JP3178918B2 - Curable resin composition, composite material and laminate using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a curable resin composition and a cured product obtained by curing the same. Further, the present invention relates to a curable composite material comprising the resin composition and a substrate, a cured product thereof, and a laminate comprising a laminated product comprising a cured product and a metal foil. The resin composition of the present invention exhibits excellent chemical resistance, dielectric properties, and heat resistance after curing, and can be used as a dielectric material, an insulating material, and a heat-resistant material in fields such as the electronics industry, the space and aircraft industries. .

[0002]

2. Description of the Related Art In recent years, there has been a remarkable trend toward miniaturization and high-density mounting methods in the field of electronic devices for communication, consumer use, industrial use, and the like, and accordingly, materials have become more excellent. Heat resistance, dimensional stability, and electrical properties are being demanded. For example, a copper-clad laminate made of a thermosetting resin such as a phenol resin or an epoxy resin has been used as a printed wiring board. Although these have various performances in a well-balanced manner, they have a drawback that electrical characteristics, particularly, dielectric characteristics in a high frequency range are poor. As a new material for solving this problem, polyphenylene ether has recently attracted attention and is being applied to copper-clad laminates.

[0003] One of the methods using polyphenylene ether is to use a curable polymer or monomer. Attempts have been made to improve the chemical resistance of polyphenylene ether by combining it with a curable polymer or monomer, and to obtain a material utilizing the excellent dielectric properties of polyphenylene ether. Examples of the curable polymer and monomer include epoxy resin (Japanese Patent Application Laid-Open No. 58-69046), 1,2-polybutadiene (Japanese Patent Application Laid-Open No. Sho 59-193929), and polyfunctional maleimide (Japanese Patent Application Laid-Open No. Sho 56-193929). 133355) and polyfunctional cyanate esters (JP-A-56-141).
No. 349), polyfunctional acryloyl or methacryloyl compounds (JP-A-57-149317, etc.), triallyl isocyanurate and / or triallyl cyanurate (JP-A-61-218652, etc.), isocyanate compounds Many examples are known.

However, polyphenylene ether is
Since it originally has no chemical resistance at all, even if a curable polymer or monomer is used in combination, its improvement is naturally limited and not sufficient. In order to solve the above-mentioned drawbacks, the present inventors have previously reported that a resin composition comprising a reaction product of polyphenylene ether and an unsaturated carboxylic acid or acid anhydride has a solvent film-forming property and a chemical resistance after curing. It has been found that it is excellent in various properties such as properties and dielectric properties and is suitable as a material for a printed circuit board (Japanese Patent Application No. Hei 3-1258).
No. 1). However, this polyphenylene ether-based resin composition has a solvent film-forming property, but is not sufficient, and further improvement of the film-forming property has been desired.

[0005]

DISCLOSURE OF THE INVENTION The present invention has been made in view of the above circumstances, and retains the excellent dielectric properties of polyphenylene ether, and provides excellent chemical resistance and heat resistance after curing. An object of the present invention is to provide a novel curable resin composition and a composite comprising the curable resin composition and a base material.

[0006]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, have found a novel resin composition that meets the object of the present invention, and have completed the present invention. It has arrived. That is, the present invention provides: A curable resin composition comprising (a) a reaction product of a polyphenylene ether resin with an unsaturated carboxylic acid or acid anhydride, (b) triallyl isocyanurate and / or triallyl cyanurate, and (c) a polystyrene resin. The component (a) is 98 to 40 parts by weight based on 100 parts by weight of the sum of the components (a) and (b);
Component (b) is 2 to 60 parts by weight, and (a) to
(A) + based on 100 parts by weight of the sum of components (c)
The component (b) is 99 to 50 parts by weight, and the component (c) is 1 to 50 parts by weight.
1. a curable resin composition characterized by being in parts by weight; 2. a film comprising the curable resin composition of the first invention, 3. a cured resin composition obtained by curing the curable resin composition of the first invention; 4. a film comprising the cured resin composition of the third invention, (A) a reaction product of a polyphenylene ether resin and an unsaturated carboxylic acid or anhydride, (b) triallyl isocyanurate and / or triallyl cyanurate, (c) a polystyrene resin, and (d) a base material. A curable composite material, wherein component (a) is 98 to 40 parts by weight, component (b) is 2 to 60 parts by weight, based on 100 parts by weight of the sum of components (a) and (b); and (A)
(A) + based on 100 parts by weight of the sum of components (c)
The component (b) is 99 to 50 parts by weight, and the component (c) is 1 to 50 parts by weight.
Parts by weight, and based on 100 parts by weight of the sum of the components (a) to (d), the components (a) to (c) are 95 to 10 parts by weight, and the component (d) is 5 to 90 parts by weight. 5. A curable composite material comprising the curable resin composition of the first invention and a base material, 6. A cured composite material obtained by curing the curable composite material of the fifth invention, A laminate comprising the cured composite material of the sixth invention and a metal foil.

Hereinafter, the present invention will be described in detail. The polyphenylene ether used in the present invention is represented by the following general formula 1.

[0008]

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Examples of the lower alkyl group represented by R _{1 to} R ₄ in the general formula A include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group and an isobutyl group. Examples of the aryl group include a phenyl group. Examples of the haloalkyl group include a bromomethyl group and a chloromethyl group. Examples of the halogen atom include bromine and chlorine.

As a typical example of Q in Chemical Formula 1, the following 4
And a group of compounds represented by the general formula (2).

[0011]

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Specific examples include the following chemical formulas (3) to (4).

[0013]

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[0014]

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In the polyphenylene ether chain represented by J in the general formula 1, in addition to the unit represented by the general formula A, a unit represented by the following general formula 5 may be contained. .

[0016]

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Preferred examples of the polyphenylene ether resin of the general formula 1 used in the present invention include poly (2,6-dimethyl-1,4-phenylene ether) and poly (2,6-dimethyl-1,4-phenylene ether) obtained by homopolymerization of 2,6-dimethylphenol. 2,
Styrene graft polymer of 6-dimethyl-1,4-phenylene ether), 2,6-dimethylphenol and 2,6-dimethylphenol
Copolymer of 3,6-trimethylphenol, copolymer of 2,6-dimethylphenol and 2-methyl-6-phenylphenol, presence of 2,6-dimethylphenol and polyfunctional phenol compound represented by general formula (6) A polyfunctional polyphenylene ether resin obtained by polymerization under the following conditions, for example, JP-A-63-301222, JP-A-1-297
General formulas A and B as disclosed in US Pat.
And the like.

[0018]

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Regarding the molecular weight of the polyphenylene ether resin described above, the viscosity number ηsp / c measured with a 0.5 g / dl chloroform solution at 30 ° C. is 0.1 to 1.0.
Can be used favorably. As a curable resin composition that emphasizes the flow of molten resin, for example, a prepreg for a multilayer wiring board, a resin having a small viscosity number is preferable. The component (a) used in the present invention is produced by reacting the above polyphenylene ether resin with an unsaturated carboxylic acid or an acid anhydride. Examples of suitable acids and acid anhydrides include acrylic acid, methacrylic acid, maleic anhydride, fumaric acid, itaconic acid, itaconic anhydride, glutaconic anhydride, citraconic anhydride and the like. Particularly, maleic anhydride and fumaric acid can be used most preferably.

The reaction is carried out by heating the polyphenylene ether resin and the unsaturated carboxylic acid or acid anhydride at a temperature in the range of 100 ° C to 390 ° C. At this time, a radical initiator may coexist. Although both the solution method and the melt mixing method can be used, the melt mixing method using an extruder or the like can be more easily performed and is suitable for the purpose of the present invention.
The ratio of the unsaturated carboxylic acid or acid anhydride is 0.01 to 5.0 parts by weight based on 100 parts by weight of the polyphenylene ether resin.
0 parts by weight, preferably 0.1 to 3.0 parts by weight.

The triallyl isocyanurate and / or triallyl cyanurate used as the component (b) of the present invention are represented by the following structural formula (7):
It is a functional monomer.

[0022]

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In practicing the present invention, triallyl isocyanurate and triallyl cyanurate can be used not only alone, but also in a mixture of any ratio. In the present invention,
Triallyl isocyanurate and triallyl cyanurate exhibit effects as plasticizers and crosslinking agents. That is, the resin flow at the time of pressing and the crosslinking density are improved.

The polystyrene used as the component (c) in the present invention is not particularly limited. If the molecular weight is too high, the solvent film-forming property is improved, but the resin flowability is reduced, while the molecular weight is low. If it is too high, the resin flowability will be good, but it will be inferior to the solvent film-forming property, and it is necessary to use a resin having a molecular weight suitable for the application. Although not particularly limited, those having a weight average molecular weight in the range of 50,000 to 300,000 can be used favorably.

Of the three components (a) to (c) described above, the mixing ratio of component (a) and component (b) is such that component (a) is 98 to 40 parts by weight based on the sum of the two. ,
Component (b) is 2 to 60 parts by weight. If the amount of the component (b) is less than 2 parts by weight, the improvement of the chemical resistance is insufficient, which is not preferable. Conversely, if it exceeds 60 parts by weight, the dielectric properties and the moisture absorption properties decrease, and the material becomes extremely brittle after curing, which is not preferable.

The mixing ratio of the component (c) is (a) to (c)
The component (a) + (b) is 99 to 50 based on the sum of the components.
Parts by weight, component (c) is 1 to 50 parts by weight, preferably component (a) + (b) is 99 to 70 parts, component (c) is 1 to
30 parts by weight, more preferably 99% of component (a) + (b)
It is desirable that the content of the component (c) is 1 to 15 parts by weight.

If the amount of the component (c) exceeds 50 parts by weight, heat resistance is undesirably reduced. When the amount of the component (c) is less than 1 part by weight, the film forming property of the solvent is undesirably reduced. A substrate can be added to the curable resin composition of the present invention to increase mechanical strength and increase dimensional stability. Examples of the substrate used in the present invention include various glass cloths such as roving cloth, cloth, chopped mat, and surfacing mat, asbestos cloth, metal fiber cloth and other synthetic or natural inorganic fiber cloths; polyvinyl alcohol fiber, polyester fiber, Woven or non-woven fabric obtained from synthetic fiber such as acrylic fiber, wholly aromatic polyamide fiber, polytetrafluoroethylene fiber; natural fiber cloth such as cotton cloth, linen cloth, felt; carbon fiber cloth; kraft paper, cotton paper, paper-glass blend Natural cellulosic cloth such as fine paper is used alone or 2
Used in combination of more than one species.

The proportion of the substrate in the curable composite material of the present invention is 5 to 90% by weight, more preferably 10 to 80% by weight, and still more preferably 20 to 70% by weight, based on 100 parts by weight of the curable composite material. It is. Base material is 5% by weight
If the amount is less than the above, the dimensional stability and strength after curing of the composite material are insufficient, and if the amount is more than 90% by weight, the dielectric properties and the flame retardancy of the composite material are inferior.

Examples of the metal foil used in the present invention include a copper foil and an aluminum foil. Although the thickness is not particularly limited, it is 5 to 200 μm, more preferably 5 to 200 μm.
１０５105 μm. As a method of mixing the above components (a) to (c), a solution mixing method of uniformly dissolving or dispersing the four components in a solvent, a melt blending method of heating with an extruder or the like can be used. Examples of the solvent used for the solution mixing include halogen solvents such as dichloromethane, chloroform and trichloroethylene; aromatic solvents such as benzene, toluene and xylene; ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone; and tetrahydrofuran alone or Two or more types are used in combination.

The curable resin composition of the present invention may be molded and cured in advance according to its use. The molding method is not particularly limited. Usually, a casting method in which the resin composition is dissolved in the above-described solvent and molded into a desired shape, or a heat melting method in which the resin composition is heated and melted to form a desired shape is used. The above-described casting method and heat melting method may be performed alone. Moreover, you may combine and perform each. For example, several to several tens of films of the curable resin composition of the present invention created by a casting method are laminated, and then heated and melted,
For example, the sheet of the curable resin composition of the present invention can be obtained by heating and melting with a press molding machine.

As a method for producing the curable composite material of the present invention, for example, the components (a) to (c) of the present invention and, if necessary, other components are mixed with the aforementioned halogen-based, aromatic-based, ketone-based, etc. And a method of uniformly dissolving or dispersing in a solvent or a mixed solvent thereof, impregnating the substrate, and then drying. The impregnation is performed by dipping (dipping), coating, or the like. The impregnation can be repeated multiple times as necessary, and in this case, the impregnation can be repeated using multiple solutions having different compositions and concentrations to finally adjust the desired resin composition and resin amount It is.

In the curable composite material of the present invention, if necessary, a coupling agent can be used for the purpose of improving the adhesion at the interface between the resin and the substrate. As the coupling agent, general ones such as a silane coupling agent, a titanate coupling agent, an aluminum-based coupling agent, and a zircoaluminate coupling agent can be used. The resin composition of the present invention is cured by causing a crosslinking reaction by means of heating or the like as described later, and contains a radical initiator for the purpose of lowering the reaction temperature or promoting the crosslinking reaction of the unsaturated group. You may use it.

The amount of the radical initiator used in the curable resin composition of the present invention is 0.1 to 10% by weight, preferably 0.1 to 8% by weight, based on the sum of the components (a) and (b). %. Representative examples of the radical initiator include benzoyl peroxide, cumene hydroperoxide, 2,5-dimethylhexane-2,5-dihydroperoxide, and 2,5-dimethyl-2,5-di (t -Butylperoxy) hexyne-3, di-t-butyl peroxide, t-butylcumyl peroxide, α, α ′
-Bis (t-butylperoxy-m-isopropyl) benzene, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, dicumyl peroxide, di-t
-Butylperoxyisophthalate, t-butylperoxybenzoate, 2,2-bis (t-butylperoxy) butane, 2,2-bis (t-butylperoxy) octane, 2,5-dimethyl-2, There are peroxides such as, but not limited to, 5-di (benzoylperoxy) hexane, di (trimethylsilyl) peroxide, and trimethylsilyltriphenylsilyl peroxide. Although not a peroxide, 2,3-dimethyl-2,3-diphenylbutane can also be used as a radical initiator. However, the initiator used for curing the present resin composition is not limited to these examples.

The resin composition of the present invention can be used by blending fillers and additives in amounts not to impair the original properties, for the purpose of imparting desired performance according to the use. The filler may be fibrous or powdery,
Carbon black, silica, alumina, talc, mica,
Glass beads, glass hollow spheres, and the like can be given.
Additives include antioxidants, heat stabilizers, antistatic agents,
Plasticizers, pigments, dyes, coloring agents, and the like are included. The chlorine in order to further improve the flame retardancy, bromine, and flame retardant _{phosphorus-based, Sb 2 O 3, Sb 2} O 5, NbSbO 3 · 1
A flame retardant auxiliary such as / 4H ₂ O may be used in combination. In a composite material including a base material, a combination of brominated diphenyl ethers and antimony oxide is preferably used. Furthermore, one or two or more other thermoplastic resins or thermosetting resins can be blended.

The cured resin composition of the present invention is obtained by curing the above-described cured resin. The method of curing is arbitrary, and a method using heat, light, an electron beam, or the like can be employed. In the case of curing by heating, the temperature is selected in the range of 80 to 300 ° C, more preferably 120 to 250 ° C, depending on the presence or absence and type of the radical initiator and the curing agent. The time is
It is about 1 minute to 10 hours, more preferably 1 minute to 5 hours.

The resin composition of the obtained cured resin composition can be analyzed by a method such as infrared absorption spectroscopy, high-resolution solid nuclear magnetic resonance spectroscopy, and pyrolysis gas chromatography. The cured composite material of the present invention can be used as a film or as a laminate composed of at least one kind of metal foil and a cured resin composition in which the above-mentioned metal foil is laminated on at least one surface.

The cured composite material of the present invention is obtained by curing the curable composite material thus obtained by a method such as heating. The manufacturing method is not particularly limited.For example, a plurality of the curable composite materials are stacked, and the respective layers are adhered to each other under heat and pressure, and simultaneously heat-cured to obtain a cured composite material having a desired thickness. Can be. Further, it is also possible to obtain a cured composite material having a new layer configuration by combining the cured composite material once cured by adhesion and the curable composite material. Lamination molding and curing are usually performed simultaneously using a hot press or the like, but both may be performed independently. That is, the uncured or semi-cured composite material obtained by lamination molding in advance can be cured by heat treatment or another method.

The molding and curing are performed at a temperature of 80 to 300 ° C.
The reaction can be carried out at a pressure of 0.1 to 1000 kg / cm 2 and a time of 1 minute to 10 hours, more preferably at a temperature of 120 to 250 ° C., a pressure of 1 to 100 kg / cm 2 and a time of 1 minute to 5 hours. The laminate of the present invention is composed of the cured composite material of the present invention and a metal foil.

The method for producing the laminate of the present invention includes:
For example, there is a method in which the curable composite material of the present invention and a metal foil are laminated in a layer configuration according to the purpose, and the respective layers are adhered to each other under heating and pressurization and, at the same time, thermally cured. In the laminate, the curable composite material and the metal foil are laminated in an arbitrary layer configuration. The metal foil can be used as both a surface layer and an intermediate layer.

Also, a laminate composed of the curable composite material of the present invention and a metal plate, and a metal-clad laminate composed of a metal foil, a cured composite material, and a metal plate can be manufactured.
In a laminate, a curable composite material is laminated on one or both sides of a metal plate as a base. In a metal-clad laminate, a metal foil is laminated on one or both sides of a metal plate via a curable composite material. At this time, the metal foil is used as the outermost layer, but may be used as an intermediate layer other than the outermost layer.

In addition to the above, the lamination and curing may be repeated a plurality of times to form a multilayer. An adhesive can be used for bonding the metal foil and the metal plate. As an adhesive,
Examples include epoxy-based, acrylic-based, phenol-based, and cyanoacrylate-based, but are not particularly limited thereto. The above-mentioned lamination molding and curing can be performed under the same conditions as the cured composite material of the present invention.

[0042]

EXAMPLES Hereinafter, the present invention will be described with reference to examples to further clarify the present invention, but the scope of the present invention is not limited to these examples.

[0043]

Synthesis Example 1 Poly (2,500) having a viscosity number ηsp / c of 0.54 measured in a chloroform solution of 0.5 g / dl at 30 ° C.
100 parts by weight of 6-dimethyl-1,4-phenylene ether), 1.5 parts by weight of maleic anhydride, and 2,5-dimethyl-2,5-di (t-butylperoxy) hexane [Perhexa 25B manufactured by NOF Corporation After dry blending 1.0 part by weight at room temperature, the cylinder temperature was 30
Extrusion was performed by a twin screw extruder under the conditions of 0 ° C. and a screw rotation speed of 230 rpm. This reaction product is designated as A.

[0044]

[Synthesis Example 2] Viscosity number η measured by the same method as in Synthesis Example 1.
poly (2,6-dimethyl-1,4 having an sp / c of 0.60
After dry-blending 100 parts by weight of (phenylene ether) and 1.5 parts by weight of maleic anhydride at room temperature, the mixture was extruded by a twin-screw extruder at a cylinder temperature of 300 ° C. and a screw rotation speed of 230 rpm. This reaction product is designated B.

[0045]

Examples 1 to 3 Curable resin composition and curable resin composition A or B were mixed with various compounds in the composition shown in Table 1 using a Henschel mixer, and mixed with a press molding machine.
Molding and curing were performed at 0 ° C. for 2 hours to prepare a cured product having a thickness of about 1 mm.

The cured product is prepared in trichloroethylene for 5 hours.
No warping or change in appearance was observed even after boiling for 1 minute, and dimensional stability was good.

[0047]

Examples 4 to 6 Films composed of curable resin composition and cured films A or B and various compounds were dissolved in chloroform with the compositions shown in Table 1. This solution was cast on a Teflon dish to obtain a film. The obtained film is about 100
The film had a thickness of μm, and had no stickiness or the like, and was excellent in film-forming properties.

After drying in an air oven, the obtained film was laminated and cured by a vacuum press molding machine to prepare a cured product having a thickness of 1 mm. This cured product did not show any warpage or change in appearance even after boiling for 5 minutes in trichloroethylene, and had good dimensional stability.

[0049]

COMPARATIVE EXAMPLE 1 The same operation as in Examples 4 to 6 was carried out without blending the polystyrene resin in Example 4, but the solvent film-forming properties were inferior to those blended with the polystyrene resin.

[0050]

Examples 7 to 10 Curable Composite Materials The components having the compositions shown in Table 2 were dissolved or dispersed in toluene. A glass cloth was immersed in this solution for impregnation, and dried in an air oven.・ Laminate A plurality of the above-mentioned curable composite materials are laminated so that the thickness after molding becomes about 0.8 mm, and the thickness is 35 μm on both surfaces thereof.
Was placed and molded and cured by a press molding machine to obtain a laminate. Table 3 shows the curing conditions of each example. The pressure was 40 kg / cm ^{2 in} each case.

Various properties of the thus obtained laminate were measured by the following methods. 1. Trichlorethylene resistance The laminate from which the copper foil was removed was cut into 25 mm squares, boiled in trichlorethylene for 5 minutes, and visually observed for changes in appearance (based on JIS C 6481). 2. The dielectric constant and the dielectric loss tangent were measured at 1 MHz (based on JIS C 6481). 3. Solder heat resistance The laminate from which the copper foil has been removed is cut into 25 mm squares,
The sample was floated in a solder bath at 120 ° C. for 120 seconds, and the change in appearance was visually observed (based on JIS C 6481). 4. Copper foil peeling strength A test piece having a width of 20 mm and a length of 100 mm is cut out from the laminate, and a parallel cut having a width of 10 mm is formed in the copper foil surface, and then a speed of 50 mm / min is perpendicular to the surface. , The copper foil was continuously peeled off, and the stress at that time was measured with a tensile tester, and the lowest value of the stress was shown (based on JIS C 6481).

[0052]

Comparative Example 2 The same operation as in Example 7 was carried out except that the polystyrene resin was not used, and a curable composite material was produced.
The surface properties of this curable composite material were more cracked than those obtained by blending a polystyrene resin.

[0053]

[Table 1]

[0054]

[Table 2]

[0055]

[Table 3]

[0056]

According to the curable resin composition of the present invention, a film or a curable composite material having good solvent film formability and excellent handleability without stickiness on the surface can be obtained. This is considered to be because the curable resin composition of the present invention is a resin composition having particularly excellent film-forming properties due to the blending of polystyrene.

The laminate, laminate and metal-clad laminate obtained using the curable resin composition of the present invention are materials having both good chemical resistance and excellent dielectric properties. In addition, it exhibits well-balanced properties in various physical properties such as heat resistance, adhesiveness to metal, dimensional stability, and heat dissipation. Therefore, the material of the present invention can be used as a dielectric material, an insulating material, a heat-resistant material, and the like in the fields of the electric industry, the electronics industry, the space and aircraft industries, and the like. In particular, it is suitably used as a prepreg for single-sided, double-sided, multi-layer printed boards, semi-rigid boards, metal base boards, and multi-layer printed boards.

Further, the material of the present invention is excellent as an adhesive for a high-density circuit board having a line interval of 100 μm or less, a multilayer circuit board having an interphase insulating layer having a thickness of 200 μm or less, and a circuit board for mounting because of its heat-resistant, moisture-absorbing and insulating properties. Can be used for

Continuation of the front page (51) Int.Cl. ⁷ identification code FI C08L 25/04 C08L 25/04 (58) Investigated field (Int.Cl. ⁷ , DB name) C08L 1/00-101/16

Claims (7)

(57) [Claims] 1. A reaction product of (a) a polyphenylene ether resin and an unsaturated carboxylic acid or acid anhydride, (b)
A curable resin composition comprising triallyl isocyanurate and / or triallyl cyanurate and (c) a polystyrene resin, wherein component (a) is based on 100 parts by weight of the sum of components (a) and (b). Is 98 to 40 parts by weight, the component (b) is 2 to 60 parts by weight, and (a)
(A) + based on 100 parts by weight of the sum of components (c)
The component (b) is 99 to 50 parts by weight, and the component (c) is 1 to 50 parts by weight.
A curable resin composition characterized by being in parts by weight. 2. A film comprising the curable resin composition according to claim 1. 3. A cured resin composition obtained by curing the curable resin composition according to claim 1. 4. A film comprising the cured resin composition according to claim 3. 5. A reaction product of (a) a polyphenylene ether resin and an unsaturated carboxylic acid or acid anhydride, (b)
Triallyl isocyanurate and / or triallyl cyanurate, (c) a polystyrene resin, and (d)
A curable composite material comprising a base material, wherein the component (a) is 98 to 40 parts by weight and the component (b) is 2 to 60 parts by weight based on 100 parts by weight of the sum of the components (a) and (b). And based on 100 parts by weight of the sum of the components (a) to (c), 99 to 50 parts by weight of the component (a) + (b), 1 to 50 parts by weight of the component (c), and ( Components (a) to (c) are 95 based on 100 parts by weight of the sum of components (a) to (d).
A curable composite material comprising 10 to 10 parts by weight and the component (d) in 5 to 90 parts by weight. 6. A cured composite material obtained by curing the curable composite material according to claim 5. 7. A laminate comprising the cured composite material according to claim 6 and a metal foil.