JP3201535U - PCB mounting terminals - Google Patents

Abstract

A lightweight and small printed circuit board mounting terminal that can be adsorbed by an adsorption nozzle of an automatic adsorption machine, ensures stable energization between a main board and a sub board, and can firmly support the sub board. provide. A printed circuit board mounting terminal according to the present invention includes a flat bottom surface portion, a left side wall portion that extends vertically from the left end of the bottom surface portion and bends inward upward, and a bottom surface portion. From the right end of the right side wall portion 30 that extends vertically from the right end and bends inward upward, the circuit contact portion 40 that extends from the front end of the left side wall portion 20 and bends in a “<” shape, and from the front end of the right side wall portion 30 The circuit contact surface portion 50 extends vertically upward with respect to the bottom surface portion, and the attracted portion 60 extends from the tip of the circuit contact surface portion 50 outward in the horizontal direction with respect to the bottom surface portion 10. [Selection] Figure 1

Description

  The present invention relates to a terminal for vertically connecting two printed circuit boards.

  It is a common practice to electrically connect a secondary printed circuit board (hereinafter referred to as a sub board) to a main printed circuit board (hereinafter referred to as a parent board). There are various methods for connection, including a method using a lead wire. Among them, a method in which a socket-like connector is arranged on a parent board and a child board is inserted into the socket and connected is the mainstream.

  Socket-like connectors have various advantages. For example, a large number of electrical contacts can be provided between the parent substrate and the child substrate, the child substrate can be stably supplied with good current, and the child substrate can be easily replaced.

  However, it is not economical to use a socket-like connector until there are few electrical contacts. In such a case, it is appropriate to use a lightweight and small printed circuit board mounting terminal (hereinafter referred to as a terminal). It is desirable that the terminal can be transported on the conductive pattern of the parent substrate as a structure that can be sucked by the suction nozzle of the automatic suction device.

  As a terminal having a structure capable of being sucked by a suction nozzle of an automatic suction device, for example, a terminal having a lead support portion for attaching an electronic component from which a lead wire such as a resistor, a capacitor, or a light emitting diode is derived to a conductive pattern of a substrate Is disclosed (see Patent Document 1).

JP 2011-14570 A

  The invention of Patent Document 1 has a structure in which an upright portion supports a lead support portion in order to attach a small electronic component to a conductive pattern of a substrate, and does not assume that a child substrate is attached vertically. Even if the child board is installed vertically, the conductive pattern of the child board and the lead support part are not on the same plane, and the lead support part is supported by a single upright part. Even if the part is fixed with solder, it is difficult to firmly support the child board due to lack of stability of energization.

  In the present invention, when the child board is connected to the parent board vertically, it can be sucked by the suction nozzle of the automatic sucker without using the socket-like connector and the terminal according to the invention of Patent Document 1. The present invention provides a lightweight and small terminal capable of ensuring stable energization between a substrate and a child substrate and firmly supporting the child substrate.

  That is, the terminal of the present invention is intended to achieve the above-described object, and the means of claim 1 is a flat bottom surface portion and extends vertically from the left end of the bottom surface portion and bends inward upward. A left side wall, a right side wall that extends vertically from the right edge of the bottom surface and bends inwardly upward, a circuit contact part that extends from the tip of the left side wall and bends in a "<" shape, and a right side wall A circuit contact surface portion extending vertically upward from the tip of the circuit board and a portion to be adsorbed extending outward in the horizontal direction from the tip of the circuit contact surface portion to the bottom surface.

The terminal of the present invention has a structure in which the child board is sandwiched by elasticity. Here, since one of the parts that sandwich the child board is bent into a "<" shape, if there is no need to replace the child board, the contact part between the "<" shape and the child board Can be easily soldered, and by soldering, the child board can be firmly fixed and supported.
The other part of the portion sandwiching the daughter board has a structure in contact with the circuit of the daughter board on the surface. And the circuit and the terminal of the parent substrate are in contact with each other on the surface. Therefore, it is possible to obtain stable energization between the child board and the parent board through the terminals.
Furthermore, the terminal can be transported onto the conductive pattern of the parent substrate by the automatic suction device by providing the suction target portion.
Furthermore, the terminal can connect the child substrate vertically to the parent substrate while firmly supporting the child substrate.

It is a terminal in the present invention, and (a) is a perspective view. (B) to (f) are six views, but the rear view is omitted because it is symmetrical with the front view. (B) is a plan view, (c) is a left side view, (d) is a front view, (e) is a right side view, and (f) is a bottom view. It is the reference perspective view which shows the use condition of the terminal in this invention, (a) is a reference perspective view which shows the state before attaching a terminal to a parent board, (b) is before attaching a child board to the terminal attached to the parent board. It is a reference perspective view which shows the state.

  The lightweight and small printed circuit board mounting terminal of the present invention is a thin plate-like conductive metal plate as a whole, and is molded after being punched from the metal plate. Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

  The terminal structure will be described with reference to FIG. The terminal 1 has a flat bottom 10, a left side wall 20 that extends vertically from the left end of the bottom 10 and bends inward upward, and extends vertically from the right end of the bottom 10 and extends upward inside A right side wall portion 30 that bends to the right side, a circuit contact portion 40 that extends from the front end of the left side wall portion 20 and bends in a “<” shape, and a vertical extension from the front end of the right side wall portion 30 to the bottom surface portion 10. A circuit contact surface portion 50 to be attached, and an attracted portion 60 extending outward from the front end of the circuit contact surface portion 50 in the horizontal direction with respect to the bottom surface portion 10. Here, with respect to each side wall portion, the left side wall portion is referred to as the left side wall portion 20 and the right side wall portion is also referred to as the right side wall portion 30 for convenience, with reference to the front view of FIG.

  The bottom surface portion 10 of the terminal 1 is connected to the parent substrate via solder and can be energized. By being a flat surface, good adhesion and electrical conductivity by solder are obtained. The depth dimension of the terminal 1 can be determined as appropriate in consideration of the width of the contact portion with the daughter board and the stability of the daughter board.

  The inner width of the terminal 1, here, the width between the left wall portion 20 and the lower portion of the right wall portion 30, is made larger than the thickness of the child board to sandwich the child board. By making the inner width of the terminal 1 larger than the thickness of the sub-board and bending the left side wall portion 20 and the right side wall portion 30, the circuit contact portion 40 and the circuit contact surface portion 50 are elastic. The bending angle of the left side wall part 20 and the right side wall part 30 may be the same or different.

The circuit contact portion 40 and the circuit contact surface portion 50 of the terminal 1 have a structure that sandwiches the daughter board by elasticity. Here, since the circuit contact portion 40 has a structure that bends in a “<” shape, if it is not necessary to replace the child board, the contact portion between the “<” shape and the child board can be easily soldered. The child board can be firmly fixed and supported by soldering.
Further, the circuit contact surface portion 50 has a structure that makes contact with the circuit of the daughter board on the surface. The circuit of the parent board and the terminal 1 are also in contact with each other. Therefore, it is possible to obtain stable energization between the child board and the parent board via the terminal 1.

  FIG. 2A shows an example of use of the terminal 1. The terminal 1 is attached to the parent substrate 100 by an automatic suction device. FIG. 2B shows a usage example of the daughter board 200. The child board 200 is attached to the terminal 1 attached to the parent board 100. The automatic adsorber is not shown.

Hereinafter, a method for connecting the parent substrate 100 and the child substrate 200 using the terminal 1 will be described in detail.
First, as a first step, the portion to be sucked 60 of the terminal 1 is sucked by an automatic sucker equipped with a suction nozzle. Since the terminal 1 includes the attracted portion 60, the terminal 1 can be transported onto the conductive pattern of the parent substrate 100 by an automatic suction device. Here, a solder paste and an adhesive are arranged on the conductive pattern of the parent substrate 100 in advance. By applying heat to the solder paste, for example, when the terminal 1 bonded to the parent substrate 100 and the terminal 1 bonded to the parent substrate 100 pass through a high temperature furnace, the solder is melted and the terminal 1 is fixed to the parent substrate 100.

  Next, as a second step, the sub board 200 is fitted into the terminal 1 fixed in the previous step. Here, the fitting means may be automatic or manual.

  When it is not necessary to replace the sub board 200, the contact portion between the sub board 200 and the circuit contact portion 40 may be soldered as a third step.

  Through the above steps, the child board and the parent board can be stably energized via the terminal 1. At the same time, the terminal 1 can connect the sub board 200 vertically to the main board 100 while firmly supporting the sub board 200.

1 ... terminal.
DESCRIPTION OF SYMBOLS 10 ... Bottom surface part, 20 ... Left side wall part, 30 ... Right side wall part, 40 ... Circuit contact part, 50 ... Circuit contact surface part, 60 ... Adsorbed part.
100: parent substrate, 200: child substrate.

Claims (1)

A bottom surface that is planar;
A left side wall portion extending vertically from the left end of the bottom portion and bent inward at the top;
A right side wall portion that extends vertically from the right end of the bottom portion and bends inward at the top;
A circuit contact portion that extends from the front end of the left side wall portion and bends into a "<"shape;
A circuit contact surface portion extending vertically upward from the front end of the right wall portion to the bottom surface portion;
A printed circuit board mounting terminal comprising: an attracted portion that extends outward in the horizontal direction from the front end of the circuit contact surface portion to the bottom surface portion.

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