JP3234812U - Lightweight water circulation system that enables heating and cooling of water - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lightweight water circulation system capable of heating and cooling water, which improves the performance of a product and realizes compactification and energy saving. A lightweight water circulation system capable of heating and cooling water, which comprises a thermoelectric semiconductor chip 1, a first heat conduction module 2, a second heat conduction module 3, and an electromagnetic valve 12. The first heat conduction module and the second heat conduction module are arranged so as to correspond to the left and right, and a thermoelectric semiconductor chip is provided between the first heat conduction module and the second heat conduction module, and the first heat conduction module is provided. The module is provided with a first water channel 4, and the first water inlet portion 5 and the first outlet portion 6 are connected to the upper and lower left sides, and the first outlet portion is fixed to the electromagnetic valve. There is. The second heat conduction module is provided with a second water channel 7, and a second water inlet portion 8 and a second outlet portion 9 are fixed above and below the right side. The heating and cooling functions are combined into one and controlled by the same system unit. [Selection diagram] Fig. 1

Description

The present invention relates to the technical field of heating / cooling water, and specifically to a lightweight water circulation system that enables heating / cooling of water.

Conventional lightweight water circulation products do not have a heating or cooling function, or only products having a function of independently heating or cooling independently, so that highly reliable performance cannot be obtained, the size is large, and the energy consumption is large.

In order to solve the above problems, the present invention provides a kind of lightweight water circulation system capable of heating and cooling water, which comprises a thermoelectric semiconductor chip, a first heat conduction module, a second heat conduction module, and an electromagnetic valve.

The first heat conduction module and the second heat conduction module are arranged so as to correspond to the left and right, and a thermoelectric semiconductor chip is provided between the first heat conduction module and the second heat conduction module.

The first heat conduction module is provided with a first water channel, and a first inflow port portion of water is connected to the upper left side of the first heat conduction module, and the first inflow port portion is fixed to a solenoid valve. Has been done.

The first heat conduction module is fixedly connected to the first outlet portion of water on the lower left side, and the second heat conduction module is provided with a second water channel, and the second heat conduction module is provided. The module is characterized in that a second inflow port of water is fixed to the upper right side, and the second heat conduction module has a second outflow port fixed to the lower right side.

Preferably, the first heat conductive module and the second heat conductive module are fixed to each other by a connecting block.

Preferably, a heat conductive silicone grease is applied between the thermoelectric semiconductor chip and the first heat conductive module and between the second heat conductive module.

Preferably, the second heat transfer module has a heat recovery conductor fixedly attached to the outer wall.

Preferably, the first heat conductive module has a heat insulating layer adhered to an outer wall.

Compared with the prior art, the beneficial effects of the present invention are as follows.
The present invention integrates the heating and cooling functions into one, controls heating and cooling in the same system unit, and controls heating and cooling in the same unit instead of independent heating and independent cooling. We will improve the performance, make it more compact, and save energy.

The left side of the thermoelectric semiconductor chip is the cooling side, and the right side is the heat dissipation (heating) side. When the thermoelectric semiconductor chip operates, the cooling temperature on the left side (cooling side) of the thermoelectric semiconductor chip drops, and the temperature of the first heat conduction module is lowered by heat conduction, so that the water in the first channel can be made cold water. can.

At the same time, by setting the opening / closing time of the solenoid valve, the water in the first heat conduction module can be sufficiently cooled and the cooling effect can be improved.
The left side of the thermoelectric semiconductor chip is cooled, and at the same time, the right side of the thermoelectric semiconductor chip dissipates (heats) heat.

In this water circulation system, the cold water of the first heat conduction module is circulated to the second heat conduction module to dissipate heat by water circulation, so that the cooling sustainability of the semiconductor is improved and the heat dissipation effect is also improved.

By changing the positive and negative polarities of the thermoelectric semiconductor chip voltage, the left side of the chip can be switched to the heat dissipation (heating) side and the right side to the cooling side. When the thermoelectric semiconductor chip operates, the right side (cooling side) of the thermoelectric semiconductor chip is cooling, and at the same time, the left side of the thermoelectric semiconductor chip dissipates heat. Due to the heat dissipation on the left side, the temperature of the first heat conduction module rises due to heat conduction, and the water in the first water channel becomes hot water.

At the same time, by setting the opening / closing time of the solenoid valve, the water in the first heat conduction module can be sufficiently heated and the heating effect can be improved.

The right side of the semiconductor continues to cool, and the left side of the semiconductor continues to dissipate heat, so that the water in the first channel is continuously heated to generate hot water.

It is a schematic diagram of the whole structure of this invention. It is a structural drawing of this invention. It is a heating / cooling circuit diagram of the thermoelectric semiconductor chip of this invention. It is a pump operation circuit diagram. It is a solenoid valve control circuit diagram.

Hereinafter, the technical solution in the embodiment of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiment of the utility model. Obviously, the embodiments described are only part of, but not all, of the embodiments of the Utility Model.

If a related company is enlightened by the present invention and designs a structural method or embodiment similar to a non-inventive technical solution without deviating from the creative purpose of the present invention, it is within the scope of protection of the present invention. It is said that it will enter.

In the description of the present invention, terms such as "top", "bottom", "inside", "outside", "left", "right", and "top / bottom" are the orientations and positional relationships shown in the attached drawings. It indicates the orientation and positional relationship based on the above, and is intended only to facilitate and simplify the explanation of the present invention, and the mentioned devices and elements have a specific orientation and are constructed in a specific orientation. It should be noted that it is not an indication or suggestion that it must be, and therefore should not be construed as limiting the invention. Moreover, the terms "first" and "second" are used for explanatory purposes only and should not be understood as implying or implying relative importance.

In the description of the present invention, terms such as "installed,""connected,""set," and "fixed" are understood in a broad sense, unless specifically defined and restricted. Should be. For example, a "connection" can be a fixed connection, a detachable connection, an integrated connection, a mechanical connection, an electrical connection, a direct or intermediary connection, within two components. It's also a connection. For related companies, the meaning of the above terms in the present invention is to be understood under certain circumstances.
Example

An embodiment of the present invention will be described with reference to FIGS. 1 to 5.
The present invention provides a kind of lightweight water circulation system capable of heating and cooling water, which comprises a thermoelectric semiconductor chip (Pelche element chip) 1, a first heat conduction module 2, a second heat conduction module 3, and an electromagnetic valve 12.

The first heat conduction module 2 and the second heat conduction module 3 are arranged so as to correspond to the left and right, and a thermoelectric semiconductor chip 1 is provided between the first heat conduction module 2 and the second heat conduction module 3. ing. The left side of the thermoelectric semiconductor chip 1 is the cooling surface, the right side is the heating surface, and by changing the positive and negative polarities of the voltage of the thermoelectric semiconductor chip 1, the left side can be changed to the heating surface and the right side can be changed to the cooling surface. The drive circuit of the chip 1 is shown in FIG.

As shown in FIG. 2, the control circuit of the present invention uses the output voltage of the master MCU (U1) to switch between the high voltage and the low voltage of the IO-HOT1 terminal and the IO-HOT2 terminal to cool or heat the semiconductor. To change. The IO-NTC1 terminal and IO-NTC2 terminal each input a real-time temperature detection signal of the thermoelectric semiconductor chip 1 to the MCU (U1), and the MCU (U1) uses the detection signal to perform heating and cooling functions of the thermoelectric semiconductor chip 1. Control.

The first heat conduction module 2 is provided with a first water channel 4, and the first inflow port portion 5 of the first water channel 4 is fixed on the upper left side of the first heat conduction module 2, and the first inflow port is described. The first outlet portion 6 of the first water channel 4 is fixed to the lower left side of the first heat conduction module 2 to which the water pipe is connected to the portion 5, and the electromagnetic valve is connected to the first outlet portion 6. 12 are connected.

As shown by the broken line 1 in the figure, the first outlet portion 6 is connected to the inlet port A of the solenoid valve 12 via a water pipe, and the outlet port B of the solenoid valve 12 serves as a water outlet. Water at room temperature enters the first water channel 4 from the first inflow port 5, and then is cooled by the thermoelectric semiconductor chip 1 to become cold water, which is discharged from the first outflow port 6.

The second heat conduction module 3 is provided with a second water channel 7, and the second heat conduction module 3 has a second inflow port 8 of the second water channel 7 fixed to the upper right side. The second outlet portion 9 of the second water channel 7 is fixedly connected to the lower right side of the second heat conduction module 3.

The second inflow port 8 and the second outflow port 9 are for connecting to an external water pipe, and water at room temperature enters the second water channel 7 from the second inflow port 8 and is heated by the thermoelectric semiconductor chip 1. The water becomes hot water and is discharged from the second outlet portion 9, so that the heat dissipation of the second heat conduction module 3 is improved.

The water in the first water channel 4 is used after being heated or cooled by the thermoelectric semiconductor chip 1. At the same time that the left side of the thermoelectric semiconductor chip 1 is cooled by the cooling surface, it is heated by the heating surface on the right side, and the heat is conducted to the water in the second water channel 7 via the second heat conduction module 3, and the second Circulating water for cooling the thermoelectric semiconductor chip 1 is supplied to the water channel 7.

At the same time, the cold water of the first heat conduction module 2 can also play a role of dissipating heat through the circuit. The water cycle of circulating water involves circulating water at a negative pressure generated by a pump. The pump is connected to the device of the present invention via a water pipe, and the drive circuit of the pump is shown in FIG. In the present invention, the amount of water is controlled by using the solenoid valve 12 to secure the amount of water output.

The opening / closing time of the solenoid valve 12 is set so that the water in the first water channel 4 of the first heat conduction module 2 can be completely cooled or heated, and the efficiency of finally producing cold ice water or hot water becomes better. Set. The control circuit of the solenoid valve 12 is shown in FIG.

A connection block 10 is fixed between the first heat conductive module 2 and the second heat conductive module 3. The connection block 10 is a heat-resistant insulating resin body.

Thermally conductive silicon grease is applied between the thermoelectric semiconductor chip 1 and the first heat conductive module 2 and between the second heat conductive module 3. The second heat conduction module 3 has a heat recovery conductor fixedly attached to an outer wall. A heat insulating layer is adhered to the outer wall of the first heat conductive module 2.

The operation of the examples will be described below.
Principle of operation: The present invention combines the functions of heating and cooling into one, controlling heating and cooling in the same system unit, and controlling heating and cooling in the same unit instead of independent heating and independent cooling. , Product performance can be further improved, and more compact and energy saving can be achieved.

When the cooling surface of the thermoelectric semiconductor chip 1 is cooled, the heating surface is heated and heat is dissipated through the second heat conduction module 3. At the same time, the cold water in the first heat conduction module 2 can also play the role of cooling and heat dissipation through the circuit.

The basic principles, main features, and advantages of the present invention have been described above, but the present invention is not limited to the details of the above examples, and deviates from the spirit or essential features of the present invention. It is clear to those skilled in the art that it can be carried out in other specific forms.

Therefore, the present embodiment should be regarded as exemplary and non-limiting, and the scope of the rights of the present invention is limited by the claims rather than the above description.
For those skilled in the art, various modifications, modifications, substitutions and modifications can be made to these embodiments without departing from the principles of the present invention. The scope of rights of the present invention is defined as the scope of claims and their equivalents.

1 Thermoelectric semiconductor chip 2 1st heat conduction module 3 2nd heat conduction module 4 1st water channel 5 1st inflow port 6 1st inflow port 7 2nd waterway 8 2nd inflow port 9 2nd outflow port 10 connection Block 11 Heat recovery conductor 12 Electromagnetic valve

Claims (5)

A lightweight water circulation system capable of heating and cooling water including a thermoelectric semiconductor chip (1), a first heat conduction module (2), a second heat conduction module (3), and an electromagnetic valve (12). Characterized by:
The first heat conduction module (2) and the second heat conduction module (3) are arranged on the left and right, and a thermoelectric semiconductor chip is provided between the first heat conduction module (2) and the second heat conduction module (3). (1) is provided.
The first heat conduction module (2) is provided with a first water channel (4), and the first inflow port portion of the first water channel (4) is provided above and below the left side of the first heat conduction module (2). (5) and the first outlet (6) are connected,
The first outlet portion (6) is connected to a solenoid valve (12), the second heat conduction module (3) is provided with a second water channel (7), and the second heat conduction module is provided. In (3), the second inlet portion and the second outlet portion (9) of the second water channel (7) are fixed above and below the right side. The lightweight water circulation system capable of heating and cooling water according to claim 1, wherein a connection block (3) is connected between the first heat conductive module (2) and the second heat conductive module (3). It is characterized in that it is fixed by 10). The lightweight water circulation system capable of heating and cooling water according to claim 1, wherein the thermoelectric semiconductor chip (1) is connected to and from a first heat conductive module (2) and is second heat conductive. It is characterized in that a thermally conductive silicon grease is applied between the module (3) and the module (3). The lightweight water circulation system capable of heating and cooling water according to claim 1, characterized in that a heat recovery conductor (11) is fixed to the outer wall of the second heat conduction module (3). do. The lightweight water circulation system capable of heating and cooling water according to claim 1, wherein the first heat conduction module (2) has a heat insulating layer adhered to an outer wall.

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