JP3189693B2 - Device for holding conductive balls - Google Patents

Device for holding conductive balls

Info

Publication number
JP3189693B2
JP3189693B2 JP22093196A JP22093196A JP3189693B2 JP 3189693 B2 JP3189693 B2 JP 3189693B2 JP 22093196 A JP22093196 A JP 22093196A JP 22093196 A JP22093196 A JP 22093196A JP 3189693 B2 JP3189693 B2 JP 3189693B2
Authority
JP
Japan
Prior art keywords
conductive ball
head
concave portion
current
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP22093196A
Other languages
Japanese (ja)
Other versions
JPH1064913A (en
Inventor
宏 土師
省二 酒見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP22093196A priority Critical patent/JP3189693B2/en
Publication of JPH1064913A publication Critical patent/JPH1064913A/en
Application granted granted Critical
Publication of JP3189693B2 publication Critical patent/JP3189693B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • H01L2224/11001Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • H01L2224/113Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3478Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、半田ボールなどの
導電性ボールの保持装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for holding conductive balls such as solder balls.

【0002】[0002]

【従来の技術】近年、半導体チップなどの電極にバンプ
(突出電極)を形成するため導電性ボールが用いられて
いる。
2. Description of the Related Art In recent years, conductive balls have been used to form bumps (protruding electrodes) on electrodes such as semiconductor chips.

【0003】ところで、従来の導電性ボールの保持装置
では、ヘッドに細かな吸引孔を多数形成し、吸引孔に吸
引装置を接続し、この吸引孔内を負圧にすることで、導
電性ボールを吸引孔に真空吸着する構成となっていた。
In a conventional conductive ball holding device, a large number of fine suction holes are formed in a head, a suction device is connected to the suction holes, and a negative pressure is applied to the inside of the suction holes. Was sucked into the suction hole by vacuum.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、このよ
うな構成では、吸引をオン/オフする際の応答時間が長
くなるだけでなく、吸引孔に導電性ボール以外の異物
(例えば、ホコリやフラックスなど)が吸着されて吸引
孔がつまったりするトラブルが発生しやすいという問題
点があった。
However, such a structure not only increases the response time when turning on / off the suction, but also causes foreign matters other than the conductive balls (such as dust and flux) to be present in the suction hole. ) Is easily adsorbed and the suction hole is clogged.

【0005】そこで本発明は、導電性ボールを真空吸着
せず保持できる導電性ボールの保持装置を提供すること
を目的とする。
Accordingly, an object of the present invention is to provide a conductive ball holding device capable of holding a conductive ball without vacuum suction.

【0006】[0006]

【課題を解決するための手段】本発明の導電性ボールの
保持装置は、導電性ボールを保持する凹部と、凹部内の
導電性ボールに接触する少なくとも2つの端子と、端子
に電流を流す電流供給手段と、電流の向きに直交する方
向に磁力線を作用させる磁力線発生手段と、少なくとも
凹部と端子とを保持するヘッドとを備えている。
SUMMARY OF THE INVENTION According to the present invention, there is provided a device for holding a conductive ball, comprising: a recess for holding the conductive ball; at least two terminals for contacting the conductive ball in the recess; The apparatus includes a supply unit, a magnetic field line generating unit that applies a magnetic line in a direction perpendicular to the direction of the current, and a head that holds at least a concave portion and a terminal.

【0007】[0007]

【発明の実施の形態】請求項1記載の導電性ボールの保
持装置は、導電性ボールを保持する凹部と、凹部内の導
電性ボールに接触する少なくとも2つの端子と、端子に
電流を流す電流供給手段と、電流の向きに直交する方向
に磁力線を作用させる磁力線発生手段と、少なくとも凹
部と端子とを保持するヘッドとを備えている。したがっ
て、電流供給手段を動作させると、電流と磁力線との作
用により、導電性ボールを凹部へ引きつけたり導電性ボ
ールを凹部から離反させたりすることができる。ここ
で、この作用は電流供給手段から電流を流したり流さな
かったりするだけで実現できるので、動作応答性を向上
できる。また、導電性ボール以外の電流を通さない異物
には、このような作用が及ばないので、つまりなどのト
ラブルを防止できる。
A conductive ball holding device according to a first aspect of the present invention includes a concave portion for holding the conductive ball, at least two terminals contacting the conductive ball in the concave portion, and a current flowing through the terminal. The apparatus includes a supply unit, a magnetic field line generating unit that applies a magnetic line in a direction perpendicular to the direction of the current, and a head that holds at least a concave portion and a terminal. Therefore, when the current supply means is operated, the conductive ball can be attracted to the concave portion or the conductive ball can be separated from the concave portion by the action of the current and the magnetic force lines. Here, this operation can be realized only by flowing or not flowing the current from the current supply means, so that the operation responsiveness can be improved. In addition, foreign substances that do not allow current to pass therethrough, such as conductive balls, are not affected by such an effect, so that trouble such as clogging can be prevented.

【0008】次に図面を参照しながら、本発明の実施の
形態を説明する。図1は、本発明の一実施の形態におけ
る導電性ボールの搭載装置の側面図である。図1におい
て、1は基台、2は基台1上に設けられ内部に多数の導
電性ボール3を収納するボール溜である。ボール溜2の
上部は開口されており、上部から導電性ボール3を供給
できるようになっている。
Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a conductive ball mounting apparatus according to an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a base, and 2 denotes a ball reservoir provided on the base 1 and accommodating a large number of conductive balls 3 therein. The upper part of the ball reservoir 2 is opened so that the conductive balls 3 can be supplied from the upper part.

【0009】4はボール溜2に隣接して基台1に設けら
れ、基板5を位置決めする位置決め部である。基板5の
上面には、回路パターン6が形成されており、この回路
パターン6上に導電性ボール3が搭載される。
Reference numeral 4 denotes a positioning portion provided on the base 1 adjacent to the ball reservoir 2 for positioning the substrate 5. A circuit pattern 6 is formed on the upper surface of the substrate 5, and the conductive balls 3 are mounted on the circuit pattern 6.

【0010】7は基台1の上方にボール溜2と位置決め
部4とにわたって設けられた駆動軸であり、8は駆動軸
7によって図1の左右方向に移動する移動ユニットであ
る。そして、移動ユニット8の下部には、移動ユニット
8に対して昇降するヘッド9が設けられる。またヘッド
9の上部には、ヘッド9と一体的に移動する磁力線発生
手段としての永久磁石10が装着されている。永久磁石
10は、矢印N1方向の磁力線を発生する。
Reference numeral 7 denotes a drive shaft provided above the base 1 over the ball reservoir 2 and the positioning portion 4, and reference numeral 8 denotes a moving unit which is moved by the drive shaft 7 in the left-right direction of FIG. A head 9 that moves up and down with respect to the moving unit 8 is provided below the moving unit 8. Further, a permanent magnet 10 is attached to the upper portion of the head 9 as a magnetic force line generating means that moves integrally with the head 9. The permanent magnet 10 generates magnetic force lines in the direction of the arrow N1.

【0011】ヘッド9をその下面9a側から見ると、図
2のようになっている。即ち、11は下面9aを四角錐
状にへこませた形状をなす凹部であり、下面9aに複数
個形成されている。そして、各凹部11には、磁力線の
向きN1と直交するように、陽極13と陰極14とが対
向して配置され、これらの陽極13、陰極14に、電流
供給部12が接続されている。つまり、各凹部11に、
導電性ボール3が接近し、図3に示すように、導電性ボ
ール3が陽極13、陰極14に接触すると、磁力線Bの
向きN1と直交する向き(矢印N2)に電流Iが流れ
る。
FIG. 2 shows the head 9 when viewed from the lower surface 9a side. That is, reference numeral 11 denotes a concave portion having a shape in which the lower surface 9a is dented into a quadrangular pyramid, and a plurality of concave portions 11 are formed on the lower surface 9a. In each recess 11, an anode 13 and a cathode 14 are arranged opposite to each other so as to be orthogonal to the direction N1 of the line of magnetic force, and a current supply unit 12 is connected to the anode 13 and the cathode 14. That is, in each recess 11,
When the conductive ball 3 approaches and the conductive ball 3 comes into contact with the anode 13 and the cathode 14 as shown in FIG. 3, a current I flows in a direction (arrow N2) orthogonal to the direction N1 of the line of magnetic force B.

【0012】その結果、フレミングの左手の法則によっ
て、導電性ボール3に矢印N3方向の力Fが作用し、導
電性ボール3は凹部11に押し付け(吸着)される。そ
して、電流供給手段12をオフにすると、この力Fは発
生せず、導電性ボール3はその自重により凹部11から
離れて落下するものである。電流供給手段12のオン/
オフ切替は、電気的動作であるから、従来の導電性ボー
ルの保持装置のように、真空吸着のオン/オフを切替え
る場合に比べて、格段に短時間で行える。しかも、電流
を通さない異物が凹部11の付近に存在していても、こ
の異物には力Fは作用しないから、凹部11が異物でつ
まるというようなトラブルは発生しない。
As a result, the force F in the direction of arrow N3 acts on the conductive ball 3 by the Fleming's left-hand rule, and the conductive ball 3 is pressed (adsorbed) into the concave portion 11. When the current supply means 12 is turned off, this force F is not generated, and the conductive ball 3 is separated from the recess 11 by its own weight and falls. ON / OFF of current supply means 12
Since the off-switching is an electrical operation, the off-switching can be performed in a much shorter time than in the case of switching on / off of vacuum suction as in a conventional conductive ball holding device. In addition, even if there is a foreign matter that does not allow electric current to be present near the concave portion 11, the force F does not act on the foreign material, so that there is no trouble that the concave portion 11 is clogged by the foreign material.

【0013】次に、図4、図5を参照しながら、本発明
の他の実施の形態について説明する。この例では、ヘッ
ド9の下面9aをへこませるのではなく、下面9aに4
つの突部を形成している。そして、これらの突部に囲ま
れた箇所を導電性ボール3が進入できる凹部19(図
5)としている。
Next, another embodiment of the present invention will be described with reference to FIGS. In this example, the lower surface 9a of the head 9 is not
Form two protrusions. A portion surrounded by these protrusions is a concave portion 19 (FIG. 5) into which the conductive ball 3 can enter.

【0014】ここで、4つの突部のうち、磁力線Bの向
きN1と平行な位置の突部は、電流を流さない単なる突
部17,18としている。また、磁力線Bの向きN1と
直交する位置にある突部は、一方を陽極15とし、他方
を陰極16としており、これら陽極15と陰極16とを
電流供給手段12に接続してある。
Here, of the four protrusions, the protrusions at positions parallel to the direction N1 of the magnetic force lines B are simply the protrusions 17, 18 through which no current flows. Further, one of the protrusions at a position orthogonal to the direction N1 of the magnetic field line B has an anode 15 and the other has a cathode 16, and these anode 15 and cathode 16 are connected to the current supply means 12.

【0015】したがって、図5に示すように、上述した
形態(図3)と同様に、電流供給手段12をオンする
と、導電性ボール3に凹部19へ向かう力Fを作用させ
ることができ、導電性ボール3が凹部19に吸着され
る。一方、電流供給手段12をオフすると、力Fは発生
せず導電性ボール3は自重により凹部19から離れる。
Therefore, as shown in FIG. 5, similarly to the above-described embodiment (FIG. 3), when the current supply means 12 is turned on, a force F directed toward the concave portion 19 can be applied to the conductive ball 3, and The conductive ball 3 is attracted to the recess 19. On the other hand, when the current supply means 12 is turned off, the force F is not generated, and the conductive ball 3 is separated from the concave portion 19 by its own weight.

【0016】[0016]

【発明の効果】本発明は、以上のように構成したので、
動作が高速でしかもトラブルの少ない導電性ボールの保
持装置を得ることができる。
The present invention has been configured as described above.
It is possible to obtain a conductive ball holding device which operates at high speed and has few troubles.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態における導電性ボールの
搭載装置の側面図
FIG. 1 is a side view of a conductive ball mounting apparatus according to an embodiment of the present invention.

【図2】本発明の一実施の形態におけるヘッドの底面図FIG. 2 is a bottom view of the head according to the embodiment of the present invention;

【図3】本発明の一実施の形態における凹部の拡大側面
FIG. 3 is an enlarged side view of a concave portion according to the embodiment of the present invention.

【図4】本発明の他の実施の形態における凹部の拡大斜
視図
FIG. 4 is an enlarged perspective view of a concave portion according to another embodiment of the present invention.

【図5】本発明の他の実施の形態における凹部の拡大側
面図
FIG. 5 is an enlarged side view of a concave portion according to another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

3 導電性ボール 9 ヘッド 11 凹部 13 陽極 14 陰極 I 電流 B 磁力線 3 Conductive Ball 9 Head 11 Depression 13 Anode 14 Cathode I Current B Magnetic Field Line

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H01L 21/60 B23P 21/00 305 H05K 3/34 501 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) H01L 21/60 B23P 21/00 305 H05K 3/34 501

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】導電性ボールを保持する凹部と、前記凹部
内の導電性ボールに接触する少なくとも2つの端子と、
前記端子に電流を流す電流供給手段と、前記電流の向き
に直交する方向に磁力線を作用させる磁力線発生手段
と、少なくとも前記凹部と前記端子とを保持するヘッド
とを備えたことを特徴とする導電性ボールの保持装置。
1. A recess for holding a conductive ball, at least two terminals in contact with the conductive ball in the recess,
A conductive element comprising: a current supply unit for supplying a current to the terminal; a magnetic line generating unit for applying a magnetic line in a direction perpendicular to the direction of the current; and a head holding at least the concave portion and the terminal. Ball holding device.
【請求項2】前記凹部は、前記ヘッドの一部をへこませ
て形成されていることを特徴とする請求項1記載の導電
性ボールの保持装置。
2. The conductive ball holding device according to claim 1, wherein said recess is formed by recessing a part of said head.
【請求項3】前記凹部は、前記ヘッドから突設される前
記端子によって形成されていることを特徴とする請求項
1記載の導電性ボールの保持装置。
3. The conductive ball holding device according to claim 1, wherein said concave portion is formed by said terminal projecting from said head.
【請求項4】前記磁力線発生手段は、前記ヘッドと一体
的に設けられた永久磁石であることを特徴とする請求項
1記載の導電性ボールの保持装置。
4. The conductive ball holding device according to claim 1, wherein said magnetic force line generating means is a permanent magnet provided integrally with said head.
JP22093196A 1996-08-22 1996-08-22 Device for holding conductive balls Expired - Fee Related JP3189693B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22093196A JP3189693B2 (en) 1996-08-22 1996-08-22 Device for holding conductive balls

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22093196A JP3189693B2 (en) 1996-08-22 1996-08-22 Device for holding conductive balls

Publications (2)

Publication Number Publication Date
JPH1064913A JPH1064913A (en) 1998-03-06
JP3189693B2 true JP3189693B2 (en) 2001-07-16

Family

ID=16758806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22093196A Expired - Fee Related JP3189693B2 (en) 1996-08-22 1996-08-22 Device for holding conductive balls

Country Status (1)

Country Link
JP (1) JP3189693B2 (en)

Also Published As

Publication number Publication date
JPH1064913A (en) 1998-03-06

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