JP3176116B2 - Adhesive composition for flexible printed circuit board - Google Patents
Adhesive composition for flexible printed circuit boardInfo
- Publication number
- JP3176116B2 JP3176116B2 JP03007992A JP3007992A JP3176116B2 JP 3176116 B2 JP3176116 B2 JP 3176116B2 JP 03007992 A JP03007992 A JP 03007992A JP 3007992 A JP3007992 A JP 3007992A JP 3176116 B2 JP3176116 B2 JP 3176116B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- adhesive composition
- manufactured
- present
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、接着力、耐薬品性、保
存安定性に優れたフレキシブル印刷回路（ＦＰＣ）用基
板の接着剤組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive composition for a substrate for a flexible printed circuit (FPC) having excellent adhesive strength, chemical resistance and storage stability.
【０００２】[0002]
【従来の技術】ＩＣ、ＬＳＩ、チップ部品の開発によっ
て電子機器の高密度実装がますます進む中で、ＦＰＣ用
基板は、設計の自由度があり、小形化・軽量化・薄形化
に有効な配線材料として広い分野で使用されている。こ
のＦＰＣ用基板に使用されるカバーレイシートなるもの
は、回路の酸化防止、屈曲性の向上等の目的で、回路上
にそれを硬化接着させて用いられる。そしてカバーレイ
シート接着の工程は、生産性の都合上から短時間での硬
化接着が行われている。従って、ＦＰＣ用基板に使われ
ている接着剤は、短時間で硬化させた場合においても接
着性、耐薬品性、電気絶縁性が良好で、かつＢステージ
での保存安定性に優れていることが要求される。2. Description of the Related Art As high-density mounting of electronic devices is progressing more and more due to the development of ICs, LSIs, and chip components, FPC boards have a degree of freedom in design, and are effective in reducing size, weight, and thickness. It is used in a wide range of fields as a suitable wiring material. The coverlay sheet used for the FPC board is used by curing and bonding it on a circuit for the purpose of preventing oxidation of the circuit and improving the flexibility. In the coverlay sheet bonding step, hardening bonding is performed in a short time from the viewpoint of productivity. Therefore, the adhesive used for the FPC substrate should have good adhesion, chemical resistance, and electrical insulation even when cured in a short time, and have excellent storage stability at the B stage. Is required.
【０００３】従来、ＦＰＣ用基板の接着剤としては、ア
クリロニトリルブタジエンゴム／エポキシ系、アクリル
ゴム／エポキシ系、アクリロニトリルブタジエンゴム／
フェノール系、ポリエステル／イソシアネート系、ポリ
アミド系等が用いられているが、短時間の硬化において
上記各種の特性がよく、かつ保存安定性に優れるという
相反する特性を付与することは困難であった。Conventionally, adhesives for FPC substrates include acrylonitrile butadiene rubber / epoxy, acrylic rubber / epoxy, acrylonitrile butadiene rubber /
Although phenol-based, polyester / isocyanate-based, polyamide-based, and the like are used, it has been difficult to impart the above-mentioned various properties in curing for a short time and contradictory properties such as excellent storage stability.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記の事情
に鑑みてなされたもので、短時間の硬化をさせた場合で
も接着性、耐薬品性、電気絶縁性が良好で、かつＢステ
ージでの保存安定性に優れているＦＰＣ用基板の接着剤
組成物を提供しようとするものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has good adhesiveness, chemical resistance, and electrical insulation even when cured for a short time, and has a B-stage. It is an object of the present invention to provide an adhesive composition for a substrate for FPC, which is excellent in storage stability at room temperature.
【０００５】[0005]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究を重ねた結果、後述する組成の
接着剤が、上記の目的を達成できることを見いだし、本
発明を完成したものである。Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, have found that an adhesive having a composition described later can achieve the above object, and have completed the present invention. Things.
【０００６】即ち、本発明は、（Ａ）ポリエステルポリ
オール、（Ｂ）ブロックイソシアネート、（Ｃ）エポキ
シ樹脂及び（Ｄ）化２の構造式で示される1,8-ジアザ−
ビシクロ(5,4,0）ウンデセン-7That is, the present invention relates to (A) polyester polyol, (B) blocked isocyanate, (C) epoxy resin and (D) 1,8-diaza-
Bicyclo (5,4,0) undecene-7
【０００７】[0007]
【化２】 と炭素数20以下の有機酸又はフェノール類との塩を必須
成分とし、前記（Ａ）のポリエステルポリオール 100重
量部に対して、前記（Ｂ）のブロックイソシアネートを
10〜40重量部、前記（Ｃ）のエポキシ樹脂を10〜40重量
部、前記（Ｄ）の塩を 0.01 〜 0.3重量部、それぞれ配
合してなることを特徴とするＦＰＣ用基板の接着剤組成
物である。Embedded image And a salt of an organic acid or a phenol having 20 or less carbon atoms as an essential component, and the blocked isocyanate of (B) is added to 100 parts by weight of the polyester polyol of (A).
An adhesive composition for an FPC substrate, comprising 10 to 40 parts by weight, 10 to 40 parts by weight of the epoxy resin (C), and 0.01 to 0.3 part by weight of the salt of (D). Things.
【０００８】以下、本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.
【０００９】本発明に用いる（Ａ）ポリエステルポリオ
ールとしては、特に制限はなく接着剤用として用いられ
ているものは広く使用することができる。具体的なもの
として、例えばニッポラン３０２２（日本ポリウレタン
社製、商品名）、デスモフェン６９０（住友バイエルウ
レタン社製、商品名）等が挙げられ、これらは単独又は
2種以上混合して使用することができる。The polyester polyol (A) used in the present invention is not particularly limited, and those used for adhesives can be widely used. Specific examples include Nipporan 3022 (manufactured by Nippon Polyurethane Co., trade name), Desmophen 690 (manufactured by Sumitomo Bayer Urethane Co., trade name) and the like.
Two or more kinds can be used as a mixture.
【００１０】本発明に用いる（Ｂ）ブロックイソアネー
トとしては、特に制限はなく接着剤用として用いられて
いるものは広く使用することができる。例えば具体的な
ものとしてデスモジュールＢＬ３１７５（住友バイエル
ウレタン社製、商品名）、コロネートＡＰ stable Ｍ
（日本ポリウレタン社製、商品名）等が挙げられ、これ
らは単独又は 2種以上混合して使用することができる。The block isoanate (B) used in the present invention is not particularly limited, and those used for adhesives can be widely used. For example, Death Module BL3175 (manufactured by Sumitomo Bayer Urethane Co., Ltd., trade name), Coronate AP stable M
(Manufactured by Nippon Polyurethane Company, trade name) and the like, and these can be used alone or in combination of two or more.
【００１１】本発明に用いる（Ｃ）エポキシ樹脂として
は、特に制限はなく接着剤用として用いられているもの
は広く使用することができる。例えば具体的なものとし
てエピコート１００１（油化シェルエポキシ社製、商品
名）、エピコート１００４（油化シェルエポキシ社製、
商品名）等が挙げられ、これらは単独又は 2種以上混合
して使用することができる。The epoxy resin (C) used in the present invention is not particularly limited, and those used for adhesives can be widely used. For example, as specific examples, Epicoat 1001 (manufactured by Yuka Shell Epoxy, trade name), Epicoat 1004 (manufactured by Yuka Shell Epoxy,
And the like, and these can be used alone or in combination of two or more.
【００１２】本発明に用いる（Ｄ）の化３の構造式で示
される1,8-ジアザ−ビシクロ（ 5,4,0）ウンデセン-71,8-Diaza-bicyclo (5,4,0) undecene-7 represented by the structural formula (3) of (D) used in the present invention.
【００１３】[0013]
【化３】 と炭素数20以下の有機酸又はフェノール類との塩（以下
ＤＢＵ塩という）としては、例えば、Ｕ−ＣＡＴ ＳＡ
１０２（サンアボット社製、商品名）、Ｕ−ＣＡＴ Ｓ
Ａ１（サンアボット社製、商品名）等が挙げられ、これ
らは単独又は 2種以上混合して使用することができる。Embedded image And salts of organic acids or phenols having 20 or less carbon atoms (hereinafter referred to as DBU salts) include, for example, U-CAT SA
102 (manufactured by Sun Abbott, product name), U-CAT S
A1 (manufactured by Sun Abbot, trade name) and the like, and these can be used alone or in combination of two or more.
【００１４】本発明のＦＰＣ用基板の接着剤組成物は、
ポリエステルポリオール、ブロックイソシアネート、エ
ポキシ樹脂およびＤＢＵ塩を必須成分とするが、本発明
の目的に反しない限度において、また必要に応じて、微
粉末の無機質、有機質の充填剤、顔料等を添加配合する
ことができる。上述した各成分は、メチルエチルケトン
等の溶剤に均一に溶解して容易にＦＰＣ用基板の接着剤
組成物を製造することができる。The adhesive composition for an FPC substrate of the present invention comprises:
The polyester polyol, the blocked isocyanate, the epoxy resin and the DBU salt are essential components. However, as long as the object of the present invention is not adversely affected, and if necessary, inorganic and organic fillers and pigments of fine powder are added and blended. be able to. Each of the above-mentioned components is uniformly dissolved in a solvent such as methyl ethyl ketone, so that an adhesive composition for an FPC substrate can be easily produced.
【００１５】[0015]
【作用】本発明のＦＰＣ用基板の接着剤粗物は、ポリエ
ステルポリオール、ブロックイソシアネート、エポキシ
樹脂の樹脂成分にＤＢＵ塩を添加配合することによっ
て、ブロックイソシアネートの解離を促進コントロール
し、またエポキシ樹脂の硬化を促進させて、例えば温度
160℃，圧力30kg／cm2 ，15分という条件の短時間硬化
でも優れた特性のＦＰＣ用基板の接着剤組成物を得るこ
とができた。According to the present invention, the crude adhesive of the FPC substrate of the present invention is prepared by adding a DBU salt to a resin component of a polyester polyol, a blocked isocyanate and an epoxy resin to promote and control the dissociation of the blocked isocyanate. Accelerate curing, eg temperature
An adhesive composition for an FPC substrate having excellent characteristics was obtained even by curing for a short time at 160 ° C., a pressure of 30 kg / cm 2 and 15 minutes.
【００１６】[0016]
【実施例】次に本発明を実施例によって具体的に説明す
るが、本発明はこれらの実施例によって限定されるもの
ではない。以下の実施例及び比較例において「部」とは
「重量部」を意味する。Next, the present invention will be described specifically with reference to examples, but the present invention is not limited to these examples. In the following Examples and Comparative Examples, “parts” means “parts by weight”.
【００１７】実施例１ ポリエステルポリオールのニッポラン３０２２（日本ポ
リウレタン社製、商品名） 100部、ブロックイソシアネ
ートのデスモジュールＢＬ３１７５（住友バイエルウレ
タン社製、商品名）20部、エポキシ樹脂のエピコート１
００１（油化シェルエポキシ社製、商品名）30部、ＤＢ
Ｕ塩のＵ−ＣＡＴ ＳＡ１０２（サンアポット社製、商
品名） 0.05 部をメチルエチルケトンに溶解してＦＰＣ
用基板の接着剤組成物を製造した。Example 1 100 parts of Nipporan 3022 polyester polyol (manufactured by Nippon Polyurethane Co., Ltd.), 20 parts Desmodur BL3175 of block isocyanate (manufactured by Sumitomo Bayer Urethane Co., Ltd.), Epicoat 1 of epoxy resin
001 (product name, manufactured by Yuka Shell Epoxy) 30 parts, DB
Dissolve 0.05 parts of U salt U-CAT SA102 (manufactured by Sun Apot Co., Ltd.) in methyl ethyl ketone and
An adhesive composition for a substrate for production was produced.
【００１８】実施例２ 実施例１において、充填剤として水酸化アルミニウムの
ハイジライトＨ−４２（昭和電工社製、商品名）12部を
加えた以外は全て実施例１と同一にしてＦＰＣ用基板の
接着剤組成物を製造した。Example 2 An FPC substrate was prepared in the same manner as in Example 1, except that 12 parts of aluminum hydroxide Heidilite H-42 (trade name, manufactured by Showa Denko KK) was added as a filler. Was produced.
【００１９】比較例１ カルボキシ含有アクリロニトリルブタジエンゴムのニポ
ール１０７２（日本ゼオン社製、商品名）50部、臭素化
エポキシ樹脂ＹＤＢ−４００（東都化成社製、商品名）
44部、4,4-ジアミノジフェニルスルホン 6部、イミダゾ
ール２Ｅ４ＭＺ（四国化成社製、商品名） 0.05 部をメ
チルエチルケトンに溶解してＦＰＣ用基板の接着剤組成
物を製造した。Comparative Example 1 50 parts of Nipol 1072 carboxy-containing acrylonitrile-butadiene rubber (trade name, manufactured by Zeon Corporation) and brominated epoxy resin YDB-400 (trade name, manufactured by Toto Kasei Co., Ltd.)
44 parts, 4,4-diaminodiphenylsulfone 6 parts, and imidazole 2E4MZ (trade name, manufactured by Shikoku Chemicals Co., Ltd.) 0.05 part were dissolved in methyl ethyl ketone to prepare an adhesive composition for an FPC substrate.
【００２０】比較例２ 実施例１において、ブロックイソシアネートのデスモジ
ュールＢＬ３１７５（住友バイエルウレタン社製、商品
名）20部の替わりに、ポリイソシアネートのコロネート
Ｌ（日本ポリウレタン社製、商品名）20部を用いた以外
は全て実施例１と同一にしてＦＰＣ用基板の接着剤組成
物を製造した。Comparative Example 2 In Example 1, 20 parts of Coronate L (product name, manufactured by Nippon Polyurethane Co., Ltd.) of polyisocyanate was used instead of 20 parts of Desmodur BL3175 (product name, manufactured by Sumitomo Bayer Urethane Co., Ltd.) of blocked isocyanate. An adhesive composition for an FPC substrate was manufactured in the same manner as in Example 1 except that the adhesive composition was used.
【００２１】実施例１〜２及び比較例１〜２で製造した
ＦＰＣ用基板の接着剤組成物を、厚さ25μm のダイヤホ
イル＃２１Ｊ（ダイヤホイル社製、ポリエステルフィル
ム商品名）に、接着剤組成物の厚みが38μm となるよう
にロールコーターで塗布し、乾燥半硬化させてカバーレ
イシートを作製した。このカバーレイシートと、サブト
ラクト法によりテストパターンを形成したフレキシブル
銅張積層板とを、温度160℃，圧力30kg／cm2 ，15分の
条件で熱プレスで積層成形してＦＰＣ用基板を得た。こ
れらのＦＰＣ用基板について、接着性、耐薬品性、可使
時間の試験を行ったので、その結果を表１に示した。本
発明のＦＰＣ用基板の接着剤組成物は、いずれも優れた
特性を示し本発明の効果が確認された。The adhesive composition of the FPC board manufactured in Examples 1 and 2 and Comparative Examples 1 and 2 was applied to a 25 μm-thick Diafoil # 21J (diafoil Co., polyester film trade name) with an adhesive. The composition was applied with a roll coater so as to have a thickness of 38 μm, and dried and semi-cured to prepare a coverlay sheet. The coverlay sheet and a flexible copper-clad laminate on which a test pattern was formed by a subtractive method were laminated and formed by hot pressing at a temperature of 160 ° C., a pressure of 30 kg / cm 2 and 15 minutes to obtain an FPC substrate. . These FPC substrates were tested for adhesion, chemical resistance and pot life, and the results are shown in Table 1. All of the adhesive compositions for an FPC substrate of the present invention exhibited excellent characteristics, and the effects of the present invention were confirmed.
【００２２】特性の試験は次のようにして行った。接着
性の試験は、ＩＰＣ−ＦＣ−２４０Ｂによって引剥がし
強さを測定した。耐薬品性の試験は、10％水酸化ナトリ
ウム溶液、メタノール、メチルエチルケトンそれぞれに
15分間浸漬し、取り出して20分間放置後、引剥がし強さ
を測定した。可使時間の試験は、温度 5℃に保管し、積
層成形時に回路埋め込み不良が発生するまでの日を示し
た。The characteristics were tested as follows. In the adhesion test, the peel strength was measured by IPC-FC-240B. The chemical resistance test was performed on 10% sodium hydroxide solution, methanol and methyl ethyl ketone.
After soaking for 15 minutes, taking out and leaving for 20 minutes, the peel strength was measured. The test of the pot life was stored at a temperature of 5 ° C., and the days until circuit embedding failure occurred during lamination molding were shown.
【００２３】[0023]
【表１】 [Table 1]
【００２４】[0024]
【発明の効果】以上の説明及び表１から明らかなよう
に、本発明のＦＰＣ用基板の接着剤組成物は、短時間硬
化で接着性、耐薬品性に優れ、かつ保存安定性のよいも
ので、この組成物を使用することによって、信頼性の高
い電気機器を製造することができる。As is clear from the above description and Table 1, the adhesive composition for an FPC substrate of the present invention is one which cures in a short time, has excellent adhesion and chemical resistance, and has good storage stability. By using this composition, a highly reliable electric device can be manufactured.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/38 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 3/38
Claims (1)
(5,4,0）ウンデセン-7 【化１】 と炭素数20以下の有機酸又はフェノール類との塩を必須
成分とし、前記（Ａ）のポリエステルポリオール 100重
量部に対して、前記（Ｂ）のブロックイソシアネートを
10〜40重量部、前記（Ｃ）のエポキシ樹脂を10〜40重量
部、前記（Ｄ）の塩を 0.01 〜 0.3重量部、それぞれ配
合してなることを特徴とするフレキシブル印刷回路用基
板の接着剤組成物。1. A polyester polyol (A), a blocked isocyanate (B), an epoxy resin (C) and a 1,8-diaza-bicyclo compound represented by the structural formula (D)
(5,4,0) undecene-7 And a salt of an organic acid or a phenol having 20 or less carbon atoms as an essential component, and the blocked isocyanate of (B) is added to 100 parts by weight of the polyester polyol of (A).
10 to 40 parts by weight, 10 to 40 parts by weight of the epoxy resin (C), and 0.01 to 0.3 parts by weight of the salt of (D), respectively. Composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03007992A JP3176116B2 (en) | 1992-01-21 | 1992-01-21 | Adhesive composition for flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03007992A JP3176116B2 (en) | 1992-01-21 | 1992-01-21 | Adhesive composition for flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05198940A JPH05198940A (en) | 1993-08-06 |
| JP3176116B2 true JP3176116B2 (en) | 2001-06-11 |
Family
ID=12293794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03007992A Expired - Fee Related JP3176116B2 (en) | 1992-01-21 | 1992-01-21 | Adhesive composition for flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3176116B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3388619B2 (en) * | 1993-12-24 | 2003-03-24 | 株式会社イノアックコーポレーション | How to use two-component polyurethane adhesive |
| AU2638999A (en) | 1998-02-19 | 1999-09-06 | Hitachi Chemical Company, Ltd. | Novel compounds, hardening accelerator, resin composition, and electronic part device |
-
1992
- 1992-01-21 JP JP03007992A patent/JP3176116B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05198940A (en) | 1993-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI486372B (en) | Resin composition | |
| JP4588834B2 (en) | Phosphorus-containing epoxy resin composition, flame-retardant resin sheet using the phosphorus-containing epoxy resin, metal foil with resin, prepreg and laminate, multilayer board | |
| CN101268163B (en) | Bonding agent composition, bonding agent tablet using same and its uses | |
| US5718039A (en) | Method of making multilayer printed wiring board | |
| EP1453364A1 (en) | Film for circuit board | |
| US5674611A (en) | Adhesive for copper foils and an adhesive-applied copper foil | |
| JP3676375B2 (en) | Copper foil with resin for multilayer printed wiring board and multilayer printed wiring board using the copper foil | |
| JP2009096940A (en) | Flame-retardant adhesive composition, coverlay, adhesive sheet, and flexible printed wiring board | |
| JP2006290997A (en) | Thermosetting resin composition, adhesive sheet using the composition and adhesive sheet with copper foil | |
| TWI707611B (en) | Resin sheet with supporting body and manufacturing method of built-in circuit board of parts using it | |
| JP2009167396A (en) | Adhesive composition, copper-clad laminate plate using the same, cover-lay film and adhesive sheet | |
| JP2011105916A (en) | Prepreg, multilayer printed wiring board, and flexible printed wiring board | |
| JP3176116B2 (en) | Adhesive composition for flexible printed circuit board | |
| JP4411876B2 (en) | Adhesive composition for semiconductor device, adhesive sheet and coverlay film using the same, and copper-clad polyimide film | |
| KR20140146542A (en) | Method for manufacturing component-embedded wiring substrate and semiconductor device | |
| JP4425118B2 (en) | Flame retardant resin composition, metal-clad laminate for flexible printed wiring board using the composition, coverlay, adhesive sheet, and flexible printed wiring board | |
| JP2722402B2 (en) | Adhesive composition for flexible printed circuit boards | |
| JP2650158B2 (en) | Adhesive composition for flexible printed circuit board | |
| KR20050094048A (en) | Thermo-activated adhesive material for fpcb agglutinations | |
| JP2022017947A (en) | Thermosetting adhesive sheet and use thereof | |
| JP2007073737A (en) | Printed wiring board having a plurality of conductive circuit layers | |
| JP3065682B2 (en) | Flexible printed circuit board | |
| JP2005272567A (en) | Adhesive composition for semiconductor device and coverlay film using it, adhesive sheet and copper-clad polyimide film using it | |
| JP2755158B2 (en) | Coverlay film | |
| KR101102218B1 (en) | Resine composition and prepreg and printed wiring board using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |