JP3238919B2 - High-precision microparts manufacturing method using energy beam - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a high-precision micropart utilizing an energy beam, and more particularly, to manufacturing a plurality of mold holes by utilizing a lithography etching technique in a semiconductor process. The present invention relates to a method of stacking a plurality of mold holes, further utilizing an electroplating method, and manufacturing a required lead frame punch head using the mold holes.

[0002]

2. Description of the Related Art As a well-known method for manufacturing microparts, there is a method in which a workpiece is polished using an optical projection technique, and is manufactured by a micro-electric discharge machining technique. Since the dimensions are extremely fine, it is often impossible to manufacture the required microparts due to the problem of mechanical accuracy when manufactured by such a machining method.

According to a well-known machining method, first, a single or relatively simple fine part is manufactured, and then combined to form a plurality of fine parts, such as a punch head, an extruded plate, and a mold such as a mold plate. To manufacture. However, due to the effects of machine processing stress and residual stress, microparts manufactured by such a method often did not reach the required degree of dimensional accuracy.

[0004] In addition to the above-mentioned problems, fine microparts manufactured by a well-known machining method have a certain size in each of the dimensions of a mold to be manufactured due to a limitation of a machining tool. There has been a problem that there is a limit and it is not possible to achieve the precision required for semiconductor devices in general. According to the machining method, first, a single or relatively simple micropart is manufactured, and then combined to produce a die, such as a punch head, an extruded plate, and a template, composed of a plurality of microparts. In the course of manufacturing, a relatively large number of work stations was required to complete all manufacturing operations and form the required molds. The manufactured structure has a problem in that the pitch of two pins is relatively large and the number of pins is insufficient due to the mechanical structure in terms of the number of distribution pins per unit area. In addition, when manufacturing a high-pin-count micropart, there is a problem that processing is difficult. Each of these issues also had a detrimental effect on production costs and production time. As a result, the competitiveness of the product was greatly reduced.

FIG. 1 is a view showing the structure of a punch head manufacturing die manufactured by a known technique. In the figure, a template 1 shown at A has a plurality of guide holes 10.
0 is obtained through the micro electric discharge machining technique as shown in B, or as shown in C, the molds of the upper mold plate 12 and the lower mold plate 14 are manufactured by using optical projection optical projection polishing molding processing, and Are obtained in combination. See also FIG.
FIG. 2 shows a template attached with a punch head manufactured using the mold of FIG. It has a plurality of screw holes 28 and a plurality of insertion holes 29 on one fixing plate, the punch head 15 is inserted in the insertion hole 29, and a guide hole is formed along the inclined portion at one end of the punch head 10, A metal key 22 is provided at a contact position with the fixing plate 20, and the punch head 15 is coupled to the metal key 22 by the key groove 24,
A plurality of screw holes 26 are provided in the metal key 22 and screwed into screw holes 28 of the fixing plate 20.

A description has been given of a method of manufacturing a punch head mold by the above-described well-known machining method and a punch head manufactured by using the mold. Next, FIGS. 3 to 6
Please refer to. FIGS. 3 to 6 show a well-known technique for manufacturing a fine punch head part by using the irradiation of ultraviolet light or X light and by a lithography etching method in a semiconductor process. First, as shown in FIG.
One layer of photoresist 30 is applied on substrate 33, and mask 31 is placed on photoresist 30. Irradiation with ultraviolet light or X light 32 causes the pattern designed on the mask 33 to absorb or excite the ultraviolet light or X light 32 to obtain a necessary lead frame punch head 34 on the photoresist 30 (see FIG. 4). . As shown in FIG. 3, thereafter, as shown in FIG. 5, an electroplating operation is performed on the lead frame punch head 34 to form a plated metal 35 layer on the lead frame punch head 34, and the above operation is performed. Is completed, the substrate 33 and the lead frame punch head 34 are removed, and the lead frame mold 3 is removed.
A plated metal 35 having 51 is obtained. That is, it is as shown in FIG.

[0007]

SUMMARY OF THE INVENTION An object of the present invention is to provide a kind of high-precision micropart manufacturing method using an energy beam, which uses a lithography etching technique in a semiconductor process for manufacturing microparts and a lithography. In this step, it is assumed that the method is such that a high-density, high-precision punch head module for manufacturing a lead frame can be manufactured by installing a common mask.

[0008]

According to a first aspect of the present invention, a lower photoresist layer is formed on a substrate, a conductive layer is formed on the lower photoresist layer, and an upper photoresist layer is formed on the conductive layer. Then, on this substrate, the lower photoresist layer, the conductive layer, an ultraviolet light mask is placed on the structure composed of the upper photoresist layer and irradiated with ultraviolet light, the pattern is transferred to the upper photoresist layer, and further the After the etching and the subsequent electroplating, the remaining upper photoresist layer is removed, the portion exposed to the outside of the conductive layer is etched to form a necessary mold hole, and then further irradiated with X light,
Lithography and etching of the lower photoresist layer are performed, and then the second electroplating is performed to form a micropart in the formed second electroplating layer.
The microparts are used as a lead frame punch head, and the required pattern is formed by lithography and etching using ultraviolet light on the upper photoresist layer, and the electroplating immediately thereafter can be operated by a sputtering method and replaced with gold or gold An electroplating layer of an appropriate pattern composed of various materials is formed, and the remaining photoresist layer is removed and the exposed portion of the conductive layer is etched using a physical or chemical method. Exposure and development are performed on the lower photoresist layer exposed to the outside without being coated, and etching is progressed to leave a portion of the lower photoresist layer that has not been exposed to X light. The layer and the substrate are removed and only the remaining lower photoresist layer, which reveals a pattern as appropriate, is retained. The presence under the photoresist layer, multiple,
Aligning and stacking, forming a serious groove of required height and a photoresist layer under the overlap to form a mold for manufacturing a lead frame punch head, and then proceeding with the second electroplating to form the lead frame punch head A method for manufacturing a high-precision micropart using an energy beam is to obtain a lead frame punch head by superposing a metal on a manufacturing mold and then removing the mold. The invention of claim 2 includes the following steps a to o: a. Forming a lower photoresist layer on the substrate; b. Forming a conductive layer on the lower photoresist layer; c. Forming an upper photoresist layer on the conductive layer; d. Placing an ultraviolet light mask over the structure composed of the substrate, lower photoresist layer, conductive layer and upper photoresist layer; e. Irradiating the upper photoresist layer with ultraviolet light to transfer the pattern of the ultraviolet light mask to the upper photoresist layer; f. Forming a mold cavity in the upper photoresist layer by etching; g. Filling an electroplating material in the mold cavity using a sputtering technique to form an electroplating layer; h. Removing the remaining upper photoresist layer and the portion of the conductive layer that is not covered by the electroplated layer by using an etching technique; i. Irradiating a structure composed of the substrate, the lower photoresist layer, the conductive layer, and the electroplated layer with X light and performing exposure and development on the lower photoresist layer; j. Removing the exposed and developed portions of the lower photoresist layer using an etching technique to leave a residual lower photoresist layer; k. Removing the electroplated layer, conductive layer and substrate to retain only the remaining lower photoresist layer having a slightly appropriate pattern, l. Performing the above-mentioned steps a to k in duplicate to prepare a plurality of remaining remaining photoresist layers having the reserved appropriate patterns, m. Stacking a plurality of reserved lower photoresist layers having the appropriate pattern in precise alignment, and placing one template at the bottom; n. Using electroplating technology to fill the recesses formed in the stacked remaining lower photoresist layer with an electroplated structure, o. Removing the remaining bottom photoresist layer which has been stacked, comprising the above steps, and forming an electroplated structure obtained as described above, thereby forming a micropart component having a punch head template and a lead frame punch head. And a high-precision micropart manufacturing method using an energy beam.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the present invention, a lower photoresist layer, a conductive layer and an upper photoresist layer are formed on a substrate composed of components which are not changed by light irradiation, and further, on the upper photoresist layer, A thin ultraviolet light mask having a glass structure with a pattern is installed, and one mold hole is manufactured in the upper photoresist layer by the steps of ultraviolet light irradiation, exposure, development, and etching, and the mold hole is subjected to metal plating by electroplating. To remove the remaining upper photoresist layer, and to remove the exposed conductive layer that is not covered with the metal filled by electroplating, and then perform X light irradiation, exposure, and etching to provide an appropriate pattern as required. A remaining lower photoresist layer is obtained. After aligning and superimposing the remaining lower photoresist layer to a required height, electroplating is performed to form an electroplating structure, and the superposed lower photoresist layer is removed to form an electroplating structure, that is, required micro parts. To win.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a high-precision micropart utilizing an energy beam is an invention obtained by operating semiconductor manufacturing technology. In the semiconductor manufacturing technology, there are steps such as crystal oxidation, diffusion, superimposition and photoresist, mask layout, and lithography etching. In these semiconductor manufacturing steps, the current technology already has a minimum line width of 0.25 μm. It is the subject of the present invention to operate such highly dense and fine technologies and to produce high-density microparts, to the following degree:

Please refer to FIG. 7 to FIG. These drawings are step diagrams of the embodiment of the present invention. In the step of FIG. 7, a lower photoresist layer 412 is provided on the substrate 410. The component of the lower photoresist layer 412 is a high-molecular polymer, and acrylic is used in this embodiment. On the lower photoresist layer 412, a conductive layer 414 made of a thin and conductive material is provided. The material used for the conductive layer 414 is generally copper laid out by a sputtering method. After the conductive layer 414 composed of copper is formed on the lower photoresist layer 412, an upper photoresist layer 416 is further formed on the conductive layer 414. After the above steps are completed, an ultraviolet light mask 418 is placed on this structure, and then a structure required for X-light etching is first manufactured.

As described above, the substrate 410, the lower photoresist layer 412, the conductive layer 414, and the upper photoresist layer 41
6 is formed, and an ultraviolet light mask 418 is formed thereon.
Is installed. Further, as shown in FIG. 8, ultraviolet light 425 is irradiated from above the ultraviolet light mask 418. The ultraviolet light mask 418 is a general mask, that is, a chromium layer having an appropriate pattern is laid out in a structure mainly composed of glass. After irradiation with the ultraviolet light 425, the ultraviolet light mask 41
8, the upper photoresist layer 416 is exposed. The upper photoresist layer 416 has a structure mainly composed of a polymer material, and is required to be sufficiently flat and transparent during the manufacturing process. Similarly, planarization requirements exist for the lower photoresist layer 412, the conductive layer 414, and the substrate 410, but such requirements are easily met by current technology.

The upper photoresist layer 416 contains a photosensitive material, and is irradiated with ultraviolet light 425 so that the ultraviolet light
The eighteen patterns are transferred to the upper photoresist layer 416. In addition, the photosensitive material contained in the upper photoresist layer 416 is sensitive to the ultraviolet light 425, and is absorbed by the ultraviolet light 425 or excited by irradiation of the ultraviolet light 425, so that a development operation reaction occurs in the upper photoresist layer 416. . The operation of development on the upper photoresist layer 416 is generally called an exposure step.

The ultraviolet light mask 418 in FIG. 8 has a glass structure having an appropriate pattern, and the setting of the appropriate pattern is precisely drawn by a computer drawing program. By using a computer drafting program to produce the required pattern, we can achieve the required degree of accuracy,
A required punch head can be manufactured by combining this with the lithography etching technique.

FIG. 9 shows an electroplating layer 43 obtained by further performing an etching process after the exposure lithography step of FIG. 8 and performing electroplating on the etched portion.
3 and the electroplating layer 433 is
14 shows a structure obtained by being structurally connected to the substrate 14 and then removing the remaining photoresist 416 ′ of the upper photoresist layer 416 by etching. Among them, the conductive layer 41
4 provides an electrode position for electroplating ion deposition as the electroplating operation proceeds. That is, the structure of FIG. 9 has a substrate 410 as a bottom layer, a lower photoresist layer 412 thereon, and a thin conductive layer 414 on the lower photoresist layer 412.
And an electroplating layer 4 having an appropriate pattern thereon.
33 is formed.

After completing the above electroplating steps,
A portion of the conductive layer 414 which is not covered with the electroplating layer 433 and is exposed to the outside is removed by etching. The etching in this step is performed by the conductive layer 414 having a metal structure.
However, the process proceeds by a physical or chemical method that does not cause any effect on the lower photoresist layer 412. FIG. 10 shows a structure obtained after etching the conductive layer 414 in this manner. That is, the lower photoresist layer 412 is provided on the substrate 410, and the remaining conductive layer 414 ′ having an appropriate pattern and the electroplating layer 433 thereover are provided on the lower photoresist layer 412. The remaining conductive layer 414 ′ and the electroplating layer 433 are X
Since the lower photoresist layer 412 is made of a material that generates exposure by X-ray irradiation, when the structure is irradiated with X-light 447 as shown in FIG. The presence of the layer 414 ′ and the electroplating layer 433 allows the appropriate pattern to be directly
2 and an appropriate pattern appears on the lower photoresist layer 412.

After the exposure operation of the lower photoresist layer 412,
The etching of the lower photoresist layer 412 proceeds,
The resulting structure is shown in FIG. That is, on the substrate 410, an appropriate pattern in which the electroplating layer 433, the remaining conductive layer 414 ', and the remaining lower photoresist layer 412' appear is formed, and the serious groove 4 is formed in the portion removed by etching.
55 are formed. Of the structure shown in FIG.
All we need is the remaining lower photoresist layer 41
This is the 2 'part. Therefore, after the structure of FIG. 11 is completed, the substrate 410, the electroplating layer 433, and the remaining conductive layer 41 are removed from the structure of FIG.
4 'is removed, leaving only the remaining lower photoresist layer 412'. The remaining lower photoresist layer 41 thus obtained
2 'is shown in FIG.

Since the lead frame punch head required by us is relatively large in structure, even if the remaining lower photoresist layer 412 'obtained by the above manufacturing method is operated,
Although we can get the leadframe configuration we need, we operate alignment methods because the structure is not long enough to use. That is, the remaining lower photoresist layer 412 'having the appropriate lead frame punch head pattern shown in FIG. 12 is accurately aligned and stacked in accordance with the required height and standard, thereby obtaining the required standard mode. One electrode plate 470 is provided under the remaining lower photoresist layer 412 ′ to be superimposed, the electrode plate 470 supports the structure thereon, and the electrodes necessary for electroplating when manufacturing a punch die. Make a plate.

Please refer to FIG. After the completion of the alignment of the remaining lower photoresist layer 412 ′ shown in FIG. 13, the electroplating operation is performed to manufacture a necessary punch die. Among them, the electrode plate 470 in FIG. 13 is used for depositing electrolytic ions in this electroplating operation. In this electroplating work, the most suitable electrolytic solution is selected and used after understanding the physical structure of the metal, alloy, etc., so that the punch mold thus manufactured can achieve the required cost performance during use. Then, a metal structure, that is, a mold 480, that meets the work requirements is formed. FIG. 15 shows that after the electroplating step in FIG. 14, the remaining lower photoresist layer 412 ′ and the electrode plate 470 that have been superimposed are removed to obtain only the mold 480. The mold 480 has an appropriate pattern structure, and the pattern is exposed by the recess 492.

The light used in the present invention is ultraviolet light or X light. In order to produce more precise and fine parts with the progress of the era in practical operation, we will develop and manufacture future technologies. Under the above requirements, it is possible to manufacture microparts using higher level or more precise energy beams, and currently available usable beams include electron beam (E-beam) or ion beam. There is an energy beam such as a beam.

FIG. 16 shows an embodiment of a micropart product manufactured by the present invention. That is, a plurality of lead frame punch dies 52 are attached to one punch head template 50. As shown in FIG. 16, the microparts manufactured according to the present invention achieve the requirements of high precision and high density, and have a clear advancement and novelty as compared with products manufactured by known techniques. ing.

[0022]

The present invention provides a kind of high-precision micropart manufacturing method using an energy beam, in which a lithography etching technique in a semiconductor process is applied to micropart manufacturing, and a uniform mask is formed in a lithography step. This method is capable of manufacturing a high-density, high-precision punch head module for manufacturing a lead frame by installing the module.

[Brief description of the drawings]

FIG. 1 is a view showing a structure of a template of a lead frame punch head manufactured by a known machining technique.

FIG. 2 is a perspective view of a lead frame punch head manufactured using the technique of FIG.

FIG. 3 is a step display diagram of another known technique.

FIG. 4 is a step display diagram of another known technique.

FIG. 5 is a step display diagram of another known technique.

FIG. 6 is a step display diagram of another known technique.

FIG. 7 is a step display diagram of the present invention.

FIG. 8 is a step display diagram of the present invention.

FIG. 9 is a step display diagram of the present invention.

FIG. 10 is a step display diagram of the present invention.

FIG. 11 is a step display diagram of the present invention.

FIG. 12 is a step display diagram of the present invention.

FIG. 13 is a step display diagram of the present invention.

FIG. 14 is a step display diagram of the present invention.

FIG. 15 is a step display diagram of the present invention.

FIG. 16 is a structural diagram of an embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 mold plate 10 guide hole 12 upper mold plate 14 lower mold plate 15 punch head 16 tip 18 inclined portion 20 fixing plate 22 metal key 24 key groove 26 screw hole 28 screw hole 29 insertion hole 30 photoresist 31 mask 32 ultraviolet ray 33 substrate 34 lead Frame punch head 35 Plating metal 351 Lead frame mold 410 Substrate 412 Lower photoresist layer 414 Conductive layer 416 Upper photoresist layer 418 Ultraviolet light mask 425 Ultraviolet light 433 Electroplate layer 435 Mold hole 416 ′ Residual photoresist 414 ′ Residual conductive layer 447 X light 412 ′ Residual lower photoresist layer 455 Serious groove 470 Punch template 480 Die 492 Recess 52 Lead frame punch die 50 Punch head template

──────────────────────────────────────────────────続 き Continuation of front page (51) Int.Cl. ⁷ Identification symbol FI // B21D 28/00 B21D 28/00 B (56) References JP-A-6-207293 (JP, A) JP-A-7- 81069 (JP, A) JP-A-7-263379 (JP, A) JP-A-9-90609 (JP, A) JP-A-6-89848 (JP, A) JP-A-5-4232 (JP, A) JP-A-6-212477 (JP, A) JP-A-8-117885 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B81C 1/00 B21D 37/20 B23K 15/00 C23F 4/00 C25D 7/00 B21D 28/00

Claims (2)

(57) [Claims] 1. A lower photoresist layer is formed on a substrate, a conductive layer is formed on the lower photoresist layer, an upper photoresist layer is formed on the conductive layer, and the substrate, the lower photoresist layer, and the conductive layer are formed. After placing an ultraviolet light mask on the structure composed of the upper photoresist layer and irradiating with ultraviolet light, transferring the pattern to the upper photoresist layer, and further proceeding with etching and subsequent electroplating on the upper photoresist layer,
The remaining upper photoresist layer is removed, and the portion exposed to the outside of the conductive layer is etched to form a required mold hole. Thereafter, X light is further irradiated, and lithography and etching of the lower photoresist layer are performed. A method for manufacturing a high-precision microparts using an energy beam, wherein the microparts are composed of a second electroplating layer formed by electroplating, wherein the microparts are used as a lead frame punch head, and the ultraviolet light is applied to the upper photoresist layer. The required pattern is formed by lithography and etching using, and in the immediately after electroplating, an appropriate pattern of electroplating layer composed of gold or a material that can be replaced by gold is formed by operating the sputtering method, and the remaining photoresist is formed. Physical removal and removal of exposed portions of conductive layers After exposure and development of the lower photoresist layer exposed to the outside without being covered with the conductive layer by X-ray irradiation using a target or a chemical method, the etching proceeds and the lower photoresist layer is not exposed to the X light of the lower photoresist layer. The portion is left, the electroplated layer, the remaining conductive layer, and the substrate are removed by an appropriate method, and only the remaining lower photoresist layer that appropriately exposes the pattern is retained.
Aligning and stacking, forming a serious groove of required height and a photoresist layer under the overlap to form a mold for manufacturing a lead frame punch head, and then proceeding with the second electroplating to form the lead frame punch head A method for manufacturing a high-precision micropart using an energy beam, in which a metal is superimposed on a mold for manufacturing, and the mold is removed to obtain a lead frame punch head. 2. Each of the following steps a to o: a. Forming a lower photoresist layer on the substrate; b. Forming a conductive layer on the lower photoresist layer; c. Forming an upper photoresist layer on the conductive layer; d. Placing an ultraviolet light mask over the structure composed of the substrate, lower photoresist layer, conductive layer and upper photoresist layer; e. Irradiating the upper photoresist layer with ultraviolet light to transfer the pattern of the ultraviolet light mask to the upper photoresist layer; f. Forming a mold cavity in the upper photoresist layer by etching; g. Filling an electroplating material in the mold cavity using a sputtering technique to form an electroplating layer; h. Removing the remaining upper photoresist layer and the portion of the conductive layer that is not covered by the electroplated layer by using an etching technique; i. Irradiating a structure composed of the substrate, the lower photoresist layer, the conductive layer, and the electroplated layer with X light and performing exposure and development on the lower photoresist layer; j. Removing the exposed and developed portions of the lower photoresist layer using an etching technique to leave a residual lower photoresist layer; k. Removing the electroplated layer, conductive layer and substrate to retain only the remaining lower photoresist layer having a slightly appropriate pattern, l. Performing the above-mentioned steps a to k in duplicate to prepare a plurality of remaining remaining photoresist layers having the reserved appropriate patterns, m. Stacking a plurality of reserved lower photoresist layers having the appropriate pattern in precise alignment, and placing one template at the bottom; n. Using electroplating techniques to fill the recesses formed in the stacked remaining lower photoresist layer with an electroplated structure, o. Removing the remaining lower photoresist layer which has been stacked, comprising the above steps, and forming an electroplated structure obtained as described above, thereby forming a micropart component having a punch head template and a lead frame punch head. , High-precision micro parts manufacturing method using energy beam.