JP3214762B2 - Endoscope imaging device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an endoscope image pickup apparatus subjected to heat sterilization.

[0002]

2. Description of the Related Art An endoscope which can be used for observing a deep portion of a body cavity or the like by inserting it into a body cavity or the like and performing a medical treatment or the like by using a treatment tool as necessary is used in the medical field. It has become widely used. Also, in the industrial field, endoscopes are widely used for inspection inside jet engines or inside plants. In particular, in the case of a medical endoscope, it is indispensable to surely sterilize the used endoscope in order to prevent infectious diseases and the like.

Conventionally, this sterilization treatment has relied on a gas such as EOG or a cleaning solution. However, as is well known, sterilization gases are highly toxic, and the sterilization operation is complicated to ensure the safety of the sterilization operation. Further, in the case of the cleaning liquid, there is a disadvantage that the management of the cleaning liquid is complicated, and a great deal of cost is required for disposal processing of the cleaning liquid.

Therefore, recently, heat sterilization (autoclave or the like) which does not involve complicated work as described above is becoming mainstream in endoscope devices.

[0005]

However, in an external endoscope camera which detachably attaches to an eyepiece of an endoscope and takes an endoscope image, for example, an image pickup device or the like is provided inside.
Electronic components typified by semiconductors are provided, and since these electronic components have low heat resistance, they cannot withstand required temperatures during heat sterilization at present.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides an endoscope imaging apparatus capable of improving the heat resistance of imaging means composed of electronic components and the like and enabling heat sterilization. It is an object.

[0007]

In order to achieve the above object, an endoscope imaging apparatus according to the first aspect of the present invention has a predetermined configuration.
In an electronic endoscope having an electronic component of at least ,
A first covering layer covering the predetermined electronic component , a second covering layer covering the first covering layer, and a first covering layer provided between the first covering layer and the second covering layer. A first elastic member that maintains a seal between the first coating layer and the second coating layer, a third coating layer that covers the second coating layer,
The second coating layer provided between the second coating layer and the third coating layer.
A second elastic member for maintaining the airtightness between the coating layer and the third coating layer, wherein the multilayer coating reduces heat transfer, and the elastic member ensures the airtightness. The heat resistance of the electronic component is improved. An endoscope imaging apparatus according to a third aspect of the present invention includes a predetermined electronic component.
In the electronic endoscope having at least the predetermined
A first coating layer covering the child component , a second coating layer covering the first coating layer, a heat insulating layer formed between the first coating layer and the second coating layer, A first elastic member provided between the first coating layer and the second coating layer, for maintaining a hermetic seal between the first coating layer and the second coating layer; A third coating layer covering the second coating layer;
A heat insulating layer formed between the first coating layer and the third coating layer, and the second coating layer and the third coating layer provided between the second coating layer and the third coating layer. A second elastic member for maintaining the airtightness between the electronic component and the electronic component by reducing heat transfer by the multilayer coating and the heat insulating layer, and ensuring the airtightness by the elastic member. To improve heat resistance.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 relate to a first embodiment of the present invention. FIG. 1 is a sectional view showing the structure of a camera head.
FIG. 3 is a cross-sectional view showing the connection between the exterior layers of FIG. 1 and the cover glass, FIG. 3 is a cross-sectional view showing a modification of the connection between the metal layer of FIG. 1 and the cover glass, and FIG. FIG.

As shown in FIG. 1, a camera head 1 as an endoscope imaging apparatus according to the present embodiment is detachably attached to, for example, an eyepiece 5 of a rigid endoscope 4 via a camera adapter 2. Has become. The rigid endoscope 4 has an LG base 6
Illumination light from a light source (not shown) is supplied to a light guide (not shown) that passes through the inside of the rigid mirror 4, and the illumination light is transmitted to the front end of the rigid mirror 4. Then, the endoscope image obtained by the illumination light is transmitted to the eyepiece by an image transmission means (for example, a relay lens system or an image guide) (not shown) that passes through the inside of the rigid endoscope 4.

The endoscope image transmitted in this way is formed on an image pickup surface of a solid-state image pickup device, for example, a CCD 7 in the camera head 1 via an optical system (not shown) in the camera adapter 2.

In the camera head 1, an incident endoscope image is provided by a first cover glass 11, a first air layer 12, a second cover glass 13, a second cover glass 13 provided on the front surface of the camera head 1.
The light passes through the air layer 14 and the third cover glass 15 sequentially and forms an image on the imaging surface of the CCD 7. The endoscopic image by CCD7 is converted into an electric signal, and is output to a video processor (not shown) as image information by a signal cable 17 via the circuit board 16 mounted with a preamplifier and the like.

The exterior of the camera head 1 is made of a conductive layer (for example, a cylindrical member covered with a metal sheath,
Alternatively, a metal is vapor-deposited on the surface, and a conductive paint is coated on the surface, etc.) 21, an insulating layer 22, and a metal layer 23.
It has a three-layer structure. The conductive layer 21 has one end fixed to the signal cable 17, a circuit board 16, and a CCD.
7 and the third cover glass 15, and the circuit board 16, the CCD 7
Is shielded. The insulating layer 22 covers the conductive layer 21 and the second cover glass 13, and the base end is fixed to the signal cable 17 via an O-ring 24 in a watertight manner. The metal layer 23 covers the insulating layer 22 and the first cover glass 11, and the base end is fixed to the signal cable via an O-ring 24 in a watertight manner. This metal layer 2
A screw mount 25 is provided on the outer periphery of the distal end of 3, and is attached to the camera adapter 2 by the screw mount 25.

The conductive layer 2 is formed by the insulating layer 22.
1 and the metal layer 23 are secured, and the insulating layer 22 is made of a material having a low thermal conductivity, so that heat from the metal layer 23 is hardly transmitted to the conductive layer 21. .

The connection between the cover glass and each layer is shown in FIG.
As shown in (a), for example, the connection between the metal layer 23 and the first cover glass 11 is made by connecting the tip of the metal layer 23 to the inner diameter side.
A first annular elastic member 31 is provided on the projecting portion, and the first annular elastic member 31 is provided on the first cover glass 1.
1 are in contact with each other. And the first cover glass 11
A second annular elastic member 32 is provided on the surface on the opposite side of the first annular elastic member. The airtightness is ensured by the member 31 and the second annular elastic member 32, and the airtight state of the first air layer 12 is maintained. Similarly, the connection between each of the other layers and the cover glass realizes a connection in which hermeticity is ensured.

According to the camera head 1 of the present embodiment having the above-described configuration, the insulating state between the conductive layer 21 and the metal layer 23 is ensured by the insulating layer 22 and the insulating layer 22 is made of a material having a low thermal conductivity. , The heat from the metal layer 23 is less likely to be transmitted to the conductive layer 21. As a result, the temperature rise of the CCD 7 and the circuit board 16 can be prevented. The electronic components in 1 are not damaged.

When an interlayer air layer is formed between the respective layers, the respective layers and the cover glass may be connected as shown in FIG. 2 (b). That is, for example, when the interlayer air layer 35 is formed between the metal layer 23 and the insulating layer 22, the connection between the first cover glass 11 and the metal layer 23 is performed by using an insulating layer instead of the frame member 33 of FIG. 22 may be extended and the second annular elastic member 32 may be pressed to secure the airtightness and be connected and fixed. As for the second cover glass, a step may be provided at a predetermined position of the insulating layer 22 and the second cover glass may be fixed to the step with the sealing resin 36.

The first cover glass 11 and the metal layer 23
2A is connected as shown in FIG. 2A, but is not limited to this, and may be connected as shown in FIG. That is, a step is provided at the tip of the metal layer 23, the second annular elastic member 32 is provided at the step, and the first cover glass 11 is brought into contact with the frame member 33 a at the tip of the metal layer 23. A first annular elastic member 3 is provided between the notch and the frame member 33a.
1 may be provided and the frame member 33a may be tightened from the front end side to secure the airtightness and connect and fix the frame member 33a. By thus providing the frame member 33a on the front end surface side of the first cover glass 11, the assembly is facilitated. Here, the notch is provided in the first cover glass 11, but it goes without saying that the notch may be provided in the frame member 33a.

Further, by forming the first annular elastic member 31 from a chemical resistant member and the second annular elastic member 32 from a moisture proof member, a camera head with more excellent durability can be realized.

Further, in the first embodiment, the CCD 7 and the circuit board 16 are arranged in the same space in the camera head 1. However, the present invention is not limited to this, and as shown in FIG. By connecting the circuit boards in a detachable manner, only the camera head can be repeatedly sterilized, and the circuit board 16 and the signal cable 17 may be disposable. Further, as shown in FIG.
6 alone may be hermetically sealed with a three-layer exterior. In this case, since the circuit board side has a completely sealed structure, the circuit board 16
Is completely moisture-proof and reliability is improved.

Next, a second embodiment will be described. 5 to 9 relate to the second embodiment. FIG. 5 is a cross-sectional view showing the structure of a camera head in which an interlayer air layer is formed between outer layers, and FIG. 6 is formed between a metal layer and an insulating layer. FIG. 7 is a cross-sectional view showing a configuration of a modified example of the camera head of FIG. 5 in which the interlayer air layer is filled with a latent heat storage material, and FIG. FIG. 8 is a cross-sectional view showing a configuration of a modification of the camera head of FIG. 6, and FIG. 8 is a view of the camera head of FIG. FIG. 9 is a cross-sectional view illustrating a configuration of a modified example, and FIG. 9 is a cross-sectional view illustrating a configuration of a modified example of a camera head insulated by a latent heat storage material.

Since the second embodiment has the same configuration as the first embodiment, the same components are denoted by the same reference numerals and description thereof will be omitted.

In the camera head of the second embodiment, as shown in FIG. 5, the first cover glass 11 is fixed to the first frame 41, and the second cover glass 13 is fixed to the second frame 42. The third cover glass 15 is fixed to the third frame 43. The first frame 41 is hermetically connected to the metal layer 23 by an O-ring 44, and the second frame 42 is
And the O-ring 45 is hermetically connected to the first frame 41 to form a sealed interlayer air layer 46 between the metal layer 23 and the insulating layer 22. In addition, an independent air layer 49 is formed between the first cover glass 11 and the second cover glass 13.

Similarly, the third frame 43 is connected to the conductive layer 21, and the connection between the second frame 42 and the insulating layer 22 is such that an interlayer air layer 47 is formed between the conductive layer 21 and the insulating layer 22. The shape is as follows.

Further, a fixing member 48 is provided at a connection portion between the metal layer and the signal cable 17 so that the connection state does not change due to the bending of the signal cable 17. 23 is secured.

According to the camera head of the second embodiment constructed as described above, in addition to the effects of the first embodiment, the heat insulation of the CCD 7 and the circuit board 16 is improved by the interlayer air layers 46 and 47, and the heat The heat resistance of the camera head in the sterilization process is further improved.

The interlayer air layer 46 of the camera head according to the second embodiment can be filled with a latent heat storage material (phase change material) 51 as shown in FIG. For example, in an autoclave at 135 ° C for 5 minutes,
Assuming that the heat-resistant temperature of 7 is 85 ° C., the latent heat storage material 51 filled in the interlayer air layer 46 may be a latent heat storage material having a melting point of about 80 ° C. The filling amount of the latent heat storage material 51 is
It can be easily determined from the amount of heat that the steam at 135 ° C. can give in 5 minutes and the latent heat per unit weight of the latent heat storage material 51.
In this case, no matter how high the temperature of the metal layer 23, which is the outermost layer, rises, the latent heat storage material 51 is completely (that is, all of the charged latent heat storage material 51), for example, a phase from a solid phase to a liquid phase. Until the change is completed, the temperature of the latent heat storage material 51 does not rise above the melting point. Accordingly, since the internal temperature of the area where the CCD 7 and the circuit board 16 are arranged does not exceed the melting point of the latent heat storage material 51, the heat resistance of the camera head in the heat sterilization process can be remarkably improved. The latent heat storage material 51
Although the phase change is described as a phase change from a solid phase to a liquid phase, the invention is not limited to this, and a latent heat storage material that causes a phase change from a liquid phase to a gas phase may be used.

In the camera head shown in FIG. 6, the interlayer air layer 47 can be filled with a heat insulating material 52 as shown in FIG. By doing so, the thermal resistance of the camera head can be further improved as compared with FIG.

Further, the second cover glass 13 may be fogged by the heat sterilization process. For example, in the camera head shown in FIG. 8, by connecting the second frame member 42 and the first frame member 41, the air phase is reduced. 49 and the interlayer air phase 46 are in the same space, in which a latent heat storage material 51 having excellent light transmittance is provided.
By filling a, fogging of the second cover glass 13 can be completely prevented.

Further, the camera head can be covered with a disposable heat sterilization camera head cover filled with the latent heat storage material 51 to perform heat sterilization. As shown in FIG. 9, the camera head 1 (in FIG. 9, the camera head of the first embodiment will be described, but the camera head 1 of the second embodiment and its modified examples and the camera head of each embodiment described later) Camera head cover 5 filled with a latent heat storage material 51 for heat sterilization.
5 and heat sterilization may be performed. At this time, for example, when the latent heat storage material 51 is a latent heat storage material causing a phase change from a liquid phase to a gaseous phase, the camera head cover 55 is changed to a gaseous phase. If the internal pressure becomes equal to or higher than a predetermined pressure in order to avoid an abnormal increase in the internal pressure, a pressure valve 56 for discharging the latent heat storage material 51 in the internal gas phase to the outside can be provided.

Next, a third embodiment will be described. FIG.
11 and 12 relate to the third embodiment. FIG. 10 is a cross-sectional view showing a configuration of a camera head, and FIG. 11 is a cross-sectional view showing a configuration of a modification of the camera head of FIG.

Since the third embodiment is almost the same as the first embodiment, the same components are denoted by the same reference numerals and description thereof will be omitted.

The third embodiment differs from the first embodiment shown in FIG. 1 in that an interlayer air layer is formed between the layers, and
7 is different from the first embodiment in that a support member is provided.

As shown in FIG. 10, the signal cable 17 is fitted and fixed in a hollow portion of a support member 61 having a hollow portion at the center. Then, the conductive layer 21, the insulating layer 22, and the metal layer 23 are screwed to the support member 61.
At this time, the metal layer 23 is screwed via the packing 62,
Interlayer air layers 63 and 64 are formed between the respective layers. Other configurations are the same as those of the first embodiment.

According to the third embodiment thus constructed, in addition to the effects of the first embodiment, the heat insulating effect is enhanced by the interlayer air layers 63 and 64 , and the thermal resistance of the camera head is improved. Further, the conductive layer 21, the insulating layer 22, and the metal layer 23
Is fixed by the support member 61, so that a completely sealed state can be maintained.

The structure of the support member 61 is not limited to that shown in FIG. 10, but as shown in FIG. 11, an O-ring 72 is formed in the groove of the first support member 71 having a hollow portion having a plurality of grooves.
The signal cable 17 is inserted into the hollow portion, and the signal cable 17 and the first support member 71 are connected while maintaining a sealed state by the O-ring 72. On the other hand, the first support member 7
The outer periphery of 1 is cut out in an L shape so as to have a vertical portion on the incident side, and the vertical portion, the conductive layer 21, the insulating layer 22, and the metal layer 23 are sequentially arranged via a packing 73. A screw portion 74 is formed on the outer periphery of the first support member 71 on the signal cable side (opposite side of the incident side), and a second support member 75 is screwed to the screw portion 74. Then, by screwing the second support member 75 to a predetermined position, the vertical portion, the conductive layer 21,
The insulating layer 22 and the metal layer 23 are fixedly connected in a sealed state.

The CCD of the camera head shown in FIG.
The space in which the circuit board 7 and the circuit board 16 are arranged has the same sectional area as that of the camera head of FIG. 10, but has a different length in the axial direction. That is, when the length L2 in FIG. 11 is compared with the length L1 in FIG. 10, L1 <L2. As a result, since the space in which the CCD 7 and the circuit board 16 are arranged is larger in FIG. 11, the latent heat of the space becomes larger. Therefore, the ambient temperature of the CCD 7 and the circuit board 16 rises more slowly than in FIG. The heat resistance in the heat sterilization process can be improved.

Next, a fourth embodiment will be described. FIG.
FIG. 9 is a cross-sectional view showing the shape of each layer of the multilayer exterior according to the fourth embodiment.

The fourth embodiment is different from the second and third embodiments in that the interlayer air layer is formed by the connection shape of each layer and the cover glass. On the other hand, the shape of the insulating layer is three-dimensional in the radial direction. Is different in that an interlayer air layer between the respective layers is formed by forming the layer.

FIG. 1 is a cross section perpendicular to the axis of the camera head.
As shown in FIG. 2A, the outer periphery of the third cover glass 15 is covered with a conductive layer 21 in close contact therewith.
Is also closely covered with an insulating layer 22a made of resin or the like. A plurality of projections 91 are formed on the outer periphery of the insulating layer 22a, and the metal layer 23 covers the tip of the projections 91 in close contact. The protrusion 91 forms an interlayer air layer 92 between the insulating layer 22a and the metal layer 23.

The other construction is the same as in the second and third embodiments.

According to the camera head of the fourth embodiment configured as described above, in addition to the effects of the second and third embodiments, the insulating layer 22a can be easily formed by resin molding. An interlayer air layer 92 can be formed,
A camera head with excellent heat resistance can be realized at low cost.

Although the plurality of protrusions 91 are provided on the outer periphery of the insulating layer 22a, the present invention is not limited to this. By providing a plurality of protrusions on the outer periphery of the conductive layer 21, the An interlayer air layer may be formed between them.

As shown in FIG. 12B, the insulating layer 22b provided with the projection 95 not only on the outer periphery but also on the inner periphery forms an interlayer air layer 96 between the conductive layer 21 and the insulating layer 22b.
And an interlayer air layer 9 between the insulating layer 22b and the metal layer 23.
The protrusion 91 may be resin-molded on the insulating layer 22a so as to form 2.

Further, as shown in FIG. 12C, the interlayer air layer 99 may be formed by the insulating layer 22c formed with a plurality of protrusions 98.

In the above embodiment, the camera head used for the rigid endoscope has been described. However, the present invention is not limited to this, and the same effect can be obtained by similarly configuring the camera head connected to the flexible endoscope. Can be.

Each of the embodiments and the modifications thereof is an embodiment and a modification applicable to the other embodiments (for example, a third modification of the second embodiment).
Modifications of each embodiment are not limited to the described embodiments. Furthermore, it goes without saying that the above effects can be achieved by a combination of each embodiment and its modification.

[0047]

According to the endoscope imaging apparatus of the present invention described above, according to the present invention, by reducing the heat transfer by a multilayer coating predetermined
The heat resistance of the electronic component can be improved, and the heat resistance can be further improved by providing the heat insulating layer.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a configuration of a camera head according to a first embodiment.

FIG. 2 is a cross-sectional view showing the connection between the exterior layers of FIG. 1 and a cover glass.

FIG. 3 is a sectional view showing a modification of the connection between the metal layer and the cover glass in FIG. 1;

FIG. 4 is a sectional view showing a configuration of a modified example of the camera head according to the first embodiment.

FIG. 5 is a cross-sectional view showing a configuration of a camera head in which an interlayer air layer is formed between exterior layers according to a second embodiment.

6 is a cross-sectional view illustrating a configuration of a modification of the camera head of FIG. 5 in which an interlayer air layer formed between a metal layer and an insulating layer is filled with a latent heat storage material.

FIG. 7 is a cross-sectional view illustrating a configuration of a modification of the camera head of FIG. 6 in which an interlayer air layer formed between an insulating layer and a conductive layer is filled with a heat insulating material.

8 is a cross-sectional view showing a configuration of a modified example of the camera head of FIG. 7 in which a latent heat storage material having excellent light transmittance is used and a latent heat storage material is filled between first and second cover glasses.

FIG. 9 is a cross-sectional view illustrating a configuration of a modified example of the camera head insulated by the latent heat storage material according to the second embodiment.

FIG. 10 is a sectional view showing a configuration of a camera head according to a third embodiment.

FIG. 11 is a sectional view showing a configuration of a modification of the camera head of FIG. 10;

FIG. 12 is a cross-sectional view showing the shape of each layer of a multilayer exterior package according to a fourth embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Camera head 7 ... CCD 11 ... 1st cover glass 13 ... 2nd cover glass 15 ... 3rd cover glass 16 ... Circuit board 17 ... Signal cable 21 ... Conductive layer 22 ... Insulating layer 23 ... Metal layer

────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kenji Omachi 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside the Olympus Optical Industrial Co., Ltd. (72) Inventor Nobuyoshi Tanizawa 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside the Olympus Optical Co., Ltd. (72) Masao Uehara, the inventor 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside the Olympus Optical Co., Ltd. Masahiro Hagiwara, 2-43-2, Hatagaya, Shibuya-ku, Tokyo In Olympus Optical Co., Ltd. (56) References JP-A-3-11821 (JP, A) JP-A-5-42103 (JP, A) JP-A 63-49512 (JP, U) (58) Field (Int.Cl. ⁷ , DB name) A61B 1/00-1/32 G02B 23/24

Claims (3)

(57) [Claims] 1. An electronic endoscope having predetermined electronic components.
And at least a first coating layer that covers the predetermined electronic component , a second coating layer that covers the first coating layer, and between the first coating layer and the second coating layer. Equipped,
A first elastic member that maintains a seal between the first coating layer and the second coating layer, a third coating layer that covers the second coating layer, and a second coating layer And the third coating layer.
An endoscope imaging device, comprising: a second elastic member that maintains the airtightness between the second coating layer and the third coating layer. 2. The second coating layer is formed of an insulating material.
And The first and third coating layers are formed of a conductive material;
In the meantime, A signal cable for outputting an imaging signal from the imaging means;
The first coating layer is electrically connected to the first coating layer.
The endoscope imaging device according to claim 1. 3. An electronic endoscope having predetermined electronic components.
And at least a first coating layer that covers the predetermined electronic component , a second coating layer that covers the first coating layer, and between the first coating layer and the second coating layer. A heat insulating layer formed, provided between the first coating layer and the second coating layer,
A first elastic member that maintains a seal between the first coating layer and the second coating layer, a third coating layer that covers the second coating layer, and a second coating layer And a heat insulating layer formed between the second coating layer and the third coating layer.
An endoscope imaging device, comprising: a second elastic member that maintains the airtightness between the second coating layer and the third coating layer.