JP3235298B2 - Pyroelectric infrared array sensor - Google Patents

Pyroelectric infrared array sensor

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Publication number
JP3235298B2
JP3235298B2 JP27221993A JP27221993A JP3235298B2 JP 3235298 B2 JP3235298 B2 JP 3235298B2 JP 27221993 A JP27221993 A JP 27221993A JP 27221993 A JP27221993 A JP 27221993A JP 3235298 B2 JP3235298 B2 JP 3235298B2
Authority
JP
Japan
Prior art keywords
pyroelectric
pyroelectric element
substrate
conductive paste
array sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP27221993A
Other languages
Japanese (ja)
Other versions
JPH07128142A (en
Inventor
憲治 堀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP27221993A priority Critical patent/JP3235298B2/en
Priority to US08/329,333 priority patent/US5625188A/en
Priority to DE4438673A priority patent/DE4438673C2/en
Priority to GB9421786A priority patent/GB2283362B/en
Publication of JPH07128142A publication Critical patent/JPH07128142A/en
Priority to US09/078,349 priority patent/US6175114B1/en
Application granted granted Critical
Publication of JP3235298B2 publication Critical patent/JP3235298B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、人体等から放射される
赤外線を検知して警報等を発する焦電型赤外線アレイセ
ンサに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pyroelectric infrared array sensor that detects an infrared ray emitted from a human body or the like and issues an alarm or the like.

【0002】[0002]

【従来の技術】焦電型赤外線センサは、PZT(チタン
酸ジルコン酸鉛)等の焦電効果を有する材料を感知素子
として利用するセンサである。焦電効果とは素子に赤外
線が入射すると素子表面の温度が変化し、これに伴い今
まで安定であった電荷の中和状態が崩れ電気的に不平衡
となり、電荷を発生する特性をいう。この時発生する電
荷はインピーダンス変換により電圧として取り出され
る。
2. Description of the Related Art A pyroelectric infrared sensor uses a material having a pyroelectric effect such as PZT (lead zirconate titanate) as a sensing element. The pyroelectric effect refers to a characteristic in which, when infrared rays are incident on an element, the temperature of the element surface changes, and the neutralized state of charges, which has been stable up to now, collapses and becomes electrically unbalanced, thereby generating charges. The charge generated at this time is taken out as a voltage by impedance conversion.

【0003】焦電型赤外線センサの等価回路例を図3に
示す。焦電素子上に形成された検知部1は、高抵抗チッ
プ2と並列に接続され、その並列回路の一方端がFET
(電界効果トランジスタ)3のゲート端子と接続され、
他方端がアースされる。FET3のドレイン端子とつな
がるドレイン端子ピン4に正電圧を加えると、検知部1
に赤外線が入射したとき発生する電荷はFET3のソー
ス端子とつながるソース端子ピン5から電圧出力として
取り出せる。
FIG. 3 shows an example of an equivalent circuit of a pyroelectric infrared sensor. The detection unit 1 formed on the pyroelectric element is connected in parallel with the high-resistance chip 2, and one end of the parallel circuit is an FET.
(Field effect transistor) connected to the gate terminal of 3,
The other end is grounded. When a positive voltage is applied to the drain terminal pin 4 connected to the drain terminal of the FET 3, the detecting unit 1
The charge generated when infrared rays enter the device can be taken out as a voltage output from a source terminal pin 5 connected to the source terminal of the FET 3.

【0004】この特性を利用して、複数の検知部を一列
に並べた焦電型赤外線リニアアレイセンサや二次元に配
列した焦電型赤外線二次元アレイセンサが知られてお
り、人間等の移動方向や存在位置等の検知をするのに用
いられる。
A pyroelectric infrared linear array sensor in which a plurality of detection units are arranged in a line and a pyroelectric infrared two-dimensional array sensor in which the detection units are arranged two-dimensionally by utilizing this characteristic are known. It is used to detect the direction and the location.

【0005】図4は、焦電型赤外線アレイセンサの分解
斜視図で、端子ピン6は、絶縁筒片7を介して金属ヘッ
ダー8を貫通して植設される。アース端子ピン(図示せ
ず)は、任意の端子ピンの絶縁筒片7上に導電ペースト
を塗布して金属ヘッダー8と端子ピン6をショートさせ
ることにより作成される。
FIG. 4 is an exploded perspective view of the pyroelectric infrared array sensor. The terminal pins 6 are implanted through the metal header 8 via the insulating tubular piece 7. A ground terminal pin (not shown) is formed by applying a conductive paste on an insulating tubular piece 7 of an arbitrary terminal pin and short-circuiting the metal header 8 and the terminal pin 6.

【0006】金属ヘッダー8の上に突出した端子ピン6
は、基板9に開けた開口部10に挿入後、その開口部1
0周辺に設けた基板9の回路(図示せず)に接続するラ
ンド(図示せず)と接続固定される。
[0006] Terminal pins 6 protruding above metal header 8
Is inserted into the opening 10 formed in the substrate 9 and then the opening 1
Lands (not shown) connected to a circuit (not shown) of the substrate 9 provided around 0 are fixed.

【0007】基板9表面には焦電素子11が、また表面
および裏面には複数の検知部に対応した数の高抵抗チッ
プ2およびFET3が実装される。
A pyroelectric element 11 is mounted on the front surface of the substrate 9, and a number of high resistance chips 2 and FETs 3 corresponding to a plurality of detectors are mounted on the front and back surfaces.

【0008】キャンケース12には、焦電素子11と向
かい合う部分に開口部13が設けられ、その開口部13
には開口部13を塞ぐ赤外線フィルター14が取り付け
てある。
[0008] An opening 13 is provided in the can case 12 at a portion facing the pyroelectric element 11.
Is provided with an infrared filter 14 for closing the opening 13.

【0009】金属ヘッダー8とキャンケース12は電気
溶接等され、導通状態にある。
The metal header 8 and the can case 12 are in a conductive state by electric welding or the like.

【0010】焦電素子11はあらかじめ片面が正、他面
が負となるように分極しておき、焦電素子11の受光面
は焦電素子11の分極軸と垂直の方向にある赤外線フィ
ルター14と対向する。図5に示すように、焦電素子1
1の受光面には電極15Aが、裏面には電極15Aと対
向する電極15Bがそれぞれ複数個設けられ、対向する
電極を一対とする複数の検知部が形成される。また、各
検知部の電極15Aは接続線15Cで相互に接続され、
さらに相互に接続された電極15Aと基板9の回路を接
続するためのリード線15Dが形成される。電極15A
と15B、接続線15C、リード線15Dは、NiC
r、Ag、Ag−Cu等の蒸着によって形成される。電
極15A、15BがAg、Ag−Cuによって形成され
た場合は、電極15A上面に熱を効率良く吸収するため
の黒色の膜が設けられる。
The pyroelectric element 11 is polarized in advance so that one surface is positive and the other surface is negative, and the light receiving surface of the pyroelectric element 11 has an infrared filter 14 that is perpendicular to the polarization axis of the pyroelectric element 11. Opposes. As shown in FIG.
A plurality of electrodes 15A are provided on one light-receiving surface, and a plurality of electrodes 15B facing the electrode 15A are provided on the back surface, and a plurality of detecting portions having a pair of facing electrodes are formed. In addition, the electrodes 15A of each detection unit are connected to each other by a connection line 15C,
Further, lead wires 15D for connecting the mutually connected electrodes 15A and the circuit of the substrate 9 are formed. Electrode 15A
And 15B, the connection wire 15C, and the lead wire 15D are made of NiC
It is formed by vapor deposition of r, Ag, Ag-Cu or the like. When the electrodes 15A and 15B are formed of Ag or Ag-Cu, a black film for efficiently absorbing heat is provided on the upper surface of the electrode 15A.

【0011】焦電素子11は、焦電素子11の検知部で
発生した熱が基板9に逃げるのを防ぐため基板9から浮
かした状態で、電極15Bを介して基板9の回路上に設
けられた半田バンプ16と導電ペースト17を用いて接
続固定される。さらに電極15Bは、基板9の回路を介
して高抵抗チップ2の一端およびFET3のゲート端子
とに接続される。また接続線15Cで相互に接続された
電極15Aはリード線15Dを介して基板9の回路上に
設けられた半田バンプ16等の導体部と導電ペースト1
7を用いて接続固定され、さらにアース端子ピンおよび
高抵抗チップ2の他端と接続される。FET3のドレイ
ン端子とソース端子はそれぞれ所定の端子ピン6に接続
される。
The pyroelectric element 11 is provided on the circuit of the substrate 9 via the electrode 15B in a state where the pyroelectric element 11 is floated from the substrate 9 to prevent heat generated in the detecting portion of the pyroelectric element 11 from escaping to the substrate 9. The solder bump 16 and the conductive paste 17 are connected and fixed. Further, the electrode 15B is connected to one end of the high resistance chip 2 and the gate terminal of the FET 3 via the circuit of the substrate 9. The electrodes 15A connected to each other by the connection lines 15C are connected to the conductors such as the solder bumps 16 provided on the circuit of the substrate 9 via the lead wires 15D and the conductive paste 1.
7 and connected to the ground terminal pin and the other end of the high resistance chip 2. The drain terminal and the source terminal of the FET 3 are connected to predetermined terminal pins 6 respectively.

【0012】焦電素子11の複数の検知部で発生した電
荷は、高抵抗チップ2およびFET3による複数のイン
ピーダンス変換回路により電圧として取り出され、複数
の検知部の出力差によって人間等の移動方向や存在位置
等を把握できる。
The electric charges generated in the plurality of detecting portions of the pyroelectric element 11 are taken out as voltages by a plurality of impedance conversion circuits including the high-resistance chip 2 and the FET 3, and the direction of movement of a person or the like is determined by the output difference between the plurality of detecting portions. The location and the like can be grasped.

【0013】[0013]

【発明が解決しようとする課題】図6に例示するような
4×4個の検知部18乃至33からなる焦電型赤外線二
次元アレイセンサの場合、焦電素子11の4隅に位置す
る検知部18、21、30、33は焦電素子11の二辺
に隣接することから熱抵抗が大きく、赤外線入射によっ
て発生した熱が拡散しにくい。また焦電素子11の各辺
に位置する検知部19、20、22、25、26、2
9、31、32は、焦電素子11の一辺に隣接すること
から二番目に熱が拡散しにくい。そのため、検知部1
8、21、30、33の感度が最も高く、検知部19、
20、22、25、26、29、31、32が二番目に
高くなる。
In the case of a pyroelectric infrared two-dimensional array sensor composed of 4 × 4 detectors 18 to 33 as shown in FIG. 6, the detection located at the four corners of the pyroelectric element 11 is performed. Since the portions 18, 21, 30, and 33 are adjacent to two sides of the pyroelectric element 11, the thermal resistance is large, and the heat generated by the incidence of infrared rays is not easily diffused. In addition, the detecting units 19, 20, 22, 25, 26, 2 located on each side of the pyroelectric element 11
9, 31, and 32 are the second least likely to dissipate heat because they are adjacent to one side of the pyroelectric element 11. Therefore, the detection unit 1
8, 21, 30, and 33 have the highest sensitivity,
20, 22, 25, 26, 29, 31, 32 are the second highest.

【0014】しかしながら、焦電型赤外線二次元アレイ
センサ自体ではこの感度バラツキの対策をとることがで
きず、焦電型赤外線二次元アレイセンサを使用する際の
増幅回路での増幅率を個々の検知部に対応して調整する
ことが行われていた。このため、増幅回路での調整処理
を一つ一つ行うため工数がかかり、コスト的に高くなる
という欠点があった。
However, the pyroelectric infrared two-dimensional array sensor itself cannot take measures against this sensitivity variation, and the amplification factor in the amplifier circuit when using the pyroelectric infrared two-dimensional array sensor is individually detected. Adjustments were made in accordance with the department. For this reason, there is a disadvantage that the adjustment process in the amplifier circuit is performed one by one, which takes a lot of man-hours and increases in cost.

【0015】また、図7に例示するような複数の検知部
を一次元に配列した焦電型赤外線リニアアレイセンサの
場合も、焦電型赤外線二次元アレイセンサと同様の理由
により焦電素子11の両端に隣接する検知部の感度が一
番高く、内側になるほど感度が低くなる傾向がある。
In the case of a pyroelectric infrared linear array sensor in which a plurality of detectors are arranged one-dimensionally as shown in FIG. 7, the pyroelectric element 11 is also used for the same reason as the pyroelectric infrared two-dimensional array sensor. There is a tendency that the sensitivity of the detection units adjacent to both ends of the image is highest, and the sensitivity becomes lower toward the inside.

【0016】このため、焦電素子11の両端に隣接する
検知部をダミーとしたり、焦電素子11の両端から離し
て設ける等の工夫をしていたため、焦電素子11が大き
くなり、焦電型赤外線リニアアレイセンサを小型化する
ことができないという欠点があった。
For this reason, the detection units adjacent to both ends of the pyroelectric element 11 are made dummy or provided separately from both ends of the pyroelectric element 11, so that the pyroelectric element 11 becomes large and the pyroelectric element 11 becomes large. However, there is a disadvantage that the size of the infrared linear array sensor cannot be reduced.

【0017】そこで本発明は上記の点に鑑み、焦電型赤
外線アレイセンサの複数の検知部の感度バラツキを低減
した焦電型赤外線アレイセンサを提供するものである。
In view of the above, the present invention provides a pyroelectric infrared array sensor in which the variation in the sensitivity of a plurality of detectors of the pyroelectric infrared array sensor is reduced.

【0018】[0018]

【課題を解決するための手段】本発明は、上記の目的を
達成するため次のように構成されている。すなわち、入
射赤外線によって生ずる熱に応じて電荷を発生する一対
の対向する電極よりなる検知部が複数形成された焦電素
子と、焦電素子を接続固定するための複数の導体部が形
成された基板と、複数のFETとを備えた焦電形赤外線
センサにおいて、受光面である焦電素子表面には複数の
検知部の電極を相互に接続する接続線および焦電素子表
面の端部に隣接して形成された検知部の電極から引き出
されるリード線が設けられ、基板上の導体部は焦電素子
の各検知部およびリード線の引き出し部に対応する位置
に形成され、焦電素子裏面に形成された各検知部の電極
が基板上の対応する導体部とそれぞれ導電ペーストで接
続固定され、それぞれ前記導体部を介してFETのゲー
ト端子と接続されるとともに、前記接続固定部分の導電
ペーストの量は、焦電素子の中心部に位置する接続固定
部分ほど少なくなっており、さらに、リード線と基板上
の導体部が各リード線の引き出し部において導電ペース
トで接続固定されるとともに、当該接続固定部分の導電
ペーストの量は、各リード線の引き出し部において互い
にほぼ同量とされる。
The present invention is configured as follows to achieve the above object. That is, a pyroelectric element in which a plurality of detecting portions each including a pair of opposed electrodes that generate electric charges in accordance with heat generated by incident infrared rays were formed, and a plurality of conductors for connecting and fixing the pyroelectric element were formed. In a pyroelectric infrared sensor including a substrate and a plurality of FETs, a connection line for connecting electrodes of a plurality of detection units to each other and an end of the pyroelectric element surface are provided on the surface of the pyroelectric element which is a light receiving surface. A lead wire drawn out from the electrode of the detection unit formed is provided, and a conductor on the substrate is formed at a position corresponding to each detection unit of the pyroelectric element and a lead-out part of the lead wire, and on the back surface of the pyroelectric element each sensing portion of the electrode formed is fixedly connected with the corresponding conductor portion and each conductive paste on the substrate, the gate of the FET, respectively via the conductive portion
Rutotomoni is connected to the bets terminals, conductive of the connecting and fixing parts
The amount of paste is fixed at the center of the pyroelectric element.
It has become smaller as part further fixedly connected by a conductive paste conductor portion of the lead wire and on the substrate in the lead portion of each lead Rutotomoni, conductive of the connection fixed part
The amount of paste should be
Are almost the same.

【0019】[0019]

【作用】焦電素子11に形成した検知部を基板9に接続
固定する際に用いる導電ペースト17をヒートシンクお
よび熱伝導経路として利用することにより、赤外線入射
によって発生する検知部での熱拡散を促進し、また基板
9への熱伝導を増大して、各検知部での発生電荷量を均
一化することができる
By using the conductive paste 17 used for connecting and fixing the detection section formed on the pyroelectric element 11 to the substrate 9 as a heat sink and a heat conduction path, heat diffusion in the detection section caused by the incidence of infrared rays is promoted. In addition, the heat conduction to the substrate 9 is increased, and the amount of charge generated in each detection unit can be made uniform.

【0020】[0020]

【実施例1】図1は本発明を用いた16個の検知部から
なる焦電型赤外線二次元アレイセンサの実施例を示す。
基板9と焦電素子11以外は従来例と同じなため説明お
よび図面を省略し、また焦電素子11内の検知部の番号
は従来例と同じ番号を使用する。
Embodiment 1 FIG. 1 shows an embodiment of a pyroelectric infrared two-dimensional array sensor comprising 16 detectors using the present invention.
Except for the substrate 9 and the pyroelectric element 11, the description and drawings are omitted because they are the same as the conventional example, and the numbers of the detection units in the pyroelectric element 11 are the same as those of the conventional example.

【0021】図1に示すように、16個の検知部18乃
至33からなる焦電型赤外線二次元アレイセンサの場
合、焦電素子11表面には16個の電極15Aが縦4個
横4個等間隔に二次元に配列され、裏面にはそれに対向
して電極15Bが設けられる。四辺形の焦電素子11の
対角方向に配列されている検知部18,23,28、3
3と、21,24,27,30の電極15Aは接続線1
5Cでそれぞれ対角方向に直列に接続され、19,22
と、20,25と、26,31と、29,32の電極1
5Aは、対角方向に設けられた接続線15Cと交差する
接続線15Cで相互に接続され、更にこれら接続線15
Cは交差する位置で相互に接続されている。また、焦電
素子11の四隅に位置する検知部18、21、30、3
3の各電極15Aから、焦電素子11の四隅付近にリー
ド線15Dが設けられる。電極15Aと15B、接続線
15C、リード線15Dは、NiCr、Ag、Ag−C
u等の蒸着によって形成される。電極15A、15Bが
Ag、Ag−Cuによって形成された場合は、電極15
A上面に熱を効率良く吸収するための黒色の膜が設けら
れる。
As shown in FIG. 1, in the case of a pyroelectric infrared two-dimensional array sensor comprising 16 detectors 18 to 33, 16 electrodes 15A are provided on the surface of the pyroelectric element 11 in a lengthwise direction and a widthwise direction. The electrodes 15B are two-dimensionally arranged at regular intervals, and an electrode 15B is provided on the rear surface so as to face the electrode 15B. Detecting sections 18, 23, 28, 3 arranged in a diagonal direction of quadrilateral pyroelectric element 11
3 and electrodes 15A of 21, 24, 27 and 30 are connected to connection line 1
5C are connected in series diagonally,
, 20, 25, 26, 31, 29, 32
5A are connected to each other by a connection line 15C crossing a connection line 15C provided in a diagonal direction.
C are connected to each other at intersections. In addition, the detectors 18, 21, 30, 3 located at the four corners of the pyroelectric element 11
From the three electrodes 15A, lead wires 15D are provided near the four corners of the pyroelectric element 11. The electrodes 15A and 15B, the connection wire 15C, and the lead wire 15D are made of NiCr, Ag, Ag-C
It is formed by vapor deposition of u or the like. When the electrodes 15A and 15B are made of Ag or Ag-Cu,
A black film for efficiently absorbing heat is provided on the upper surface of A.

【0022】リード線15Dは、焦電素子11の四隅付
近で、ほぼ同量の導電ペースト17を用いて基板9の回
路(図示せず)上に設けられた半田バンプ16等の導体
部と接続固定される。
The lead wires 15D are connected to conductors such as solder bumps 16 provided on a circuit (not shown) of the substrate 9 using substantially the same amount of conductive paste 17 near the four corners of the pyroelectric element 11. Fixed.

【0023】また検知部18乃至33の電極15Bを、
基板9の回路上に設けた半田バンプ16と導電ペースト
17を用いて接続固定する。この場合、検知部18、2
1、30、33の電極15Bの接続固定では導電ペース
ト17量を多く、検知部19、20、22、25、2
6、29、31、32の場合には、二番目に多く使用す
る。
The electrodes 15B of the detection units 18 to 33 are
The solder bumps 16 provided on the circuit of the substrate 9 and the conductive paste 17 are used for connection and fixing. In this case, the detection units 18 and 2
In connection and fixing of the electrodes 15B of 1, 30, and 33, the amount of the conductive paste 17 is large, and the detecting portions 19, 20, 22, 25, and 2 are used.
In the case of 6, 29, 31, and 32, the second most is used.

【0024】導電ペースト17は、赤外線入射によって
検知部18乃至33で発生した熱のヒートシンクおよび
基板9への熱伝導路の役割を果たし、従来熱抵抗が大き
く熱拡散しにくかった検知部18、21、30、33か
らの熱の逃げを良くし、検知部19、20、22、2
5、26、29、31、32からの熱の逃げを二番目に
良くすることができる。これにより、焦電素子11に形
成した検知部18乃至33で発生する電荷量が均一とな
り、検知部13乃至33の感度バラツキが低減できる。
The conductive paste 17 functions as a heat sink and a heat conduction path to the substrate 9 for the heat generated by the detectors 18 to 33 due to the incidence of infrared rays, and the detectors 18 and 21 which conventionally have a large thermal resistance and are difficult to diffuse. , 30 and 33 to improve the escape of heat, the detection units 19, 20, 22, and 2
The escape of heat from 5, 26, 29, 31, 32 can be secondarily improved. As a result, the amount of electric charge generated in the detectors 18 to 33 formed in the pyroelectric element 11 becomes uniform, and the variation in sensitivity among the detectors 13 to 33 can be reduced.

【0025】導電ペースト17は、導電性シリコン、導
電性エポキシ樹脂、導電性フェノール樹脂等の導電性の
ものであればいずれでもよい。
The conductive paste 17 may be any conductive material such as conductive silicon, conductive epoxy resin and conductive phenol resin.

【0026】[0026]

【実施例2】図2に本発明を用いた焦電型赤外線リニア
アレイセンサの実施例を示す。基板9と焦電素子11以
外は従来例と同じなため説明及び図面を省略し、また焦
電素子11内の検知部の番号は従来例と同じ番号を使用
する。
Embodiment 2 FIG. 2 shows an embodiment of a pyroelectric infrared linear array sensor using the present invention. Except for the substrate 9 and the pyroelectric element 11, the description and drawings are omitted because they are the same as the conventional example, and the numbers of the detection units in the pyroelectric element 11 are the same as those of the conventional example.

【0027】図2に示すように、複数個の検知部からな
る焦電型赤外線リニアアレイセンサの場合、焦電素子1
1表面には電極15Aが等間隔に二次元に配列され、裏
面にはそれに対向して電極15Bが設けられる。焦電素
子11表面の電極15Aは、接続線15Cで相互に接続
される。また、焦電素子11の端部に隣接して形成され
た検知部の電極15Aから、焦電素子11の端辺にリー
ド線15Dが設けられる。電極15Aと15B、接続線
15C、リード線15Dは、NiCr、Ag、Ag−C
u等の蒸着により形成される。電極15A、15BがA
g、Ag−Cuによって形成された場合は、電極15A
上面に熱を効率良く吸収するための黒色の膜が設けられ
る。
As shown in FIG. 2, in the case of a pyroelectric infrared linear array sensor comprising a plurality of detecting portions, the pyroelectric element 1
The electrodes 15A are two-dimensionally arranged on one surface at equal intervals, and the electrodes 15B are provided on the rear surface so as to face the electrodes. The electrodes 15A on the surface of the pyroelectric element 11 are mutually connected by a connection line 15C. In addition, a lead 15D is provided on an end side of the pyroelectric element 11 from the electrode 15A of the detection unit formed adjacent to the end of the pyroelectric element 11. The electrodes 15A and 15B, the connection wire 15C, and the lead wire 15D are made of NiCr, Ag, Ag-C
It is formed by vapor deposition of u or the like. The electrodes 15A and 15B are A
g, when formed of Ag-Cu, the electrode 15A
A black film for efficiently absorbing heat is provided on the upper surface.

【0028】リード線15Dは焦電素子11の端部で、
ほぼ同量の導電ペースト17を用いて基板9の回路(図
示せず)上に設けられた半田バンプ16等の導体部と接
続固定される。
The lead wire 15D is at the end of the pyroelectric element 11,
Using approximately the same amount of conductive paste 17, it is connected and fixed to a conductor such as a solder bump 16 provided on a circuit (not shown) of the substrate 9.

【0029】また各検知部の電極15Bは、基板9の回
路上に設けたバンプと導電ペーストを用いて接続固定さ
れる。焦電素子11の両端部に隣接して形成された検知
部の電極15Bの接続固定では導電ペースト17量を多
くし、焦電素子11の中心部に位置する検知部に向うに
つれて導電ペースト17量を減らしていくことによっ
て、焦電素子11の端部に形成した検知部からの熱の逃
げを更に良くすることができる。
The electrodes 15B of the respective detecting portions are connected and fixed to the bumps provided on the circuit of the substrate 9 using a conductive paste. In the connection and fixing of the electrodes 15B of the detection unit formed adjacent to both ends of the pyroelectric element 11, the amount of the conductive paste 17 is increased, and the amount of the conductive paste 17 is increased toward the detection unit located at the center of the pyroelectric element 11. , The escape of heat from the detection unit formed at the end of the pyroelectric element 11 can be further improved.

【0030】導電ペースト17は、赤外線入射によって
各検知部で発生した熱のヒートシンクおよび基板9への
熱伝導路の役割を果たし、従来熱抵抗が大きく熱拡散が
しにくかった焦電素子11の端部に隣接して形成された
検知部からの熱の逃げを良くすることができる。これに
より、焦電素子11に形成した検知部で発生する電荷量
が均一となり、複数の検知部の感度バラツキが低減でき
る。
The conductive paste 17 serves as a heat sink and a heat conduction path to the substrate 9 for heat generated in each detection unit by the incidence of infrared rays, and the end of the pyroelectric element 11 which has conventionally had a large thermal resistance and is difficult to diffuse heat. The escape of heat from the detecting portion formed adjacent to the portion can be improved. As a result, the amount of electric charge generated in the detector formed in the pyroelectric element 11 becomes uniform, and the variation in sensitivity among the plurality of detectors can be reduced.

【0031】導電ペースト17は、導電性シリコン、導
電性エポキシ樹脂、導電性フェノール樹脂等の導電性の
ものであればいずれでもよい。
The conductive paste 17 may be any conductive material such as conductive silicon, conductive epoxy resin and conductive phenol resin.

【0032】[0032]

【発明の効果】本発明は上述のように構成したので下記
の効果を有する。対向する一対の電極よりなる複数の検
知部を形成した焦電素子において、焦電素子を基板に導
電ペーストを用いて接続固定する際、従来入射赤外線に
よって発生する熱が拡散しにくかった検知部から、導電
ペーストをヒートシンクおよび基板への熱伝導路として
利用することにより、熱の逃げを良くすることができ、
複数の検知部での発生電荷量を均一化、すなわち複数の
検知部の感度のバラツキが低減できる。
The present invention has the following effects because it is configured as described above. In a pyroelectric element formed with a plurality of detecting parts consisting of a pair of electrodes facing each other, when the pyroelectric element is connected and fixed to the substrate using a conductive paste, the heat generated by incident infrared rays has been difficult to diffuse. By using the conductive paste as a heat sink and a heat conduction path to the substrate, it is possible to improve the escape of heat,
The amount of charge generated in the plurality of detection units can be made uniform, that is, the variation in sensitivity among the plurality of detection units can be reduced.

【0033】また、焦電型赤外線2次元アレイセンサの
場合、従来行っていた増幅回路での各検知部の感度に対
応した増幅率の調整が不要となり、工数削減ひいてはコ
スト削減を図ることができる。
In the case of the pyroelectric infrared two-dimensional array sensor, it is not necessary to adjust the amplification factor corresponding to the sensitivity of each detection unit in the conventional amplification circuit, and it is possible to reduce man-hours and cost. .

【0034】更にまた、焦電型赤外線リニアアレイセン
サの場合には、ダミーとなる検知部が必要なくなるの
で、焦電素子を小さくすることができ、その結果焦電型
赤外線リニアアレイセンサを小型化できる。
Further, in the case of the pyroelectric infrared linear array sensor, the need for a dummy detection unit is eliminated, so that the pyroelectric element can be reduced in size. As a result, the pyroelectric infrared linear array sensor can be downsized. it can.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の焦電型赤外線2次元アレイセンサで、
(a)は焦電素子を基板に実装した斜視図、(b)は焦
電素子を基板に実装した断面図である。
FIG. 1 is a pyroelectric infrared two-dimensional array sensor of the present invention;
(A) is a perspective view in which a pyroelectric element is mounted on a substrate, and (b) is a cross-sectional view in which the pyroelectric element is mounted on a substrate.

【図2】本発明の焦電型赤外線リニアアレイセンサで、
(a)は焦電素子を基板に実装した斜視図、(b)は焦
電素子を基板に実装した断面図である。
FIG. 2 is a pyroelectric infrared linear array sensor of the present invention;
(A) is a perspective view in which a pyroelectric element is mounted on a substrate, and (b) is a cross-sectional view in which the pyroelectric element is mounted on a substrate.

【図3】焦電型赤外線センサの一般的な等価回路図であ
る。
FIG. 3 is a general equivalent circuit diagram of a pyroelectric infrared sensor.

【図4】従来の焦電型赤外線アレイセンサの分解斜視図
である。
FIG. 4 is an exploded perspective view of a conventional pyroelectric infrared array sensor.

【図5】従来の焦電型赤外線アレイセンサの焦電素子を
基板に接続固定した実装断面図である。
FIG. 5 is a mounting sectional view in which a pyroelectric element of a conventional pyroelectric infrared array sensor is connected and fixed to a substrate.

【図6】従来の焦電型赤外線2次元アレイセンサの焦電
素子で、(a)は表面図、(b)は裏面図である。
6A and 6B are pyroelectric elements of a conventional pyroelectric infrared two-dimensional array sensor, wherein FIG. 6A is a front view and FIG. 6B is a rear view.

【図7】従来の焦電型赤外線リニアアレイセンサの焦電
素子で、(a)は表面図、(b)は裏面図である。
7A and 7B show a pyroelectric element of a conventional pyroelectric infrared linear array sensor, wherein FIG. 7A is a front view and FIG. 7B is a rear view.

【符号の説明】[Explanation of symbols]

18乃至33 検知部 2 高抵抗チップ 3 FET(電界効果トランジスタ) 6 端子ピン 9 基板 11 焦電素子 12 キャンケース 14 赤外線フィルター 15A、15B 電極 15C 接続線 15D リード線 16 半田バンプ 17 導電ペースト 18 to 33 detection unit 2 high resistance chip 3 FET (field effect transistor) 6 terminal pin 9 substrate 11 pyroelectric element 12 can case 14 infrared filter 15A, 15B electrode 15C connection line 15D lead wire 16 solder bump 17 conductive paste

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) G01J 1/02 G01J 5/02 G01J 5/12 G01V 9/04 H01L 37/00 - 37/02 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) G01J 1/02 G01J 5/02 G01J 5/12 G01V 9/04 H01L 37/00-37/02

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】入射赤外線によって生ずる熱に応じて電荷
を発生する一対の対向する電極よりなる検知部が複数形
成された焦電素子と、焦電素子を接続固定するための複
数の導体部が形成された基板と、複数のFETとを備え
た焦電形赤外線センサにおいて、 受光面である焦電素子表面には複数の検知部の電極を相
互に接続する接続線および焦電素子表面の端部に隣接し
て形成された検知部の電極から引き出されるリード線が
設けられ、 基板上の導体部は焦電素子の各検知部およびリード線の
引き出し部に対応する位置に形成され、 焦電素子裏面に形成された各検知部の電極が基板上の
応する導体部とそれぞれ導電ペーストで接続固定され
それぞれ前記導体部を介してFETのゲート端子と接続
されるとともに、前記接続固定部分の導電ペーストの量
は、焦電素子の中心部に位置する接続固定部分ほど少な
くなっており、さらに、 リード線と基板上の導体部が各リード線の引き出し部に
おいて導電ペーストで接続固定されるとともに、当該接
続固定部分の導電ペーストの量は、各リード線の引き出
し部において互いにほぼ同量とされることを特徴とする
焦電形赤外線アレイセンサ。
1. A pyroelectric element having a plurality of detectors formed of a pair of opposed electrodes for generating electric charges in response to heat generated by incident infrared rays, and a plurality of conductors for connecting and fixing the pyroelectric elements. In a pyroelectric infrared sensor including the formed substrate and a plurality of FETs, a connection line for connecting electrodes of a plurality of detection units to each other and an end of the pyroelectric element surface are provided on a surface of the pyroelectric element which is a light receiving surface. A lead wire is provided to be drawn out from an electrode of a detection portion formed adjacent to the portion, and a conductor portion on the substrate is formed at a position corresponding to each detection portion of the pyroelectric element and a lead portion of the lead wire. pairs each sensing portion of the electrode formed on the element back surface of the substrate
The corresponding conductors are connected and fixed with conductive paste, respectively .
Connected to the gate terminal of the FET via the conductor
Amount of Rutotomoni, the connecting fixing portion of the conductive paste
Is smaller at the fixed connection part located at the center of the pyroelectric element.
Kuna' and, further, the conductor portion of the lead wire and on the substrate to the lead portion of each lead
Fixedly connected with Oite conductive paste Rutotomoni, the contact
The amount of conductive paste in the fixed part depends on the
A pyroelectric infrared array sensor having substantially the same amount at each end .
JP27221993A 1993-10-29 1993-10-29 Pyroelectric infrared array sensor Expired - Fee Related JP3235298B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP27221993A JP3235298B2 (en) 1993-10-29 1993-10-29 Pyroelectric infrared array sensor
US08/329,333 US5625188A (en) 1993-10-29 1994-10-26 Pyroelectric infrared array sensor
DE4438673A DE4438673C2 (en) 1993-10-29 1994-10-28 Pyroelectric infrared array sensor
GB9421786A GB2283362B (en) 1993-10-29 1994-10-28 Pyroelectric infrared array sensor
US09/078,349 US6175114B1 (en) 1993-10-29 1998-05-13 Pyroelectric infrared array sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27221993A JP3235298B2 (en) 1993-10-29 1993-10-29 Pyroelectric infrared array sensor

Publications (2)

Publication Number Publication Date
JPH07128142A JPH07128142A (en) 1995-05-19
JP3235298B2 true JP3235298B2 (en) 2001-12-04

Family

ID=17510778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27221993A Expired - Fee Related JP3235298B2 (en) 1993-10-29 1993-10-29 Pyroelectric infrared array sensor

Country Status (1)

Country Link
JP (1) JP3235298B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103229028B (en) * 2010-10-25 2016-02-10 Nec东金株式会社 Pyroelectric sensor array and thermoelectric type infra-red ray detection device

Also Published As

Publication number Publication date
JPH07128142A (en) 1995-05-19

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