JP3181265U - Substrate transfer device - Google Patents

Abstract

There is provided a substrate transfer apparatus that can easily detect whether a substrate held on a fork is displaced from a normal position and performs appropriate transfer control according to the holding state of the substrate.
In a substrate transport apparatus that receives a substrate from a substrate platform 73 on which the substrate is placed and transports the received substrate, the substrate platform is provided so as to surround the substrate to be transported. 73, a holding frame 3B that can be moved forward and backward, a drive unit 33 that drives the holding frame 3B forward and backward to the substrate mounting portion 73, and an inner edge of the holding frame 3B. Three or more holding units that hold the substrate by placing the peripheral portion of the substrate, and detection units 4A and 4B that are provided in the holding unit and detect that the substrate is placed. And the detection units 4A and 4B detect the placed substrate using a capacitive proximity sensor.
[Selection] Figure 12

Description

  The present invention relates to a substrate transfer apparatus for transferring a substrate.

  In the manufacturing process of a semiconductor device or an LCD (Liquid Crystal Display) substrate, a plurality of processing modules for processing a substrate (hereinafter also referred to as “wafer”) are provided in the apparatus, and these processing modules are provided by a substrate transfer device. Predetermined processing is performed by sequentially transporting the substrates. For example, the substrate transport device is configured such that a fork for holding a substrate is provided so as to be able to advance and retreat along a base, and the substrate can be rotated about a vertical axis and can be moved up and down.

  Some of such substrate transport apparatuses are provided with a sensor for confirming whether or not the position of the fork is normal (see, for example, Patent Document 1). Some sensors are provided to check whether or not the fork has received a substrate from the processing module (see, for example, Patent Document 2).

  In Patent Document 1, a light reflector is provided on a fork, and an optical sensor capable of projecting and receiving light is provided below the reflector, so that it is possible to detect that the fork has shifted from a normal position. An apparatus is disclosed. Further, Patent Document 2 is provided with an optical sensor for detecting that the substrate is supported on the fork, and can detect that the substrate is supported on the fork when the substrate blocks the optical axis. A substrate transfer apparatus is disclosed.

Japanese Patent No. 4047182 Japanese Patent No. 3965131

  However, the above-described substrate transfer apparatus and substrate transfer method for transferring a substrate have the following problems.

  In the example disclosed in Patent Document 1, it is possible to detect that the position of the fork has deviated from the normal position. However, it cannot be detected that the substrate held on the fork is displaced from the fork.

  On the other hand, in the example disclosed in Patent Document 2, when the substrate held by the fork is displaced from the side where the sensor is provided to the side where the sensor is not provided, the optical axis is not blocked. Therefore, the positional deviation can be easily detected. However, when the substrate held on the fork is displaced from the side where the sensor is not provided to the side where the sensor is provided, the state where the optical axis is blocked does not change. It cannot be detected.

  Usually, the optical sensor is often provided on the base side of the fork. At this time, it is not possible to detect a state where the board has run on the base side of the fork. For example, when the fork holds the substrate while the substrate is shifted to the base side of the fork, since the displacement of the substrate cannot be detected, the position where the fork holds the substrate is misaligned. The backward movement is performed in an unknown state. As a result, for example, when the substrate is delivered to the next processing module, the position of the substrate may be shifted, or the substrate may come into contact with other parts in the processing module and be damaged.

  The present invention has been made in view of the above points, and can easily detect whether the substrate held on the fork is displaced from the normal position, and further, depending on the holding state of the substrate on the fork. Provided is a substrate transfer apparatus capable of performing proper transfer control.

  In order to solve the above-described problems, the present invention is characterized by the following measures.

  According to one embodiment of the present invention, in the substrate transfer apparatus that receives the substrate from the substrate mounting unit on which the substrate is mounted and transfers the received substrate, the substrate is provided so as to surround the substrate to be transferred, A holding frame that can be moved forward and backward with respect to the substrate mounting portion; a drive portion that drives the holding frame to move back and forth with respect to the substrate mounting portion; and an inner edge of the holding frame that is spaced from each other. Three or more holding parts that hold the substrate by being placed on the peripheral edge of the sensor, and a detection part that is provided in the holding part and detects that the board is placed, There is provided a substrate transfer device, wherein the detection unit detects the substrate placed using a capacitive proximity sensor.

  According to another embodiment of the present invention, the substrate transfer apparatus may be the substrate transfer apparatus, wherein the holding unit includes a plurality of the detection units. Further, in the substrate transport apparatus, the detection unit detects a relative position of the substrate with respect to the holding frame, and determines whether the relative position needs to be corrected based on a detection value of each detection unit. When it is determined that the correction of the relative position is necessary, a correction operation is performed. When it is determined that the correction of the relative position is not necessary, the driving of the driving unit is stopped or the conveyance of the substrate is continued. A substrate transfer apparatus characterized by the above may be used. Further, in the substrate transport apparatus, when the driving unit advances the holding frame and receives the substrate from the substrate mounting unit to the holding unit, any one of the holding units is detected by the detection unit. The substrate transport apparatus may be characterized in that when it is determined that the substrate is not placed, the driving of the driving unit is stopped.

  According to the present invention, in a substrate transfer apparatus for transferring a substrate, it is possible to easily detect whether the substrate held on the fork is displaced from the normal position, and further, depending on the holding state of the substrate on the fork. Transport control can be performed.

It is a top view which shows the structure of the resist pattern formation apparatus which concerns on embodiment. It is a schematic perspective view which shows the structure of the resist pattern formation apparatus which concerns on embodiment. It is a side view which shows the structure of the resist pattern formation apparatus which concerns on embodiment. It is a perspective view which shows the structure of a 3rd block. It is a perspective view which shows the conveyance arm which concerns on embodiment. It is the top view and side view which show the conveyance arm which concerns on embodiment. It is a top view which expands and shows the fork of the conveyance arm which concerns on embodiment. It is sectional drawing which expands and shows the fork of the conveyance arm which concerns on embodiment. It is a top view and a sectional view showing a fork and a wafer when a wafer is normally placed on a holding claw. It is a top view and a sectional view showing a fork and a wafer when a wafer is not normally placed on a holding claw. It is a top view which shows the fork and wafer in another example when the wafer is not normally mounted on the holding claw. It is a block diagram which shows the heating module and control part which were provided in the resist pattern formation apparatus. It is a flowchart which shows the procedure of each process in a board | substrate conveyance method. It is a figure which shows the state of the heating module at the time of delivering a wafer and a conveyance arm. It is a top view which expands and shows the fork of the conveyance arm which concerns on the modification of embodiment.

  Hereinafter, a case where a substrate processing apparatus provided with a substrate transfer apparatus according to the present invention is applied to a coating and developing apparatus will be described as an example.

  First, a resist pattern forming apparatus in which an exposure apparatus is connected to a coating and developing apparatus will be briefly described with reference to FIGS.

  FIG. 1 is a plan view showing a configuration of a resist pattern forming apparatus according to the present embodiment. FIG. 2 is a schematic perspective view showing the configuration of the resist pattern forming apparatus according to the present embodiment. FIG. 3 is a side view showing the configuration of the resist pattern forming apparatus according to the present embodiment. FIG. 4 is a perspective view showing the configuration of the third block (COT layer) B3.

  As shown in FIGS. 1 and 2, the resist pattern forming apparatus has a carrier block S1, a processing block S2, and an interface block S3. An exposure device S4 is provided on the interface block S3 side of the resist pattern forming apparatus. The processing block S2 is provided adjacent to the carrier block S1. The interface block S3 is provided on the side opposite to the carrier block S1 side of the processing block S2 so as to be adjacent to the processing block S2. The exposure apparatus S4 is provided on the side opposite to the processing block S2 side of the interface block S3 so as to be adjacent to the interface block S3.

  The carrier block S1 includes a carrier 20, a mounting table 21, and delivery means C. The carrier 20 is mounted on the mounting table 21. The delivery means C is for taking out the wafer W from the carrier 20 and delivering it to the processing block S 2, receiving the processed wafer W processed in the processing block S 2, and returning it to the carrier 20.

  As shown in FIG. 2, the processing block S2 includes a shelf unit U1, a shelf unit U2, a first block (DEV layer) B1, a second block (BCT layer) B2, a third block (COT layer) B3, A fourth block (TCT layer) B4 is included. The first block (DEV layer) B1 is for performing development processing. The second block (BCT layer) B2 is for performing an antireflection film forming process formed on the lower layer side of the resist film. The third block (COT layer) B3 is for performing a resist liquid coating process. The fourth block (TCT layer) B4 is for performing an antireflection film forming process formed on the upper layer side of the resist film.

The shelf unit U1 is configured by stacking various modules. As illustrated in FIG. 3, the shelf unit U1 includes, for example, delivery modules TRS1, TRS1, CPL11, CPL2, BF2, CPL3, BF3, CPL4, and TRS4 stacked in order from the bottom. Moreover, as shown in FIG. 1, the transfer arm D which can be moved up and down is provided in the vicinity of the shelf unit U1. Wafers W are transferred by the transfer arm D between the processing modules of the shelf unit U1.

  The shelf unit U2 is configured by stacking various processing modules. As illustrated in FIG. 3, the shelf unit U2 includes delivery modules TRS6, TRS6, and CPL12 stacked in order from the bottom, for example.

  In FIG. 3, the delivery module attached with CPL also serves as a cooling module for temperature control, and the delivery module attached with BF also serves as a buffer module on which a plurality of wafers W can be placed. ing.

  The first block (DEV layer) B1 has a developing module 22, a transport arm A1, and a shuttle arm E as shown in FIGS. The development module 22 is stacked in two upper and lower stages in one first block (DEV layer) B1. The transfer arm A1 is for transferring the wafer W to the two-stage development module 22. That is, the transfer arm A1 is a common transfer arm for transferring the wafer W to the two-stage development module 22. The shuttle arm E is for directly transferring the wafer W from the delivery module CPL11 of the shelf unit U1 to the delivery module CPL12 of the shelf unit U2.

  The second block (BCT layer) B2, the third block (COT layer) B3, and the fourth block (TCT layer) B4 are respectively a coating module, a heating / cooling system processing module group, and a transfer arm A2. A3 and A4 are included. The processing module group is for performing pre-processing and post-processing of processing performed in the coating module. The transfer arms A2, A3, A4 are provided between the coating module and the processing module group, and transfer the wafer W between the processing modules of the coating module and the processing module group.

  In each block from the second block (BCT layer) B2 to the fourth block (TCT layer) B4, the chemical solution in the second block (BCT layer) B2 and the fourth block (TCT layer) B4 is used for the antireflection film. It has the same configuration except that the chemical solution in the third block (COT layer) B3 is a resist solution.

  The transfer arms A1 to A4 correspond to the substrate transfer apparatus in the present invention, and the configuration of the transfer arms A1 to A4 will be described later. Moreover, the part which mounts the mounting base 21 and the board | substrate in each processing module is equivalent to the board | substrate mounting part in this invention.

  Here, referring to FIG. 4, the second block (BCT layer) B2, the third block (COT layer) B3, and the fourth block (TCT layer) B4 are represented as the third block (COT layer). ) The configuration of B3 will be described.

  The third block (COT layer) B3 includes a coating module 23, a shelf unit U3, and a transfer arm A3. The shelf unit U3 includes a plurality of processing modules stacked so as to constitute a heat treatment module group such as a heating module and a cooling module. The shelf unit U3 is arranged to face the coating module 23. The transfer arm A3 is provided between the coating module 23 and the shelf unit U3. In FIG. 4, reference numeral 24 denotes a transfer port for delivering the wafer W between each processing module and the transfer arm A3.

  The interface block S3 has an interface arm F as shown in FIG. The interface arm F is provided in the vicinity of the shelf unit U2 of the processing block S2. The wafer W is transferred by the interface arm F between the processing modules of the shelf unit U2 and between the exposure units S4.

  The wafer W from the carrier block S1 is sequentially transferred by the transfer means C to one transfer module of the shelf unit U1, for example, the transfer module CPL2 corresponding to the second block (BCT layer) B2. The wafer W transferred to the transfer module CPL2 is transferred to the transfer arm A2 of the second block (BCT layer) B2, and each processing module (coating module and heating / cooling system processing module group) is transferred via the transfer arm A2. Each processing module) performs processing in each processing module. Thereby, an antireflection film is formed on the wafer W.

  The wafer W on which the antireflection film is formed passes through the transfer arm A2, the transfer module BF2 of the shelf unit U1, the transfer arm D, and the transfer module CPL3 of the shelf unit U1, and the transfer arm A3 of the third block (COT layer) B3. Is passed on. Then, the wafer W is transferred to each processing module (each processing module in the processing module group of the coating module and the heating / cooling system) via the transfer arm A3, and processing is performed in each processing module. Thereby, a resist film is formed on the wafer W.

  The wafer W on which the resist film is formed is transferred to the transfer module BF3 of the shelf unit U1 via the transfer arm A3.

  The wafer W on which the resist film is formed may further have an antireflection film formed in the fourth block (TCT layer) B4. In this case, the wafer W is transferred to the transfer arm A4 of the fourth block (TCT layer) B4 via the transfer module CPL4, and each processing module (processing of the coating module and heating / cooling system) is transferred via the transfer arm A4. Each processing module in the module group is transported to and processed in each processing module. Thereby, an antireflection film is formed on the wafer W. Then, the wafer W on which the antireflection film is formed is transferred to the transfer module TRS4 of the shelf unit U1 via the transfer arm A4.

  The wafer W on which the resist film is formed or the wafer W on which the antireflection film is further formed on the resist film is transferred to the transfer module CPL11 via the transfer arm D, the transfer modules BF3, and TRS4. The wafer W transferred to the transfer module CPL11 is directly transferred to the transfer module CPL12 of the shelf unit U2 by the shuttle arm E, and then transferred to the interface arm F of the interface block S3.

  The wafer W delivered to the interface arm F is transported to the exposure apparatus S4, and a predetermined exposure process is performed. The wafer W that has undergone the predetermined exposure processing is placed on the delivery module TRS6 of the shelf unit U2 via the interface arm F, and returned to the processing block S2. The wafer W returned to the processing block S2 is subjected to development processing in the first block (DEV layer) B1. The developed wafer W is returned to the carrier 20 via the transfer arm A1, the transfer module of the shelf unit U1, and the transfer means C.

  Next, the transfer arms A1 to A4, which are substrate transfer apparatuses according to the present invention, will be described with reference to FIGS. Since the transfer arms A1 to A4 are similarly configured, the transfer arm A3 provided in the third block (COT layer) B3 will be described as a representative. FIG. 5 is a perspective view showing the transfer arm A3. FIG. 6 is a plan view and a side view showing the transfer arm A3.

  As shown in FIGS. 4 to 6, the transfer arm A <b> 3 includes two forks 3 (3 </ b> A, 3 </ b> B), a base 31, a rotation mechanism 32, advance / retreat mechanisms 33 </ b> A, 33 </ b> B, and an elevator base 34.

  The two forks 3A and 3B are provided so as to overlap each other. The base 31 is provided by a rotation mechanism 32 so as to be rotatable around the vertical axis. Further, the forks 3A and 3B are respectively supported on the base end sides by the advance / retreat mechanisms 33A and 33B, and are moved from the base 31 to, for example, push-up pins 73 of the heating module 7 described later by the advance / retreat mechanisms 33A and 33B. It is provided to freely advance and retreat.

  The forks 3 (3A, 3B) correspond to the holding frame in the present invention.

  The advance / retreat mechanisms 33A, 33B are connected to a motor M, which is a drive mechanism provided inside the base 31, using a transmission mechanism such as a timing belt, and drives the forks 3A, 3B to advance and retract. As the transmission mechanism, a known configuration such as a ball screw mechanism or a mechanism using a timing belt can be used.

  The advance / retreat mechanisms 33A and 33B correspond to drive units in the present invention. Further, in FIG. 12 described later, the drive mechanism 33 of the advance / retreat mechanism 33 </ b> A is illustrated below the base 31. The advance / retreat mechanism 33A rotates the drive mechanism 33 provided in the base 31 by the motor M, thereby driving the forks 3A, 3B from the base 31 to, for example, a push-up pin 73 of the heating module 7 described later. It is configured as follows. The motor M is connected to the encoder 38. In FIG. 12, 39 is a counter for counting the number of pulses of the encoder 38.

  As shown in FIG. 4, the lifting platform 34 is provided below the rotation mechanism 32. The elevating table 34 is provided so as to be movable up and down by an elevating mechanism along a Z-axis guide rail (not shown) extending linearly in the vertical direction (Z-axis direction in FIG. 4). As the elevating mechanism, a known configuration such as a ball screw mechanism or a mechanism using a timing belt can be used. In this example, the Z-axis guide rail and the elevating mechanism are each covered by a cover body 35, and are connected and integrated, for example, on the upper side. The cover body 35 is configured to slide along a Y-axis guide rail 36 that extends linearly in the Y-axis direction.

  Next, the proximity sensor 4 provided on the fork 3, the holding claw 30, and the holding claw 30 will be described with reference to FIGS. In the following, the forks 3A and 3B will be described as a representative example of the forks 3A, but the forks 3B can be configured in exactly the same way as the forks 3A.

  The proximity sensor 4 corresponds to a detection unit in the present invention.

  FIG. 7 is an enlarged plan view showing the fork 3A. FIG. 8 is an enlarged cross-sectional view of the fork 3A. FIG. 8 is a cross-sectional view taken along line AA in FIG. FIG. 8 shows two holding claws and two proximity sensors among the four holding claws 30 and the four proximity sensors 4. 9A and 9B are a plan view and a cross-sectional view showing the fork 3A and the wafer W when the wafer W is normally placed on the holding claw 30, respectively. FIG.9 (b) is sectional drawing which follows the AA line in Fig.9 (a). 10A and 10B are a plan view and a cross-sectional view showing the fork 3A and the wafer W when the wafer W is not normally placed on the holding claw 30, respectively. FIG.10 (b) is sectional drawing which follows the AA line in Fig.10 (a). FIG. 11 is a plan view showing the fork 3 </ b> A and the wafer W in another example when the wafer W is not normally placed on the holding claw 30. 7 to 11, the holding claws 30 and the proximity sensor 4 are shown slightly enlarged with respect to the fork 3A for easy illustration.

  As shown in FIGS. 7 and 8, the fork 3A is formed in an arc shape and is provided so as to surround the periphery of the substrate to be transported. Further, as shown in FIGS. 5 and 6, holding claws 30 are formed on the forks 3 </ b> A and 3 </ b> B, respectively. The holding claws 30 protrude inward from the inner edges of the forks 3A and 3B, and are spaced from each other along the inner edges, and hold the wafer W by placing the peripheral edge of the wafer W thereon. Is. Three or more holding claws 30 are provided. In the example shown in FIGS. 5 and 6, four holding claws 30 </ b> A, 30 </ b> B, 30 </ b> C, and 30 </ b> D are provided in order to hold the four peripheral portions of the wafer W.

  Each of the holding claws 30A to 30D is provided with proximity sensors 4A, 4B, 4C, and 4D for detecting the wafer W that is a detection target when the wafer W is placed on the holding claws 30A to 30D. Yes. In the example illustrated in FIGS. 7 and 8, capacitive proximity sensors (hereinafter simply referred to as “capacitance sensors”) are used as the proximity sensors 4 </ b> A to 4 </ b> D.

  As shown in FIG. 8, the capacitance sensors 4A, 4B, 4C, and 4D are electrically connected to the capacitance measuring units 41A, 41B, 41C, and 41D, respectively, and the capacitance sensors 4A to 4D are used. The detected change in capacitance is configured to change and output a predetermined electric signal, for example, a large voltage signal in accordance with an increase in capacitance, by these capacitance measuring units 41A to 41D. When the wafer W is not placed on the capacitance sensors 4A to 4D, the capacitance (output) detected by the capacitance sensors 4A to 4D is substantially zero. Further, the capacitance (output) detected by the capacitance sensors 4A to 4D when the wafer W is placed on the capacitance sensors 4A to 4D is the wafer W on the capacitance sensors 4A to 4D. Is larger than the capacitance (output) detected by the capacitance sensors 4A to 4D when the is not mounted. Further, as indicated by the dotted lines in FIG. 8, the capacitance (output) detected by the capacitance sensors 4A to 4D when the distance between the capacitance sensors 4A to 4D and the wafer W is larger than the normal state. ) Is larger than the electrostatic capacity (output) when the wafer W is not placed at all, but smaller than the electrostatic capacity (output) when the wafer W is placed in a normal state.

  The outputs of the capacitance measuring units 41A, 41B, 41C, and 41D are configured to be input to the comparison units 42A, 42B, 42C, and 42D. And the output of the comparison parts 42A, 42B, 42C, 42D is comprised so that it may input into the control part 5 mentioned later. The comparison units 42A to 42D compare the outputs of the capacitance measurement units 41A to 41D with preset lower limit values.

  In the present embodiment, a first lower limit value and a second lower limit value that is larger than the first lower limit value are used as the lower limit value.

  The first lower limit value is a value close to approximately 0, and when the wafer W is not held by the holding claws 30A to 30D provided with the capacitance sensors 4A to 4D, the capacitance measuring units 41A to 41A. The value of 41D is set as a value that is smaller than the first lower limit value.

  The second lower limit value is a value larger than the first lower limit value. Further, the second lower limit value is such that when the wafer W is normally placed on the holding claws 30A to 30D, the outputs of the capacitance measuring units 41A to 41D are larger than the second lower limit value. It is set as a value. When the outputs of the capacitance measuring units 41A to 41D are smaller than the second lower limit value, the wafer W is not normally placed on the holding claws 30A to 30D, that is, the relative of the wafer W to the fork 3A. This is when the position deviates from the normal position. At this time, as described later, the wafer W is returned from the fork 3A to the push-up pin or mounting table of each processing module corresponding to the substrate mounting portion in the present invention, and after correcting the position of the fork 3A, The wafer W is received by the fork 3A from the push-up pin or mounting table of each processing module.

  The comparison units 42A to 42D are configured to perform comparison processing as follows, for example. That is, the comparison units 42 </ b> A to 42 </ b> D generate a placement signal for the control unit 5 when the outputs of the capacitance measurement units 41 </ b> A to 41 </ b> D are greater than the second lower limit value. Further, the comparison units 42A to 42D generate a warning signal to the control unit 5 when the outputs of the capacitance measurement units 41A to 41D are smaller than the first lower limit value. Further, when the outputs of the capacitance measuring units 41A to 41D are larger than the first lower limit value and smaller than the second lower limit value, the comparison units 42A to 42D do not generate any placement signal or warning signal.

  First, as shown in FIGS. 9A and 9B, a case where the wafer W is normally placed on the holding claws 30A to 30D will be described. In such a case, the outputs of all the capacitance measuring units 41 </ b> A to 41 </ b> D become larger than the second lower limit value, and all of the comparison units 42 </ b> A to 42 </ b> D output placement signals to the control unit 5. . Then, the control unit 5 to which the placement signals are input from all the comparison units 42A to 42D corrects the relative position of the wafer W with respect to the fork 3A because the wafer W is normally placed on the holding claws 30A to 30D. Determine that it is not necessary. The control unit 5 that determines that the correction is not necessary controls the advance / retreat mechanism 33A and the lifting platform 34, and drives the fork 3A to transport the wafer W.

  Next, as shown in FIGS. 10A, 10B, and 11, a case where the wafer W is not normally placed on the holding claws 30A to 30D will be described. FIGS. 10A and 10B show a case where the wafer W is displaced in the Y direction substantially orthogonal to the X direction, which is the forward and backward direction of the fork 3A. FIG. 11 shows the wafer W of the fork 3A. It shows the time when it is shifted in the X direction, which is the forward / backward direction. In such a case, in any of the capacitance measuring units 41A to 41D, the output becomes smaller than the second lower limit value, and any of the comparing units 42A to 42D sends a placement signal to the control unit 5. Is not output. The control unit 5 to which no placement signal is input from any of the comparison units 42A to 42D corrects the relative position of the wafer W with respect to the fork 3A because the wafer W is not normally placed on the holding claws 30A to 30D. It is determined that there is a need for The control unit 5 that determines that correction is necessary controls the advance / retreat mechanism 33A and the lift table 34, and returns the wafer W from the holding claws 30A to 30D of the fork 3A to the push-up pins or mounting tables of each processing module. The position of 3A is corrected. And after correction | amendment, the wafer W is again received by the holding nail | claw 30A-30D of the fork 3A from the push-up pin or mounting base of each module.

  Furthermore, when the position of the wafer W is considerably deviated from the normal position, or when the wafer W is not placed on any of the holding claws 30A to 30D, any one of the capacitance measuring units 41A to 41D. The output is further smaller than the first lower limit value, which is smaller than the second lower limit value. At this time, the comparison units 42A to 42D corresponding to the capacitance measurement units 41A to 41D generate warning signals. When the warning signal is input from any of the comparison units 42A to 42D, the control unit 5 has either the position of the wafer W significantly deviated from the normal position, or the wafer W is one of the holding claws 30A to 30D. The fork 3A stops moving.

  Next, the control unit 5 that controls the delivery of the wafer W between the transfer arm and the processing module will be described with reference to FIG.

  Hereinafter, the heating module 7 will be described as an example of a processing module in which the transfer arm delivers the wafer W, including the description of the substrate transfer method. As described with reference to FIGS. 3 and 4, the heating module 7 includes the first block (DEV layer) B1, the second block (BCT layer) B2, the third block (COT layer) B3, Each of the fourth blocks (TCT layers) B4 is incorporated in the shelf unit U3.

  FIG. 12 is a configuration diagram showing the control unit 5 together with the transfer arm A3 and the heating module 7 in the third block (COT layer) B3.

  As shown in FIG. 12, the heating module 7 includes a processing container 71, a hot plate 72, a push-up pin 73, and an elevating mechanism 74. The heating module 7 performs heat treatment on the wafer W. A heat plate 72 is provided in the processing container 71. The hot plate 72 is provided with push-up pins 73. The elevating mechanism 74 is for elevating the push-up pin 73. The push-up pin 73 corresponds to the substrate mounting portion in the present invention. In FIG. 12, reference numeral 70 denotes a transfer port for the wafer W.

  The control unit 5 includes an arithmetic processing unit 51, a storage unit 52, a display unit 53, and an alarm generation unit 54.

  The arithmetic processing unit 51 is a computer which is a data processing unit having, for example, a memory and a CPU (Central Processing Unit). The arithmetic processing unit 51 reads a program recorded in the storage unit 52 and sends a control signal to each part of the resist pattern forming apparatus in accordance with an instruction (command) included in the program, thereby various substrates included in the resist pattern forming process. Execute the process. Specifically, the arithmetic processing unit 51 sends a predetermined control signal to the motor M, the encoder 38, the counter 39, and the like provided in the drive mechanism 33 of the advance / retreat mechanism 33A, 33B of the transfer arm A3, and the wafer W Perform delivery and transport.

  The storage unit 52 is a computer-readable recording medium that records a program for causing the arithmetic processing unit 51 to execute various processes. As the recording medium, for example, a flexible disk, a compact disk, a hard disk, a magneto-optical (MO) disk, or the like can be used.

  The display unit 53 is composed of a computer screen, for example. The display unit 53 can select various substrate processes and input parameters in each substrate process.

  The alarm generation unit 54 generates an alarm when an abnormality occurs in each part of the resist pattern forming apparatus including the transfer arm A3.

  Next, with reference to FIG. 12 to FIG. 14, the substrate transfer method according to the present embodiment will be described by exemplifying steps when the fork 3A of the transfer arm A3 receives the wafer W from the heating module 7. FIG. 13 is a flowchart showing the procedure of each step in the substrate carrying method. FIG. 14 is a diagram illustrating a state of the heating module 7 and the transfer arm A3 when the wafer W is delivered.

  In the substrate transfer method according to the present embodiment, when the control unit 5 advances the fork 3A by the advance / retreat mechanism 33A and receives the wafer W from the push-up pins 73 to the holding claws 30A to 30D, the capacitance sensors 4A to 4A. The relative position of the wafer W with respect to the fork 3A is detected by 4D, and whether or not the relative position needs to be corrected is determined based on the detection values of the electrostatic capacitance sensors 4A to 4D. When it is determined that the relative position needs to be corrected, a correction operation is performed. When it is determined that the relative position is not required to be corrected, the driving of the advance / retreat mechanism 33A is stopped, or the wafer W is continuously transferred. is there.

  As shown in FIG. 13, the substrate transport method includes a receiving process (step S11), a detecting process (step S12), a determining process (step S13, step S14), a correcting process (step S15), an unloading process (step S16), And a stop step (step S17).

  In the receiving step (step S11), as shown in FIG. 14A, the heating module 7 pushes up the wafer W by the push-up pins 73, and raises the wafer W to a position above the hot plate 72. Next, as shown in FIG. 14B, the fork 3 </ b> A is advanced from the outside of the heating module 7 to the lower side of the wafer W by the advance / retreat mechanism 33 </ b> A controlled by the control unit 5. And as shown in FIG.14 (c), by raising the fork 3A with the raising / lowering stand 34 controlled by the control part 5, and holding the wafer W up from the lower side, it is made to hold | maintain on the holding claws 30A-30D. The wafer W is received from the push-up pins 73 to the holding claws 30A to 30D of the fork 3A.

  Next, in the detection step (step S12), when the wafers W are received by the holding claws 30A to 30D, the static claws provided on the holding claws 30A to 30D are held in a state where the wafers W are held by the holding claws 30A to 30D. The capacitances (outputs) of the capacitance sensors 4A to 4D are detected.

  In the control unit 5, the comparison units 42 </ b> A to 42 </ b> D compare the capacitance (output) that is the detection value of the capacitance sensors 4 </ b> A to 4 </ b> D with the first lower limit value and the second lower limit value. When the capacitance (output) is smaller than the first lower limit value, warning signals are output from the comparison units 42A to 42D. When the capacitance (output) is larger than the second lower limit value, placement signals are output from the comparison units 42A to 42D. Further, when the capacitance (output) is larger than the first lower limit value and smaller than the second lower limit value, neither the placement signal nor the warning signal is output from the comparison units 42A to 42D.

  Next, in the determination step (step S13, step S14), the control unit 5 has presence / absence of placement signals and warning signals output from the four comparison units 42A to 42D corresponding to the four capacitance sensors 4A to 4D. Based on the above, it is determined whether or not the relative position of the wafer W with respect to the fork 3A is normal, and it is determined whether the relative position needs to be corrected. That is, the control unit 5 determines whether or not the relative position needs to be corrected based on the capacitance (output) that is a detection value of the four capacitance sensors 4A to 4D.

  In step S13, it is determined whether a warning signal is output from any of the four comparison units 42A to 42D.

  When a warning signal is output from any of the four comparison units 42A to 42D, the process proceeds to the stop step (step S17). In the stop process (step S17), the transfer arm A3 is prohibited from retreating to the retreat position as shown in FIGS. 14D and 14E, and the wafer W is received in the heating module 7. The drive is stopped. When the driving of the transfer arm A3 is stopped, the operator identifies the cause of the abnormality in the position of the wafer W, performs recovery processing, maintenance, and the like.

  On the other hand, when no warning signal is output from any of the four comparison units 42A to 42D, the process proceeds to step S14. In step S14, it is determined whether placement signals are output from all the comparison units 42A to 42D.

  When the placement signals are output from all the comparison units 42A to 42D, it is determined that the position of the wafer W is normal, and correction of the relative position of the wafer W with respect to the fork 3A is not necessary, and the unloading process (step S16). ) In the carry-out process (step S16), as shown in FIGS. 14D and 14E, the push-up pin 73 is lowered and the fork 3A is moved backward, so that the holding claws 30A to 30A of the fork 3A are moved from the push-up pin 73. Deliver wafer W to 30D. Then, after the fork 3A is retracted, the held wafer W is moved to the next transfer destination.

  On the other hand, when the placement signal is not output from any of the comparison units 42A to 42D, the position of the wafer W is not deviated enough to output a warning signal, but is shifted by a certain amount of shift. It is determined that the relative position of the wafer W with respect to 3A needs to be corrected. At this time, the process proceeds to the correction step (step S15).

  In the correction step (step S15), the fork 3A is lowered by the lifting platform 34 controlled by the controller 5, and the wafer W is returned from the holding claws 30A to 30D to the push-up pins 73. As a result, the state shown in FIG. Then, the fork 3 </ b> A is moved backward from the lower side of the wafer W to the outside of the heating module 7 by the advance / retreat mechanism 33 </ b> A controlled by the control unit 5. As a result, the state shown in FIG. Then, the position of the fork 3A is corrected outside the heating module 7 so as to compensate for the positional deviation of the wafer W.

  For example, among the four capacitance sensors, the capacitance (output) of 4A and 4B is larger than the second lower limit value, but the capacitance (output) of 4C and 4D is smaller than the second lower limit value. At this time, as shown in FIG. 10, it is considered that the position of the wafer W has shifted by a certain shift amount in the -Y direction. Further, the amount of deviation can be calculated based on the difference between the 4A and 4B capacitance (output) and the second lower limit value. This is because the capacitance (output) of the capacitance sensor depends on the area of the surface of the capacitance sensor that is covered with the object to be detected. Therefore, based on the capacitance (output) of the capacitance sensor, it is possible to calculate the area of the region covered with the wafer W among the upper surfaces of the holding claws 30A to 30D. Then, the position of the fork 3A is corrected so that the calculated shift amount in the -Y direction is compensated, that is, canceled.

  Or, for example, among the four capacitance sensors, the capacitance (output) of 4A and 4D is larger than the second lower limit value, but the capacitance (output) of 4B and 4C is the second lower limit value. When it is smaller, it is considered that the position of the wafer W has shifted by a certain shift amount in the −X direction as shown in FIG. The amount of deviation can be calculated based on the difference between the 4B and 4C capacitances (outputs) and the second lower limit value, as in the case described with reference to FIG. Then, the position of the fork 3A is corrected so as to compensate, that is, cancel, the calculated shift amount in the −X direction.

  After correcting the deviation amount of the fork 3A in this way, the process returns to the receiving step (step S11). In the receiving step (step S11), as shown in FIG. 14B, the position of the fork 3A is again moved from the outside of the heating module 7 by the advance / retreat mechanism 33A controlled by the control unit 5. Advance downward. And as shown in FIG.14 (c), the fork 3A is raised by the raising / lowering base 34 controlled by the control part 5, and the holding claws 30A-30D hold | maintain so that the wafer W may be scooped up from the downward side. Then, after the wafer W is held by the holding claws 30A to 30D, the detection process (step S12) and the determination process (step S13, step S14) are performed again.

  In the detection step (step S12), the capacitances (outputs) of the capacitance sensors 4A to 4D provided on the holding claws 30A to 30D are detected again. In step S13, no warning signal is output from any of the four comparison units 42A to 42D, and in step S14, when mounting signals are output from all the comparison units 42A to 42D, the wafer is It determines with the position of W being normal, and progresses to a carrying-out process (step S16).

  In the present embodiment, the relative position of the wafer W held by the holding claws 30A to 30D with respect to the fork 3A is displaced from the normal position by the determination process (step S13, step S14) and the correction process (step S15). Can be easily detected. In addition, when the relative position of the wafer W with respect to the fork 3A is shifted from the normal position, the relative position of the wafer W with respect to the fork 3A without dropping the wafer W or making contact with other portions of the processing module. It can be held again so that the position becomes a normal position.

  Further, by stopping the driving of the transfer arm A3 when a warning signal is output from any of the comparison units 42A to 42D, the wafer W that has not been placed in a normal state is being retreated by the fork 3A. It can be prevented that the wafer W falls or the dropped wafer W collides with the transfer arm A3. Even if there is an abnormality in the position of the wafer W, it is sufficient to perform a response to return the position of the wafer W to a normal position, and the processing can be resumed promptly after the response.

  That is, according to the present embodiment, appropriate transfer control can be performed according to the holding state of the wafer W on the fork 3A.

  Further, when the wafer W is received from the push-up pin 73 to the holding claws 30A to 30D of the fork 3A, it is determined whether or not the relative position of the wafer W with respect to the fork 3A is normal. Stop. Therefore, when there is a problem such as damage of the wafer W in the processing module, the state at the time of the problem can be observed as it is, and the state in the fork 3A and the processing module immediately after the problem occurs can be observed. Easy to confirm. Therefore, it is easy to identify whether the defect is caused by the processing module or the defect is caused by the transfer operation of the wafer W, and the reoccurrence of the defect can be easily prevented.

  In the present embodiment, an example in which not only the advance / retreat mechanism 33A but also the lifting platform 34 is driven in the reception process (step S11) and the correction process (step S15) has been described. However, the wafer W is transferred between the holding claws 30 </ b> A to 30 </ b> D of the fork 3 </ b> A by driving the lifting mechanism 74 of the heating module 7 and moving the push-up pins 73 up and down without driving the lifting platform 34. Also good.

  In the present embodiment, after the wafer W is returned to the push-up pin 73, the fork 3A is retracted from the heating module 7, the amount of deviation of the fork 3A is corrected outside the heating module 7, and the fork 3A is heated again. The example in which the module 7 is advanced and the wafer W is received by the fork 3A from the push-up pins 73 has been described. However, when the correction amount is relatively small, there is no possibility that the fork 3A contacts the wafer W or other portions in the heating module 7. At this time, the wafer W is returned from the holding claws 30 </ b> A to 30 </ b> D of the fork 3 </ b> A to the push pin 73, and the fork 3 </ b> A is advanced into the heating module 7 to correct the deviation amount of the fork 3 </ b> A in the heating module 7. After that, the wafer W may be received again from the push-up pins 73 to the holding claws 30A to 30D of the fork 3A.

  Further, when a capacitance sensor is used as the proximity sensors 4A to 4D, the detected capacitance (output) depends on the dielectric constant of the object to be detected. That is, even if the wafers W have the same shape, the detected capacitance (output) changes depending on various materials such as silicon, glass, sapphire, and aluminum.

  Therefore, according to the present embodiment, the type (material) of the wafer W can be detected by the capacitance sensors 4A to 4D. Then, the moving speed of the fork 3A is changed according to the type (material) of the wafer W. Thereby, for example, the manufacturing process adjusted for each wafer W so that the cost increase due to the loss when the wafer W falls from the fork 3A and is damaged and the cost reduction due to the shortening of the process time (tact time) is optimized. It can be performed.

  Alternatively, when processing a plurality of types (materials) of wafers W, processing parameters for processing the wafers W may differ depending on the types (materials) of the wafers W. According to the present embodiment, since the type (material) of the wafer W can be detected, the processing parameters can be automatically changed according to the detected type (material) of the wafer W. Thus, even when processing a plurality of types (materials) of wafers W, the same substrate processing apparatus can perform the processing, and there is no need to prepare a plurality of substrate processing apparatuses.

  Further, when a capacitance sensor is used as the proximity sensors 4A to 4D, the detected capacitance (output) also depends on the charged state of the object to be detected. Accordingly, the proximity sensors 4A to 4D may detect the charging of the wafer W and generate an alarm.

  Further, as the proximity sensors 4A to 4D, strain gauges may be used instead of the capacitance sensors. Moreover, the modification using various other proximity switches, such as a photoelectric sensor, a contact sensor, and a magnetic sensor, is also possible. Such a modification will be described with reference to FIG. FIG. 15 is an enlarged plan view showing the fork 3A of the transfer arm according to this modification. As in FIG. 7, also in FIG. 15, the holding claws 30 </ b> A to 30 </ b> D and the proximity switches 4 </ b> A to 4 </ b> D are slightly enlarged with respect to the fork 3 </ b> A for easy illustration.

  As shown in FIG. 15, a plurality of proximity switches 4 </ b> A to 4 </ b> D are provided in the holding claws 30 </ b> A to 30 </ b> D along the radial direction of the held wafer W. Then, based on detection values detected by a plurality of proximity switches 4A to 4D provided along the radial direction of the wafer W, it is determined whether or not it is necessary to correct the relative position of the wafer W with respect to the fork 3A.

  Specifically, among the plurality of proximity switches 4A to 4D provided on the holding claws 30A to 30D, the number of proximity switches 4A to 4D whose detection value is smaller than a predetermined lower limit value is larger than a preset number. Sometimes it is determined that the relative position needs to be corrected.

  In the example shown in FIG. 15, for example, four proximity switches 4 </ b> A to 4 </ b> D are provided in one holding claw 30 </ b> A to 30 </ b> D along the radial direction of the wafer W. Then, the ON value is set when the detected value is larger than the predetermined lower limit value, and the OFF value is set when the detected value is smaller than the lower limit value. Then, when the number of proximity switches that output the OFF value is larger than two of the four, for example, a preset number, it is determined that the relative position needs to be corrected.

  Unlike the capacitance sensor described above, the proximity switch detects the output of the proximity switch that changes between the ON value and the OFF value depending on whether the surface of the proximity switch is covered with the detection object. It is. Therefore, of the upper surface of the holding claws 30A to 30D, the region of the upper surface of the holding claws 30A to 30D that is covered with the wafer W is determined based on how many proximity switches are covered with the wafer W. The area can be calculated.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to such specific embodiments, and is within the scope of the present invention described in the claims of the utility model registration. Various modifications and changes are possible.

3, 3A, 3B fork (holding frame)
30, 30A-30D Holding claw (holding part)
33, 33A, 33B Advancement / retraction mechanism (drive unit)
4, 4A, 4B, 4C, 4D Capacitance sensor (detection unit)
5 Control part 73 Substrate placing part

Claims (4)

In the substrate transfer apparatus for receiving the substrate from the substrate mounting portion on which the substrate is mounted and transferring the received substrate,
A holding frame that is provided so as to surround a substrate to be transported, and is movable forward and backward to the substrate mounting portion;
A drive unit for driving the holding frame forward and backward with respect to the substrate mounting unit;
Three or more holding parts that are provided at intervals along the inner edge of the holding frame and hold the substrate by placing the peripheral edge of the substrate,
A detection unit that is provided in the holding unit and detects that the substrate is placed;
The detection unit detects the mounted substrate using a capacitive proximity sensor.
A substrate transfer apparatus.   The substrate transfer apparatus according to claim 1, wherein the holding unit includes a plurality of the detection units. The detection unit detects a relative position of the substrate with respect to the holding frame;
Based on the detection value of each detection unit, it is determined whether or not the relative position needs to be corrected. When it is determined that the relative position needs to be corrected, a correction operation is performed and it is determined that the relative position is not required When this is done, the drive of the drive unit is stopped or the conveyance of the substrate is continued.
The substrate transfer apparatus according to claim 1, wherein: The drive unit advances the holding frame;
When the substrate is received from the substrate placement unit to the holding unit, if the detection unit determines that any of the holding units does not place the substrate, the driving of the driving unit is stopped.
The substrate transfer apparatus according to claim 1, wherein:

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