JP3198221B2 - Method for manufacturing inkjet head, inkjet head, and inkjet head recording apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a substrate (hereinafter, referred to as "heater") having a plurality of energy generating elements (hereinafter, referred to as "heater") on a base (hereinafter, referred to as "base plate").
A plurality of "heater boards") are arranged, and a single top plate having a plurality of ink passage grooves corresponding to each heater and a plurality of ink ejection ports communicating with each of the ink passage grooves is assembled. The present invention relates to a method of manufacturing a full line type ink jet head, an ink jet head, and an ink jet head recording apparatus.

[0002]

2. Description of the Related Art Conventionally, 128 nozzles, 256 nozzles, A
In a full line type ink jet head having a width of 4 or the like, the end faces of a plurality of heater boards made of Si, glass, or the like are described in JP-A-2-212162 (European Patent No. 0376514). And a top plate having a plurality of ink passage grooves corresponding to the heater and a plurality of ink ejection ports communicating with the respective ink passage grooves is joined thereon. It is manufactured by.

In addition, a notch is formed in a part of a unit of a heater board and a top plate as disclosed in Japanese Patent Application Laid-Open No. 4-229278 (US Pat. No. 5,098,503), and the cutout is formed on a base plate. There are ways to hit a certain criterion.

On the other hand, in a method of manufacturing an ink jet head in which a top plate having ink passage grooves and the like corresponding to each heater is assembled on one heater board having a plurality of heaters formed thereon. A heater for heating the ink and a groove for the ink flow path communicating with the ink discharge port for discharging the bubbled ink heated and boiled by the heater toward the recording medium are accurately formed on the order of microns. From the necessity of positioning, a first imaging step of imaging the heater on the heater board, and from the image information captured in the first imaging step, whether or not a recognition mark indicating a heater serving as a reference exists. In the determination step of determining the presence of the recognition mark in this determination step,
A first measurement step of measuring a position of a reference heater, a second imaging step of imaging a reference nozzle hole corresponding to the reference heater, and an image captured in the second imaging step. From the information, a second measurement step of measuring the position of the reference nozzle hole, and based on the measurement results in the first and second measurement steps, the reference heater and the reference nozzle hole are And a moving step of moving the heater board or the top plate so as to coincide with the arrangement direction of the nozzle holes.

[0005]

However, the above-described conventional method for manufacturing a full-line type ink jet head has the following problems. (1) There is a problem in that the variation in the cutting accuracy of the heater board becomes the alignment accuracy as it is due to the arrangement by the abutting method. This problem will be described with reference to FIG. FIG. 13 shows a state in which the heater boards are arranged in a straight line with each other. As shown in this figure, a plurality of heater boards 101 are
In the case where the ends of the heater boards 101 are abutted against each other and arranged in a straight line, the cutting pitch of the heater boards 101 influences, and the center pitch P of the heater boards 101 varies. For this reason, when assembling one top plate on which a plurality of ink flow channel grooves to be corresponding to each heater are formed on a plurality of heater boards arranged in abutting manner,
The position of the groove for the ink flow path and the position of the heater do not correspond to each other. (2) It is very difficult to obtain the accuracy by mechanical processing of a reference abutment piece or the like, which is very difficult. (3) Similar to the above (1), since the arrangement accuracy is obtained by abutting, the cutting accuracy of the heater board or the like is strict, and there is a problem in mass productivity or device capacity. (4) There is a problem that a means such as position correction cannot be used due to variation in cutting accuracy due to the arrangement by abutting.

On the other hand, in order to form a long head, a plurality of heater boards are arranged on a base plate, and a plurality of ink passage grooves corresponding to the heaters and a plurality of ink passage grooves communicating with the respective ink passage grooves are formed thereon. If a single top plate with an ink discharge port is assembled, if the heater board alignment accuracy is a little poor, the ink flow channel grooves in the top plate will straddle the gap between the heater boards, causing a crosstalk phenomenon. Cause. In addition, when it becomes severe, non-discharge, shobo, etc. may occur.

Accordingly, the present invention has been made in view of the above-mentioned problems of the prior art, and has good positional accuracy between the ink flow channel groove of the top plate and the heater of the heater board, prevents the crosstalk phenomenon and the like, and has a low cost. An object of the present invention is to provide a method of manufacturing a full-line type ink jet head having a good yield, an ink jet head, and an ink jet head recording apparatus.

[0008]

In order to achieve the above object, a first aspect of the present invention is to arrange a plurality of substrates having a plurality of energy generating elements on a base and to correspond to each of the energy generating elements. In a method for manufacturing an ink jet head in which one top plate having a plurality of ink flow path grooves formed thereon is joined to the base, a gap is provided between the substrates on the base, and the amount of the gap is set to The arrangement is characterized by being changed according to the cutting precision in the arrangement direction.

In this method of manufacturing an ink jet head, a specific frame pattern is formed on a surface of the base on which the substrate is arranged, and a plurality of the substrates are arranged on the base. At this time, after applying an adhesive in the frame pattern, the substrate is placed on the base, and the position of the substrate is held until the adhesive is solidified. Alternatively, the method may be such that the adhesive is poured from outside the substrate into the frame pattern below the substrate, and the position of the substrate is held until the adhesive is solidified.

In addition, when arranging a plurality of the substrates on the base, an adhesive may be applied to a back surface of the substrate, and then the substrate may be arranged on the base.

Further, in any one of the above-described methods for manufacturing an ink jet head, when arranging a plurality of the substrates on the base, the width in the arrangement direction of the substrates may vary, and When the distance from the side surface to the energy generating element on the substrate closest to one side of the substrate and the distance from the other side of the substrate to the energy generating element of the substrate closest to the other side of the substrate are significantly different, When joining the top plate and the base, the energy-generating elements do not protrude from the ink flow channel grooves of the top plate, and the substrates to be arranged are arranged first from the regular arrangement position. It is characterized by being shifted to a certain substrate side or the opposite side.

In such a case, a plurality of dimensions of the substrates are measured in advance by a non-contact method, and the energy generating elements of the substrates are placed inside the ink flow channel grooves of the top plate. In combination, a method of sequentially arranging or a method of measuring the dimensions of the substrate by a non-contact method immediately before arranging the substrate, correcting the position based on the measured dimensions, and then arranging the same. Good.

In any one of the above-described methods for manufacturing an ink jet head, when arranging a plurality of the substrates on the base, the substrates are arranged in accordance with a shift caused by processing of the ink flow channel grooves of the top plate. The arrangement may be characterized by correcting the arrangement position.

[0014] To achieve the above object, a second invention provides
After arranging a plurality of substrates having a plurality of energy generating elements on a base, a plurality of ink flow path grooves corresponding to the respective energy generating elements and a plurality of ejection ports communicating with the respective ink flow path grooves In the method for manufacturing an ink jet head for joining the top plate formed with the base to the base, a recognition mark is provided at a predetermined position of each substrate, and an image of a reference substrate among the respective substrates is taken. A first measurement step of measuring the position of the reference board recognition mark, and at least two board recognition marks different from the reference board recognition mark, wherein the reference board recognition mark is The amount of deviation from the normal position with respect to the position is measured, and based on the measurement results, the position where the reference discharge port is to be disposed with respect to the energy generation element of the reference substrate. A calculating step of calculating, a second measurement step of imaging the reference discharge port, and measuring the position of the reference discharge port, a calculation result of the calculation step, and a measurement result of the second measurement step A moving step of moving the base or the top plate such that the position at which the reference discharge port is to be arranged and the reference discharge port match with respect to the direction in which the discharge ports are arranged. It is characterized by having.

In this method of manufacturing an ink jet head, the identification mark is provided corresponding to an energy generating element located at the center of each substrate.

In the same manner as described above, after arranging a plurality of substrates having a plurality of energy generating elements on a base, a plurality of ink flow path grooves corresponding to the respective energy generating elements and the respective ink flow path grooves A method for manufacturing an inkjet head in which a top plate formed with a plurality of discharge ports communicating with a base is joined to the base, a first measurement step of imaging a gap between the substrates and measuring a position of the gap; Imaging a groove wall between the ink flow channel grooves corresponding to the gap, a second measurement step of measuring the groove wall, and the gap based on a measurement result in the first and second measurement steps. A moving step of moving the base or the top plate so that the groove wall coincides with the arrangement direction of the discharge ports, and a reference among the substrates. Image the gap between the substrates, A first measurement step of measuring the position of the gap between the substrates as a reference, different from the gap between the substrates to be the reference, in the gap between the substrates of the at least two positions,
The amount of deviation from the normal position with respect to the position of the gap between the reference substrates is measured, and based on the measurement results, the gap between the reference ink flow channels and the gap between the reference ink flow channels is determined. Calculating the position at which the groove wall is to be disposed, imaging the groove wall between the reference ink flow channel grooves, and measuring the position of the reference groove wall between the ink flow channel grooves. Based on a second measurement step, a calculation result of the calculation step, and a measurement result of the second measurement step, a position where the groove wall between the ink flow path grooves serving as the reference is to be arranged and the reference position. A moving step of moving the base or the top plate such that the groove walls between the ink flow channel grooves are aligned with respect to the direction in which the ejection ports are arranged may be provided.

Furthermore, an ink jet head manufactured by any one of the above manufacturing methods also belongs to the present invention.

In such an ink jet head, the energy generating element is an electrothermal converter for generating thermal energy for discharging ink, and is generated in the ink by the thermal energy applied by the electrothermal converter. It is characterized in that ink is ejected from an ejection port using film boiling.

In addition, an ink jet head recording apparatus which includes the above ink jet head and performs recording by discharging ink from the discharge port of the ink jet head based on a recording signal also belongs to the present invention.

[0020]

According to the first aspect of the present invention, when arranging a plurality of substrates having a plurality of energy generating elements on a base, a gap is provided between the substrates and the amount of the gap is determined in the arrangement direction of the substrates. By changing according to the cutting precision, even if the cutting precision in the arrangement direction of the substrate varies, the positions of the arranged energy generating elements correspond to the positions of the plurality of ink flow channel grooves formed on the top plate without being shifted. It becomes possible.

Further, in the second invention configured as described above, before assembling one top plate to the substrate having a plurality of energy generating elements arranged on the base, First, an image of the recognition mark of the reference substrate is taken, the position of the recognition mark is measured, and further, the recognition marks of at least two or more substrates are measured separately. Based on the measurement results, the reference mark is obtained. With respect to the energy generating element of the substrate to be disposed, the position of the discharge port to be disposed is calculated. Next, after assembling the top plate, an image of the discharge port of the top plate is taken, the position of the reference discharge port is measured, and the reference discharge port is placed at the position of the reference discharge port to be arranged. The base or the top board is moved so as to be coincident with respect to the direction in which the exits are arranged.

This improves the positional accuracy of the top plate,
The ink flow path does not overlap the gap between the substrates. Therefore, the crosstalk phenomenon, non-discharge, shoveling, and the like are prevented.

[0023]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic perspective view showing an example of a long type ink jet head produced by using the manufacturing method of the present invention, FIG. 2 is a structural view of a top plate shown in FIG. 1, and FIG. FIG. 4B is a plan view, FIG. 4B is a front view, FIG. 4C is a bottom view, and FIG. 4D is an enlarged cross-sectional view taken along line XX of FIG.

The ink jet head shown in FIG.
A base plate 2 made of a material such as metal or ceramic is a full line type (long type) having a density of 360 dpi (70.5 μm) of ink discharge ports and 3008 nozzles of ink discharge (print width 212 mm). Have.

On the base plate 2, glass or S
Heater board 1 as a plurality of substrates made of i etc.
Are aligned on one end of the base plate 2 and arranged on a straight line.

At a position on one end side of the base plate 2 on each heater board 1, a plurality of heaters 10 as energy generating elements are arranged at a constant pitch in the same direction as the arrangement direction of the heater boards 2.

An electric power pad is provided on each heater board 1 at a position on the other end side of the base plate 2.
Are arranged in the same direction as the arrangement direction. Note that the heater 10 as an energy generating element is an electrothermal transducer for discharging ink, and the present invention is not limited to this. Instead of the electrothermal transducer of the heater 10, a laminated piezoelectric element may be used. .

Further, on the base plate 2, a single wiring board 12 for arranging signal lines and power supply lines to power pads of each heater board 1 is fixed. At this time, the power pad on the heater board 1 and the wiring board 1
2 are arranged in a predetermined positional relationship with the signal / power supply pads provided thereon and are electrically connected by gold wires 11 or the like.

The wiring board 12 is provided with a connector 13 for supplying an external printing signal and driving power.

Then, a top plate 7 is adhered so as to cover the plurality of heater boards 1. As shown in FIG. 2, the top plate 7 is formed of resin, and at the same time, a common liquid chamber recess 15 for storing ink and an ink supply port communicating with the common liquid chamber recess 15 for supplying ink. 18 are also formed. In addition, a plurality of ink flow channel grooves (nozzle grooves) 16 formed corresponding to each heater 10 and a plurality of ink ejection grooves formed corresponding to each ink flow channel groove (nozzle grooves) 16. The outlet 17 is leather-processed with an excimer laser or the like.

Alternatively, when the top plate 7 is manufactured using glass, metal, or the like, the grooves 16 for the ink flow path, the concave portions 15 for the common liquid chamber, and the ink discharge ports 17 may be processed by cutting or etching. It is possible.

Here, the operation when ink is ejected from each ink ejection port 17 will be described. The ink supplied from the ink supply port 18 to the common liquid chamber concave portion 15 and temporarily stored therein is a capillary phenomenon. As a result, the ink flows into each ink flow channel groove 16 and forms a meniscus at each ink discharge port 17 to maintain a state in which each ink flow channel 17 is filled. At this time, when a predetermined heater 10 is energized and generates heat from the external device through the connector 13 and the wiring board 12 shown in FIG. 1, the ink on the heater 10 is rapidly heated and bubbles are generated in the ink flow path. The ink is ejected from a predetermined ink ejection port by the expansion of the bubble.

With such an ink jet head,
An ink jet head recording apparatus that performs recording by discharging ink from the discharge port of the ink jet head based on a recording signal can also be manufactured.

[0035] Part 1 will now be described in detail various methods when arranging a plurality of heater board to the base plate at the time of manufacture of the ink-jet head having the above structure.

(First Embodiment) FIG. 3 is a schematic diagram for explaining a first embodiment of the method of manufacturing an ink jet head according to the present invention, in which a heater board is directly placed on a base plate and bonded and fixed. is there.

In the manufacturing method of this embodiment, as shown in FIG. 3, first, an adhesive 3 is applied in advance to a base plate 2 having a frame pattern formed on a surface on which the heater boards 1 are arranged. Then, the heater boards 1 positioned by the contacting method at different locations are arranged in a line with a gap between the heater boards 1 at each position of the base plate 2 where the adhesive 3 is applied, and are arranged in the frame pattern. The heater board 1 is sucked into the base plate 2 from a suction hole (not shown) defined in the formed adhesive application area, and the adhesive 3
Release the suction when is solidified.

However, the amount of the adhesive 3 is set so as not to protrude from the adhesive application area when the heater board 1 is arranged. Further, the heater boards were arranged so as to absorb the cutting precision of the heater boards by the gap between the heater boards.

Since the heater boards are placed directly on the base plate, the flatness of the upper surface of the arranged heater boards is improved.

(Second Embodiment) FIG. 4 is a view for explaining a second embodiment of the method of manufacturing an ink jet head according to the present invention.

When each heater board is arranged on the base plate in the first embodiment, an adhesive is previously applied on the base plate. In the present embodiment, as shown in FIG. A suction hole 5 for clamping 1, a frame pattern forming an application area 6,
After the heater board is placed at the position of the application area 6, an injection port 4 into which the adhesive 3 can be injected from the outside of the heater board 1 to the application area 6 is processed in the base plate 2. After that, the adhesive 4 was injected from the injection port 4 to fix the heater board 1.

That is, first, similarly to the first embodiment,
The heater boards 1 positioned at another location by the non-contact method are arranged in a row on the base plate 2 so that the suction holes 4
To fix by suction. After that, the adhesive 3 is poured into the application area 6 from the inlet 4 of the heater board 1. At this time, the order of the adhesive injection may be performed after all the heater boards are arranged. Thereafter, when the adhesive 3 is fixed, the suction from the suction hole is released.

The position of the injection port 4 is not limited to the position shown in FIG. 2 as long as it is formed so as to communicate with the inside of the coating area 6 below the heater board.

(Third Embodiment) FIG. 5 is a view for explaining a third embodiment of the method of manufacturing an ink jet head according to the present invention.

In the first and second embodiments, the adhesive is applied to the base plate side. In this embodiment, as shown in FIG. 5, the adhesive 3 is applied to the heater board 1 side. And put it on the base plate 2 while pressing it.

First, similarly to the first and second embodiments, before disposing the heater board 1 positioned at another location by the non-contact method on the base plate 2, an adhesive is applied to the back surface of the heater board 1. 3 is applied in one place or several places. At this time, the adhesive 3 is applied so as to avoid the suction holes 5 formed in the base plate 2.

After the heater boards are arranged in a line on the base plate 2 and the heater board 1 is sucked through the suction holes 5, when the adhesive 3 is hardened, the first and second heater boards are set.
The suction is released in the same manner as in the embodiment.

The adhesive 3 is made of a silicone-based material having a small curing shrinkage, and prevents the heater board 2 from shifting during curing. The material of the adhesive was the same in the first and second embodiments.

(Fourth Embodiment) FIG. 6 is a view for explaining a fourth embodiment of the method of manufacturing an ink jet head according to the present invention.

According to the manufacturing method of this embodiment, FIG.
As shown in (A), when a heater board 1b larger than the cutting tolerance is placed in a normal arrangement position with respect to the heater board 1a within the cutting tolerance arranged on the base plate, the heater board is cut due to variation in cutting of the heater board. The ends of the board hit each other. Therefore, FIG.
As shown in (B), the heater boards are shifted in the arrangement direction within a range that does not impair the ejection performance.

Even if the dimensions of all the heater boards are within the cutting tolerance, the distance from one end of the heater board to the heater on the heater board closest to the one end of the heater board and the other lengths of the heater board If the distance from the end to the heater on the heater board closest to the other end of the heater board is significantly different, the heater board or the heater board which is placed earlier as long as the discharge performance is not impaired. Place on the other side.

In the present embodiment, the “range that does not impair the ejection performance” is the range where the heater on the heater board is inside the ink flow channel groove of the top plate 7 (± 8 μm).

As a result, as shown in FIG. 6 (c), even when the top plate 7 is joined, the heater is surely inside the ink flow channel groove, and no problem occurs in printing.

Also, the heater board 1b which is staggered
It is preferable to place a heater board having a dimension shifted to the opposite side with respect to the amount of displacement.

At this time, the dimensions of the heater boards are measured in advance by a non-contact method, and the heater boards are combined and arranged in a line in order. For example, using a non-contact method such as image processing, heater boards are sorted according to their width in the arrangement direction, divided into separate trays, and based on the sorting data at this time, the heater of each heater board is a long top plate. A number of combinations that fall inside the ink channel groove of No. 7 are calculated, and the most suitable combination among them is arranged in a line. Alternatively, the dimensions of the heater boards may be measured by a non-contact method just before the placement as described above, and the heater boards may be placed while performing position correction according to the dimensions.

Further, the present invention can be applied to the pitch deviation of the ink passage groove of the long top plate.

That is, when a long top plate is manufactured by injection molding or the like, and the grooves for the ink flow path and the discharge ports are processed by excimer laser or the like, the processing deviation (pitch deviation) to the pitch of the groove for the ink flow path. Occurs, the position of the groove for the ink flow path corresponding to the position of the heater of the heater board arranged in a line is measured at another position in advance by a non-contact method, or immediately before the arrangement, the non-contact Method, and based on the data, the arrangement position of the heater board is corrected to ensure that the heater enters the inside of the nozzle wall.

(Fifth Embodiment) FIGS. 7A and 7B are views for explaining a fifth embodiment of the method of manufacturing an ink jet head according to the present invention. FIGS. 7A and 7B show a heater board on a base plate. 2 shows a method of positioning when abutting is performed. In these figures, reference numeral 1a denotes a heater board arranged earlier, reference numeral 1b denotes a heater board to be arranged on a base plate, Δx denotes a gap between adjacent heater boards, and Δy denotes a shift in the ink ejection direction of an adjacent heater board. is there.

In the first to fourth embodiments described above, positioning must be performed before the heater board is placed on the base plate. Therefore, an example is shown.

According to the manufacturing method of this embodiment, FIG.
As shown in (A), first, the heater board 1b to be arranged is temporarily stopped once above the base plate 2, and the gap Δx between the adjacent heater boards is measured by a non-contact method such as image processing while positioning in the lateral direction. Do. that time,
The value of the gap Δx between the heater boards can be changed each time due to variations in the cutting accuracy of the heater boards.

As shown in FIG. 7 (B), the displacement of the ink ejection direction can be corrected by setting the surface of the heater board from above in a state where the heater board is stopped above the base plate 2 in the same manner as described above. The heater board 1b to be disposed is moved so that the displacement Δy in the discharge direction of the adjacent heater boards is measured by the contact method and becomes zero.

The heater boards 1 b having been positioned in the above two directions are arranged in a row on the base plate 2.

As a result, the gap Δx between the adjacent heater boards was ± 1 μm or less with respect to the set value, and the deviation Δy in the ink ejection direction was ± 2 μm or less. FIG. 8 is a schematic diagram of the heater board shown in FIG.

[0064] Part 2 will now be described in detail how the time of assembling the top plate on the base plate in which a plurality of heater boards are arranged in the production of ink-jet head shown in FIGS.

Here, before describing the method of assembling the top plate, the structure of an assembling apparatus for an ink jet head used for assembling the top plate will be described.

FIG. 8 is a schematic perspective view showing an example of an assembling apparatus used in the method of manufacturing an ink jet head according to the present invention.

The assembling apparatus shown in FIG. 8 includes a y-direction moving mechanism 20 which moves in the y-direction, an x-direction moving mechanism 21 which is mounted on the y-direction moving mechanism 20 and which moves in the x-direction, and which is mounted on the x-direction moving mechanism 21. And a base plate clamp 23 for clamping the base plate 2 placed on the x-direction moving mechanism 21 and a top plate 7 attached to a plurality of heater boards 1 arranged in a straight line on the base plate. Forming a top plate top clamp 24 and a top plate front clamp 25 disposed on the top and front sides of the top plate 7, a heater board image processing camera 26 for measuring the position of the heater board 1, and the formation of the top plate 7 A hole image processing camera 27 for measuring the position of the formed discharge port hole, and a hole image processing camera 27 disposed near both side ends of the top plate 7, respectively, in the arrangement direction of the heater board 1. Top position adjusting means 28 for shifting the position of the top plate 7 Te (top position adjusting means in the vicinity of one end portion of the top plate 1 is not shown) composed of a.

FIG. 9 is a schematic view of the heater board. The heater board 1 is located at substantially the center in the X-axis direction on each heater board 1 for image processing by the heater board image processing camera 26 of the assembling apparatus shown in FIG. A recognition mark 8 for recognizing that the heater 10 is a reference heater is provided in the vicinity of the heater 10. In the following description of the embodiment, it is assumed that 11 heater boards 1 are arranged on a base plate.

Hereinafter, various manufacturing methods using the assembling apparatus shown in FIG. 8 will be described.

(Sixth Embodiment) FIG. 10 is a view for explaining image processing in a sixth embodiment of the manufacturing method of the present invention.

Referring to FIG. 8, the manufacturing method of the present embodiment will be described. First, a base plate 2 on which 11 heater boards 1 are arranged is placed at a predetermined position on an x-direction moving mechanism 21, and a base plate clamp 23 is used. Fix it. Next, the heater board 1 is moved by the y-direction moving mechanism 20 to a position where the heater board 1 can be observed by the heater board image processing camera 26. At this point, the sixth (11 middle) heater board 1 serving as a reference is observed, and the position of the recognition mark 8 is image-processed. Based on this result, the x-direction moving mechanism 21 is moved to a position where the first heater board 1 can be observed. At this time, it is accurately moved from the recognition mark 8 of the sixth heater board 1 as a reference (45.12 mm = 0.0705 × 12 in this embodiment).
8 x (6-1)). In this state, image processing is performed on the position of the recognition mark 8 on the first heater board 1, and image processing is also performed on the position of the recognition mark 8 on the eleventh heater board 1 in the same manner.

Based on the above measurement results, a calibration value when assembling the top plate to a heater board row where the arrangement accuracy is not sufficient is obtained.

As shown in FIG. 10 (A), the calibration value when shifted from the reference to the left or right is as follows: calibration value = reference + (X ₁ + X ₂ ) / 2 (maximum value of left and right) . Further, as shown in FIG. 10 (B), the calibration value when the image is shifted one-way with respect to the reference is a calibration value equal to the reference + X _4/2 (maximum one-way).

Next, returning to FIG. 8, the top plate 7 is placed on the arranged heater boards 1 and the top plate top clamp 24 and the top plate front clamp 25 are pressed against each other, so that the gap between the heater board 1 and the top plate 7 is increased. The hole image processing camera 27
Observe the hole of the ink ejection port with. Here, the reference hole is adjusted by the top plate position adjusting means 28 to the position of the above-described calibration value.

By adopting the above-described method, the positional accuracy of the top plate with respect to the plurality of heater boards arranged on the base plate is improved, and the ink flow path does not overlap the gap between the heater boards. Therefore, it is possible to prevent the crosstalk phenomenon, non-discharge, shoveling, and the like. Further, in this embodiment, the image processing is performed on the sixth and eleventh heater boards to obtain the calibration value. However, the present invention is not limited to this, and the position accuracy of the top plate is further improved. In order to perform this, the heating may be performed on two or more heater boards different from the central heater board serving as a reference.

(Seventh Embodiment) FIG. 11 is a view for explaining image processing in a seventh embodiment of the manufacturing method of the present invention.

Referring to FIG. 8 similarly to the sixth embodiment,
Describing the manufacturing method of the present embodiment, first, the base plate 2 on which the 11 heater boards 1 are arranged is placed at a predetermined position on the x-direction moving mechanism 21 and fixed by the base plate clamp 23. Next, the x-direction moving mechanism 21
As a result, the hole image processing camera 27 moves to a position where the positions of the gaps between the fifth and sixth heater boards can be observed. Here, image processing is performed on the gap between the fifth and sixth heater boards.

Next, the top plate 7 is placed on the arranged heater boards 1, and the top plate top clamp 24 and the top plate front clamp 2
5, the heater board 1 and the top plate 7 are pressed.
Between the fifth and sixth heater boards by the hole image processing camera 27.
Observe.

Here, the top plate 7 is shifted by the top plate position adjusting means 28 based on the result of the image processing described above.
As shown in (2), the groove walls 29 between the ink flow channel grooves 16 are aligned with the gap between the heater boards 1.

By adopting the above method, the sixth
The same effect as that of the embodiment can be obtained. In addition, since the heater board image processing camera 26 is not used, it can be manufactured at a lower cost than the sixth embodiment.

(Eighth Embodiment) FIG. 12 is a view for explaining image processing in an eighth embodiment of the manufacturing method of the present invention.

As in the seventh and eighth embodiments, FIG.
First, the base plate 2 on which the 11 heater boards 1 are arranged is placed at a predetermined position on the x-direction moving mechanism 21 and fixed by the base plate clamp 23. Next, the x-direction moving mechanism 21 moves the hole image processing camera 27 to a position where the position of the gap between the fifth and sixth heater boards can be observed. Here, image processing is performed on the gap between the fifth and sixth heater boards. Based on this result, the x-direction moving mechanism 21 is moved to a position where the gap between the first and second heater boards can be observed. At this time, the heater board is accurately moved from the gap between the fifth and sixth heater boards (in this embodiment, 36.096 mm = 0.0).
705 x 128 x (5-1)). In this state the first and second
Image processing of the gap between the tenth heater board is performed, and image processing of the gap between the tenth and eleventh heater boards is performed in the same manner.

Based on the above-described measurement results, a calibration value when assembling the top plate to a heater board row where the arrangement accuracy is not sufficient is obtained.

As shown in FIG. 12 (A), the calibration value when shifted from the reference to the left and right is: calibration value = reference + (X ₁ + X ₂ ) / 2 (maximum value of left and right) . Further, as shown in FIG. 12 (B), the calibration value when the image is shifted one-way with respect to the reference is a calibration value equal to the reference + X _4/2 (maximum one-way).

Next, returning to FIG. 8, the top plate 7 is placed on the arranged heater boards 1 and the top plate top clamp 24 and the top plate front clamp 25 are pressed against each other, so that the gap between the heater board 1 and the top plate 7 is increased. The hole image processing camera 27
Then, the ink ejection ports near the gap between the fifth and sixth heater boards are observed.

Here, the reference groove wall among the groove walls between the ink flow path grooves of the top plate is adjusted to the position of the calibration value by the top plate position adjusting means 28.

With the above configuration, the seventh
The position accuracy of the top plate is further improved as compared with the embodiment of FIG.
It is possible to obtain an effect equal to or more than that of the embodiment. Also,
In this embodiment, the calibration value is determined at two places other than the reference, that is, the gap between the first and second heater boards,
Although image processing was performed on the gaps between the tenth and eleventh heater boards, the present invention is not limited to this, and in order to further improve the positional accuracy of the top plate, the fifth and sixth reference points were used. This may be performed in a gap between two or more heater boards different from the gap between the second heater boards.

[0088]

Since the present invention is constructed as described above, it has the following effects.

According to the first aspect of the present invention, a gap is provided between substrates having a plurality of energy generating elements, and the gap amount is changed depending on the arrangement direction of the substrates. Can be absorbed.

According to the second aspect of the present invention, since the frame pattern is formed on the surface of the base on which the substrate is arranged, it is possible to prevent misalignment due to entry of foreign matter such as dust.

According to the third, fourth and fifth aspects of the present invention, the arrangement and fixing of the substrate using an adhesive can be performed with high precision.

According to the sixth aspect of the present invention, since the arrangement position is shifted within a range that does not impair the ejection performance, the cutting tolerance range is widened, and the yield by cutting the substrate is improved.

[0093] In the invention described in claims 7 and 8,
Since gaps between substrates and dimensions in the direction of arrangement of the substrates are measured and arranged by a non-contact method, there is no problem due to processing accuracy compared to the case of creating a reference such as a positioning frame by machining, and furthermore, the arrangement position of the substrates Does not matter.

Further, since the adjacent heater boards can be confirmed until the substrate is arranged on the base, errors in arrangement can be reduced and corrected, and the yield can be improved.

According to the ninth aspect of the present invention, since the arrangement can be made in accordance with the pitch of the ink passage grooves of the top plate, the yield can be improved by molding or processing the top plate.

According to the tenth and eleventh aspects of the present invention, when one top plate is joined to a base on which a plurality of substrates having a plurality of energy generating elements are arranged, image processing is performed before assembling the top plate. Is measured at two or more locations, based on the amount of these shifts, determine the position where the reference discharge port is to be arranged, and measure the position of the reference discharge port after assembling the top plate. By disposing the base or the top plate at a position where the discharge port serving as the reference is to be arranged, the position accuracy of the top plate with respect to each of the plurality of substrates arranged on the base is improved. Thus, the ink flow path does not overlap the gap between the substrates. Therefore, it is possible to prevent the crosstalk phenomenon, non-discharge, shoveling, and the like.

According to the twelfth aspect of the present invention, when one top plate is joined to a base on which a plurality of substrates having a plurality of energy generating elements are arranged, the position of the gap between the substrates after the top plate is assembled is determined. The positions of the groove walls between the ink flow path grooves that should correspond to the gaps are measured, and based on the measurement results, the grooves between the ink flow path grooves that should correspond to the gaps are formed in the gaps between the substrates. By displacing the base or the top plate so that the walls are aligned, the same effect as in claims 10 and 11 can be obtained, and the arrangement position of the substrates does not need to be measured before assembling the top plate. The cost can be reduced.

According to the thirteenth aspect of the present invention, when one top plate is joined to a base on which a plurality of substrates having a plurality of energy generating elements are arranged, an image processing is performed before the top plate is assembled. The gap displacement of the gap is measured at two or more locations, and based on these displacement amounts, the position where the groove wall between the reference ink passage grooves is to be arranged is determined. The position of the groove wall between the grooves for ink flow is measured, and the groove wall between the grooves for the ink flow path serving as the reference is placed at a position where the groove wall between the grooves for the ink flow path serving as the reference is to be arranged, a base or By displacing the top plate, effects similar to those of the tenth and eleventh aspects can be obtained, and effects equivalent to or greater than those of the invention described in the twelfth aspect can be obtained.

According to the fourteenth aspect of the present invention, an ink jet head having a free width suitable for the purpose can be manufactured at a low cost and a good yield by the manufacturing method according to any one of the first to thirteenth aspects. It has become possible.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing an example of a long ink jet head manufactured by using the manufacturing method of the present invention.

2 (a) is a plan view, FIG. 2 (b) is a front view, FIG. 2 (c) is a bottom view, and FIG. 2 (d) is (b)
FIG. 3 is an enlarged sectional view taken along line XX of FIG.

FIG. 3 is a schematic view illustrating a first embodiment of a method for manufacturing an ink jet head according to the present invention, in which a heater board is directly placed on a base plate and fixedly adhered thereto.

FIG. 4 is a view for explaining a second embodiment of the method of manufacturing an ink jet head according to the present invention.

FIG. 5 is a view for explaining a third embodiment of the method of manufacturing an ink jet head according to the present invention.

FIG. 6 is a view for explaining a fourth embodiment of the method for manufacturing an ink jet head according to the present invention.

FIG. 7 is a view for explaining a sixth embodiment of the method of manufacturing an ink jet head according to the present invention.

FIG. 8 is a schematic perspective view showing an example of an assembling apparatus used in the method of manufacturing an ink jet head according to the present invention.

FIG. 9 is a schematic diagram of a heater board.

FIG. 10 is a diagram for explaining image processing in a sixth embodiment of the manufacturing method of the present invention.

FIG. 11 is a view for explaining image processing in a seventh embodiment of the manufacturing method of the present invention.

FIG. 12 is a diagram for explaining image processing in a seventh embodiment of the manufacturing method of the present invention.

FIG. 13 is a diagram showing a state in which heater boards are arranged in a straight line by abutting each other.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heater board 2 Base plate 3 Adhesive 4 Inlet 5 Suction hole 6 Application area 7 Top plate 8 Recognition mark 10 Heater 11 Gold wire 12 Wiring board 13 Connector 15 Common liquid chamber recess 16 Ink channel groove 17 Ink discharge port 18 Ink supply port 20 Y direction moving mechanism 21 X direction moving mechanism 22 Base plate 23 Base plate clamp 24 Top plate upper surface clamp 25 Top plate front clamp 26 Heater board image processing camera 27 Hole image processing camera 28 Top plate position adjusting means 29 Groove wall

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Haruhiko Terai 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Kiyomitsu Kudo 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon (56) References JP-A-3-184860 (JP, A) JP-A-4-229278 (JP, A) JP-A-7-241994 (JP, A) (58) Fields surveyed (Int. Cl. ⁷ , DB name) B41J 2/16 B41J 2/05

Claims (17)

(57) [Claims] After arranging a plurality of substrates having a plurality of energy generating elements on a base, one top plate having a plurality of ink flow channel grooves corresponding to each of the energy generating elements is mounted on the base plate. In the method for manufacturing an ink jet head to be joined to a base, the substrate is provided with a gap in the base, and the gap is arranged by changing the amount of the gap depending on the cutting accuracy in the arrangement direction of the substrate. Head manufacturing method. 2. A surface of the base on which the substrate is arranged,
The method according to claim 1, wherein a specific frame pattern is formed. 3. When arranging a plurality of the substrates on the base, after applying an adhesive in the frame pattern, the substrate is placed on the base, and the position of the substrate is set by the adhesive. The method for manufacturing an ink jet head according to claim 2, wherein the ink jet head is held. 4. When arranging a plurality of substrates on the base, the substrate is placed on the base, and an adhesive is poured into the frame pattern below the substrate from outside the substrate, and the position of the substrate is adjusted. 3. The method according to claim 2, wherein the adhesive is held until the adhesive hardens. 5. The method according to claim 1, wherein, when arranging a plurality of substrates on the base, applying an adhesive to a back surface of the substrate and then arranging the substrates on the base. Of manufacturing an inkjet head. 6. When arranging a plurality of substrates on the base, the width of the substrates in the arrangement direction varies, and the substrate is closest to one side of the substrate from one side in the arrangement direction of the substrates. When the distance to the upper energy generating element and the distance from the other side of the substrate to the energy generating element of the substrate closest to the other side of the substrate are significantly different, when joining the top plate and the base, As long as each of the energy generating elements does not protrude from each of the ink flow channel grooves of the top plate, the substrate to be arranged is shifted from the regular arrangement position to the substrate arranged earlier or to the opposite side thereof. The method for manufacturing an ink jet head according to any one of claims 1 to 5, wherein: 7. A plurality of dimensions of the substrates are measured in advance by a non-contact method, and the respective substrates are combined so that the energy generating elements of the respective substrates enter inside the ink flow channel grooves of the top plate. 7. The method according to claim 6, wherein the ink jet heads are arranged one after another. 8. The method according to claim 6, wherein the dimensions of the substrate are measured by a non-contact method immediately before the substrate is arranged, the position is corrected based on the measured dimension, and then the substrate is arranged. The manufacturing method of the inkjet head according to the above. 9. When arranging a plurality of the substrates on the base, the arrangement positions of the substrates are corrected and arranged in accordance with a shift caused by processing of an ink flow channel groove of the top plate. The method of manufacturing an ink jet head according to claim 1, wherein 10. After arranging a plurality of substrates having a plurality of energy generating elements on a base, communicating with the plurality of ink flow path grooves corresponding to the respective energy generating elements and the respective ink flow path grooves. In a method for manufacturing an ink jet head for joining a top plate having a plurality of discharge ports formed thereon to the base, a recognition mark is provided at a predetermined position on each of the substrates, and a reference substrate among the substrates A first measurement step of imaging the reference mark of the substrate serving as the reference, and the reference mark of at least two boards different from the reference mark of the board serving as the reference. The amount of deviation from the normal position with respect to the position of the recognition mark on the substrate is measured, and based on the measurement results, the reference discharge port is determined for the energy generation element of the reference substrate. A calculation step of calculating a position to be arranged; a second measurement step of imaging the reference discharge port and measuring a position of the reference discharge port; and a calculation result of the calculation step and the second Based on the measurement result of the measurement step, the base or the top plate is moved such that the position where the reference discharge port is to be arranged and the reference discharge port match with respect to the arrangement direction of the discharge ports. And a moving step. 11. The method according to claim 10, wherein the recognition mark is provided corresponding to an energy generating element located at the center of each substrate. 12. After arranging a plurality of substrates having a plurality of energy generating elements on a base, communicating with the plurality of ink flow path grooves corresponding to the respective energy generating elements and the respective ink flow path grooves. A method for manufacturing an inkjet head in which a top plate having a plurality of discharge ports formed thereon is joined to the base, wherein a first measurement step of imaging a gap between the substrates and measuring a position of the gap; Imaging a groove wall between the ink flow channel grooves corresponding to and measuring the groove wall; and the gap and the groove based on the measurement results in the first and second measurement steps. A moving step of moving the base or the top plate such that a wall coincides with the arrangement direction of the ejection ports. 13. After arranging a plurality of substrates having a plurality of energy generating elements on a base, communicating with the plurality of ink flow path grooves corresponding to the respective energy generating elements and the respective ink flow path grooves. In a method of manufacturing an ink jet head in which a top plate having a plurality of discharge ports formed thereon is joined to the base, a gap between reference substrates among the respective substrates is imaged, and A first measuring step of measuring the position of the gap; and a regular position with respect to the position of the gap between the reference substrates in at least two gaps between the substrates different from the gap between the reference substrates. And calculating a position where the groove wall between the reference ink flow channel grooves is to be arranged with respect to the gap between the reference substrates based on the measurement results. The standard Imaging a groove wall between the ink flow grooves and measuring a position of the groove wall between the ink flow grooves serving as the reference;
Based on the calculation result of the calculation step and the measurement result of the second measurement step, the position where the groove wall between the ink flow path grooves serving as the reference is to be arranged and the reference ink flow As the groove walls between the road grooves match with respect to the arrangement direction of the discharge ports,
And a moving step of moving the base or the top plate. 14. An ink-jet head manufactured by the method for manufacturing an ink-jet head according to claim 1. Description: 15. The ink jet head according to claim 14, wherein said energy generating element is an electrothermal converter for generating thermal energy for discharging ink. 16. The ink jet head according to claim 15, wherein the ink is ejected from an ejection port by using film boiling generated in the ink by thermal energy applied by the electrothermal transducer. 17. An ink jet head recording apparatus, comprising: the ink jet head according to claim 16; and recording by discharging ink from a discharge port of the ink jet head based on a recording signal.