JP3180715U - Learning materials that do not require soldering and can achieve component placement according to the circuit diagram - Google Patents

Abstract

An electronic circuit learning material that does not use a breadboard, does not require soldering work, and can realize component placement according to a circuit diagram.
By connecting a conductor between pins on the bottom surface of a pin socket 13, the pin sockets are connected, an electronic component is inserted into the pin socket 13, and an electronic module corresponding to the electronic component is used as shown in the circuit diagram. By connecting the pin sockets with jumper wires, the layout and wiring as shown in the circuit diagram is realized.
[Selection] Figure 1

Description

  The present invention relates to a wiring system for electronic components used for experiments and learning of electronic circuits.

In order to improve scientific ability, electronic device kits that combine various electronic components are on the market.
On the other hand, the number of volunteers responsible for education is also increasing. However, in order to experiment and learn electronic devices, there are many cases that require soldering work, and it is difficult to perform the rework necessary for work. In addition, there is a demand for a system in which components and wiring can be arranged at positions corresponding to the circuit diagram. Currently, a wiring board (hereinafter referred to as a breadboard) connected inside is used. The breadboard has the advantage that the number of wirings is small, but the already wired part cannot be visually confirmed, and the wiring route and component arrangement are limited and not as per the circuit diagram. For this reason, learning materials that can be arranged and wired according to the circuit diagram at low cost, which improve the creativity of the learner and the learning of the electronic circuit, are desired.

Utility model registration number 3009036

Electronic work is easy to understand for learning if the circuit diagram matches the circuit components and wiring layout of the circuit. The task of examining the circuit and following the wiring in trial and error is disrupted in thinking and hinders the creation of a new circuit. Patent Document 1 “Experimental board kit for learning and learning a circuit of a transistor for a short time” is disclosed, but it is necessary to solder a socket in advance, which requires a prior cost. Patent Document 2 “Electronic Circuit Learning Template” is a method that does not require soldering. However, since a breadboard is used, there is a problem that wiring does not follow the circuit diagram. In addition, there is a method to configure the circuit without wiring, by modularizing the electronic component, but it is not the same electronic component arrangement and wiring as the circuit diagram, or because the electronic component is put in a block and solder wiring is done It is expensive and the types of electronic components are also limited. This method devised a new modularization method with electronic components mounted, and without using a breadboard, soldering work is unnecessary and wiring according to the circuit diagram is realized.
When the problems are listed, 1) the operation of the circuit can be easily understood, 2) the function of the electronic component is easy to understand, 3) the change of the component is easy, and the point of signal measurement can be easily understood.
In order to realize the above, 1) component arrangement and wiring according to the circuit diagram, 2) modularization of electronic components, 3) easy to obtain components and low cost, 4) downsizing that can be stored in a small box, etc. It is necessary to realize.

In order to eliminate the need for soldering and modularization, a pin socket that does not require soldering is used, and a small capsule system that inserts electronic components into the pin socket is adopted. This method can be realized by a method in which a large number of pin sockets 13 connected to each other and sold at low cost are cut, and a conductor is fitted on the pin side of the pin socket to perform a cross connection. Hereinafter, the socket side is referred to as a socket capsule, and the entire electronic component mounted is referred to as an electronic capsule. Electronic capsules are arranged according to the circuit diagram, and each electronic capsule is wired with a jumper wire. In this case, about 2 to 4 sockets are connected to the socket of the electronic capsule, so that electronic components can be connected by inserting a jumper wire into the socket. In the case of two sockets, the pins of the pin socket are bent and brought into contact with the opposing pins for connection.

According to this method, the electronic component is modularized as an electronic capsule, and the components can be arranged according to the circuit diagram. The connection between each electronic capsule can be provided with a learning material suitable for wiring according to an electronic circuit by connecting with a jumper wire using a socket connected by a conductor on the back surface of the pin socket, and without soldering. .

The figure which shows the arrangement and connection of electronic parts of learning materials Electronic circuit diagram of learning materials Figure showing an example of the appearance of a 3-terminal component mounted on an electronic socket and the connection of the bottom Diagram showing how to make an electronic socket Figure showing a connection example of an electronic socket A figure showing an example of an electronic capsule corresponding to each circuit component (a figure in which both the socket side and the pin side connection of the component mounting are displayed in an overlapping manner) Figure showing the conductor and pin with the socket pin groove cut out in advance A diagram showing the method of fitting by drilling holes according to the pin dimensions Diagram showing the method of fitting the connection board with socket

FIG. 1 shows the arrangement and connection of electronic parts of a learning material. Here, an electronic circuit that produces sound using a melody IC that fits in a small box (small melody box) will be described as an example. 2 is a schematic wiring diagram of an electronic circuit disposed on the universal substrate 11. FIG. 2 shows an electronic circuit diagram of the learning material. This circuit shows a circuit example in which a battery 21 is used as a power source, a signal from a melody IC 24 is amplified by a transistor 26, and a speaker 27 is driven. These used parts are collectively referred to as an electronic part 20. If FIG. 1 and FIG. 2 are made to correspond, it will be understood that the arrangement and connection relationship are easy to understand. This circuit is the basic form, and the expected learning effect is to consider what kind of characteristics it will have when it is conceived and changed. Changing the resistance value, changing the characteristics when the light-emitting diodes are reversely connected, etc. can be considered as a basis for the first time when the circuit diagram and the actual experimental device are consistent. By the way, even if the light-emitting diodes are reversely connected, the light-emitting diode has the characteristic of being lit. This is because the energy of the speaker coil is regenerated because the melody signal is a rectangular wave, and the current flows in the opposite direction. Corresponding to the circuit diagram to such an extent that it can be thought only by actually looking at the actual wiring, the thinking of the cause investigation comes to work.

FIG. 3 shows an example of an external appearance in which a three-terminal component is mounted on an electronic socket, and connection of the bottom surface.
FIG. 3- (1) shows a state in which a transistor is inserted into the pin socket 13. FIG. 3- (2) shows the connection state of the back surface. A square conductor 42 (FIG. 4) is pushed in and connected to each of the upper and lower four pins, and the central pin is connected to the adjacent pin. Since the pitch between the pins is 2.54 mm, the rectangular conductors 42 are connected by pressing a square cut with a thickness of 0.3 mm and a side of 3.5 mm against the edges of the pins. By connecting a rectangular conductor 42 to the pin side of the pin socket 13, connection between the pins is realized, and connection to the connection socket of the jumper wire 14 is also possible. The dimensions are adjusted according to the dimensions of the pins.
FIG. 4 shows a method for manufacturing an electronic socket. In the method of manufacturing the socket capsule, the long pin socket 13 is usually divided by the required number of sockets. A manufacturing method taking the socket capsule (5-2) of FIG. The conductor 42 has a thickness of 0.3 mm. Usually, since the conductor 42 uses a copper plate, if it is 0.2 mm, the waist is weak and may come off. Next, the details of the manufacturing procedure will be described. In the case of other conductive materials, the thickness is selected according to the contact state.

(1) A 0.3 mm conductor 41 is cut into a strip shape with a width of 3.5 mm. (2) Cut out a square of 3.5 mm with a nipper or the like. The cutting length is adjusted so that the edge of the pin of the socket and the edge of the conductor 42 bite.
(3) (4) Using tweezers, the conductor 42 is placed diagonally between the four pins. (5) Press the conductor 42 between the pins with a small flat-blade screwdriver. (6) One of the four pins is bent so that the conductor 42 does not come off. (7) Slightly cut one end of the center pin and bend it to the opposite pin side to bring the pins into contact. By this method, the edge of the pin and the edge of the conductor 42 are brought into contact with each other by the pressing pressure and connected.
Other socket capsules are manufactured in the same way. In order to prevent the conductor 42 from coming off and to improve the contact reliability, the reliability can be improved by bending and connecting the pins connected by the conductor 42 to the opposite pins.

FIG. 5 shows a connection example of the socket capsule. Typical types of socket capsule connection modules are shown in (3-1) to (11-1). (5-2) in FIG. 5 is the connection of the socket capsule for the transistor 26. The resistor 25 and the capacitor 23 can be used similarly. However, when there are few connection places, (3-1) can also be used. The switch 22 uses (5-2), and the battery 21 uses (11-1). Although there are various types of speakers 27 this time, (6-1) is used when using a small 12 mm. Socket capsules are limited in connection, and reducing the number of types is an important factor in terms of price and electronic component preparation. In the small box of the melody described above, there are 9 types (4), (5-2), 1 (5-3), 1 (6-1), 1 (11-1). It is feasible.
FIG. 6 shows an example of an electronic socket corresponding to each circuit component. It is the figure which displayed by overlapping both the connection of the socket side of the upper surface of component mounting, and the pin side of a bottom face so that the front-and-back positional relationship of the pin socket 13 might be easy to understand.
The left three types are examples of three-terminal electronic components, and the right three types are examples of two-terminal electronic components. Capacitor 23, melody IC 24, resistor 26, and transistor 26 are each inserted into a socket capsule to produce an electronic capsule. The battery 21 and the switch 22 are also inserted into a socket capsule to form a module. All of these use the socket capsule (5-2) in FIG.

The parts are arranged as shown in the circuit diagram. In this case, the universal substrate 11 having holes with a pitch of 2.54 mm is used so that positioning and changing are possible. Insert the pin into the through hole of the board and fix the position. According to the circuit diagram, the upper and lower sides are related to the power supply, and the electronic capsule is arranged. In this case, the position of the terminal displayed on the circuit diagram and the actual terminal position of the transistor 26 and the melody IC 24 are different. In the circuit diagram, the collector (C), the base (B), and the emitter (E) are usually from the top, but in an actual part, the base (B), the collector (C), and the emitter (E) are in this order. In order to clarify this difference, the connection relationship of the socket pins and the positions of B, C, and E are clearly indicated on the side surface of the electronic capsule by the connection diagram sheet 44. A connection diagram sheet 44 of FIG. 3 is attached to the side surface of the electronic capsule for easy understanding.

As an advanced method, FIG. 7 shows an example of the conductor 71 in which the groove of the socket pin is cut out in advance. Although the number of processing steps for the conductor 71 is increased, by cutting the conductor in accordance with the dimensions of the pin in advance, there is an effect of improving the contact reliability and making it difficult for the conductor 71 to come off the pin.
FIG. 7- (1) shows a cut state of the processed conductor 71, and FIG. 7- (2) shows a state where the processed conductor 71 is fitted into the pin. In this case as well, the effect of bending the pin to further improve the contact reliability and make it difficult to come off is the same as described above.
FIG. 8 shows a case where a hole is made in accordance with the pin size and the fitting method is used. Make holes in the conductor according to the dimensions of the pins, insert the pins, and connect the pins. Also in this case, a holed conductor 81 for connection between two pins and a connection between four pins are prepared and connected by being pushed into the pins. The punching-type conductor 81 shows an example of connection between four pins. It is also possible to change the number of holes depending on the number of pins to be connected.

The case where the present mass production efficiency is taken into account is shown in FIG.
In this case, a connection mode on the insulating substrate is formed, and a socket into which a pin is inserted is embedded in each mode. Free connection is possible by selecting a board corresponding to the connection of the electronic component and inserting it into the pin. FIG. 9- (1) shows an example of a combination of four pins (socket-type conductor 91) and two pins (socket-type conductor 92). FIG. 9- (2) shows an example in which a connection pattern often used is formed on a single substrate and used. According to this method, even if the pin arrangement of the transistor or IC is different from that of the circuit diagram, wiring according to the circuit diagram is possible by changing the connection mode.

11: Universal board 12: Mesh-like through hole 13 arranged on grid 13: Pin socket 14: Jumper wire 20: Collective name of electronic parts 21 to 28: Each electronic part 41: Conductor 42: Cut conductor 43: Pin 44 on the bottom side of the pin socket: Connection diagram sheet 61: 3-terminal IC electronic capsule 62: 3-terminal transistor electronic capsule 63: 3-terminal switch electronic capsule 64: 2-terminal resistance electronic capsule 65: 2-terminal capacitor Electronic capsule 66: Electronic capsule 71 of two-terminal light emitting diode 71: Processing conductor 81: Drilling type conductor 91: Socket type conductor (4-point connection)
92: Socket-type conductor (two-point connection)

Claims (5)

Cut the pin socket according to the circuit components, insert the conductor into the pins on the bottom side, fit the pins, connect the pins, connect the pin socket to the universal board, fix the position, and the pins An electronic circuit learning material characterized by eliminating the need for soldering work by connecting the sockets with jumper wires and using the same actual wiring as the layout of the circuit diagram.       2. The learning material for an electronic circuit according to claim 1, wherein the pins are bent and connected to the adjacent pins so that the pins can be connected without any conductor. In claim 1, the pin socket is inserted into the universal board with a pin for fixing the position, the pin socket is connected with a jumper wire, and the actual wiring is the same as the layout of the circuit diagram. A learning material for electronic circuits, which eliminates the need for soldering. 2. The learning material for electronic circuit according to claim 1, wherein the conductor is aligned with the pin and the cutting process is performed in advance to increase the contact area, thereby increasing the contact area and the contact pressure. 2. The socket-type wiring board in which the conductor is preliminarily mode-wired, means for connecting the socket-type wiring board to the pins and connecting the pins, and the pin socket with the pins inserted into the universal board. Electronic circuit learning materials characterized by eliminating the need for soldering work by means of fixing the position with the pins, means for connecting the pin sockets with jumper wires, and using the same actual wiring as the layout of the circuit diagram .

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