and as shown in FIG. When the molded product 6 is released from the mold by the pins 4 and 5, the molded product 6 made of a resin having a low mechanical strength at high temperature undergoes plastic deformation and warpage, resulting in poor dimensional accuracy of the molded product, particularly flatness. There was a problem of becoming. Also,
In the case where the molded article 7 as shown in FIG. 4 is a semiconductor device in which the semiconductor element 10 is incorporated together with the lead frame 9 inside the sealing resin 8, the semiconductor element 1 which is incorporated due to the stress at the time of mold release.
In some cases, the cracks were broken and the reliability of the semiconductor device product was lost.

According to the present invention, there is provided a semiconductor device capable of reducing the stress applied to a molded product when releasing the molded product from the upper and lower molds, improving the dimensional accuracy of the molded product, and improving the reliability of the semiconductor device. An object of the present invention is to provide a method for manufacturing a device.

[0011]

In order to solve the above-mentioned conventional problems, in a method of manufacturing a semiconductor device according to the present invention, in a mold releasing step, a first surface of a molded product is replaced with a surface of a first mold. The ejector pin provided in the second mold is lowered and brought into contact with the second surface of the molded article in a state where the molded article is fixed, and the molded article is raised by raising the second mold. Releasing the second surface of the second mold from the surface of the second mold, again sandwiching the molded product between the first mold and the second mold, In a state where the second surface is fixed by the surface of the second mold, the first surface of the molded product is fixed to the first surface.
Step of ejector pin provided in the mold is raised was abut, to the first face and release the surface of the first mold wherein the molded product lowers the first mold And

In a state where the first surface of the molded product is fixed by the surface of the first mold, an ejector pin provided in the second mold is provided with respect to the second surface of the molded product. The first mold and the molded product are lowered by bringing the first mold and the molded product down, so that the second mold is raised.
Releasing the surface of the second mold and the surface of the second mold, again,
A step of sandwiching the molded article between the first mold and the second mold; and a step of fixing the first surface of the molded article in a state where the second surface of the molded article is fixed by the surface of the second mold. An ejector pin provided in the first mold is lowered and brought into contact with the surface to lower the first mold, and
And releasing the mold and the molded product from each other to release the first surface of the molded product from the surface of the first mold.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS As described above, in the method of manufacturing a semiconductor device according to the present invention, a support such as a lead frame on which a semiconductor element is mounted is sealed with a sealing resin in a mold of a sealing device. After that, the method has a releasing step of removing the molded product from the mold, and in the releasing process, the first surface of the molded product is moved to the first surface.
With the surface of the mold stably fixed, the ejector pin provided in the second mold is lowered and brought into contact with the second surface of the molded product, and the second mold Is lifted to release the second surface of the molded product from the surface of the second mold, and the molded product is once again sandwiched between the first mold and the second mold, and then molded. While the second surface of the object is stably fixed by the surface of the second mold, the ejector pin provided in the first mold is lowered with respect to the first surface of the molded object. In the step of contacting and lowering the first mold to release the first surface of the molded product from the surface of the first die, the molded product is not deformed by the ejector pins, and the molded product is not deformed. Can be prevented from being stressed.

Hereinafter, an embodiment of a method of manufacturing a semiconductor device according to the present invention will be described with reference to the drawings. FIG. 1 is a partial cross-sectional process diagram showing a method for releasing a molded product from a mold as a method for manufacturing a semiconductor device of the present embodiment.

FIG. 1A shows a state in which a support such as a lead frame on which a semiconductor element is mounted is sealed with a sealing resin. ) And the lower mold 13 (first mold). The upper mold 12 is provided with an upper ejector pin 14, and the lower mold 13 is provided with a lower ejector pin 15. The upper mold 12 and the lower ejector pin 15 function to rise at a constant speed. And the upper ejector pin 14 has a function of descending at a constant speed.

Then, as shown in FIG.
With the upper ejector pin 14 of 2 pressed against one surface of the molded product 11 against the lower mold 13, the upper mold 12 rises to release the molded product 11 from the upper mold 12. At this time, molding 1
1 is pressed against the lower mold 13 by the upper ejector pin 14, so that the surface of the lower mold 13 stably supports the surface (first surface) of the molded product 11,
Is small, and the stress applied to the semiconductor element in the molded product 11 is also small.

In the above description, only the upper mold 12 is raised, but the molded product 11 and the upper ejector pin 1 are lifted.
4. While maintaining the positional relationship of the lower mold 13, the molding 1
1. The lower mold 13 and the upper ejector pin 14 may be lowered at a constant speed, and the positional relationship between the molded product 11, the upper ejector pin 14 and the lower mold 13 is maintained while the upper mold 12 is raised. In this state, the molded product 11, the lower mold 13, and the upper ejector pin 14 may be lowered at a constant speed.

Next, as shown in FIG.
In preparation for releasing the mold 11 from the mold 11, the upper mold 12 and the lower mold 13 are closed, and the mold 11 is again sandwiched between the molds.

Then, as shown in FIG. 1D, with the lower ejector pin 15 pressing one surface of the molded article 11 against the upper mold 12, the lower mold 13 is lowered to lower the molded article 11
Is released from the lower mold 13. At this time, since the molded product 11 is pressed against the upper mold 12 by the lower ejector pins 15, the surface of the upper mold 12 stably supports the surface (second surface) of the molded product 11. The deformation of the molded article 11 is small, and the stress applied to the semiconductor element in the molded article 11 is also small.

In the above description, only the lower mold 13 is lowered, but the molded product 11 and the lower ejector pin 1 are lowered.
5. While maintaining the positional relationship of the upper mold 12, the molding 1
1. The upper die 12 and the lower ejector pin 15 may be raised at a constant speed, or the positional relationship between the molded product 11, the lower ejector pin 15 and the lower die 13 is maintained while the upper die 12 is raised. In this state, the molded article 11, the lower mold 13, and the lower ejector pin 15 may be raised at a constant speed.

Then, as shown in FIG.
After the mold 1 is released from the upper mold 12 and the lower mold 13, the upper mold 12 is raised above the operating range of the lower ejector pin 15, the mold is opened, and the molded article 11 is taken out of the mold.

Through the above steps, the molded product is released from the molding die of the sealing device, and the semiconductor device is manufactured.

In the process of releasing the mold by opening the mold and removing the molded product 11 from the mold in the present embodiment, only the upper ejector pin 14 is used when the molded product 11 is in contact with the upper mold 12. To remove the close contact between the tip portion of the upper ejector pin 14 and the molded product 11,
When the molded article 11 is in contact with the lower mold 13, only the lower ejector pin 15 is lowered to release the close contact between the tip end of the lower ejector pin 15 and the molded article 11, and the releasability is improved. To make sure.

As described in the present embodiment, a support such as a lead frame on which a semiconductor element is mounted is sealed with a sealing resin in a mold of a sealing device, and then the molded product is molded. In the mold release step of removing from the mold, the first surface of the molded product is stably fixed by the surface of the first mold, and the second surface of the molded product is moved in the second mold with respect to the second surface of the molded product. The second mold is lifted to release the second surface of the molded product from the surface of the second mold, and the first mold is again moved up. The molded product is once sandwiched between the mold and the second mold, and then the first surface of the molded product is stably fixed by the second mold surface with the second surface of the molded product.
The ejector pin provided in the first mold is lowered and brought into contact with the surface of the first mold, and the first mold is lowered so that the first surface of the molded product and the surface of the first mold are brought into contact with each other. By releasing the mold,
The molded product is not deformed by the ejector pins, and it is possible to prevent stress from being applied to the molded product.

In addition to the above method, the ejector pin of the second mold is brought into contact with the second surface of the molded product, and the first surface of the molded product is supported by the surface of the first mold. Similarly, by raising the second mold and lowering the first mold together with the molded product at the same speed as the rising speed, the stress applied to the molded product is similarly prevented, and the second mold of the molded product is prevented. Can be released from the second mold. Similarly, the ejector pin of the first mold is brought into contact with the first surface of the molded product, the second surface of the molded product is supported by the surface of the second die, and the first die is lowered. At the same time, by raising the second mold together with the molding at the same speed as the lowering speed,
The first surface of the molded article is prevented from being stressed by applying a first force to the first face.
Can be released from the mold.

[0026]

As described above, according to the present invention, when the upper and lower dies are raised or lowered, the operations of the upper and lower ejector pins facing the upper and lower dies are linked at a constant speed. The surface is stably supported by the mold surface, and the molded product is released from the mold without being deformed by being pinched by the ejector pins facing the mold. And the mold can be released without breaking the internal element, and the reliability of the manufactured semiconductor device can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional process view showing a method for manufacturing a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a sectional process view showing a conventional method for manufacturing a semiconductor device.

FIG. 3 is a cross-sectional view showing a problem in a conventional method for manufacturing a semiconductor device.

FIG. 4 is a sectional view showing a problem in a conventional method of manufacturing a semiconductor device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 molded product 2 upper mold 3 lower mold 4 upper ejector pin 5 lower ejector pin 6 molded product 7 molded product 8 sealing resin 9 lead frame 10 semiconductor element 11 molded product 12 upper mold 13 lower mold 14 upper ejector pin 15 Lower ejector pin

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-56-136319 (JP, A) JP-A-6-79748 (JP, A) JP-A-57-14437 (JP, U) (58) Survey Field (Int.Cl. ⁷ , DB name) H01L 21/56 B29C 45/40

Claims (4)

(57) [Claims] 1. A semiconductor device having a mold release step in which a support on which a semiconductor element is mounted is resin-sealed in a mold of a resin sealing apparatus to form a molded article, and the molded article is removed from the mold. In the manufacturing method, in the mold release step, the first surface of the molded product is fixed to the surface of the first mold, and the second surface of the molded product is placed in the second mold. A step of lowering the provided ejector pin to make contact therewith, raising the second mold to release the second surface of the molded product from the surface of the second mold, and again, A step of sandwiching the molded article between a first mold and a second mold;
In a state of being fixed by the surface of the mold, the ejector pin provided in the first mold is raised and brought into contact with the first surface of the molded product, and the first mold is Lowering the first surface of the molded product and the surface of the first mold by lowering the molded product. 2. A semiconductor device having a mold release step in which a support on which a semiconductor element is mounted is resin-sealed in a mold of a resin sealing apparatus to form a molded article, and the molded article is removed from the mold. In the manufacturing method, in the mold release step, the first surface of the molded product is fixed to the surface of the first mold, and the second surface of the molded product is placed in the second mold. The ejector pins provided are lowered and brought into contact with each other to raise the second die, and the first die and the molded product are lowered to move the second surface of the molded product to the second surface. A step of releasing the surface of the mold from the mold, a step of sandwiching the molded object between the first mold and the second mold again, and a step of clamping the second surface of the molded object to the second mold. With the surface fixed, the ejector pin provided in the first mold with respect to the first surface of the molded product
It raised to abut, together with lowering the first mold, the first surface and the first mold surface of the second mold and a molded product and the molded product is raised and And a step of releasing the mold. 3. The first mold is a lower mold, the second mold is an upper mold, and a first surface of the molded product is a surface in contact with the first mold. 3. The method according to claim 1, wherein the second surface of the object is a surface in contact with the second mold. 4. An ejector pin provided in a second mold with respect to a second surface of the molded product in a state where the first surface of the molded product is fixed by the surface of the first mold. The second mold is raised by lowering and making contact with the first mold.
In the step of lowering the mold and the molded product to release the second surface of the molded product and the surface of the second mold, the speed at which the second die is raised; The speed at which the first mold and the molded product are lowered is constant, and the second surface of the molded product is fixed to the surface of the second mold while the second surface of the molded product is fixed to the first surface of the molded product. Then, the ejector pins provided in the first mold are raised and brought into contact with each other to lower the first mold, and the second mold and the molded product are raised to form the molded product. In the step of releasing the first surface from the surface of the first mold, the speed at which the first mold is lowered and the speed at which the second mold and the molded product are raised are: 3. The method for manufacturing a semiconductor device according to claim 2, wherein the speed is constant.