JP3238527U - Computer host and computer casing assembly - Google Patents

Abstract

Kind Code: A1 The present disclosure provides a computer host and computer casing assembly that allows attachment of a motherboard to a computer casing and removal of the motherboard from the computer casing in a safe and convenient manner.
A computer host includes a casing, an auxiliary assembly, and a motherboard. The casing includes a support plate and multiple mounting pillars. A plurality of mounting pillars protrude from the support plate. The auxiliary assembly includes at least one positioning member. A positioning member is attached to the casing. The height by which the positioning members protrude from the support plate is higher than the height by which each mounting pillar protrudes from the support plate. The motherboard is positioned by the positioning member so as to be placed at the mounting position.
[Selection drawing] Fig. 2

Description

TECHNICAL FIELD This disclosure relates to computer hosts and computer casing assemblies, and more particularly to computer casing assemblies for computer hosts having computer hosts and ancillary assemblies.

A motherboard is one of the most important parts in a computer, and there are various electronic components arranged on the motherboard. Motherboards can easily be damaged when a maintainer carelessly installs them in a computer or carelessly removes them from a computer. Therefore, it is cumbersome to attach the motherboard to the computer or remove the motherboard from the computer. Due to the widespread use of computers, how to safely and conveniently attach a motherboard to a computer or remove a motherboard from a computer is a very important topic in this field.

The present disclosure provides a computer host and computer casing assembly that allows attachment of a motherboard to and removal of a motherboard from a computer casing in a safe and convenient manner.

One embodiment of the present disclosure provides a computer host. A computer host includes a casing, an auxiliary assembly, and a motherboard. The casing includes a support plate and multiple mounting pillars. A plurality of mounting pillars protrude from the support plate. The auxiliary assembly includes at least one positioning member. A positioning member is attached to the casing. The height by which the positioning members protrude from the support plate is higher than the height by which each mounting pillar protrudes from the support plate. The motherboard is positioned by the positioning member so as to be placed at the mounting position.

One embodiment of the present disclosure provides a computer casing assembly. A computer casing assembly includes a casing and an ancillary assembly. The casing includes a support plate and multiple mounting pillars. A plurality of mounting pillars protrude from the support plate. The auxiliary assembly includes at least one positioning member. A positioning member is attached to the casing. The height by which the positioning members protrude from the support plate is higher than the height by which each mounting pillar protrudes from the support plate.

As described in the above embodiments, according to the present computer host and present computer casing assembly, the positioning member attached to the casing can quickly position the motherboard to the mounting position.

The present disclosure will be better understood from the detailed description given here below and the accompanying drawings, which are given by way of illustration only and are therefore not intended to limit the disclosure.

1 is a perspective view of a computer host according to the first embodiment of the present disclosure; FIG. Figure 2 is an exploded view of the computer host of Figure 1; Figure 3 is a perspective view of the positioning member of Figure 2; 2 is a top view of the computer host of FIG. 1; FIG. Figure 2 shows the mounting of the motherboard of Figure 1; Figure 2 shows the mounting of the motherboard of Figure 1; Figure 2 shows the mounting of the motherboard of Figure 1; Figure 2 shows the mounting of the motherboard of Figure 1; Figure 2 shows the mounting of the motherboard of Figure 1; FIG. 3 is a top view of a computer casing according to a second embodiment of the present disclosure; FIG. 4 is a top view of a computer casing according to a third embodiment of the present disclosure;

In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, it may be evident that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown to simplify the drawings.

Also, unless the terms are additionally defined in this disclosure, terms used in this disclosure, such as technical and scientific terms, have their own meanings and can be understood by those of ordinary skill in the art. That is, unless the terms have a specific meaning in this disclosure, the terms used in the following paragraphs should be read with their commonly used meanings in the relevant arts and are not intended to be overly descriptive.

Please refer to FIGS. FIG. 1 is a perspective view of a computer host 1 according to a first embodiment of the present disclosure, and FIG. 2 is an exploded view of the computer host 1 of FIG.
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In this embodiment, computer host 1 includes casing 10 , auxiliary assembly 20 , motherboard 30 and multiple fasteners 40 . Together, casing 10 and auxiliary assembly 20 form a computer casing assembly for housing motherboard 30 and other electronic equipment (not shown). Auxiliary assembly 20 allows attachment of motherboard 30 to casing 10 in a safe and convenient manner. Additionally, computer host 1 may include a power supply, disk drives, and other electronic equipment (not shown), although these equipment are omitted from the figures to clearly show aspects of the present disclosure. .

Casing 10 includes bottom plate 11 , back plate 12 , support plate 13 and a plurality of mounting pillars 14 . The back plate 12 connects to one surface of the bottom plate 11 and has a connector attachment portion 121 . The support plate 13 is fixed to the bottom plate 11 via screws (not shown). A plurality of mounting pillars 14 protrude from the support plate 13 .

Auxiliary assembly 20 includes a cushioning pad 21 and two positioning members. The buffer pad 21 is attached to the support plate 13 , and the height H<b>1 at which the buffer pad 21 protrudes from the support plate 13 is higher than the height H<b>2 at which each of the plurality of mounting pillars 14 protrudes from the support plate 13 . In this embodiment, the buffer pad 21 includes a flexible layer 211 and a contact layer 212 . Flexible layer 211 is, for example, a sponge. A flexible layer 211 adheres to the support plate 13 . Contact layer 212 is, for example, a film of polyethylene terephthalate (eg, Mylar®). A contact layer 212 is laminated to one side of the flexible layer 211 located opposite to the support plate 13 . The surface roughness of the contact layer 212 is less than the surface roughness of the flexible layer 211 , ie the surface of the contact layer 212 is smoother than the surface of the flexible layer 211 . The elasticity of the flexible layer 211 is greater than that of the contact layer 212 so that the buffer pad 21 can be elastically deformed.

Please refer to FIGS. FIG. 3 is a perspective view of one positioning member 22 of FIG. The two positioning members 22 are configured to contact two different surfaces of the motherboard 30 . Since the two locating members 22 are of the same construction, the following description will only describe one of them in detail. The positioning member 22 includes a mounting portion 221 and wall portions 222 . The mounting portion 221 has a plurality of through holes 2211 , and at least some of the plurality of mounting pillars 14 extend through at least some of the mounting portions 221 of the positioning member 22 so as to fix the positioning member 22 to the support plate 13 . They are arranged in the through holes 2211 respectively. The wall portion 222 is connected to the mounting portion 221 and protrudes from the mounting portion 221 along the direction away from the support plate 13 . The height H3 at which the wall portion 222 of the positioning member 22 protrudes from the support plate 13 is higher than the height H1 at which the buffer pad 21 protrudes from the support plate 13 . In this embodiment, the height H2 by which each of the plurality of mounting pillars 14 protrudes from the support plate 13 is, for example, 6.5 mm, and the height H1 by which the buffer pad 21 protrudes from the support plate 13 is, for example, 7 mm. and the height H3 at which the wall portion 222 protrudes from the support plate 13 is, for example, 8 mm, but the present disclosure is not limited thereto.

In this embodiment, the wall portion 222 further has an inclined guide surface 2221 to facilitate the positioning member 22 guiding the circuit board 31 of the motherboard 30 to the mounting position.

In this embodiment, the positioning member 22 further includes multiple alignment protrusions 223 . A plurality of alignment protrusions 223 protrude from the wall portion 222 and correspond to the through holes 2211 respectively.

The plurality of alignment protrusions 223 of the positioning member 22 may vary in the present disclosure, and in some other embodiments the positioning member has a plurality of protrusions on the wall to indicate through holes and multiple mounting pillars. It may include indicia or multiple patterns.

In this embodiment, the number of through-holes 2211 in the mounting portion 221 is three, but the present disclosure is not limited to this, and in some other embodiments, the number of through-holes in the mounting portion is two. It could be one or some other number.

In this embodiment, the number of alignment protrusions 223 of the positioning member 22 is equal to the number of through holes 2211, but the disclosure is not limited thereto, and in some other embodiments, the positioning member may have multiple alignment protrusions 223. may not be equal to the number of through-holes, and may be changed to one or two.

Motherboard 30 includes circuit board 31 and input/output connector assemblies 32 . The circuit board 31 has a plurality of through holes 311 , and the input/output connector assembly 32 is arranged on the circuit board 31 and electrically connected to the circuit board 31 . Input/output connector assembly 32 includes a plurality of electronic connectors such as, for example, audio connectors, network connectors, and USB connectors. The circuit board 31 of the motherboard 30 is in contact with the contact layer 212 of the buffer pad 21 and is positioned by the walls 222 of the positioning member 22 respectively located on two different sides of the motherboard 30 so as to be placed in the mounting position. be done. The so-called attachment position of the motherboard 30 is the position where the motherboard 30 is properly attached to the casing 10 while the computer host 1 is in operation.

Referring to FIG. 4, FIG. 4 is a top view of computer host 1 of FIG. The plurality of mounting pillars 14 together form a contour P, and the cushioning pads 21 of the auxiliary assembly 20 are positioned, for example, outside the contour P and positioned on one side of the contour P adjacent the connector mounting portion 121 . The location of the cushioning pad 21 is not limited in this disclosure, and in some other embodiments, the cushioning pad 21 is located inside the contour and as close to the connector attachment as possible. Alternatively, it may have two portions located inside and outside the contour respectively.

5-9, FIGS. 5-9 are diagrams illustrating the mounting of the motherboard 30 of FIG. The first step is to attach the buffer pad 21 to the support plate 13 and attach the plurality of through holes 2211 of the mounting portion 221 of the positioning member 22 to the corresponding plurality of mounting pillars 14 . Then, as shown in FIG. 6, the second step is to mount the motherboard on the support plate 13 so that one side of the circuit board 31 where the input/output connector assembly 32 is located is in contact with the contact layer 212 of the buffer pad 21 . 30 is obliquely placed and the input/output connector assembly 32 is attached to the connector attachment portion 121 . Then, as shown in FIGS. 7 and 8, the third step is to lay down the motherboard 30 along the A direction so that the motherboard 30 is placed at the mounting position, and through the guidance of the positioning member 22, move the motherboard 30 along the B direction. and move the motherboard 30 along the C direction or in a direction opposite to the B and C directions. Since the motherboard 30 contacts the contact layer 212 more smoothly, the position of the motherboard 30 can be easily adjusted. Moreover, since the height H1 at which the buffer pads 21 protrude from the support plate 13 is higher than the height H2 at which each of the plurality of mount pillars 14 protrudes from the support plate 13, the circuit board 31 of the mother board 30 does not extend beyond the buffer pads 21. When in contact with the contact layer 212, the buffer pad 21 prevents the motherboard 30 from being damaged during installation by preventing the circuit board 31 of the motherboard 30 from hitting the plurality of mounting pillars 14. Then, as shown in FIG. 9, the fourth step is to attach the fasteners 40 to the circuit board of the mother board 30 so that the circuit board 31 of the mother board 30 is pushed closer to the support plate 13 along the D direction. 31 through a plurality of through holes 311, the circuit board 31 of the mother board 30 and the support plate 13 together press the buffer pad 21; By doing so, the height H4 of the buffer pad 21b becomes equal to the height H2 of the plurality of mount pillars 14. As shown in FIG. Therefore, the motherboard 30 can be attached to the support plate 13 in a safe and convenient manner because the non-pressed cushioning pad 21 has a height H1 that is higher than the height H2 of the plurality of mounting pillars 14 and provides cushioning. The mounting of the motherboard 30 on the plurality of mounting pillars 14 is ensured by the pad 21 being compressible so that the motherboard 30 can be firmly supported by the plurality of mounting pillars 14 .

In this embodiment, there are two positioning members 22 spaced apart from each other in order to accommodate motherboards of different sizes. Specifically, the widths of the circuit boards of the motherboard are different from each other. Depending on requirements, the connector mounting is such that the computer host may include only one positioning member 22 when applied to a motherboard having a circuit board with a width greater or less than the width W of the circuit board 31 of the motherboard 30. Positioning member 22, which is further spaced from portion 121, can be removed.

In this embodiment, the auxiliary assembly 20 includes cushioning pads 21 to prevent the motherboard 30 from hitting the casing during installation, but the disclosure is not limited thereto and some other embodiments. In , the auxiliary assembly 20 may not include cushioning pads as long as the motherboard does not hit the casing during installation.

Referring to FIG. 10, FIG. 10 is a top view of a computer casing according to a second embodiment of the present disclosure. The computer casing according to this embodiment is similar to the computer casing of the previous embodiment shown in FIG. have the same structure, and repeated descriptions of their constituent elements are omitted. The following description mainly describes the differences between this embodiment and the previous embodiment. In this embodiment, the positioning member 22A includes a first portion 225A and a second portion 225B connected together such that the first portion 225A and the second portion 225B together form an L-shaped structure. The first portion 225A and the second portion 225B intersect each other substantially at right angles. The first portion 225A and the second portion 225B contact two different sides of the motherboard 30, respectively.

Referring to FIG. 11, FIG. 11 is a top view of a computer casing according to a third embodiment of the present disclosure. The computer casing according to this embodiment is similar to the computer casing of the previous embodiment shown in FIG. have the same structure, and repeated descriptions of their constituent elements are omitted. The following description mainly describes the differences between this embodiment and the previous embodiments. In this embodiment, the auxiliary assembly 20B includes a first positioning member 22B and a second positioning member 23B. The second positioning member 23B is slidably arranged on the first positioning member 22B. For example, the first positioning member 22B has an insertion hole, and one end of the second positioning member 23B is slidable relative to the first positioning member 22B. It is slidably inserted into the insertion hole of the positioning member 22B. In the mounting position, the position of the first positioning member 22B and the position of the second positioning member 23B spaced from the first positioning member 22B are adjusted respectively to the two positions of the motherboard (not shown) to adjust the position of the motherboard. Touch different sides.

In this embodiment, the first positioning member 22B and the second positioning member 23B each contact two different sides of the motherboard, but the disclosure is not so limited and in some other embodiments , may contact the same side of the motherboard.

According to the computer host and computer casing assembly described in the above embodiments, a positioning member attached to the casing allows quick positioning of the motherboard at the mounting position. In addition, since the non-pressed shock pad has a height higher than the height of the multiple mounting pillars, the motherboard can be attached to the support plate in a safe and convenient way, and the shock pad is supported by the multiple mounting pillars. , to ensure mounting of the motherboard on multiple mounting pillars by being compressible so that the motherboard can be firmly supported. Furthermore, since the motherboard contacts the contact layer more smoothly, the position of the motherboard can be easily adjusted.

It will be apparent to those skilled in the art that various modifications and variations can be made to this disclosure. It is intended that the specification and examples be considered as exemplary embodiments only, with the scope of the disclosure being indicated by the following claims and their equivalents.

Claims (11)

a casing comprising a support plate and a plurality of mounting pillars, the plurality of mounting pillars projecting from the support plate;
at least one positioning member attached to the casing, wherein the at least one positioning member protrudes from the support plate to a greater height than each of the plurality of mounting pillars protrudes from the support plate; an auxiliary assembly;
a motherboard positioned by the at least one positioning member such that the motherboard is positioned in a mounting position. The auxiliary assembly further includes a buffer pad attached to the support plate, and the height at which the buffer pad protrudes from the support plate is such that each of the plurality of mounting pillars protrudes from the support plate. and the height by which the at least one positioning member protrudes from the support plate is higher than the height by which the buffer pad protrudes from the support plate, and the buffer pad comprises a flexible layer and a contact connected to each other. a layer, wherein the surface roughness of the contact layer is less than the surface roughness of the flexible layer, the elasticity of the flexible layer is greater than the elasticity of the contact layer, and the motherboard contacts the contact layer; A computer host according to claim 1. The at least one positioning member includes a mounting portion and a wall portion, the wall portion protruding from the mounting portion, the mounting portion having at least one through-hole, and extending from the plurality of mounting pillars. 2. The computer according to claim 1, wherein one is located in said at least one through-hole, and said motherboard is positioned by said wall of said at least one positioning member so as to be arranged in said mounting position. host. 4. The computer host of claim 3, wherein said at least one positioning member includes at least one alignment projection, said at least one alignment projection projecting from said wall and corresponding to said at least one through hole. 2. The computer host of claim 1, wherein said at least one positioning member comprises two positioning members, said two positioning members contacting two different surfaces of said motherboard. The at least one positioning member includes a first portion and a second portion connected to each other, the first portion and the second portion respectively contacting two different sides of the motherboard. 3. The computer host of claim 2, wherein: 2. The at least one positioning member comprises a first positioning member and a second positioning member, the second positioning member being slidably disposed on the first positioning member. The computer host described in . 8. The computer host of claim 7, wherein said first positioning member and said second positioning member each contact two different sides of said motherboard. 8. The computer host of claim 7, wherein said first positioning member and said second positioning member contact the same side of said motherboard. a casing comprising a support plate and a plurality of mounting pillars, the plurality of mounting pillars projecting from the support plate;
at least one positioning member attached to the casing, wherein the at least one positioning member protrudes from the support plate to a greater height than each of the plurality of mounting pillars protrudes from the support plate; A computer casing assembly, comprising: an auxiliary assembly. The auxiliary assembly further includes a buffer pad attached to the support plate, and the height at which the buffer pad protrudes from the support plate is such that each of the plurality of mounting pillars protrudes from the support plate. and the height by which the at least one positioning member protrudes from the support plate is higher than the height by which the buffer pad protrudes from the support plate, and the buffer pad comprises a flexible layer and a contact connected to each other. 11. The computer casing assembly of claim 10, comprising layers, wherein the surface roughness of the contact layer is less than the surface roughness of the flexible layer, and the elasticity of the flexible layer is greater than the elasticity of the contact layer.

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