JP3183291B2 - Heat sink device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink device for cooling a semiconductor element having high heat generation such as a micro processing unit (hereinafter abbreviated as MPU).

[0002]

2. Description of the Related Art Conventionally, heat sink devices have been used for cooling high heat-generating semiconductors and the like.
In order to cope with high heat generation such as U, a heat sink device integrated with a fan motor having a high cooling effect, in which a small fan is incorporated in a heat sink, is used. In this heat sink device, since air is sucked from above, a sufficient space is required above, and in a thin device such as a notebook-type personal computer, dimensions in a thickness direction are limited, and sufficient cooling capacity cannot be exhibited. Has issues.

[0003] A conventional heat sink device will be described below. FIG. 8 is a perspective view of a conventional heat sink device, and FIG.
1 is a sectional view of a conventional heat sink device.

[0004] In FIGS. 8 and 9, reference numeral 81 denotes an MPU which is a semiconductor device having a high heat generation, and 82 denotes a heat sink substrate.
83 is a heat dissipating fin, 84 is a driving means such as a motor, 85 is a fan, 86 is a structure that regulates the clearance on the upper surface of the heat sink device such as a case of a notebook type personal computer. .

The operation of the conventional heat sink device integrated with a fan motor configured as described above will be described below. Heat generated by the MPU 81 is transmitted to the heat sink base 82 and the fins 83. Fan 8 rotated by drive means 84
The air flow generated in 5 is sucked through the space between the structure and the upper surface of the heat sink device as indicated by arrow A, and is exhausted to the side of the heat sink as indicated by arrow B while passing heat through the fins 83.

[0006]

However, in the above-described conventional configuration, since air is sucked in from the upper surface of the heat sink device, a sufficient space is required on the upper surface of the heat sink device. In thin devices such as notebook type personal computers, the size in the thickness direction is limited, so there is a problem that sufficient space cannot be secured on the upper surface of the heat sink device, and sufficient cooling capacity cannot be exhibited. I was In addition, the entire heat sink device may be thinned to secure space.However, a motor that can rotate the fan to obtain a cooling air volume needs a certain thickness because of the need for a bearing structure and a winding structure. Therefore, there was a limit to thinning.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a fan motor integrated heat sink device capable of effectively blowing and cooling even when there is not enough space on the upper surface of the heat sink device. And

[0008]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention is to reduce the height of the fins of the fan and the heat sink and the height of the heat sink base as compared with the driving means such as a motor having a structurally limited thickness. Thus, a sufficient space for sucking air can be obtained on the upper surface of the heat sink device.

With this configuration, it is possible to bring the structure to the upper part of the heat sink device up to near the height of the motor, and it is possible to install the heat sink device on a thin device.

[0010]

According to the heat sink device of the present invention, the driving means for driving the fan passes through an opening provided in the cover, and the upper surface of the fan and the upper surface of the cover are provided. Height is lower than the height of the upper surface of the driving means, so that even if the upper structure is brought close to the limit of the driving means, there is room on the side of the driving means, so that an air inflow path can be secured. In addition, the heat sink device can be installed on a thin device.

According to another aspect of the present invention, there is provided a heat sink base in which a side wall having one opening is provided upright at a bottom, a driving unit having at least a part fixed to the heat sink base, and a driving unit. A rotating fan,
A plurality of fins erected on the heat sink substrate, wherein the height from the bottom of the heat sink substrate to the upper surface of the side wall is lower than the height from the bottom to the upper surface of the driving means, thereby increasing the structural thickness. Since the height of the fins of the fan and the heat sink is made lower than that of the driving means such as a motor having a limited height, a sufficient space for sucking air is obtained on the upper surface of the heat sink device. The structure can be brought to the upper part of the device, and the heat sink device can be installed on a thin device.

Further, by mounting a plate having an opening through which the driving means penetrates on the side of the heat sink substrate to which the driving means is fixed, the exhaust gas, which has taken heat from the heat sink substrate and has a high temperature, flows toward the intake side. The effect of preventing the cooling effect from being lowered is obtained.

[0013] Further, by making the size of the opening of the plate larger than the driving means penetrates and smaller than the outer diameter of the fan, the intake air causes a mixed flow between the fan and the fins, and the gas flows toward the intake side. Can be prevented from returning, and a smooth gas flow can be performed to improve the cooling effect.

Further, by providing a cover having an opening for specifying the suction direction on the air suction side, the suction direction can be limited, so that cooling of internal components or the like which generate a large amount of heat inside the equipment provided with the heat sink device. The air can be taken in from the necessary optimal direction, and the optimal cooling effect of the entire housing including the MPU and the like can be obtained.

Further, by providing a ventilation duct in the opening on the suction side or the opening on the blowing side, or both,
Since the suction side opening and the blowing side opening can be installed at any positions, it is possible to freely design the installation position of the heat generating element to which the heat sink device is mounted.

Further, by adopting an axial fan as a type of fan, it becomes possible to make the heat sink device thinner even with the same airflow than other fans such as a centrifugal fan.

Further, the electronic device is provided with a heat sink device for sucking the heat into the heating element from one direction and exhausting the heat in a direction different from the suction direction. Since cooling and exhaust of the hot air inside are performed in an arbitrary direction, effective cooling is possible and the size of the device can be reduced.

An embodiment of the present invention will be described below with reference to FIGS.

(Embodiment 1) FIG. 1 is a perspective view of a heat sink device according to Embodiment 1 of the present invention, FIG. 2 is a plan view of the heat sink device according to Embodiment 1 of the present invention, and FIG. 1 shows a sectional view of a heat sink device according to Embodiment 1 of the present invention.

1, 2 and 3, 1 is a heating element such as an MPU, 2 is a heat sink base, 3 is a motor as driving means, 4 is a blowout opening provided in the heat sink base 2, 5 is a cover, 6 Is an axial flow type fan, 7 is a radiating fin provided on the heat sink base 2, and the fin 7 is substantially parallel to the outflow direction of the air at the opening 4 portion, and is centered on the rotation axis of the fan 6 at other portions. Are provided in a substantially arc shape. Reference numeral 8 denotes a structure for regulating the clearance on the upper surface of the heat sink device, such as a case of a notebook personal computer. For example, the heating element 1 is a square or a rectangle having a side of 40 mm to 50 mm. The heat sink base 2 is attached to the upper surface of the heat generating element 1 by an adhesive or a fixing method using a hook or a screw. In this embodiment, the outer shape of the outer wall portion of the heat sink substrate 2 is a square similar to that of the heating element 1, but the outer shape may be such that the portion other than the opening 4 is circular. The height of the outer wall is lower than the height of the upper surface of the motor 3. The fan 6 is provided on the lower side of the side surface of the motor 3 so that the height of the upper surface of the fan 6 is lower than the height of the upper surface of the motor 3. The cover 5 mounted on the outer wall of the heat sink base 2 has an opening through which the motor 3 passes. The inside diameter of this opening is larger than the outside diameter of the motor 3 and smaller than the outside diameter of the fan 6. As shown in FIG. 3, even when the structure 8 has a structure approaching the upper surface of the motor 3, there is sufficient air flow between the structure 8 and the outer wall of the heat sink base 2, the cover 5, and the fan 6. Space exists.

(Embodiment 2) FIG. 4 is a perspective view of a heat sink device according to Embodiment 2 of the present invention, and FIG. 5 is a cross-sectional view of the heat sink device according to Embodiment 2 of the present invention.

11 is a heating element such as an MPU, 12 is a heat sink base, 13 is a motor as driving means, 14 is an opening for blowing out, 15 is a first cover, 16 is a fan,
Reference numeral 17 denotes a heat dissipating fin provided on the heat sink base 12, reference numeral 18 denotes a second cover, reference numeral 19 denotes an opening on the suction side provided on the second cover 18, reference numeral 20 denotes a housing of a notebook type personal computer, and the like. 4 shows a structure that regulates a clearance on the upper surface of the heat sink device. Figure 1 above,
A heat sink device similar to that shown in FIGS. 2 and 3 is provided with a second cover 18. The second cover 18 is provided with an opening 19 for specifying a suction direction, and the second cover 18 can be attached to the heat sink base 12 so that the opening 19 is in an arbitrary direction. It is.

(Embodiment 3) FIG. 6 is a perspective view of a heat sink device according to Embodiment 3 of the present invention, and FIG. 7 is an internal view of an electronic device incorporating the heat sink device according to Embodiment 3 of the present invention.

Reference numeral 60 denotes a heating element, 61 denotes a heat sink device similar to the second embodiment shown in FIGS. 4 and 5, 62 denotes a suction-side opening provided in the heat sink device 61,
Reference numeral 63 denotes an opening on the blowing side provided in the heat sink device 61, and 64 denotes a first opening provided on the opening 62 on the suction side.
The duct 65 is a second duct provided in the opening 63 on the blowing side. In the drawing, the first duct 64 and the second duct 65 have a rectangular cross-section similar to the opening 62 on the suction side or the opening 63 on the outlet side, but any shape, for example, the first duct The shape of the second duct 6 has a shape in which the front end of the suction side 64 is wider than the opening 62 on the suction side.
It is possible to take a circular shape or the like whose tip on the outlet side of No. 5 is larger than the opening 63 on the outlet side. If necessary, the duct can be provided in only one of the opening 62 on the suction side and the opening 63 on the outlet side.
7, reference numeral 70 denotes a housing of an electronic device, 71 denotes a printed circuit board, and 72 denotes a heat-generating component such as a power supply. The duct 64 on the suction side has an opening near the heat-generating component 72 such as a power supply inside the electronic device, and the duct 65 on the outlet side has an opening in the housing 70 of the electronic device. The flow of air from the heat sink device 61 is drawn into the air around the heat generating component 72 by the duct 64, passes through the inside of the heat sink device 61, and is exhausted to the outside of the housing of the electronic device by the duct 65.

The operation of the heat sink device configured as described above will be described below with reference to the drawings.

In the case of the first embodiment, in FIG. 3, the heat generated by the heat generating element 1 is transmitted to the heat sink base 2 and the fins 7. The flow of air generated by the fan 6 rotated by the motor 3 is sucked from the upper surface of the heat sink device as shown by the arrow A, passes through the fins 7 and goes to the opening 4 while removing heat, and is exhausted to the side of the heat sink as shown by the arrow B. Is done. When the upper surface of the heat sink device is open, the flow of the sucked air flows in from the upper part without interruption, but as in the case of the structure 8, in order to make the equipment thinner, the air is brought close to the upper structure 8 as far as the motor unit. Even in such a case, the structure of the present invention has a margin on the side surface, so that an air inflow path can be secured. In the conventional structure using the same motor, the inflow path is blocked, so that the airflow cannot be ensured despite the larger exposed area of the fan to the outside than the structure of the present invention. Further, when the motor itself is made thinner with the conventional structure, an air inflow path can be secured, but a decrease in the motor output cannot be avoided, and thus the air volume decreases. As described above, by adopting the structure of the present invention, an air inflow path can be secured without lowering the motor output, so that effective cooling can be achieved.

Next, the operation of the cover 5 will be described with reference to FIG. In the heat sink device having the above-described configuration, the fan 6 may have any structure of an axial fan and a centrifugal fan. However, the advantage of the present invention is that it can be made thin and is mainly used for cooling a semiconductor element of an electronic device.
About 30 mm in diameter. For this reason, it is necessary to keep the dimension of the fan in the height direction at about 5 mm. Normally, a conventional centrifugal fan such as a sirocco fan is used in the case of a conventional fan that exhausts air from the upper side as shown in FIG. 9, but in the case of the present invention, a centrifugal fan can obtain a sufficient blade length. Because it is not possible, an axial fan is used. When the cover 5 is not provided, the air flowing downward by the fan 6 escapes in the heat sink base 2 in the suction direction from the gap between the recoil blades and the gap between the fan 6 and the inner wall of the heat sink base 2. In order to suppress this escape, it is effective to provide the cover 5 so as to cover a part of the fan 6. The inner diameter of the opening of the cover 5 is the fan 6
If it is larger than the outer circumference of the tip of the, a lot of escape to the suction side occurs. If the inside diameter of the opening of the cover 5 is too small compared to the outer circumference of the tip of the fan 6, the opening area on the suction side becomes small, and the amount of suction air decreases. In actual use, the characteristics vary depending on the internal structure of the device such as the structure 8, so that an optimal dimensional design for the device is required.

Next, a second embodiment of the present invention will be described with reference to FIGS. Heat sink base 12, motor 13, opening 14, first cover 15, fan 16,
The fin 17 has the same structure as that of the first embodiment shown in FIGS. 1, 2 and 3, and has a second cover 18 mounted thereon. The second cover 18 has an opening 19 at one end of the side surface. Air is sucked in from the opening 19 by the rotation of the fan 16, passes through the fins 17, and blows out of the opening 14 while removing heat. Is done. Second
The cover 18 can be attached to the heat sink base 1 so that the opening 19 is in any one direction, thereby realizing a heat sink device that sucks in from any one direction and exhausts in any one direction. In the structure of the first embodiment shown in FIG. 1, heat is sucked from each direction. However, by adopting the structure of the second embodiment shown in FIG. 4 using the second cover 18, heat is generated inside the device provided with the heat sink device. When cooling of a large built-in component or the like is required, air can be taken in from an optimal direction, and it is possible to optimize the cooling effect of the entire housing including the MPU and the like. Further, a structure 20 for regulating the clearance on the upper surface of the heat sink device, such as a housing of a notebook type personal computer, can be brought into contact with the upper surface of the second cover 18. In comparison, although the dimensions of the heat sink device itself are somewhat thicker, there is no characteristic change due to the distance between the heat sink device and the structure 20, and the design of the device is relatively easy.

With the conventional structure, it is possible to attach the second cover 18 so that the suction is performed from one direction.
As described in the second embodiment, a space is required between the motor 13 and the second cover 18, and the thickness increases. When attaching the second cover 18 to the heat sink device having the structure of the present invention, the motor 13 and the second cover 18 can be close to each other, and a thin one-way suction one-way exhaust heat sink device can be provided. realizable. Devices that require one-way suction and one-way exhaust are mainly thin devices with limited space, and the configuration of the present invention has a great advantage that a thin heat sink device of one-way suction and one-way exhaust can be realized.

Next, a third embodiment of the present invention will be described with reference to FIGS. The heat sink device shown in FIG. 6 has the first duct 64 provided at the suction-side opening and the second duct 65 provided at the outlet opening of the heat sink device shown in FIGS. is there. By providing the first duct 64 and the second duct 65, it is possible to take in air from an arbitrary position and exhaust it to an arbitrary position, and the direction and position of intake and exhaust vary depending on the position of the MPU and the position of the printed circuit board. You will not be restricted.

FIG. 7 shows an example of electronic equipment incorporating the heat sink device. When there is no first duct 64 on the suction side, the heat sink device 61 only sucks the surrounding air on the printed circuit board 71. However, by providing the first duct 64 on the suction side, specific components, for example, the power supply device 7 are provided.
By providing the suction port of the first duct 64 on the suction side near 2, the power supply device 72 can be cooled together with the suction. Further, by providing the opening of the second duct 65 on the blowing side in the housing 70, the heat of the heating element 60 and the heat of the power supply device 72 can be reliably exhausted to the outside of the housing, and the diffusion of heat into the housing is prevented. it can. In addition, there is no need to separately provide a fan for exhausting the housing other than the heat sink device, and the configuration is simplified.

[0032]

As described above, according to the present invention, it is unnecessary to provide a space above the heat sink device.
A high-performance MPU can be mounted on a thin device.

[Brief description of the drawings]

FIG. 1 is a perspective view of a heat sink device according to a first embodiment of the present invention.

FIG. 2 is a plan view of the heat sink device of FIG. 1 according to the first embodiment of the present invention;

FIG. 3 is a sectional view of the heat sink device according to the first embodiment of the present invention;

FIG. 4 is a perspective view of a heat sink device according to a second embodiment of the present invention.

FIG. 5 is a sectional view of a heat sink device according to a second embodiment of the present invention.

FIG. 6 is a perspective view of a heat sink device according to a third embodiment of the present invention.

FIG. 7 is an internal view of an electronic device incorporating a heat sink device according to a third embodiment of the present invention.

FIG. 8 is a perspective view of a conventional heat sink device.

FIG. 9 is a sectional view of a conventional heat sink device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat generating element 2 Heat sink base 3 Motor 4 Opening 5 Cover 6 Fan 7 Radiation fin 8 Structure

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-9-129795 (JP, A) JP-A-9-51189 (JP, A) JP-A-2-196454 (JP, A) JP-A-5-196454 304379 (JP, A) JP-A-8-195456 (JP, A) JP-A 5-7998 (JP, U) JP-A-58-187190 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 7/20 H01L 23/467

Claims (4)

(57) [Claims] 1. A heat sink base on which a heating element can be mounted and a side wall is provided upright at a bottom thereof; a driving means; a fan provided below the driving means; and a fan provided on the side wall. The drive unit is mounted so that the height of the upper surface of the fan and the upper surface of the cover is lower than the height of the upper surface of the drive unit, penetrating an opening provided in the cover. A heat sink device. 2. A heat sink base on which a heating element can be attached and a side wall is erected on the bottom thereof; a driving means; a fan provided on a lower side of the driving means; A plurality of fins, and a cover provided on the side wall, wherein the driving means penetrates an opening provided in the cover, and a height of an upper surface of the fan and an upper surface of the cover is increased. A heat sink device, wherein the heat sink device is mounted so as to be lower than a height of an upper surface of the driving means, and forms an air inflow path on a side of the driving means. With wherein a heat generating element can be attached, heating
A heat sink device having a bottom and a cover of a sink base , comprising: a driving unit; a fan provided on a lower side of the driving unit; and a plurality of fins erected on the heat sink base. The heat sink device is characterized in that the means penetrates an opening provided in the cover and is mounted such that the height of the upper surface of the fan and the upper surface of the cover is lower than the height of the upper surface of the drive means. With 4. a heat generating element can be attached, heating
A heat sink device having a bottom and a cover of a sink base , comprising: a driving unit; a fan provided on a lower side of the driving unit; and a plurality of fins erected on the heat sink base. The means penetrates an opening provided in the cover, is mounted such that the height of the upper surface of the fan and the upper surface of the cover is lower than the height of the upper surface of the driving means, A heat sink device comprising an air inflow path.