JP3193248B2 - Surface mount type crystal unit and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crystal oscillator for obtaining a reference signal for controlling a cellular phone, a pager, a cordless telephone, an AV device, an OA device, and the like. Related to a vibrator.

[0002]

2. Description of the Related Art A cylindrical quartz oscillator, which has been most frequently used in a wristwatch, has been characterized by high quality, high reliability and low cost. In recent years, with the spread of portable devices,
Electronic components used in portable devices, etc., are small, thin,
There is a strong demand for a surface mount type, and a crystal resonator is also required to be a surface mount type and to be small and thin. Therefore, a surface mount type crystal unit based on a highly reliable cylinder type crystal unit has been developed.

FIG. 11 is a perspective view showing the appearance of a conventional surface mount type crystal unit, FIG. 12 is a perspective view showing the internal structure thereof, and FIG. 13 is a plan view schematically illustrating the manufacturing process. In this surface-mount type crystal unit, the cylinder type crystal unit 4 is sealed inside the resin package 2, and the lead frames 6, 7 fixed to the terminals of the cylinder type crystal unit 4 are provided outside the resin package 2. The structure has been pulled out.

[0004] This surface-mount type crystal resonator is manufactured through the following steps. As shown in FIG. 13, nickel plating and solder plating are applied to the surfaces of the lead frame members 8 and 10 arranged in a ladder shape, and the two terminals 4a and 4b of the cylinder type crystal unit 4 are reflowed, respectively. The lead frame members 8 and 10 are soldered with high-temperature solder that can withstand the heat during soldering. After that, a resin package 2 is formed with a thermosetting epoxy resin using a compression molding machine.
Is molded. Then, the lead frame members 8 and 10 are cut and bent into a desired shape by a press machine to form lead frames 6 and 7.

[0005]

As described above, in recent years, users have demanded an inexpensive, light, and thin surface-mount type crystal unit. At present, cylinder type quartz resonators widely used can satisfy most of the conditions, but cannot satisfy the condition of being only a surface mount type. Therefore, it was best to manufacture a surface-mount type crystal unit using a cylinder type crystal unit having many advantages as described above.
It was necessary to change to a surface mount type without losing the advantages of the cylinder type crystal unit. However, in the conventional surface mount type crystal unit, since the resin package 2 completely seals the entire periphery of the cylinder type crystal unit 4 over the entire circumference, there is a problem that the total thickness becomes large. Further, since the resin package 2 also plays a role of fixing the lead frames 6 and 7, when the resin package 2 is thinned, the strength is reduced, and it is difficult to reduce the thickness.

In addition, molding of a resin package made of a thermosetting epoxy resin using a compression molding machine also has a problem that it is difficult to perform a burr treatment and a large number of individual pieces during molding.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a small-sized, thin, and easily mass-produced surface-mount type crystal unit without impairing the advantages of a cylinder-type crystal unit, and a method of manufacturing the same. It is to provide a method.

[0008]

According to the present invention, there is provided a surface-mount type crystal unit, comprising: a substrate having a storage portion having a concave bottom ;
A cylindrical quartz oscillator having a pair of terminals protruding from an end portion and housed in the housing portion, and an edge of the housing portion aligned with a terminal position of the cylindrical quartz oscillator housed in the housing portion; A pair of electrode patterns are formed side by side on the upper surface , the terminals are connected, and one pattern is formed so as to go from the upper surface to the lower surface through the side surface.
It is, the other pattern via the edge to the side opposite to the side surface
A pair of electrode patterns formed so as to extend from the upper surface to the lower surface through the side surfaces, and cover the cylindrical quartz-crystal vibrator and cover the upper surface of the substrate except for the end portions.
And a sealing resin that is filled in the storage section and seals the cylindrical quartz-crystal vibrator.

Further, the manufacturing method includes a plurality of storage portions having bottoms formed of concave portions formed at predetermined intervals and a plurality of long hole through holes forming portions serving as side surfaces of each substrate. A step of forming a plurality of electrode patterns by plating so as to be drawn out from the edge of the storage portion of the collective substrate into the long hole and penetrate the lower surface , and a step of printing a high melting point solder at a predetermined position of the electrode pattern When the step of incorporating each cylindrical quartz oscillator in the receiving portion of the collective substrate, a step of soldering the terminals of the cylinder-type crystal resonator to the electrode pattern by reflow, the double
Corresponding positions to enclose a number of cylindrical quartz resonators
Potting jig with long and narrow potting holes
On the collective substrate, and put resin in the potting holes.
By filling the cylinder type quartz resonator by filling
Both cover the top surface of the substrate except for the end in the side direction.
Removing the jig to seal the cylindrical quartz-crystal vibrator ;
Cutting in one direction intersecting the through hole and separating each surface-mounted crystal resonator.

[0010]

In the surface-mount type crystal unit according to the present invention, the cylinder-type crystal unit is housed in the housing portion of the substrate so as to be dropped. For this reason, despite having a strong structure using the substrate, the thickness of the substrate hardly affects the total thickness, and an extremely thin surface-mounted crystal resonator can be obtained.

Also, by using a large collective substrate, forming an electrode pattern on the surface thereof by plating, and incorporating a plurality of cylinder-type crystal units therein, a large number of surface-mount type crystal units can be formed at once. It can be manufactured.

FIG. 1 is a cross-sectional view showing a surface-mount type crystal unit according to an embodiment of the present invention, and FIG. 2 is a perspective view showing its appearance. Reference numeral 12 denotes a substrate made of an insulating material such as glass epoxy. At the center of the substrate 12, there is provided a storage portion 12a formed of a through hole suitable for a cylinder-type crystal resonator described later.

Reference numerals 14 and 16 denote electrode patterns provided on the surface of the substrate 12. Electrode pattern 1 in this embodiment
4 and 16 are formed side by side on the left side of the edge of the storage section 12a in the figure in accordance with the terminal position of the later-described cylinder-type crystal resonator, and are respectively formed from the upper surface of the substrate 12 on the left and right in the figure
It is formed so as to be drawn out to the side surface and to go around the lower surface .

Reference numeral 18 denotes a cylindrical quartz oscillator in which a quartz plate is sealed in a cylindrical container 18c, and two terminals 18a and 18b electrically connected to electrodes formed on the surface of the quartz plate. Project from the left end of the container 18c in the figure. Cylinder type crystal resonator 18 in this embodiment
Are accommodated in the accommodating portion 12a of the substrate 12, and the terminals 18a and 18b are soldered to the electrode patterns 14 and 16, respectively.

Reference numeral 20 denotes a sealing resin made of epoxy or silicone resin. The sealing resin 20 covers the cylindrical quartz-crystal vibrator 18, and is filled in the storage portion 12 a to seal the cylindrical quartz-crystal vibrator 18.

The thickness of the substrate 12 in the surface-mount type crystal unit having the above-described configuration is set to about １ ／ of the diameter of the cylinder-type crystal unit 18. Therefore, the substrate 12
When the cylindrical quartz oscillator 18 is inserted into the housing portion 12a formed of a through hole formed in the above, it is housed so as to sink about 1/2 of its diameter. At this time, the terminals 18a and 18b of the cylindrical quartz oscillator 18 Are set so as to contact the electrode patterns 14 and 16 on the substrate 12, respectively. Thus, the cylinder-type quartz oscillator 18 is mounted on the substrate 1.
By storing in the second storage portion 12a, the thickness of the substrate is not added to the diameter of the cylindrical quartz oscillator 18 and the total thickness is not increased. In addition, the sealing resin 20 is also provided for sealing the cylinder-type crystal unit 18 and securely fixing it in the storage portion 12a.
If it is formed as a very thin film, it plays a sufficient role. Even if this sealing resin 20 is provided, the total thickness does not become extremely large.

Although the storage portion 12a is formed as a through hole in this embodiment, it may be formed as a bottomed concave portion.

Next, a method of manufacturing the surface-mount type crystal resonator having the above configuration will be described with reference to FIGS. First, as shown in FIGS. 3 and 4, the electrode patterns 14, 16 are plated on a collective substrate 22 made of an insulating material such as glass epoxy on which hundreds of cylinder-type crystal units can be mounted.
Are formed. 1 and FIG.
1 are provided with a large number of through-holes 22a serving as storage portions 12a of the substrate 12 as shown in FIG.
The length of the plurality of slit-shaped in the vertical direction in the figure at a predetermined interval to form a side and become part of the left and right in the drawing of the substrate 12 shown in equal
A hole through hole 22b is provided.

Next, as described above, the electrode patterns 14, 1
The electrode patterns 14 and 16 of the collective substrate 22 on which 6 is formed
Is printed by screen printing at a predetermined position. As shown in FIG. 1 and the like, the high melting point cream solder is applied to the terminals 18a, 18a of the cylindrical quartz oscillator 18.
Since b is to be bonded to the electrode patterns 14 and 16, it is printed at those bonding positions.

Thereafter, as shown in FIGS. 5 and 6, the cylindrical quartz oscillator 18 is incorporated into each through hole 22a, and the terminals 18a and 18b of each cylindrical quartz oscillator 18 are reflowed to form the electrode pattern 14, 16 is soldered.

Next, as shown in FIGS. 7 and 8, a potting jig 24 provided with a potting hole 24a at a position corresponding to the
Layer on 2. Then, as shown in FIGS. 9 and 10, the potting hole 24a is filled with silicon or epoxy resin. After the silicon or epoxy resin is cured, the potting jig 24 is removed.

After sealing the cylinder type crystal unit 18 by the above potting, the collective substrate 22 is cut by a slicing machine or a blade machine, etc., and separated into surface mount type crystal units. To complete.

In the above manufacturing method, the collective substrate 22 having the through-holes 22a formed therein is used as the storage portion. However, the collective substrate 22 may be formed as a concave portion, and both the through-hole and the concave portion serve as the storage portion. The formed aggregate substrate may be used.

[0024]

According to the present invention, not only can the cylinder type quartz resonator be changed to a surface mount type by using a substrate, but also a storage part is provided on the substrate, and the cylinder type crystal resonator is provided in the storage part. By storing the board, the thickness of the board hardly affects the total thickness,
A thin and small surface-mount type crystal unit can be provided without impairing the advantages of the cylinder type crystal unit.

Also, an electrode pattern is formed on the collective substrate,
Since it can be manufactured by incorporating and sealing a cylinder type crystal unit, a large number of surface mount type crystal units can be manufactured at one time.Furthermore, production automation is easy and assembly cost is greatly increased. Can be reduced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a surface-mount type crystal unit according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an appearance of the surface-mount type crystal unit shown in FIG.

FIG. 3 is a plan view showing an aggregate substrate on which an electrode pattern is formed in a process of manufacturing the surface mount type crystal unit shown in FIG.

FIG. 4 is a sectional view of the collective substrate shown in FIG. 3;

FIG. 5 is a plan view showing a state in which a cylinder-type crystal unit is mounted on the collective substrate shown in FIG. 3;

6 is a cross-sectional view of the collective substrate and the like shown in FIG.

FIG. 7 is a plan view showing a state where a potting jig is overlaid on the collective substrate shown in FIG.

FIG. 8 is a sectional view of the collective substrate and the like shown in FIG. 7;

9 is a plan view showing a state in which a potting hole of the potting jig shown in FIG. 7 is filled with resin.

FIG. 10 is a sectional view of the collective substrate and the like shown in FIG. 9;

FIG. 11 A perspective view showing the appearance of a conventional surface mount type crystal unit
FIG.

FIG. Among the conventional surface mount type crystal units shown in FIG.
It is a perspective view which shows a part structure.

FIG. 13 Manufacturing of the conventional surface mount type crystal unit shown in FIG.
It is the top view which illustrated the manufacturing process simply.

[Explanation of symbols]

 REFERENCE SIGNS LIST 12 substrate 12 a storage section 14, 16 electrode pattern 18 cylinder-type crystal oscillator 20 sealing resin 22 collective substrate 22 a through hole

────────────────────────────────────────────────── (5) References JP-A-58-215111 (JP, A) JP-A-58-215112 (JP, A) JP-A-63-283187 (JP, A) JP-A-59-215 32213 (JP, A) JP-A-6-120765 (JP, A) JP-A-2-283110 (JP, A) JP-A 62-26924 (JP, U) JP-A 60-174326 (JP, U) (58) Field surveyed (Int.Cl. ⁷ , DB name) H03H 3/00-3/04 H03H 9/00-9/215

Claims (2)

(57) [Claims] 1. A substrate having a storage part with a bottom formed of a concave part, a cylinder-type crystal unit having a pair of terminals protruding from an end part and stored in the storage part, and being stored in the storage part. A pair of electrode patterns are formed side by side on the upper surface of the edge of the housing portion in accordance with the position of the terminals of the cylindrical quartz resonator, and the terminals are connected, and one of the patterns passes from the upper surface to the lower surface through the side surface. Including
Unnecessarily formed, the other patterns covering a pair of electrode patterns which are formed so as to turn in the lower surface through the side surface from the upper surface is drawn through the edge to the opposite side, the cylindrical crystal resonator and the side surface With the above on the substrate
And a sealing resin that covers a surface except for an end portion and is filled in the storage portion to seal the cylindrical crystal resonator. 2. A bottom plate comprising concave portions formed at predetermined intervals .
The plating from the edge of the housing portion of the collective substrate having a plurality of elongated holes through holes forming part of a certain plurality of housing portions and the side surface of the substrate in such a way as to wrap around the lower surface is drawn into the slot through hole Forming a plurality of electrode patterns by soldering; soldering a high-melting point solder at predetermined positions of the electrode patterns; incorporating cylinder-type quartz oscillators in the accommodating portion of the collective substrate, respectively; A step of soldering a terminal of the crystal unit to the electrode pattern corresponds to surrounding the plurality of cylindrical crystal units.
Potting with a long and narrow potting hole
Stack a jig on the collective substrate, and place it in the potting hole.
By filling the resin, the cylindrical quartz crystal
Cover and remove the top surface of the substrate except for the side edges.
Removing the jig and sealing the cylindrical quartz-crystal vibrator; and a direction intersecting the collective substrate with the elongated through hole.
And separating the surface-mounted crystal units into individual surface-mounted crystal units.