JP3179892B2 - Laser processing apparatus and laser processing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to relates to lasers machining apparatus and a laser machining method Ru can control the direction in which sputtered by laser machining are scattered.

[0002]

2. Description of the Related Art As processing using laser light, processing such as cutting, drilling, and welding is used in various fields of machinery, electronics, and semiconductors. In particular, high-precision cutting of a thin plate by a laser processing apparatus is widely used.

[0003] Processing by a conventional laser processing apparatus will be described. In conventional general laser processing equipment,
Laser light provided from a laser oscillator is guided in the direction of the work, and is sufficiently condensed by a condensing lens so as to have a required heat energy density that can be processed on the processing surface of the work. The workpiece is irradiated from the tip of the disposed laser processing gas nozzle (hereinafter, sometimes simply referred to as a gas nozzle). The assist gas supplied to the laser beam irradiator is coaxially blown out from the tip of the gas nozzle together with the laser beam.

In drilling and cutting with such a laser processing apparatus, first, the positional relationship in the vertical direction is adjusted so that the focal point of the condenser lens is positioned on the processing surface of the work, and then the assist gas is used. While supplying the laser beam, the laser oscillator is oscillated to irradiate the workpiece with laser light. This laser light is focused until it has a sufficient heat energy density as described above, and this serves as a heat source to melt the surface of the work, and this melting proceeds sequentially from the surface in the depth direction and eventually penetrates. And a hole is drilled.
When cutting is performed, the work is moved in a horizontal plane while the laser light is being irradiated as described above, and the irradiation position of the laser light on the work is moved along a predetermined trajectory.
The vertical movement of the work, the movement in the horizontal plane, and the oscillation of the laser oscillator are automatically or manually controlled by the controller.

[0005] As prior art relating to gas nozzle for use in a laser machining apparatus as described above, JP 51
As described in JP-A-147446 , the tip of the gas nozzle has a double structure, and an inert gas is blown out so as to surround the active gas blown out to the center, and the cutting speed by laser light and dimensional accuracy at the time of cutting are performed. There is something to improve.

[0006]

The laser processing is performed by melting the surface of the work by the thermal energy given by the laser beam, and using this as a heat source to sequentially advance the molten portion in the depth direction. However, there is a problem that the molten metal of the molten work is scattered as spatter. For example, when drilling is performed by a laser beam, the molten material becomes a sputter 90 as shown in FIG.
Radially scattered around the surface of the work 92 around the processed hole 91, the surface cleanliness of the whole work 92 is deteriorated, and the quality thereof is remarkably deteriorated. Further, when a plurality of holes are drilled, spatters may scatter into the previously drilled holes, thereby closing the previously drilled holes.

[0007] With respect to such a problem, no consideration has been given to the aforementioned conventional laser processing apparatus. Further, even if the nozzle is improved as described in JP-A-51-147446, this problem cannot be solved.

An object of the present invention has been made in view of the above problems, and limit scattering range of sputtering by laser processing, and by controlling the orientation of the scattering, Ru can improve the quality after work machining rate It is an object of the present invention to provide a processing apparatus and a laser processing method.

[0009]

[0010]

To achieve the above Symbol target Means for Solving the Problems] According to the present invention, a laser oscillator, a moving table for moving and placing the workpiece the workpiece, the laser beam output from the laser oscillator Guiding means for guiding the laser light guided to the work, a condensing lens for condensing the laser light guided to the work, and an assist gas supply means for supplying an assist gas to a condensing portion of the laser light on the work. And first control means for controlling the irradiation of the laser light on the work by the guiding means and the movement of the moving table, wherein the laser light is condensed on the work and the moving table is moved. In a laser processing apparatus for processing a work, a laser beam applied to the work
Laser processing gas nozzle through which the gas passes and the assist gas is supplied, and a tip portion of the laser processing gas nozzle
It is formed on the end face of the minute so as to open to the outer peripheral surface of the tip part,
Laser discharge by selectively letting out the assist gas
One that spatters the spatter generated by the process in a specific direction
And a rotating means for rotating the gas nozzle with respect to the work, and the recess is oriented in a predetermined direction according to a moving direction of the moving table, and is formed by the laser processing.
And a second control means for controlling the rotating means so that the spatter scatters in the direction .

According to the present invention, in order to achieve the above object, laser light oscillated from a laser oscillator is guided to a work placed on a moving table, and the laser light is focused on the work by a condenser lens. In the laser processing method of processing the work by moving the moving table while ejecting an assist gas to a condensing portion of the laser light on the work, the laser light applied to the work is
For laser processing through which the assist gas is supplied
A gas nozzle is provided and the tip of this gas nozzle for laser processing
One concave on the end face of the part so as to open on the outer peripheral surface of the tip part
Where the assist gas is selectively formed from the recess.
The spatter generated by laser processing
Scattered in a certain direction, and
A laser processing method is provided in which the direction in which the assist gas flows out of the recess is controlled by controlling the rotation of the chisel to scatter the sputtering by laser processing in a direction other than the preceding processing portion. .

According to the present invention, in order to achieve the above object, laser light oscillated from a laser oscillator is guided to a work placed on a moving table, and the laser light is focused on the work by a condenser lens. A laser processing method for processing the work by moving the moving table while ejecting an assist gas to the condensing portion of the laser light on the work, and cutting the work into necessary parts and scraps; The laser beam irradiated on the work passes and is
The laser gas nozzle for supplying the assist gas
Provided on the end face of the tip of the laser processing gas nozzle.
One recess is formed to open on the outer peripheral surface of the tip,
The assist gas is selectively discharged from this recess.
Spatter generated by laser processing in a specific direction
And the laser processing gas nozzle is rotated.
By controlling the direction in which the assist gas flows out of the recess, the spatter generated by the laser processing is scattered in the direction of the discarded material.

[0013]

The recess formed in the laser processing gas nozzle preferably also opens on the inner peripheral surface of the tip.

[0015]

When the end face of the tip of the laser processing gas nozzle has a uniform shape, the resistance applied to the assist gas becomes uniform, the assist gas flows out uniformly, and the sputter is uniformly accompanied by the assist gas. Spatters radially.
However, in the gas nozzle for laser processing according to the present invention, by forming a concave portion that opens to the outer peripheral surface at the end face of the tip portion, sputter by laser processing is selectively scattered in the direction of the concave portion. This is because the resistance to the assist gas at the concave portion is reduced, so that the assist gas selectively flows out to the concave portion, so that the spatter is entrained in the direction in which the assist gas flows, and the direction of the concave portion is reduced. It is presumed that this is because it scatters a lot, and hardly scatters in other directions. Thereby, the scattering range of the spatter is restricted, and the direction of the scattering can be controlled.

The recess is formed so as to open to the outer peripheral surface of the gas nozzle at the end face of the distal end portion of the gas nozzle. By forming the recess so as to open also to the inner peripheral surface of the gas nozzle, the concave portion is formed. Is further reduced, and the range in which the assist gas flows out, and thus the range in which the spatter scatters, is further limited. This makes it possible to further restrict the scattering range of the sputter by moving the gas nozzle closer to the work.

Further, in the laser processing apparatus equipped with the laser processing gas nozzle as described above, the irradiation of the laser beam onto the work and the movement of the moving table are controlled by the first control means, and the direction in which the spatter scatters. Is controlled by the second control means. The second control means controls a rotation means for rotating the gas nozzle with respect to the workpiece, and the concave portion of the gas nozzle is oriented in a predetermined direction according to the moving direction of the moving table, whereby the laser processing direction is changed. The spatter scatters in a predetermined direction.

In the case where the laser processing gas nozzle is used to perform laser processing by moving a work by a moving table while ejecting the assist gas, the direction of the recess of the gas nozzle is controlled to discharge the assist gas. By controlling the direction to be sputtered and spattering in a direction other than the preceding processing part, for example, when performing multiple adjacent drilling processing, it is possible that the spatter scatters in the previously processed hole and closes the hole. For example, it is possible to prevent the spatter from scattering to the preceding processed portion.

Further, when the work is cut into necessary parts and discarded parts by laser processing using the laser processing gas nozzle as described above, the direction of the recess of the gas nozzle is controlled to control the direction in which the assist gas flows out. However, by scattering the spatter on the waste material, a good surface cleanliness can be maintained without the spatter being scattered toward a necessary portion. Further, since the waste material is finally discarded, there is no problem even if the spatter is selectively scattered on the surface.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS. First, the configuration of the laser processing apparatus according to the present embodiment will be described. As shown in FIG. 1, the laser processing apparatus according to the present embodiment mounts a laser oscillator 1 that outputs laser light and a work 2 that is a workpiece, and is movable in a horizontal plane (X-axis direction and Y-axis direction). An XY table 3, a Z table 4 for moving the laser oscillator 1 in the vertical direction (Z-axis direction), a processing head 5 provided on the laser oscillator 1, and a nozzle provided on the bottom surface of the processing head 5 so as to face the work 2. 6, a power supply 7 for supplying power for laser oscillation in the laser oscillator 1, a moving operation of the XY table 3 in a horizontal plane (X-axis direction and Y-axis direction), and a vertical movement of the Z table 4 (Z
A controller 8 is provided for controlling the moving operation in the axial direction), the oscillating operation of the laser oscillator 1, and the rotating operation of the rotating means 40 described later. Although not shown, in the controller 8, the first control means controls the movement of the XY table 3 in the horizontal plane, the movement of the Z table 4 in the vertical direction, and the oscillation of the laser oscillator 1, Second control means is configured to control the rotation operation of the rotation means 40.

The situation in which a laser beam is applied to a work by the laser processing apparatus shown in FIG. 1 will be described with reference to FIG. still,
FIG. 2 is a principle diagram, and a detailed configuration and functions of the processing head and the nozzle unit will be described later with reference to FIG. FIG.
, A laser beam 9 is incident on the processing head 5 from the laser oscillator 1. A bending mirror 10 is provided in an optical system inside the processing head 5 and reflects the laser beam 9 to guide the laser beam 9 toward the workpiece 2. Work 2
A condensing lens 11 is disposed inside the nozzle portion 6 positioned so as to face the workpiece 2. The condensing lens 11 has a required energy density that enables processing on the processing surface of the work 2. Is sufficiently focused. The condensed laser light 9 is output to the outside from the nozzle tip portion of the nozzle section 6 and is applied to a processing position P on the workpiece 2. further,
An assist gas supply port 28 is provided in the nozzle section 6, and an assist gas is jetted from the nozzle tip portion of the nozzle section 6 to the processing position P coaxially with the laser beam 9.

In the above configuration, processing by the laser beam 9 is performed as follows. The laser beam 9 condensed by the condenser lens 11 is applied to the work 2 by the condenser lens 11.
Z table 4 so as to focus on position P on the processing surface
(Refer to FIG. 1), and the position is set by adjusting the positional relationship in the vertical direction. Then, the controller 8
Supplies the assist gas under the control of the laser oscillator 1
Is oscillated to irradiate the work 2 with the laser light 9.
The laser light 9 is focused until the heat energy becomes sufficient, and the irradiated portion of the surface of the work 2 is melted, and this becomes a heat source, and the melting proceeds sequentially from the surface in the depth direction. Eventually, a hole in the work 2 is made through the work 2. Then, the XY table 3 is moved along a required locus under the control of the controller 8, and the laser beam 9 is moved along a portion to be cut, whereby the work 2 is cut. At this time, the molten metal of the work melted by the laser processing scatters as spatter, but the scattered range is limited by the shape of the nozzle tip. The shape and function of the nozzle tip will be described later.

Next, the configuration of the nozzle portion of the laser processing apparatus will be described. As shown in FIG. 3, a fixed outer cylinder 21 fixed to the bottom of the processing head 5, a condenser lens 11 described above fixed to the fixed outer cylinder 21 by a lens support member 11a, and a fixed outer cylinder 21 Inner cylinder 23 rotatably supported by a bearing 22, a motor 27 for transmitting rotation through a belt 26 stretched over pulleys 24 and 25 to the inner cylinder 23, an assist gas for supplying an assist gas to the nozzle section 6 A gas nozzle 30 fixed to the supply port 28 and the rotating inner cylinder 23 and rotatably supported by a bearing 29 and ejecting assist gas is provided. The bearing 22, the rotating inner cylinder 23, the pulleys 24 and 25, the belt 26, and the motor 2
7 and the bearing 29 constitute a rotating means 40.

FIGS. 4A and 4B show the shape near the tip of the laser processing gas nozzle of this embodiment. FIG. 4B is a diagram viewed from the IV-B direction in FIG. 4A. The gas nozzle 30 is provided with a recess 30c that opens to the outer peripheral surface 30b at the end face 30a of the tip portion, whereby the sputter by laser processing is selectively scattered in the direction of the recess 30c as described above. And its scattering range is limited. This is because the resistance applied to the assist gas in the recess 30c is reduced, so that the assist gas selectively flows out to the recess 30c, so that the sputter is entrained in the direction in which the assist gas flows out,
It is presumed that this is because a large amount of the particles scatter in the direction of the recess 30c and hardly scatter in the other directions. If the end face 30a of the tip portion of the gas nozzle 30 has a uniform shape, the resistance applied to the assist gas becomes uniform, the assist gas flows out uniformly, and the sputter is uniformly accompanied by the assist gas. It scatters radially and deteriorates the surface cleanliness of the entire work.

Returning to FIG. 3, in the nozzle section 6, the motor 27 rotates under the control of the controller 8 (see FIG. 1), and the rotation of the motor 27 is performed via the belt 26 stretched over the pulleys 24 and 25. The inner cylinder 23 rotates. Since the gas nozzle 30 is fixed to the rotating inner cylinder 23, it rotates simultaneously with the rotating inner cylinder 23. That is, the rotary inner cylinder 23 and the gas nozzle 30 rotate around the axis of the condenser lens 11 integrally while being supported by the bearings 22 and 29. Therefore,
If the rotation of the motor 27 is controlled by the controller 8 in accordance with the moving direction of the XY table 30, that is, the direction of laser processing, the position of the gas nozzle 30, and therefore the position of the recess 30c, is rotated accordingly, and the The direction of the scattering can be controlled in accordance with the moving direction of the XY table 30, that is, the direction of laser processing.

Next, an operation in the case of performing, for example, a plurality of adjacent drilling operations by using the laser processing apparatus will be described with reference to FIG. Drilling is performed in the order of A, B, C,... Given to each hole in the figure. The controller 8 controls the direction of the recess 30c of the gas nozzle 30 so as to be fixed in the direction of the arrow in the figure. The direction in which the spatter 50 scatters at this time is the direction of the recess 30c as shown in the figure. For example, when the relationship between the hole A and the hole L is viewed, when the hole A is processed, Although the sputter flies in the direction, the sputter does not affect the processing of the hole L performed later. In addition, since the sputter when processing the hole L flies in the opposite direction to the hole A, the hole A is not closed by this spatter. The same applies to other adjacent holes, and the problem of hole jamming does not occur. That is, it is possible to prevent the spatter from scattering to the preceding processed portion. Incidentally, the orientation of the concave plants 30c are in the drawing as long as the direction of sputtering to other than the working portion of the preceding is scattered may be controlled to be in the direction other than the arrow.

As described above, according to the present embodiment, the recess 30c that opens to the outer peripheral surface 30b is formed in the end face 30a of the tip portion of the gas nozzle 30, so that spatters are selectively scattered in the direction of the recess 30c. , Its scattering range is limited. In addition, the nozzle unit 6 is provided with a rotating unit 40 for rotating the nozzle 30 with respect to the workpiece 2, and the controller 8 controls the recess 30 c to face a predetermined direction according to the moving direction of the XY table 30. The direction of spatter scattering can be controlled.

In addition, since the direction of spatter scattering is controlled as described above, when performing a plurality of adjacent boring processes, the spatter is prevented from being spattered into the previously processed hole, and the sputter is closed. Can be prevented. That is,
Spatters can be prevented from scattering to the preceding processed part.

Next, another embodiment of the present invention will be described with reference to FIGS. The laser processing apparatus of this embodiment is
This is a case where the work is cut into necessary parts and discarded materials by using the laser processing gas nozzle of the above-described embodiment. still,
In the following description, a vector is attached to the right shoulder of the English character * (star)
It is represented by adding.

In FIG. 6, the workpiece 2 is cut in a circular shape along the locus of the processing point Q as shown by the arrow in the figure, the inner part of the cut circle becomes the necessary part 2a, and the outer part of the circle is discarded. Material 2b is obtained. At this time, the direction of the recess 30c (see FIG. 4B) of the gas nozzle 30 is directed toward the waste material 2b, whereby the spatter scatters toward the waste material 2b, and Good surface cleanliness is maintained without spattering. The direction of the recess 30c is, as shown in the figure, the direction of a vector S ^* orthogonal to a speed vector (hereinafter referred to as a machining speed vector) V ^{* at} which the machining point Q on the workpiece 2 moves by moving the XY table 3. It is most preferable that they always coincide with each other because there is no possibility of spatters scattering on the necessary portion 2a. Such a recess 30
c, the orientation of the nozzle 30 is read by the controller 8 by reading the coordinates Q (X, Y) of the processing point on the work 2;
A velocity vector V ^* is calculated from this time change, and V ^{* is} further calculated ^.
The vector S ^* perpendicular computed, the recess 30 in the direction of S ^*
It is controlled by controlling the above-mentioned rotating means 40 so that c faces.

Hereinafter, the recess 30c in the controller 8 will be described.
The direction control will be described with reference to FIGS. Here, for a general description, as shown in FIG. 7, a vector T that forms an angle of θ with the direction of the velocity vector V ^*
* It is assumed that the direction of the recess 30c matches (θ).
Θ is positive in the counterclockwise direction. Also, machining point Q
_n (X _n , Y _n ) is Q _{n + 1} (X _{n + 1} ,
Y _{n + 1} ) (where n = 0, 1, 2,...)
・ ・). At this time, the velocity vector V ^* is

[0032]

[Formula 1]

## EQU2 ## Strictly speaking, V ^* is the time derivative of each coordinate change,

[0034]

[Formula 2]

In terms of control, if Δt is set to a very short time in equation (1), the result becomes almost equal to the result of equation (2).

A rotation matrix R representing the rotation of the angle θ
(Θ) is

[0037]

[Equation 3]

The vector T ^* (θ) that forms the angle of θ with the direction of V ^* is

[0039]

(Equation 4)

Is obtained.

The control for directing the recess 30c to T ^* (θ) obtained as described above will be described with reference to the flowcharts of FIGS. The flowcharts of FIGS. 8 and 9 are stored in the controller 8. In FIG. 8, when the control is started, first, in step 100, the initial position of the processing point on the work 2, that is, the coordinates (X ₀ , Y ₀ ) of the initial position Q ₀ of the XY table 3 is read.
In the subroutine of step 200, as described below, the processing points Q _n (where n = 0, 1, 2,...)
The rotation of the nozzle 30 is controlled by reading the coordinates of ()).
Then, it is determined in step 300 whether or not to end this control, and if rotation control is to be continued, step 2 is performed again.
Returning to step 00, if the rotation control is to be ended, step 200
Stop control without returning to.

Next, the subroutine of step 102 will be described. First, in step 201, the aforementioned short time Δt is measured, and when the time Δt elapses, step 2 is executed.
At 02, the coordinates Q _{n + 1} (X _{n + 1} , Y _{n + 1} ) of the processing point are read (where n = 0, 1, 2,...). Next, step 2
03, the coordinates Q _{n + 1} read in step 202
(X _{n + 1} , Y _{n + 1} ) and coordinates Q read before time Δt
_{Using n} (X _n , Y _n ), V ^* is calculated according to equation (1), and at step 204, T ^* (θ) is determined according to equation (4). Then, in step 205, the nozzle 30 is rotated by the rotating means 40 so that the recess 30c is oriented in the direction of the vector T ^* (θ), and the subroutine ends.

In this way, control is performed to make the direction of the recess 30c coincide with the vector T ^* (θ) that forms an angle of θ with the direction of the velocity vector V ^* . The value of the angle θ is determined in advance according to the processing conditions and is input to the controller 8. In the case of the present embodiment, since θ = 90 °,

[0044]

(Equation 5)

Is as follows. Note that, in contrast to the present embodiment, in order to discard the portion inside the circle and to make the portion outside the circle a necessary portion, θ = 270 °. In addition, an appropriate value may be selected as θ depending on the processing conditions.

As described above, according to the present embodiment, the work 2
Is cut into the necessary portion 2a and the waste material 2b, the direction of the recess 30c of the gas nozzle 30 is controlled so that the sputter flies in the direction of the waste material 2b, so that the spatter scatters toward the necessary portion 2a. Good surface cleanliness can be maintained without performing this. In this case, it is most preferable to direct the recess 30c of the gas nozzle 30 in the direction of the vector orthogonal to the velocity vector. The above control method is merely an example, and there are other suitable control methods.

FIG. 1 shows still another embodiment of the present invention.
This will be described with reference to FIG. In this embodiment, the shape of the recess provided at the tip of the nozzle is changed.
In the above-described embodiment, a concave portion having a shape that opens to the outer peripheral surface is formed in the end surface of the tip portion of the gas nozzle. In the present embodiment, however, as shown in FIGS. The gas nozzle 3
The recess 30e is formed so as to open not only to the outer peripheral surface 30b but also to the inner peripheral surface 30d. That is, the recess 30e is formed in a groove on a part of the end face 30a. Further, as still another embodiment, as shown in FIG. 11, the cut in the vertical cross section of the nozzle is not a groove-shaped recess inclined with respect to the end surface of the tip portion of the gas nozzle, as shown in FIG. A groove-shaped recess 30f may be formed such that the cut end of the cross section is parallel to the end face 30a. According to the above two embodiments, the resistance of the assist gas at the concave portion 30e or 30f is further reduced, so that the gas nozzle can be brought closer to the work to further restrict the scattering range of the spatter.

[0048]

According to the present invention, a spa by laser processing is provided.
Limit the scattering range of the
Scatters the spatter to the preceding processed part
To prevent spatter from scattered on the part that will become the product after processing.
Quality after work machining
I can .

[0049]

[0050]

[0051]

[0052]

[Brief description of the drawings]

FIG. 1 is a view showing one embodiment of a laser processing apparatus of the present invention.

FIG. 2 is a diagram illustrating a state where a laser beam is applied to a workpiece by the laser processing apparatus of FIG. 1;

FIG. 3 is a cross-sectional view illustrating a configuration of a nozzle portion of the laser processing apparatus of FIG.

4A and 4B are diagrams showing the shape of the laser processing gas nozzle of FIG. 4, wherein FIG. 4A is a longitudinal sectional view of a tip portion, and FIG. 4B is a diagram of FIG. 4A viewed from the IV-B direction.

FIG. 5 is a diagram for explaining an operation when a plurality of adjacent drilling operations are performed using the laser processing apparatus of FIG. 1;

FIG. 6 is a view showing another embodiment of the laser processing apparatus according to the present invention, and is a view for explaining a situation in which a work is cut into necessary parts and discarded materials.

FIG. 7 shows a processing point Q _n (X _n ,
_{Y n), Q n + 1} (X n + 1, Y n + 1), the velocity vector V ^*, and illustrates the relationship of the vector T ^* (θ).

FIG. 8 is a flowchart showing control of a recess in the embodiment of FIG. 6;

FIG. 9 is a flowchart showing a step 200 in the flowchart of FIG.
9 is a flowchart showing a subroutine of FIG.

FIGS. 10A and 10B are views showing still another embodiment of the gas nozzle for laser processing according to the present invention, wherein FIG. 10A is a longitudinal sectional view of a tip portion, and FIG. FIG.

FIG. 11 is a view showing still another embodiment of the gas nozzle for laser processing according to the present invention, and is a longitudinal sectional view of a tip portion.

FIG. 12 is a diagram showing a state in which spatters scatter radially on the surface of a work when laser processing is performed using a conventional laser processing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Laser oscillator 2 Work 2a Necessary part of work 2b Waste material 3 XY table 4 Z table 5 Processing head 6 Nozzle part 8 Controller 9 Laser beam 11 Condensing lens 21 Fixed outer cylinder 22 Bearing 23 Rotating inner cylinder 24, 25 Pulley Reference Signs List 26 Belt 27 Motor 28 Assist gas supply port 29 Bearing 30 Gas nozzle 30a End face (at gas nozzle tip) 30b Outer peripheral face (of gas nozzle) 30c Depression 30d Inner peripheral face (of gas nozzle) 30e, 30f Recess 40 Rotating means 50 Sputter

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Yoshiaki Shimomura 650, Kandamachi, Tsuchiura-shi, Ibaraki Pref. Tsuchiura Plant, Hitachi Construction Machinery Co., Ltd. (56) References JP-A-64-15293 (JP, A) JP-A-2 JP-A-6-15468 (JP, A) JP-A-6-15468 (JP, U) JP-A-6-1551091 (JP, U) JP-B-62-145030 (JP, B2) (58) Field surveyed (Int. Cl. ⁷ , DB name) B23K 26/00-26/14

Claims (5)

(57) [Claims] 1. A laser oscillator, a moving table on which a work is placed and the work is moved, guiding means for guiding a laser beam output from the laser oscillator to the work, and the laser guided by the work A condenser lens for condensing light; an assist gas supply unit for supplying an assist gas to a condensing portion of the laser light on the work; and an irradiation of the laser light on the work by the guide unit and the moving table A first control means for controlling the movement of the laser beam, the laser beam is focused on the work, the moving table is moved to process the work, the laser light irradiated to the work is Passed and said reed
A gas nozzle for laser processing to which a strike gas is supplied, and a tip portion on an end face of a tip portion of the gas nozzle for laser processing.
The assist gas
Flow generated by laser processing
One recess for scattering the putter in a specific direction, rotating means for rotating the gas nozzle with respect to the work, and the recess oriented in a predetermined direction in accordance with a moving direction of the moving table, thereby performing the laser processing. The resulting spatter
A second control means for controlling the rotating means so as to scatter in a direction . Wherein said recess formed in the laser processing nozzle, the laser machining apparatus according to claim 1, characterized in that is also open to the inner peripheral surface of the tip portion. 3. A laser beam oscillated from a laser oscillator is guided to a work placed on a moving table, and the laser light is focused on the work by a condenser lens. In the laser processing method of processing the work by moving the moving table while ejecting the assist gas to the work, the laser light applied to the work passes and the
A gas nozzle for laser processing to which a strike gas is supplied is provided,
The tip of the tip of this laser processing gas nozzle
One recess is formed so as to open on the outer peripheral surface of the
Les by selectively flowing out the reeds Sutogasu than place
Spatter generated by laser processing is scattered in a specific direction.
Control the rotation of the laser processing gas nozzle.
A laser processing method for controlling the direction in which the assist gas flows out of the recess so as to scatter the sputtering by laser processing in a direction other than the preceding processing portion. 4. A laser beam oscillated from a laser oscillator is guided to a work placed on a moving table, and the laser light is focused on the work by a condenser lens. In the laser processing method of processing the work by moving the moving table while ejecting assist gas to cut the work into necessary parts and scraps, a laser beam applied to the work passes and Reed
A gas nozzle for laser processing to which a strike gas is supplied is provided,
The tip of the tip of this laser processing gas nozzle
One recess is formed so as to open on the outer peripheral surface of the
By selectively discharging the assist gas from the
Spatter generated by laser processing is scattered in a specific direction.
Control the rotation of the laser processing gas nozzle.
A laser processing method for controlling the direction in which the assist gas flows out of the recess to scatter spatters generated by the laser processing in the direction of the discarded material. 5. The laser processing method according to claim 3 , wherein the recess formed in the laser processing gas nozzle is also open to an inner peripheral surface of the tip portion.