JP3246834B2 - Electronic device housing structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing for an electronic device, wherein the housing for housing an electronic circuit package is cooled by natural convection of air, and the housing is protected from electromagnetic waves. Regarding body structure.

[0002]

2. Description of the Related Art FIGS. 5 to 8 show a conventional housing structure of this kind.

[0005] As shown in FIG. 5, this housing is configured by arranging a plurality of housing portions 1 in a vertical direction, and a motherboard 2 provided in each housing portion 1 includes a package. The electronic circuit package 5 is connected via the connector 3 and the motherboard connector 4.

A ventilation panel 7 having a plurality of air inlets 7a is mounted on the lower front surface of the housing 1, and an air outlet 8 is provided on the upper rear surface of the housing 1. Have been. An air inlet 7 is provided below the housing 1.
a convection guide plate 10 for guiding air taken in from a to a direction toward an opening 9 a formed in the lower surface 9 of the housing 1, and provided above the housing 1 through the housing 1. A convection guide plate 13 for guiding air discharged from an opening 11 a formed in the upper surface 11 of the housing 1 in a direction toward the air outlet 8.
Is provided.

Therefore, as shown in FIG. 6, the cold outside air taken in from the lower side surface of the casing 1 rises in the casing 1 by natural convection and cools the electronic circuit package 5 and is heated. The air is exhausted from the upper side surface of the housing 1.

In this case, the entire case is formed of a conductive material in order to protect the electronic circuit package 5 from electromagnetic interference. The air inlet 7a is provided with a shield member 15 so that electromagnetic waves do not enter from the air inlet 7a, and the air outlet 8 is provided with a shield member 16 in the same manner.

According to the conventional housing structure, when the shielding meshes of the shield members 15 and 16 provided at the air inlet 7a and the air outlet 8 are made fine to enhance the shielding effect, the air inlet 7a and the air outlet are reduced. 8 reduces the heat radiation capacity due to natural convection of air, and conversely, if heat dissipation is emphasized, the mesh of the shield mesh becomes coarse and the shield property deteriorates. Was.

This will be described by taking the ventilation panel 7 as an example. As shown in FIG. 7, the ventilation panel 7 is provided with n air inlets 7a having a vertical width h and a horizontal width w. The ventilation area A is w × h × n. However,
Since the shield member 15 is provided in these air inlets 7a, an area corresponding to the area occupied by the member of the shield member 15 is as follows.
The ventilation area will be reduced. That is, assuming that the opening ratio of the shield material (the sum of the area s of the holes in the shield material / the total area of the shield material) is α, the actual ventilation area is A × α.
That is, if α is reduced, the shielding effect is improved, but the heat radiation capability is reduced. If α is increased, the heat radiation capability is not so reduced, but the shielding effect is reduced.

[0009]

As described above, in the conventional housing structure, there is a problem in that the heat radiation ability is reduced when the shielding effect is enhanced, and the shielding effect is reduced when the heat radiation ability is maintained to some extent. Was.

[0010] The present invention has been made to solve such a conventional drawback, and without reducing the heat radiation capability,
An object of the present invention is to provide a housing structure of an electronic device that can enhance a shielding effect.

[0011]

Housing structure of an electronic device according to the present invention, in order to solve the problem] is the chassis structure of an electronic device that houses the casing with an opening formed on both surfaces of the upper and lower housing the electronic circuit package, A first guide plate provided below the housing to guide air taken in from the air inlet in a direction along the lower surface in a direction toward an opening in the lower surface ;
Between the lower surface of the first and the first guide plate, the mounting area and
The product of the opening ratio and the total area of the air intake increases.
Position, the electromagnetic waves entering from the air intake are
Prevents intrusion into the housing or inside the housing
A first shielding material for blocking electromagnetic waves emitted from the part,
The upper part is provided above the housing part and passes through the inside of the housing part.
The air discharged from the opening in the surface in the direction along the upper surface.
A second guide plate for guiding and discharging the air from the air discharge port;
A mounting surface between the upper surface of the body and the second guide plate;
The product of the product and the opening ratio is larger than the total area of the air outlet.
At the position where
Preventing magnetic waves from entering the housing, or
Second shield that blocks electromagnetic waves emitted from inside the housing
And a material. Electronic device according to the present invention
The housing structure of the container accommodates the electronic circuit package and
A housing for an electronic device that houses a housing having an opening formed on a surface.
In the structure, an air intake provided below this housing
The air taken in the direction along the lower surface from
A first guiding plate for guiding in a direction toward an opening of the surface;
A mounting surface between the lower surface of the body and the first guide plate;
The product of the product and the opening ratio is larger than the total area of the air intake.
At the position where the
Preventing magnetic waves from entering the housing, or
First shield that blocks electromagnetic waves emitted from inside the housing
And a material. Electronic device according to the present invention
The housing structure of the container accommodates the electronic circuit package and
A housing for an electronic device that houses a housing having an opening formed on a surface.
In the structure, the housing portion provided above the housing portion
The air that passes through and is discharged from the opening of the upper surface.
Second invitation to guide in the direction along
A conductive plate, between an upper surface of the housing and the second guide plate;
The product of the mounting area and the opening ratio is the total surface of the air outlet.
Provided at a position larger than the product, and from the air discharge port.
Prevents invading electromagnetic waves from entering the housing
Or to block electromagnetic waves emitted from inside the housing
And a shielding material.

[0012]

According to the present invention, the first shield member is between the lower surface and the first guide plate of the casing, the mounting area of the first shield member
Where the product of と and the opening ratio is larger than the area of the air intake
It is provided in the place. Also, the second shield material is
Attachment of a second shield material between the upper surface and the second guide plate
The product of the area and the opening ratio is larger than the area of the air outlet.
It is provided at a position where Therefore, the area of the air intake is A
1. Mounting area of the first shield material is B1, first seal
Assuming that the aperture ratio of the metal material is α1, the range of A1 ≦ B1 × α1 is satisfied.
By determining α1, the intake capacity should not be impaired.
A good shielding effect can be obtained. Also, air outlet
A2, the mounting area of the second shield material is B2,
Assuming that the aperture ratio of the shield material of No. 2 is α2, A2 ≦ B2 ×
By determining α2 within the range of α2, the exhaust capacity can be improved.
The shield effect can be obtained without spoiling.

Accordingly, if the area of the air intake is A1, the area of the first shield member is B1, and the aperture ratio of the first shield member is α1, α1 is determined in the range of A1 ≦ B1 × α1. Thus, the first shield member can be attached without impairing the intake capacity.

Similarly, assuming that the area of the air outlet is A2, the mounting area of the second shield material is B2, and the aperture ratio of the second shield material is α2, α2 is determined within the range of A2 ≦ B2 × α2. By doing so, the second shield member can be attached without impairing the exhaust capability.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to FIGS.

FIGS. 1 to 3 are views for explaining a first embodiment. FIG. 2 is a partially cutaway perspective view of a housing of an electronic apparatus.
FIG. 3 is a sectional view taken along the line AA of FIG. 2, and FIG. 3 is an explanatory view showing the relationship between the cross section of the ventilation path and the shielding material.

The housing according to the present invention comprises a plurality of housing portions 21 arranged in the vertical direction, similarly to the conventional example.
As shown in FIGS. 1 and 2, a package connector 23 is provided on a motherboard 22 provided in each housing 21.
An electronic circuit package 25 is connected via a motherboard connector 24.

A ventilation panel 27 is attached to the lower front surface of the casing 21. The ventilation panel 27 has a plurality of air inlets 27a. An air outlet 28 is provided on the upper rear surface of the housing 21. The air inlet 27 is located below the housing 21.
a convection guide plate 3 for guiding the air taken in from direction a toward the opening 29 a formed in the lower surface 29 of the housing 21.
0 is provided above the housing portion 21 to guide air discharged through an opening 31 a formed in the upper surface 31 of the housing portion 21 through the housing portion 21 in a direction toward the air outlet 28. A convection guide plate 33 is provided.

Therefore, as shown in FIG. 1, the cold outside air taken in from the air inlet 27a on the lower side surface of the housing 21 rises in the housing 21 by natural convection and cools the electronic circuit package 25. Then, the heated air is supplied to the housing 21.
Is discharged from the air discharge port 28 on the upper side surface. The casing of the present example has the same dimensions as the casing of the conventional example. The total area of the air inlet 27a is the same as the total area of the conventional air inlet 7a, and the total area of the air outlet 28. Has the same size as the total area of the conventional air outlet 8. The total area of the air inlet 27a and the air outlet 28 is the same, and the air taken in from the air inlet 27a is discharged from the air outlet 28 without interruption after passing through the inside of the housing 21. Is done.

On the other hand, it is necessary to protect the electronic circuit package 25 from electromagnetic wave interference and to prevent the emission of electromagnetic waves in order not to hinder others, and the entire housing is formed of a conductive material.

A shield mesh is provided below the housing 21 so as to prevent electromagnetic waves having entered from the air inlet 27a from entering the housing 21 or to prevent electromagnetic waves emitted from the inside of the housing. A shield material 35 is provided. This shielding material 35 is used for the air intake 27a.
Is provided between the lower surface 29 of the housing 21 and the convection guide plate 30, which is a ventilation channel leading to the inside of the housing portion 21 from the air introduced into the housing portion 21. The shield member 35 is provided so as to approach the lower surface 29 which is the portion having the largest cross-sectional area.

Further, a shield mesh is provided above the housing portion 21 so as to prevent the electromagnetic waves having entered from the air discharge port 28 from entering the housing portion 21 or to prevent the electromagnetic waves emitted from the inside of the housing portion. A shield material 36 is provided. The shield member 36 is provided between the casing upper surface 31 and the convection guide plate 33, which are ventilation passages until the air discharged from the casing upper surface 31 is discharged from the air discharge port 28. In the present example, the shield member 36 is provided so as to be close to the upper surface 31 which is the portion having the largest cross-sectional area in the ventilation passage.

In the present embodiment, the ventilation panel 27 and the shield member 35 (36) are provided with the convection guide plate 30 (3)
The unit is attached to 3), and this unit can be attached to both the upper and lower sides of the housing 21.

Next, the operation of the housing structure will be described by taking the shield member 35 as an example.

As described above, the shield member 35 is closely attached to the lower surface, which is the portion having the largest cross-sectional area, of the air passage, and as shown in FIG. Is the total area A of the air inlet 27a (w × h
× n). Therefore, A ≦ B ×
If the aperture ratio α is selected within the range of α (α; the sum of the holes s of the shield member 35 / B), the shield member 35 can be attached without obstructing the air intake capacity of the air intake 27a. Similarly, the shield member 36 can be attached to the housing 21 without hindering the exhaust capability of the air outlet 28.

On the other hand, the heat radiation effect by natural convection of air is as follows.
It is determined by the area of the air inlet 27a and the air outlet 28. Therefore, by selecting the minimum α in the above-described range, the shielding performance can be improved without lowering the heat radiation effect.

FIG. 4 is a diagram for explaining a second embodiment of the present invention. In this example, the shield member 35 is slightly inclined with respect to the lower surface 29 of the housing 21. Shielding material 3
Even if 5 is provided with such an inclination, as long as A ≦ B × α is satisfied, the shielding performance can be improved without lowering the heat radiation effect. The same applies to the shield material 36.

[0028]

As described above, in the electronic device housing structure of the present invention, the first shield member is attached to the portion of the ventilation passage having a cross section larger than the area of the air inlet, and the air outlet is provided. Since the second shield member is attached to the portion of the ventilation flow channel having a cross section larger than the area of, the shielding performance can be improved without lowering the heat radiation effect.

[Brief description of the drawings]

FIG. 1 is a sectional view of a housing according to a first embodiment of the present invention.

FIG. 2 is a partially cutaway perspective view of the housing.

FIG. 3 is a diagram illustrating an operation of the housing.

FIG. 4 is a sectional view of a housing according to a second embodiment of the present invention.

FIG. 5 is a partially cutaway perspective view of a conventional housing.

FIG. 6 is a sectional view taken along line BB of FIG. 5;

FIG. 7 is a perspective view of a ventilation panel of the housing.

FIG. 8 is an enlarged view of a circle D in FIG. 7;

[Explanation of symbols]

Reference Signs List 21 housing part 25 electronic circuit package 27a air inlet 28 air outlet 29 lower surface 30 first convection guide plate 31 upper surface 33 second convection guide plate 35 first shield material 36 second shield material

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 9/00 H05K 7/20

Claims (3)

(57) [Claims] 1. An electronic circuit package is housed and both upper and lower sides are accommodated.
Case part with opening formed inAccommodatingElectronic device housing
In the structure, from the air intake provided below the housing portion to the lower surface
Directs the air taken in along the direction to the opening on the lower surface
Guide in the directionA first guide plate; Between the lower surface of the housing and the first guide plate,
The product of the mounting area and the opening ratio is the total area of the air intake
Installed at a position where the air intake is larger
To prevent electromagnetic waves from entering the housing.
Or a first sheath that blocks electromagnetic waves emitted from inside the housing.
Wood and The upper part is provided above the housing part and passes through the inside of the housing part.
The air discharged from the opening in the surface in the direction along the upper surface.
A second guide plate for guiding and discharging from an air discharge port; Between the upper surface of the housing and the second guide plate,
The product of the mounting area and the opening ratio is the total area of the air outlet.
Larger than the air outlet.
To prevent electromagnetic waves from entering the housing.
Or a second shield for blocking electromagnetic waves emitted from inside the enclosure.
Material and Have Electronic equipment housing characterized by the above-mentioned.
Construction. (2)Both sides of electronic circuit package
Housing of an electronic device that houses a housing with an opening formed in it
In the construction From the air intake provided below this housing,
Directs the air taken in along the direction to the opening on the lower surface
A first guide plate for guiding in the direction; Between the lower surface of the housing and the first guide plate,
The product of the mounting area and the opening ratio is the total area of the air intake.
Larger than the air inlet
To prevent electromagnetic waves from entering the housing.
Or a first system that blocks electromagnetic waves emitted from inside the housing.
Material and Electronic equipment housing characterized by comprising:
Construction. (3)Both sides of electronic circuit package
Housing of an electronic device that houses a housing with an opening formed in it
In the construction Provided above the casing, passing through the casing, and
Ejected from the surface opening Air in the direction along the top surface
A second guide plate for guiding and discharging from an air discharge port; A mounting surface between an upper surface of the housing and the second guide plate;
The product of the product and the opening ratio is larger than the total area of the air outlet.
At the position where
Preventing magnetic waves from entering the housing, or
Second shield that blocks electromagnetic waves emitted from inside the housing
Wood and A housing structure for an electronic device, comprising: