JP3174969B2 - Micro probe element, integrated micro probe element, and scanning tunneling microscope and information processing apparatus using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a micro-probe element used for a tunnel current detecting device, a scanning tunnel microscope, and the like, and an information processing apparatus using the same.

[0002]

2. Description of the Related Art In recent years, a scanning tunneling microscope (hereinafter referred to as STM) capable of directly observing the electronic structure of surface atoms of a conductor.
(Abbreviated as G. Binnig et a)
l. Phys. Rev .. Lett. 49 (198
2) 57), real space images can be measured with remarkably high resolution (not more than nanometers) irrespective of single crystal or amorphous. Further, at present, observation and evaluation of atomic order and molecular order of semiconductors or polymer materials, and fine processing (EE Ehrichs, 4th.
international Conference on
Scanning Tunneling Micro
scopy / Spectroscopy, '89, S1
3-3) and applications to various fields such as information processing devices are being studied.

In particular, the demand for recording / reproducing devices having a large capacity in computer calculation information and the like is increasing more and more. Due to the progress of semiconductor process technology, microprocessors have been downsized and the computing capability has been improved. There is a demand for miniaturization. For the purpose of satisfying these requirements, the work function of the surface of the recording medium is changed by applying a voltage from a converter comprising a probe for generating a tunnel current which is present on a driving means capable of finely adjusting the distance to the recording medium. There has been proposed an information processing apparatus in which recording and writing are performed and information is read out by detecting a change in tunnel current due to a change in work function, and the minimum recording area is 10 nm square.

In such an apparatus, a sample is measured with a probe by several n.
Scanning must be performed in the range of m to several μm, and a piezoelectric element is used as a moving mechanism at that time. For this example,
The three piezoelectric elements are combined so as to be orthogonal to each other along the x, y, and z directions, and the electrodes on the outer peripheral surface of a tripod-type or cylindrical-type piezoelectric element having a probe arranged at the intersection are divided. And one end is fixed, a probe is attached to the other end, and the cylinder is deformed and scanned according to each divided electrode.

[0005] More recently, a micromachining technology (KE Peterso) utilizing a semiconductor processing technology has been developed.
n, IEEE Trans. on Electron
Devices, Vol. ED-25, No. 10, p
1241, 1978) to form a fine probe drive mechanism. FIG. 7 shows an example in which a cantilever composed of a piezoelectric bimorph is formed on a Si substrate by micromachining technology (TR Albre).
cht, "Microfabrication of I
integrated Scanning Tunnel
ing Microscope ", Proceedin
g of 4th International Co
nference on Scanning Tunn
eling Microscopy / Spectros
copy, '89, S10-2).

FIG. 7 is a perspective view of the cantilever.
Two divided electrodes 71a, 71b-ZnO piezoelectric body 7 on substrate 1
2a-medium electrode 73-ZnO piezoelectric body 72b-2 divided electrode 7
4a, 74b, and a portion of the underlying Si substrate is removed by anisotropic etching to remove Si.
It is formed so as to be cantilevered from the end of the substrate. A probe 5 made of metal or the like is attached to the tip of the cantilever made of the piezoelectric bimorph by bonding or the like, and detects a tunnel current via a lead electrode 75. Since this cantilever has a bimorph configuration, it has an excellent characteristic that a large amount of displacement can be obtained particularly in the vertical direction.

Further, a probe driving mechanism formed of a piezoelectric bimorph structure by such a micromachining technique can be made fine, and a plurality of probes required to improve the speed of writing and reading information in an information processing apparatus are provided. It is possible to facilitate the conversion. Further, this method can be directly incorporated into an IC process mainly using a Si semiconductor in that the thin film technology of a piezoelectric material is used.
This is an excellent method.

[0008]

However, in the fabrication of the conventional device shown in FIG. 7, since many layers of electrodes and piezoelectric bodies are laminated, the thickness and stress of each layer must be sufficiently controlled. No. This is because the cantilever manufactured by etching and removing the Si substrate may peel off at the interface between the electrode and the piezoelectric body or warp at the tip of the cantilever depending on the thickness and stress of each layer. is there. Therefore, in order to produce with good reproducibility,
Very advanced technology was required.

[0009] Further, in the above-described tribod-type or cylindrical-type piezoelectric displacement elements, when they are miniaturized due to integration or the like, large displacements cannot be obtained or manufacturing is difficult. there were.

In view of the above-mentioned problems of the prior art, it is an object of the present invention to provide a highly reliable microprobe element which is small in size, provides a large displacement, and has no warp. It is to manufacture and provide with good reproducibility by technology.

Another object of the present invention is to provide a highly reliable scanning tunnel microscope and an information processing apparatus using the above-mentioned micro probe element.

[0012]

The above objects can be attained by the present invention described below.

That is, the first aspect of the present invention is to provide a probe and a heater.
Comprising a displacement generating unit having the liquid by heating of the heater
A microprobe element having a configuration in which the probe is driven by expanding and contracting a body , and further comprising a plurality of the microprobe elements arranged on the same substrate. It is a micro probe element.

[0014] A second aspect of the present invention is a scanning tunnel microscope using the above-described microprobe element of the first aspect of the present invention.

A third aspect of the present invention is characterized in that the above-described first microprobe element of the present invention is used in an information processing apparatus for recording, reproducing, and erasing information on a recording medium using a tunnel current. Is an information processing apparatus.

FIG. 1 shows an example of the microprobe element of the present invention. FIG. 1A is a cross-sectional view schematically showing a device fabricated on a substrate, and FIG. 1B schematically shows a cylinder portion and a piston portion, which are main components of the device. FIG.

In the figure, reference numerals 1a, 1b, and 1c denote substrates, which are processed to form cylinders therein. 2 Displacement generator that also serves as a role of a piston, 3 is a liquid for transmitting the displacement of the displacement generating unit 2, the beam is that also serves the role of the piston 4, 5 is the probe.

The outline of the operation of the microprobe element shown in FIG. 1 will be described below. The displacement generated by the displacement generator 2 is the substrate 1a,
It is transmitted to the beam 4 via a liquid 3 sealed in a cylinder formed inside 1b, 1c. At this time, the displacement is enlarged (in the case of FIG. 1) or reduced depending on the ratio of the cross-sectional area of the cylinder between the displacement generating section 2 and the beam 4. A probe 5 is attached to the beam 4, and the displacement is transmitted to the probe 5.

Next, an outline of a method for manufacturing the microprobe element shown in FIG. 1 will be described. First substrate 1b, and 1c, the desired cylinder shape by processing so as to obtain when assembled, incorporating a displacement of generator 2. Further, the beam 4 is manufactured, and the probe 5 is attached. Thereafter, the substrate 1b and the substrate 1c are bonded and sandwiched so that one end of the beam 4 is inserted into the cylinder. Finally, after injecting the liquid 3 into the cylinder, the substrate 1a is adhered and the cylinder is sealed to produce an element.

The method for manufacturing the microprobe element of the present invention is not limited to the above. For example, the method for forming the cylindrical shape may include a method of manufacturing and bonding a substrate, a method of die cutting, A method by shaving or the like can be applied, and the method is not limited. In particular, a method in which a substrate is processed by photolithography and etching is suitable for manufacturing a large number of small cylinders. The material of the substrate and the beam 4 is not particularly limited, and glass, metal, or a semiconductor such as silicon with good workability is suitable.

Displacement generator 2 of micro probe element of the present invention
Is Ru can be applied what occurs displacement by forces such as expansion and contraction and vaporization of the liquid by the pressurized heat.

As the liquid 3 for transmitting the displacement, oil, water, or the like is used. However, the liquid 3 is not particularly limited as long as the properties such as viscosity are appropriate under the conditions of use.

Further, the probe 5 of the micro probe element of the present invention
As a material, noble metals such as Pt, Au, Rh, and Pd, metals such as W, alloys thereof, and TiC are used. The probe can be manufactured by adhering a small piece of the above material or depositing a thin film of the above material and then processing it into a desired form by etching or electrolytic polishing if necessary.

Since the microprobe element of the present invention does not have a complicated layer structure, there is no problem such as warpage and a high production yield. Also, by changing the ratio of the cross-sectional areas of the cylinders, the magnitude of the displacement of the displacement generating portion can be changed to a desired size and transmitted to the probe, so that even when the displacement obtained by the displacement generating portion is small. A large displacement can be given to the probe.

Next, FIG. 2 shows an example of a block diagram of a scanning tunneling microscope using the above-described micro probe element according to the present invention. In this apparatus, the sample 2 is
After the probe 5 is moved closer to the sample 2 (Z direction in the figure), the x- and y-directions in the plane of the sample 22 are scanned by an xy stage 23, and a bias voltage applying circuit 24 is applied to the probe 5 and the sample 22. More voltage is applied, and the tunnel current observed at that time is read out by the tunnel current detection circuit 25, and an image is observed. The drive control circuit 26 controls the distance between the sample 22 and the probe 5 and the drive control of the xy stage 23. Sequence control of these circuits is performed by the CPU 27.

More specifically, when the probe 5 is brought close to the surface of the sample 22 and the surface has conductivity, when the distance between the probe 5 and the sample 22 is reduced to about several nm, the probe 5 is closed. A tunnel current flows between the sample and the sample 22. Since this tunnel current changes exponentially depending on the distance between the tip of the probe 5 and the sample 22, the tunnel current is taken out by the tunnel current detection circuit 25 and amplified, and the microprobe 2
By applying feedback to the drive voltage of No. 1, the distance between the tip of the probe 5 and the surface of the sample 22 can be kept constant. By minutely displacing the microprobe element 21 in the x and y directions in such a state, it is possible to observe irregularities on the microscopic surface due to a change in the feedback voltage.

Although not shown in the figure, the scanning mechanism by the xy stage 23 is performed by using a control mechanism such as a cylindrical piezo actuator, a parallel spring, an operating micrometer, a voice coil, and an inch worm. .

Next, FIG. 3 shows an example of a schematic diagram of an information processing apparatus capable of recording / reproducing information using an integrated microprobe element in which a plurality of microprobe elements according to the present invention are manufactured on the same substrate . to show.

In FIG. 1, reference numeral 31 denotes a recording layer whose resistance changes when a voltage is applied, 32 denotes a metal electrode layer, and 33 denotes a recording medium substrate. 34 is an XY stage, 35 is an integrated microprobe element according to the present invention, 36 is a support for the integrated microprobe element 35, and 37 is an integrated microprobe element 35
Linear actuator for coarsely moving
Reference numerals 8 and 39 denote linear actuators for driving the XY stage 34 in the X and Y directions, respectively. Reference numeral 40 denotes a bias circuit for recording and reproduction. 41 is a tunnel current detection circuit, 42
Reference numeral 43 denotes a servo circuit for moving the integrated microprobe element 35 in the Z direction. Reference numeral 43 denotes a servo circuit for driving the actuator 37. Reference numeral 44 denotes a driving circuit for minutely displacing each minute probe element.
Reference numeral 5 denotes a drive circuit for controlling the position of the XY stage 34. A CPU 46 controls these operations.

By performing substantially the same operation as the above-mentioned scanning tunneling microscope using such a system, n
Large-capacity, high-density recording / reproduction with m-order recording density,
Erasing can be performed, and high-speed recording and reproduction can be performed by simultaneously scanning the integrated small probe elements as shown in FIG.

[0031]

Next, the present invention will be described in detail with reference to examples. Examples 1, 2 and 4 are reference examples.
This is an example.

[0032] Example 1 This example is related to infinitesimal probe element shown in FIG.

The method for manufacturing the microprobe element manufactured in this embodiment will be described below. First, the substrates 1b and 1c
Was processed into a desired cylinder shape as shown in FIG. 1 by later bonding. Silicon was used as a material for the substrates 1b and 1c, and processing was performed by photolithography and etching with an aqueous solution of potassium hydroxide. The displacement generator 2 made of a PZT piezoelectric body was incorporated in this. In addition, a beam 4 was formed using the same method and material as those of the substrates 1b and 1c. Although not shown in the figure, a probe 5 was attached after forming a lead electrode. Probe 5 is Pt, Rh, W
Adhering metal pieces such as or depositing and processing a metal film,
It is formed in a needle shape.

Next, one end of the beam 4 to which the probe 5 is attached is inserted into a cylinder as shown in the drawing, and the substrates 1b and 1c are inserted.
Glue and sandwich. The other end was free to move in the X direction in the figure, and was provided with a groove in the substrates 1b and 1c and sandwiched. Finally, after the liquid 3 was injected into the cylinder, the substrate 1a was bonded and sealed. The substrate 1a is made of silicon,
In this embodiment, an oil such as a nonflammable phosphate-based hydraulic oil is used as the liquid 3. A micro probe element was manufactured as described above.

A small manipulator was used for assembling the above elements. As the manipulator, in addition to a mechanical type, a micromanipulator using a piezoelectric element can be used when the element is minute (T. OHNISHI et. Al. Jpn. J. Ap.
pl. Phys. 29 (1990) L188).

The main structural dimensions and the like of the microprobe element manufactured in this embodiment are shown below.

The length of the beam 4 is 4 mm. The cross section of the beam 4 is 0.2 mm.times.0.2 mm. The cross section of the cylinder is 4 mm.times.4 mm. In the microprobe element of this embodiment, a large displacement can be obtained in the x direction in the figure. For example, by applying a voltage of 10 V to the displacement generator 2 made of, for example, a piezoelectric body, the probe 5 was displaced by ± 1 μm in the X direction in the drawing.

Next, the scanning tunneling microscope shown in FIG. 2 was manufactured using the above-mentioned micro probe element.

With this apparatus, the surface of the sample 22 was observed using a HOPG (graphite) plate. A DC voltage of 200 mV is applied between the probe 5 and the sample 22 by the bias voltage applying circuit 24, and in this state, the probe 5
And the surface was observed from the signal detected using the tunnel current detection circuit 25. Set the scan area to 0.
When observed as 5 μm × 0.5 μm, a good atomic image could be obtained. As described above, the operation based on the STM principle was confirmed, and the surface observation operation was confirmed.

Next, a plurality of the aforementioned microprobe elements were manufactured on the same silicon substrate to manufacture an integrated microprobe element. Such an integrated microprobe element can be manufactured by expanding the photolithographic pattern in the manufacturing method described above.

Next, the information processing apparatus shown in FIG. 3 was manufactured using the integrated microprobe element.

In this embodiment, a quartz glass substrate is used as the recording medium substrate 33, and Cr is deposited thereon by 50 mm by a vacuum evaporation method as a metal electrode 32, and A is further deposited thereon.
u is deposited by the same method at 300 °, and a medium having an electric memory effect in which four layers of SOAZ (squarylium-bis-6-octylazulene) are laminated thereon by the Langmuir-Blodgett method is used for the recording layer 31. Was.

In the present apparatus, when the probe 35 is brought close to the recording layer 31 to a predetermined interval, and a voltage exceeding a threshold value causing a change in conductivity, for example, a rectangular pulse voltage of 3 V and a width of 50 ns is applied to the recording layer 31. In addition, the characteristics of the recording layer 31 change, and a portion having a low electric resistance is generated. The information is recorded by performing this operation while scanning the recording layer 31 with the probe 35 using the XY stage 34.

When erasing recorded information, the probe 35 is brought close to a recording bit on the recording layer 31 up to a predetermined interval, and when a voltage exceeding a threshold value, for example, a triangular wave pulse voltage of 7 V and a width of 50 ns is applied, the recording bit changes in characteristics. Then, the electrical resistance becomes the same value as the portion without the recording bit, and the recording bit is erased.

When reproducing the recorded information, the probe 35
And the recording layer 31 at a predetermined interval, and a voltage that does not exceed a threshold voltage that causes a change in conductivity in the recording layer 31, for example, 20
A DC voltage of 0 mV is applied between the probe 35 and the recording layer 31. In this state, the tunnel current signal detected by the tunnel current detection circuit 41 during scanning by the probe 35 along the print data sequence on the print layer 31 corresponds to the print data signal. Therefore, a reproduced data signal can be obtained by current-to-voltage conversion of the detected tunnel current signal.

It was confirmed that writing, reading and erasing of recorded information could be performed stably with good reproducibility at a recording density of nm order by the above-mentioned apparatus.

The recording layer 31 for recording information can be used as long as it has a memory switching phenomenon (electric memory effect).

The electric memory effect referred to here means at least two or more different resistance states corresponding to the application of a voltage, and a voltage or current exceeding a threshold value that changes the conductivity of the recording layer is applied between the states. This means that the resistance state can be freely changed, and each obtained resistance state can be maintained as long as a voltage or current that does not exceed the threshold is applied.

Embodiment 2 FIG. 4 is a schematic view of a microprobe element manufactured in this embodiment.

FIG. 4A is a cross-sectional view schematically showing a device fabricated on a substrate, and FIG. 4B schematically shows a cylinder and a piston, which are main components of the device. FIG. In the drawings, reference numerals 1a, 1b, and 1c denote substrates, and a cylinder is formed inside the substrate by processing and bonding. Reference numerals 2a and 2b denote displacement generating portions also serving as pistons, and 3a and 3b denote displacement generating portions 2a and 2
Liquid for transmitting the displacement of b, 4a and 4b also serve as pistons, and 5 is a probe.

The method for manufacturing the microprobe element of this embodiment will be described below. First, the substrates 1b and 1c were processed into a desired cylinder shape as shown in FIG. At the same time, the substrate 1a was also processed into a desired cylinder shape. Silicon was used as a material for the substrates 1a, 1b, and 1c, and processing was performed by photolithography and etching with a potassium hydroxide aqueous solution. The displacement generators 2a and 2b made of a piezoelectric material were incorporated in this. Also, beams 4a and 4b were formed using the same method and material as the substrates 1a, 1b and 1c, and the probe 5 was attached after forming a lead electrode (not shown). Probe 5 is Pt, R
A metal piece such as h or W is bonded or a metal film is deposited and processed to form a needle shape.

Next, one end of the beam 4a to which the probe 5 is attached is inserted into a cylinder as shown in FIG.
c was bonded and sandwiched. The other end was free to move in the X direction in the figure, and was provided with a groove in the substrates 1b and 1c and sandwiched. Next, after injecting the liquid 3a into the cylinder, the substrate 1a was bonded and sealed. At this time, FIG.
As shown in (1), one end of the beam 4b was inserted into a cylinder formed in the substrate 1a. Thereafter, the liquid 3b was injected into the cylinder, and a displacement generating section 2b made of a piezoelectric material was further incorporated therein and sealed. In this embodiment, an oil such as a phosphate-based hydraulic oil is used as the liquids 3a and 3b.
A micro probe element was manufactured as described above.

In the microprobe element of this embodiment, a large displacement can be obtained in the X and Z directions in the figure by the two sets of pistons and cylinders. However, as shown in FIG. 4B, the micro probe element as in this embodiment has a feature that it can be driven in two axial directions. However, when a displacement is applied, the beams 4a, 4b May be slightly bent, and the amount of displacement may be slightly restricted due to the generation of a force in the opposite direction to the displacement.

The main structural dimensions and the like of the microprobe element manufactured in this embodiment are shown below.

The length of the beam 4a is 4 mm. The length of the beam 4b is 2 mm. The cross section of the beams 4a and 4b is 0.2 mm × 0.2.
mm ・ Cross section of cylinder portions 3a and 3b 3mm × 5mm The microprobe element thus manufactured is configured such that the probe 5 is moved by applying a voltage of 10V to the displacement generating portions 2a and 2b made of piezoelectric bodies. ± 1 μm in the direction, ± in the X direction
The displacement was 0.5 μm.

Next, the same scanning tunneling microscope and information processing apparatus as in Example 1 were manufactured using the microprobe element of this example. Experiments such as surface observation and information recording / reproduction were performed in the same manner as in Example 1 using these devices, and good results were obtained as in Example 1.

Embodiment 3 FIG. 5 is a sectional view schematically showing a microprobe element manufactured in this embodiment.

In the figures, reference numerals 1a, 1b, 1c and 1d denote substrates, and a cylinder is formed inside the substrate by processing and bonding. Reference numerals 2a and 2b denote displacement generating units, which in this embodiment are heaters for expanding the liquid by heating. 3a and 3b are liquids for expanding and contracting by heating by a heater to generate displacement and transmitting the displacement,
Reference numerals a and 4b denote beams that also serve as pistons, and reference numeral 5 denotes a probe. Although not shown in the figure, the elements are cooled and maintained at a constant temperature by a Peltier element or the like provided outside, and expanded by heating with a heater.
b is immediately cooled and contracts to its original volume.

The method for manufacturing the microprobe element of this embodiment will be described below. First, 1c and 1d were processed into a desired cylinder shape as shown in FIG. At the same time, the substrate 1b was also processed into a desired cylinder shape. As a material for the substrates 1a, 1b, 1c and 1d, a metal material having a high thermal conductivity was used and processed by photolithography and etching. Further substrate 1
Displacement generating parts 2a and 2b composed of heaters were incorporated in b and 1a. Also, beams 4a and 4b were formed using the same method and material as the substrates 1a, 1b, 1c and 1d, and a probe 5 was attached after forming a lead electrode (not shown). The probe 5 is formed by bonding a metal piece such as Pt, Rh, W or the like or depositing and processing a metal film to form a needle.

Next, one end of the beam 4a to which the probe 5 is attached is inserted into the cylinder as shown in FIG.
d was adhered and sandwiched. The other end was freely movable in the X direction in the drawing, and was provided with a groove in the substrates 1c and 1d and sandwiched between them.

Next, after the liquid 3a was injected into the cylinder, the substrate 1b was bonded and sealed. At this time, as shown in FIG. 5, one end of the beam 4b was inserted into a cylinder formed in the substrate 1b. Thereafter, the liquid 3b was injected into the cylinder, and the substrate 1a in which the displacement generating section 2b including a heater was incorporated was bonded and sealed. The liquids 3a, 3
In this embodiment, oil such as non-combustible phosphate ester-based hydraulic oil is used as b. A micro probe element was manufactured as described above. In the microprobe element of this embodiment, a large displacement can be obtained in the X and Z directions in the figure.

The length and cross section of the beams 4a and 4b of the microprobe element manufactured in this embodiment and the cross section of each cylinder are the same as those in the second embodiment.

By applying a voltage of 5 V to the displacement generators 2a and 2b, which are heaters, the microprobe element manufactured in this manner moves the probe 5 by ± 1 μm in the Z direction in FIG.
The displacement was ± 0.5 μm in the X direction.

Next, the same scanning tunneling microscope and information processing apparatus as in Example 1 were manufactured using the microprobe element of this example. Experiments such as surface observation and information recording / reproduction were performed in the same manner as in Example 1 using these devices, and good results were obtained as in Example 1.

Embodiment 4 FIG. 6 is a sectional view schematically showing a microprobe element manufactured in this embodiment.

In this embodiment, the cylinder is manufactured separately from the substrate, and is later incorporated into the substrate. In FIG. 6, 6
Reference numerals 1a and 61b denote cylinders, and 1 denotes a substrate, which also serves as a frame for fixing the element by processing. Reference numerals 2a and 2b denote displacement generating parts also serving as pistons, 3a and 3b denote liquids for transmitting displacement, 4a and 4b beams serving as pistons, and 5 a probe.

The method for manufacturing the microprobe element of this embodiment will be described below. First, the substrate 1 was processed into a desired frame shape as shown in FIG. The substrate 1 was made of aluminum and was machined by grinding and polishing. Next, the cylinders 61a and 61
b was made of glass. Beams 4a and 4b were made of the same method and material as the substrate 1, and a probe 5 was attached after forming a lead electrode (not shown). Probe 5 is P
A metal piece such as t, Rh, W, or the like is formed into a needle shape by bonding or depositing and processing a metal film.

Next, the beams 4a and 4b to which the probe 5 is attached
As shown in the figure, the ends were inserted into the cylinders 61a and 61b, and after the liquids 3a and 3b were injected into the cylinders 61a and 61b, the displacement generating parts 2a and 2b made of a piezoelectric material were further incorporated and sealed.
In this embodiment, an oil such as a phosphate-based hydraulic oil is used as the liquids 3a and 3b. Finally, as shown in FIG. 6, it is incorporated into a frame-shaped substrate, and in this case, the beam 4a
An element was manufactured such that one end not inserted into the cylinder could freely move in the X direction in the figure.

In the micro probe device of this embodiment, a large displacement can be obtained in the X and Z directions in the figure.

The main structural dimensions and the like of the microprobe element manufactured in this embodiment are shown below.

The length of the beam 4a is 10 mm. The length of the beam 4b is 5 mm. The cross section of the beams 4a and 4b is a circle having a diameter of 0.4 mm. The cross section of the cylinder portion is a circle having a diameter of 8 mm. The microprobe element applies a voltage of 10 V to the displacement generating portions 2a and 2b made of piezoelectric bodies, thereby moving the probe 5 within ± 1 μm in the Z direction and ± 1 μm in the X direction.
The displacement was 0.5 μm.

Next, the same scanning tunneling microscope and information processing apparatus as in Example 1 were manufactured using the microprobe element of this example. Experiments such as surface observation and recording / reproduction of information were performed using this apparatus in the same manner as in Example 1. As a result, good results were obtained as in Example 1.

[0073]

As described above, according to the micro probe device of the present invention, a large displacement can be obtained while being small, and a highly reliable device without warpage can be obtained.

Further, it can be manufactured with a simple technique with good reproducibility.
Integration has become easier. Further, the scanning tunneling microscope using the micro probe element of the present invention enables highly reliable image observation.

Further, the information processing apparatus using the micro probe element of the present invention becomes a large-capacity, high-density apparatus having a recording density on the order of nm, and can perform high-speed recording and reproduction. .

[Brief description of the drawings]

FIG. 1 is a diagram schematically showing an example of a microprobe element according to the present invention.

FIG. 2 is a block diagram showing an example of a scanning tunnel microscope according to the present invention.

FIG. 3 is a diagram schematically illustrating an example of an information processing apparatus according to the present invention.

[4] The micro probe element according to a reference embodiment is a view schematically showing.

FIG. 5 is a diagram schematically showing another embodiment of the microprobe element according to the present invention.

6 is a diagram schematically showing a micro probe element according to a reference example.

FIG. 7 is an example of a conventional cantilever type displacement element composed of a piezoelectric bimorph.

[Explanation of symbols]

 1, 1a, 1b, 1c, 1d Substrate 2, 2a, 2b Displacement generator 3, 3a, 3b Liquid for transmitting displacement 4, 4a, 4b Beam 5 Probe 21 Micro probe element 22 Sample 23 XY stage 24 Bias Voltage application circuit 25 Tunnel current detection circuit 26 Drive control circuit 27 CPU 31 Recording layer 32 Metal electrode layer 33 Recording medium substrate 34 XY stage 35 Integrated microprobe element 36 Support 37 Z-direction coarse movement linear actuator 38 X-direction drive linear actuator 39 Y-direction drive linear actuator 40 Bias circuit 41 Tunnel current detection circuit 42 Z-direction drive servo circuit 43 Servo circuit 44 Drive circuit 45 Drive circuit 46 CPU 61a, 61b Cylinder 71a, 71b Split electrode 72a, 72b ZnO piezoelectric body 73 Medium electrode 7 4a, 74b 2 split electrode 75 Leader electrode

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification code FI G12B 21/22 H01J 37/28 Z H01J 37/28 G12B 1/00 601H (56) References JP-A-63-85392 (JP, A) JP-A-1-220701 (JP, A) JP-A-4-78037 (JP, A) JP-A-2-91992 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) ) G01N 13/10-13/24 G01B 7/34 G11B 9/00 G12B 21/00-21/24 G05D 3/00-3/20 H01J 37/28 H01L 41/00-41/22 JICST file (JOIS)

Claims (4)

(57) [Claims] 1. A displacement generator having a probe and a heater , wherein the heater expands and contracts a liquid by heating the heater.
A microprobe element having a configuration for driving the probe. 2. The microprobe element according to claim 1,
An integrated microprobe element, wherein a plurality of microprobe elements are arranged on the same substrate. 3. A scanning tunneling microscope using the microprobe element according to claim 1 or 2. 4. An information processing apparatus for recording, reproducing, and erasing information on a recording medium using a tunnel current, wherein the microprobe element according to claim 1 or 2 is used. apparatus.