JP3242755U - Heat dissipation jacket with cooling liquid circulation structure - Google Patents

Abstract

The present invention relates to a heat radiation jacket having a cooling liquid circulation structure that improves the durability of heat radiation. A jacket body 1 includes a vest body 2, a front masking part connected to the waist of the vest body and extending from the waist to the abdomen, and a front masking part connected to the front masking part and extending to the shoulder of the vest body. and an elongated shoulder strap. The vest body includes a mezzanine and a pump storage bag 6. A pipe insertion hole 19 is formed on one side of the pump storage bag facing the user's back, the mezzanine and the pump storage bag are connected in a communicating state, and the mezzanine is attached to the shoulder strap. An electric wire outlet is formed at the connecting portion. The heat dissipation jacket further includes a cooling liquid circulation structure, which includes a cooling liquid storage bag, a pump and a semiconductor cooling device. A cooling liquid circulation system is formed by connecting the cooling liquid storage bag, the pump and the semiconductor cooling device with pipes, thereby improving the efficiency of heat dissipation. [Selection drawing] Fig. 1

Description

TECHNICAL FIELD This invention relates to a jacket, and more particularly to a heat dissipation jacket with a coolant circulation structure.

Working in a high-temperature working environment may affect the work efficiency and health of workers. For example, when welding work, welding is performed outdoors or in an open-air environment to ensure electrical safety. When working in a high-temperature work environment, there is a risk of affecting the worker's body. Specifically, it may affect workers' thermoregulation, water and salt metabolism, blood circulation, and the like. For example, workers sweating profusely can increase a worker's cardiovascular strain. When the working temperature exceeds the worker's tolerance, the efficiency of the work decreases and the worker's judgment may be impaired. This may expose workers to heat or affect their health.

It has been reported in various studies that devices worn by workers (e.g. heat-dissipating jackets) reduce the worker's body temperature when they work in hot environments where no air conditioner or other cooling device is provided. This is a subject that researchers are researching.

In order to prevent the heat stress effect from increasing the wear and tear of the physical fitness of the worker and making the worker sick when the worker works in a high-temperature work environment, researchers proposed various thermal jackets. Conventional heat-dissipating jackets typically lower the worker's body temperature by improving the worker's heat dissipation path. Specifically, the worker's body temperature is lowered by heat conduction, convection, radiation, evaporation, and the like. However, due to technical reasons, the conventional heat dissipation jacket has various drawbacks.

1. The heat-dissipating vest, which uses air compression means for cooling, has the drawbacks of high manufacturing cost, heavy weight, and affecting the movement of workers.
2. The heat-dissipating vest attached with the mini-fan can dry the sweat of the worker, dissipate heat, and lower the temperature, but the attachment of the mini-fan may make the heat-dissipating vest look unsightly. Also, the mini-fan attached to the heat dissipation vest cannot effectively lower the worker's temperature.
3. Cooling gel or similar materials can be injected into the heat dissipation vest as a cold source, but the cold source needs to be pre-cooled, and the cold heat source has a short duration of maintaining low temperature. has the drawback of
4. The conventional coolant storage bag for storing the coolant is a closed storage bag, so the coolant in the coolant storage bag cannot be replaced.

To overcome the shortcomings of the prior art, the purpose of this invention is to provide a heat dissipation jacket with a coolant circulation structure to improve the heat dissipation durability of the heat dissipation jacket.

In order to solve the above technical problems, the present invention provides a heat dissipation jacket with the following coolant circulation structure. The heat dissipation jacket with cooling liquid circulation structure of this invention includes a jacket body, the jacket body comprising a vest body, a front masking part connected to the waist of the vest body and extending from the waist to the abdomen, shoulder straps connected to the front masking portion and extending to shoulders of the vest body, the vest body including a mezzanine and a pump storage bag, one side of the pump storage bag facing the back of the user; is formed with a pipe insertion hole, the mezzanine and the pump storage bag are connected in a communicating state, and an electric wire outlet is formed at a portion where the mezzanine is connected to the shoulder strap,
the heat dissipation jacket further comprises a cooling liquid circulation structure, the cooling liquid circulation structure comprising a cooling liquid storage bag, a pump and at least one semiconductor cooling device;
The cooling liquid containing bag is mounted in the mezzanine, and a first opening is formed in an upper section of one side facing the outside of the cooling liquid containing bag, and a rigid liquid injection connection module is mounted in the first opening. wherein the liquid injection connection module is fixed to the cloth portion of the vest body, the liquid injection connection module includes a liquid recovery connector,
The pump is mounted in the pump housing bag, the liquid input pipe of the pump is connected to the bottom of the cooling liquid housing bag by a pipe connecting part, the liquid output pipe of the pump is delivered from the pipe insertion hole, The liquid output pipe extends to the back contact surface of the vest body, the back side surface of the front masking portion, and the back side surface of the shoulder strap, and the liquid output pipe is connected to the pump storage bag by the pipe insertion hole, and is used for collecting the liquid. extending to the top of the mezzanine to be connected to a connector;
The semiconductor cooling device is connected to the pipe of the cooling liquid circulation structure (300).

A second opening is formed in the pump storage bag, a first zipper is attached to the second opening, a third opening is formed in the mezzanine, and a second zipper is attached to the third opening. there is

the liquid injection connection module includes a plastic fitting, a screw cap and a plastic rotating part;
The plastic connector is attached to the first opening, the inner peripheral surface of the plastic connector is threaded,
the threaded lid is threaded onto the plastic fitting;
The plastic rotating part is rotatably attached to the screw lid, the back surface of the plastic rotating part is formed with waterproof silica gel, and the plastic rotating part is attached to the edge of the plastic connector by a flexible connection. When coupled, the threaded lid is tightly attached to the plastic connector so that the threaded lid presses against the plastic rotating part, thereby forming a leak-tight structure.

The cooling liquid storage bag is formed in a flat plate-like shape with a thin thickness.

A heat insulating layer is formed on the cloth placement surface of the mezzanine.

A flexible back protection plate is removably inserted into the mezzanine.

The semiconductor cooling device includes a superfluid case, a semiconductor cooling plate, a heat dissipation device and a fan,
A rotary separator is installed inside the superfluid case so that the liquid flowing into the superfluid case rotates and flows, and the liquid input and output ports of the superfluid case are the cooling liquid circulation structure (300). and the superfluid case is mounted on the vest body,
The semiconductor cooling plate is mounted on the superfluid case, and a sealed space is formed by the semiconductor cooling plate and the superfluid case,
the heat dissipation device is mounted on the superfluid case, the heat dissipation device abuts the semiconductor cooling plate;
The fan is mounted on the heat dissipation device by EVA glue, and the fan exhausts the internal air to the outside.

Zippered pockets are formed on the outside of the front masking part, respectively, and the electric wires of the pump pass through the mezzanine, are placed up to the shoulder strap by the electric wire outlet, and are finally fed into the pockets. , the electric wire of the pump is electrically connected to a control device, and the data line is connected to the input end of the control device.

The back contact surface of the vest body, the back side of the shoulder straps, and the back side of the two front masking portions are formed with wire arranging portions for determining the positions of the wires.

A tension spring is attached to the outer peripheral surface of the liquid output pipe near the pipe insertion hole.

In comparison with the prior art, the heat dissipation jacket having the cooling liquid circulation structure of this invention can achieve the effects of the following invention.
1. The heat-dissipating jacket of this invention uses the circulating liquid to dissipate heat, so that the durability of heat-dissipating can be improved.
2. The heat-dissipating jacket of this invention has the advantages of simple structure and convenient wearing.
3. The cooling liquid in the heat dissipation jacket can be replaced by attaching a liquid injection connection module to the heat dissipation jacket of this invention.
4. The semiconductor cooling device of this invention can improve the efficiency of heat dissipation and increase the speed of cooling down the temperature.

FIG. 4 is a schematic diagram of the back structure of the heat dissipation jacket with the cooling liquid circulation structure of the present invention; FIG. 4 is a structural view of the front part of the heat dissipation jacket with the cooling liquid circulation structure of the present invention; FIG. 3 is a diagram showing the structures of the cooling liquid storage bag, the back protection plate and the heat insulating layer in the heat dissipation jacket having the cooling liquid circulation structure of the present invention; FIG. 2 is a diagram showing a cooling liquid circulation structure of a heat dissipation jacket equipped with the cooling liquid circulation structure of this invention; 1 is a diagram showing a semiconductor cooling device of a heat dissipation jacket having a cooling liquid circulation structure of the present invention; FIG.

The technical matters related to the embodiments of this invention will be explained in more detail with reference to the drawings of this invention. Those skilled in the art can understand the features and effects of this invention in detail from the following description, and can clearly determine the scope of utility model registration claims of this invention. If there is no contradiction in combining the technical matters according to each embodiment of the present invention, the technical matters of each embodiment can be easily combined.

Embodiment 1 The specific structure of the heat dissipation jacket with cooling liquid circulation structure according to the first embodiment of the present invention is as follows.

Referring to FIGS. 1 to 5, the heat dissipation jacket with the cooling liquid circulation structure of this invention includes a jacket body 1. As shown in FIG. The jacket body 1 includes a vest body 2, a front masking part 12 connected to the waist of the vest body 2 and extending from the waist to the abdomen, and a vest body 2 connected to the front masking part 12 and extending from the waist to the abdomen. and a shoulder strap 14 extending to the shoulder of the body. The vest body 2 includes a mezzanine and a pump storage bag 6 . A pipe insertion hole 19 is formed in one surface of the pump storage bag 6 facing the back of the user, and the mezzanine and the pump storage bag 6 are connected in a communicating state. An electric wire outlet is formed at a portion where the mezzanine is connected to the shoulder strap.

The heat dissipation jacket further includes a cooling liquid circulation structure 300 , which includes a cooling liquid storage bag 13 , a pump 9 and at least one semiconductor cooling device 15 .

The coolant storage bag 13 is mounted inside the mezzanine. A first opening is formed in the upper region of one surface of the cooling liquid containing bag 13 facing the outside, and a rigid liquid injection connection module 3 is mounted in the first opening. The connection module for liquid injection 3 is fixed to the cloth portion of the vest body 2, and the connection module for liquid injection 3 includes a connection for liquid recovery.

The pump 9 is mounted in the pump containing bag 6, and the liquid input pipe 7 of the pump 9 is connected to the bottom of the cooling liquid containing bag 13 by a pipe connecting part. The liquid output pipe 8 of the pump 9 is delivered from the pipe insertion hole 19 and extends to the back contact surface of the vest body 2, the back surface of the front masking part 12 and the back surface of the shoulder strap 14. The liquid output pipe 8 is connected to the pump housing bag 6 through the pipe insertion hole 19 and extends to the upper part of the mezzanine so as to be connected to the liquid recovery connector.

The semiconductor cooling device 15 is connected to the pipe of the cooling liquid circulation structure 300 .

In a preferred embodiment of this invention, the pump storage bag 6 is formed with a second opening, and a first zipper 11 is attached to the second opening. A third opening is formed in the mezzanine, and a second zipper 4 is attached to the third opening.

In a preferred embodiment of this invention, the liquid injection connection module 3 includes a plastic connector 33 , a screw cap 31 and a plastic rotating part 32 .
The plastic connector 33 is attached to the first opening, and the inner peripheral surface of the plastic connector 33 is threaded.
The threaded lid 31 is screwed onto the plastic fitting 33 .
The plastic rotating part 32 is rotatably attached to the threaded lid 31 . Waterproof silica gel is formed on the back surface of the plastic rotating part 32 , and the plastic rotating part 32 is connected to the edge of the plastic connector 33 by a flexible connecting part 34 . The threaded lid 31 is tightly attached to the plastic connector 33 so that the threaded lid 31 pushes the plastic rotating part 32 . A leak-proof structure is thereby formed.

In a preferred embodiment of this invention, the cooling liquid storage bag 13 is shaped like a thin flat plate.

In a preferred embodiment of this invention, a heat insulating layer 21 is formed on the cloth placement surface of the mezzanine.

In the preferred embodiment of the invention, a flexible back protector 18 is removably inserted within the mezzanine.

In a preferred embodiment of the present invention, the semiconductor cooling device 15 includes a superfluid case 151 , a semiconductor cooling plate 152 , a heat dissipation device 153 and a fan 155 .

Since the rotary separator is installed inside the superfluid case 151, the liquid flowing into the superfluid case 151 can flow while rotating. Liquid input and output ports of the superfluid case 151 are connected to pipes of the cooling liquid circulation structure 300 . The superfluid case 151 is mounted on the vest body 2 .

The semiconductor cooling plate 152 is mounted on the superfluid case 151, and the semiconductor cooling plate 152 and the superfluid case 151 form a closed space.

The heat dissipation device 153 is mounted on the superfluid case 151 , and the heat dissipation device 153 contacts the semiconductor cooling plate 152 .

The fan 155 is mounted on the heat dissipation device 153 with an EVA adhesive 154, and the fan 155 can exhaust internal air to the outside.

In a preferred embodiment of this invention, the outside of the front masking portion 12 can each be formed with a zippered pocket. After passing through the mezzanine, the electric wire 10 of the pump 9 is arranged by the electric wire outlet up to the shoulder strap 14 and finally fed into the pocket. A wire 10 of the pump 9 is electrically connected to a control device 17, and an input end of the control device 17 is connected to a data line.

In a preferred embodiment of this invention, the back abutting surface of the vest body 2, the back surface of the shoulder strap 14, and the back surface of the two front masking portions 12 are formed with wire arranging portions for determining the position of the wires 10, respectively. It is

In a preferred embodiment of this invention, a tension spring 5 is attached to the outer peripheral surface of the liquid output pipe 8 near the pipe insertion hole 19 . The tension spring 5 can prevent the insertion portion of the liquid output pipe 8 inserted into the pipe insertion hole 19 from being damaged.

Embodiment 2 The heat dissipation jacket of this invention works as follows.
As shown in FIGS. 1-5, the plastic rotating part 32 is connected to the plastic fitting 33 by a flexible connection 34 to prevent the screwed lid 31 from falling off. The coolant can be injected into the coolant storage bag 13 by opening the screwed lid 31 . In this embodiment water is used as the coolant. By injecting water into the coolant storage bag 13, the cooling effect can be improved. In order to further improve the cooling effect, ice can be put in the coolant storage bag 13 .

A data line is connected to the rechargeable battery 16 and the rechargeable battery 16 can be stored in a pocket of the front masking portion 12 . Rechargeable battery 16 powers controller 17 and pump 9 , and controller 17 controls the operation of pump 9 . The rotation speed of the pump 9 can be controlled by the controller 17 having a multi-gear adjustment function. The pump 9 extracts the cooling liquid in the cooling liquid storage bag 13 and injects it into the liquid output pipe 8, and the liquid output pipe 8 is attached to the back side of the heat dissipation jacket. When the user wears the heat dissipation jacket of this invention, the liquid output pipe 8 contacts the user's skin. Therefore, the liquid output pipe 8 can absorb the heat of the user's back, abdomen, waist and shoulders, and the heat absorbed by the liquid output pipe 8 can be discharged through the mesh cloth of the heat dissipation jacket. . When the liquid output pipe 8 absorbs heat from the user's body, the temperature of the coolant in the liquid output pipe 8 increases, and the coolant with the increased temperature is sent to the semiconductor cooling device 15 .

The water flow passages in the semiconductor cooling device 15 are rotary flow passages. When water flows inside the case 151 , the back surface of the semiconductor cooling plate 152 absorbs the heat of the water and conducts the heat to the outer surface of the semiconductor cooling plate 152 . The heat dissipation device 153 absorbs the amount of heat conducted to the outer surface of the semiconductor cooling plate 152, and the fan 155 discharges the heat absorbed by the heat dissipation device 153 to the outside, thereby improving the heat dissipation efficiency of the heat dissipation device 153. . The semiconductor cooling device 15 discharges the water whose temperature has decreased, and the water discharged by the semiconductor cooling device 15 flows into the pump housing bag 6 through the liquid output pipe 8 . Thereby the water circulation system can carry out heat dissipation continuously. Therefore, the heat-dissipating jacket of this invention can achieve the user's desired temperature and avoid the user from being exposed to the heat.

Third Embodiment Between the two front masking parts 12 and between the two shoulder straps 14 of this invention, connecting buckles are installed respectively.

As described above, the heat-dissipating jacket of this invention can improve the durability of heat-dissipating by dissipating heat with the circulating liquid. The heat-dissipating jacket of this invention has the advantages of simple structure and convenient wearing. The coolant in the heat dissipation jacket can be replaced by attaching the connection module for liquid injection to the heat dissipation jacket of this invention. With the semiconductor cooling device of this invention, the efficiency of heat dissipation can be improved, and the speed of lowering the temperature can be improved.

Although preferred embodiments of this invention have been described above, the above-described embodiments are merely examples of this invention, and this invention is not limited to the configurations of the above-described embodiments. Engineers in this technical field can make design changes, improvements, substitutions, and modifications to the above-described embodiment within the scope of the invention, and even if they do, the utility model registration claim for this invention It is natural that the range of is included in the defined range.

1 jacket body 2 vest body 3 liquid injection connection module 4 second zipper 5 tension spring 6 pump storage bag 7 liquid input pipe 8 liquid output pipe 9 pump 10 electric wire 11 first zipper 12 front masking part 13 coolant storage bag 14 Shoulder Strap 15 Semiconductor Cooling Device 16 Rechargeable Battery 17 Controller 18 Back Protector 19 Pipe Insertion Hole 21 Thermal Insulating Layer 31 Threaded Lid 32 Plastic Rotator 33 Plastic Connector 34 Flexible Connector 151 Superfluid Case 152 Semiconductor Cooling Plate 153 Radiator 154 EVA adhesive 155 Fan 300 Coolant circulation structure

Claims (10)

A jacket body (1) comprising a vest body (2) and a front masking part (12) connected to the waist of said vest body (2) and extending from the waist to the abdomen. and shoulder straps (14) connected to the front masking part (12) and extending to the shoulders of the vest body (2), wherein the The vest body (2) includes a mezzanine and a pump storage bag (6), one surface of the pump storage bag (6) facing the back of the user is formed with a pipe insertion hole (19), the mezzanine and the pump storage. a bag (6) is connected in communication, and a wire exit is formed at the point where the mezzanine is connected to the shoulder strap;
the heat dissipation jacket further comprises a cooling liquid circulation structure (300), the cooling liquid circulation structure (300) comprising a cooling liquid storage bag (13), a pump (9) and at least one semiconductor cooling device (15);
The cooling liquid storage bag (13) is installed in the mezzanine, and a first opening is formed in an upper region of one side facing the outside of the cooling liquid storage bag (13), and a rigid liquid is formed in the first opening. A connection module for injection (3) is attached, the connection module for liquid injection (3) is fixed to the cloth portion of the vest body (2), and the connection module for liquid injection (3) is connected to a liquid recovery connector. including
The pump (9) is mounted in the pump storage bag (6), the liquid input pipe (7) of the pump (9) is connected to the bottom of the cooling liquid storage bag (13) by a pipe connecting piece, and the The liquid output pipe (8) of the pump (9) is delivered from the pipe insertion hole (19) and is connected to the back abutting surface of the vest body (2), the back surface of the front masking part (12) and the shoulder straps. (14), and the liquid output pipe (8) is connected to the pump storage bag (6) through the pipe insertion hole (19) and to the liquid recovery connector. extending to the top of the mezzanine;
A heat dissipation jacket with cooling liquid circulation structure, wherein the semiconductor cooling device (15) is connected to the pipe of the cooling liquid circulation structure (300). A second opening is formed in the pump storage bag (6), a first zipper (11) is attached to the second opening, a third opening is formed in the mezzanine, and a third opening is formed in the third opening. The heat dissipation jacket with cooling liquid circulation structure according to claim 1, characterized in that it is fitted with two zippers (4). Said liquid injection connection module (3) comprises a plastic fitting (33), a screw lid (31) and a plastic rotating part (32),
The plastic connector (33) is attached to the first opening, the inner peripheral surface of the plastic connector (33) is threaded,
said threaded lid (31) is screwed onto said plastic fitting (33),
The plastic rotating part (32) is rotatably attached to the screw lid (31), the back surface of the plastic rotating part (32) is formed with waterproof silica gel, and the plastic rotating part (32) is flexible. A connector (34) is connected to the peripheral edge of said plastic connector (33) and said screwed lid (31) is tightly attached to said plastic connector (33) such that said screwed lid (31) The heat-dissipating jacket with coolant circulation structure according to claim 1, characterized in that it pushes the plastic rotating part (32), thereby forming a leak-proof structure. 2. The heat-dissipating jacket having a cooling liquid circulation structure according to claim 1, wherein the cooling liquid storage bag (13) is formed in the shape of a thin flat plate. 2. The heat-dissipating jacket having a cooling liquid circulation structure according to claim 1, wherein a heat insulating layer (21) is formed on the cloth arrangement surface of the mezzanine. The heat dissipation jacket with cooling liquid circulation structure according to claim 1, characterized in that a flexible back protection plate (18) is detachably inserted into the mezzanine. The semiconductor cooling device (15) includes a superfluid case (151), a semiconductor cooling plate (152), a heat dissipation device (153) and a fan (155),
Since the rotary separator is installed inside the superfluid case 151, the liquid flowing into the superfluid case 151 rotates and flows through the liquid input and output ports of the superfluid case 151. is connected to the pipe of the cooling liquid circulation structure (300), the superfluid case (151) is mounted on the vest body (2),
The semiconductor cooling plate (152) is mounted on the superfluid case (151), and a closed space is formed by the semiconductor cooling plate (152) and the superfluid case (151),
The heat dissipation device (153) is mounted on the superfluid case (151), the heat dissipation device (153) abuts the semiconductor cooling plate (152),
2. Cooling according to claim 1, characterized in that said fan (155) is mounted on said heat dissipation device (153) by EVA glue (154), and said fan (155) expels internal air to the outside. A heat dissipation jacket with a liquid circulation structure. Zippered pockets are formed on the outside of the front masking part (12) respectively, and the electric wire (10) of the pump (9) passes through the shoulder strap (14) through the electric wire outlet after passing through the mezzanine. and finally fed into the pocket, the electric wire (10) of said pump (9) is electrically connected to a control device (17), and the input end of said control device (17) is connected to a data line. A heat radiating jacket having a cooling liquid circulation structure according to claim 1, characterized in that: The back contact surface of the vest body (2), the back surface of the shoulder strap (14), and the back surface of the two front masking parts (12) are formed with electric wire arrangement portions for determining the positions of the electric wires. A heat radiating jacket having the cooling liquid circulation structure according to claim 1. The cooling liquid circulation structure according to claim 1, characterized in that a tension spring (5) is attached to the outer peripheral surface of the liquid output pipe (8) near the pipe insertion hole (19). heat dissipation jacket.

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