JP3248213B2 - Panel switch manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a panel switch used for inputting operation of various electronic devices.

[0002]

2. Description of the Related Art In recent years, various electronic devices have been reduced in size and weight, and the demand for thin and lightweight panel switches has been increasing.

A method of manufacturing this type of panel switch is shown in FIG.
This will be described with reference to FIG. According to the drawing, the upper spacer 2 is formed on the lower surface of the upper sheet 1 by a conductive pattern, the lower contact 4 is formed on the upper surface of the lower sheet 6 corresponding to the upper sheet 1, and the insulating spacer is coated on both sides with an adhesive. The lower sheet 6 was bonded to the reinforcing plate 8 with a double-sided adhesive sheet 12.

Further, in order to give a feeling of operation of the switch, a metal diaphragm 14 is attached to the upper sheet 1 with a single-sided adhesive sheet 13.

[0005]

However, in the above configuration, the insulating spacer 11, the single-sided pressure-sensitive adhesive sheet 13 and the double-sided pressure-sensitive adhesive sheet 12 are all provided on both sides with release paper 10a.
Since it is necessary to attach the release papers 10a to 10e, it is necessary to peel off and release the release papers 10a to 10e by manual operation at the time of bonding. Further, since the panel switch has various shapes depending on the application, it is difficult to standardize and automate the peeling and pasting of the release papers 10a to 10e, and there is a drawback that the panel switch has to depend on a manual operation. Was.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a method of manufacturing a panel switch which can be easily automated and is inexpensive.

[0007]

SUMMARY OF THE INVENTION In order to solve this problem, the present invention is to form an upper contact with a conductive pattern on the lower surface of an upper sheet and to form a lower contact on the upper surface of the lower sheet corresponding to the upper sheet by a conductive pattern. A spacer insulating layer is formed on part or the whole surface except for the lower contact and the lower contact, and adheres to a part or the whole surface other than the contact on the lower surface of the upper sheet or the upper surface of the lower sheet at room temperature,
Form a thermoplastic adhesive layer that has no tackiness and has adhesiveness or tackiness at a temperature lower than the melting temperature of the upper and lower sheets, and the same thermoplastic adhesive is applied to the lower surface of the lower sheet or the upper surface of the reinforcing plate An agent layer is formed, and the upper sheet, the lower sheet, and the reinforcing plate are collectively pressed and heated and bonded to be integrated.

[0008]

According to the above method, there is no need to peel off the release paper manually because there is no adhesiveness or tackiness at room temperature, and the panel switch can be manufactured efficiently because it can be pressure-heated and bonded together. , Thinner and lighter, and improved workability.

[0009]

1 shows an embodiment of a panel switch according to the present invention.
This will be described with reference to FIG.

First, the outline of the panel switch of the present invention will be described. Note that the same parts as those in the conventional example will be described by giving the same numbers.

Referring to FIG. 1, reference numeral 1 denotes an upper sheet having an upper contact 2 formed on a lower surface by printing, and an upper sheet 1 provided with the upper contact 2 is formed in a diaphragm shape. 3
Is a first adhesive layer, which does not have adhesiveness and tackiness at room temperature, and is printed by a thermoplastic material having adhesiveness and tackiness lower than the melting temperature of the upper sheet 1 and a lower sheet 6 described below. Is formed. 6 is a lower sheet provided with a lower contact 4 at a position corresponding to the upper contact 2 on the upper surface, 5 is a spacer insulating layer formed by printing on the lower sheet 6, and 7 is a lower surface of the lower sheet 6 First adhesive layer 3 provided
Reference numeral 8 denotes a second adhesive layer formed by printing using the same thermoplastic material as described above, and reference numeral 8 denotes a reinforcing plate bonded by the second adhesive layer 7.

The first adhesive layer 3 and the second adhesive layer 7
By forming the spacer insulating layer 5 by the same screen printing or the like, the productivity of panel switches can be improved.

First adhesive layer 3 and second adhesive layer 7
Of rubbers such as polyester resin, polyvinyl chloride resin, polyvinyl acetate resin, ethylene-vinyl acetate copolymer, polyurethane resin, phenoxy resin, polystyrene resin and chloroprene rubber, acrylonitrile rubber, styrene butadiene rubber, natural rubber, etc. When one or two or more kinds are mixed or modified and formed by screen printing or the like, the resin is dissolved in an organic solvent such as isophorone, carbitol, or cyclohexanone, and further, if necessary, titanium oxide, silica, It is formed by adding an extender pigment such as talc and printing.

The bonding conditions must be selected according to the heat melting temperature of the adhesive, but are generally 0.5 to 60 kg / cm ² ,
70-80 ° C for 3 seconds to 3 minutes is appropriate.

For efficient bonding in a short time, it is desirable to set the heat melting temperature higher by 5 to 90 ° C. on the side where the heating plate is applied, but this is insulated by the upper and lower sheets 1 and 6 and the spacer insulating layer 5. 1st adhesive layer 3 and 2nd
This is because a temperature difference occurs in the heating temperature of the adhesive layer 7 of FIG.

In the case of bonding in a shorter time, the bonding can be performed in 0.1 to 2 seconds by using an ultrasonic heater.

A specific embodiment will be described below. Example 1 A biaxially stretched polyethylene terephthalate sheet (material thickness 120 μm) was used as the upper sheet 1, and the first adhesive layer 3 was formed on the lower surface by screen printing except for the upper contact 2. The first adhesive layer 3 was kneaded with three rolls having the composition shown in (Table 1).

[0018]

[Table 1]

Further, an upper contact 2 (conductive ink; Fujikura Kasei Kogyo Co., Ltd., XA-256) was formed in the same manner, and formed into a hemispherical mold in the upper surface direction in order to maintain the operational feeling as a switch. .

Next, the lower sheet 6 is made of a biaxially stretched polyethylene terephthalate sheet (75 μm in thickness), and the lower contact 4 (conductive ink; XA-Fujikura Kasei Kogyo Co., Ltd.) 256), spacer insulating layer 5
(Resist ink: Fujikura Kasei Kogyo Co., Ltd. XB-803
A) and a second adhesive layer 7 was formed on the lower surface. The second adhesive layer 7 used had the following composition (Table 2).

[0021]

[Table 2]

The first adhesive layer 3 and the second adhesive layer 7 have a heat melting temperature of 110 ° C. and 135 ° C., respectively, and have no adhesiveness or tackiness at room temperature.

Next, the upper sheet 1, the lower sheet 6, and the aluminum sheet having a thickness of 0.5 mm are superimposed on each other, and 150 ° C. is applied from the aluminum sheet side under a pressure of 10 kg / cm ² except for the forming portion of the upper sheet 1. After heating for 5 seconds, a panel switch according to the present invention was obtained.

This panel switch has a good adhesion state, and has no problem in appearance, adhesion state, and electrical even after the switch section is operated 200,000 times.

(Example 2) The upper sheet 1, the lower sheet 6, and the reinforcing plate 8 were subjected to ultrasonic welding from the upper sheet 1 side except for the forming portion. The shape of the ultrasonic horn on the upper sheet 1 side was a jagged shape with irregularities having a pitch of 0.5 mm and a depth of 0.3 mm so that ultrasonic waves could be efficiently propagated. This panel switch was good in both the adhesive state and the operating life as in (Example 1).

In each of the above embodiments, the first adhesive layer 3 is printed on the upper sheet, and the second adhesive layer 7 is printed on the lower sheet, but the first adhesive layer 3 is printed on the lower sheet. The second adhesive layer 7 may be printed on the reinforcing plate 8 on 6 to constitute the panel switch of the present invention.

[0027]

As described above, according to the present invention, an upper contact is formed by a conductive pattern on the lower surface of an upper sheet, and a lower contact formed by the conductive pattern and a part excluding the lower contact are formed on the upper surface of the lower sheet corresponding to the upper sheet. Or, a spacer insulating layer is formed on the entire surface, and has no adhesiveness or tackiness at room temperature on a part or the whole surface except for the contact on the lower surface of the upper sheet or the upper surface of the lower sheet, and at a temperature lower than the melting temperature of the upper and lower sheets. A first thermoplastic adhesive layer having adhesiveness or tackiness is formed, and a similar second thermoplastic adhesive layer is formed on the lower surface of the lower sheet or the upper surface of the reinforcing plate. By simultaneously applying pressure and heat to the sheet and the reinforcing plate, it is possible to provide a panel switch that can be made thinner and can be bonded together, and that can be easily automated.

[Brief description of the drawings]

FIG. 1 is a sectional view of a panel switch according to an embodiment of the present invention before bonding.

FIG. 2 is a cross-sectional view after the bonding.

FIG. 3 is a cross-sectional view of a conventional panel switch before pasting.

FIG. 4 is a cross-sectional view after the attachment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Upper sheet 2 Upper contact 3 First adhesive layer 4 Lower contact 5 Spacer insulating layer 6 Lower sheet 7 Second adhesive layer 8 Reinforcement plate

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-58-178925 (JP, A) JP-A-3-241623 (JP, A) JP-A-57-55018 (JP, A) JP-A-60-1985 151914 (JP, A) JP-A-61-114419 (JP, A) JP-A-61-8818 (JP, A) JP-A-60-152231 (JP, U) JP-A-2-79525 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01H 11/00 H01H 13/70

Claims (4)

(57) [Claims] Claims: 1. A form having an inversion operation feel.
Forming an upper contact at the contact portion of the upper sheet , forming a lower contact on the upper surface of the lower sheet corresponding to the upper sheet, and forming a spacer insulating layer on a part or entire surface excluding the lower contact; Alternatively, a thermoplastic first adhesive layer having adhesiveness or tackiness at a temperature lower than the melting temperature of the upper and lower sheets is formed on a part or the entire surface other than the contact points on the upper surface of the lower sheet . Forming a thermoplastic second adhesive layer having adhesiveness or tackiness at a temperature lower than the melting temperature of the upper and lower sheets on the upper surface of the reinforcing plate, and sequentially stacking the upper sheet, the lower sheet, and the reinforcing plate, The first adhesive layer and the second
A method for manufacturing a panel switch, wherein a temperature difference is provided in a heat melting temperature of an adhesive layer, and pressure bonding is performed to form an integrated body. 2. The method according to claim 1, wherein the heating under pressure is performed from the reinforcing plate side.
The method for manufacturing a panel switch according to claim 1, wherein 3. A process according to claim 1 or 2 The method of manufacturing the panel switch, wherein the using the ultrasonic heating to heat bonding. 4. A first adhesive layer, second adhesive layer, any one of the claims 1-3, characterized in that the contacts of the upper and lower sheets and the spacer insulating layer is formed by screen printing
Method of manufacturing a panel switch according to.