JP3173388B2 - Resin molding die equipment - Google Patents
Resin molding die equipmentInfo
- Publication number
- JP3173388B2 JP3173388B2 JP25413996A JP25413996A JP3173388B2 JP 3173388 B2 JP3173388 B2 JP 3173388B2 JP 25413996 A JP25413996 A JP 25413996A JP 25413996 A JP25413996 A JP 25413996A JP 3173388 B2 JP3173388 B2 JP 3173388B2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- sleeve
- void
- resin molding
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1703—Introducing an auxiliary fluid into the mould
- B29C45/1734—Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1703—Introducing an auxiliary fluid into the mould
- B29C45/1734—Nozzles therefor
- B29C2045/1737—Pin-in-sleeve devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は樹脂成型品内部にガ
スを注入して、中空部分のある成型品を得る樹脂成形金
型装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding apparatus for injecting a gas into a resin molded product to obtain a molded product having a hollow portion.
【０００２】[0002]
【従来の技術】近年、樹脂成型品製造においては、ひ
け、そり等の外観不良を改善するため、射出後、厚肉部
にガスを注入して中空品を得る中空成型法が広く利用さ
れつつある。2. Description of the Related Art In recent years, in the production of resin molded products, a hollow molding method for obtaining hollow products by injecting gas into a thick portion after injection to improve appearance defects such as sink marks and warpage has been widely used. is there.
【０００３】以下にボイド（中空核）を形成させる為に
必要なガスを注入するための従来の固定ピン方式による
樹脂成型金形装置について説明する。[0003] A conventional resin molding apparatus using a fixed pin method for injecting a gas necessary to form a void (hollow core) will be described below.
【０００４】図２は従来の樹脂成形金型装置における固
定ピンの組み込み状態を示す要部断面図である。ピン１
の先端１ａは尖っており、反対の端面にはツバ１ｂがあ
り、ここにはガスが通るためのスリット１ｃが設けられ
ている。このピン１を押さえるようにスリーブ２があ
り、この一端はピンと同様にツバ２ａが設けられてお
り、内面にはピン１との間に隙間２ｂが設けられてい
る。また、ピン１の先端部１ａとスリーブ２の先端３に
もわずかの隙間が設けられている。そしてスリーブ２は
インサート４によって、可動側型板５に組み込まれてい
る。この可動側型板５と固定側型板６によってキャビテ
ィ７が構成されている。スリーブ２のツバ部２ａの下に
はＯ−リング８が組み込まれ、可動側型板５よりのガス
回路９がピン１のツバ部１ｂにつながっている。また、
スリーブ２の先端外周２ｃはキャビティ内に突き出た形
になっている。FIG. 2 is a cross-sectional view of a main part showing a state in which fixing pins are incorporated in a conventional resin molding die apparatus. Pin 1
Has a point 1a, and a flange 1b is provided on the opposite end face, and a slit 1c through which gas passes is provided. A sleeve 2 is provided so as to press the pin 1. One end of the sleeve 2 is provided with a flange 2 a like the pin 2, and a gap 2 b is provided between the sleeve 2 and the pin 1 on the inner surface. A slight gap is also provided between the tip 1a of the pin 1 and the tip 3 of the sleeve 2. The sleeve 2 is incorporated into the movable mold plate 5 by the insert 4. A cavity 7 is constituted by the movable mold plate 5 and the fixed mold plate 6. An O-ring 8 is incorporated below the collar 2 a of the sleeve 2, and a gas circuit 9 from the movable mold plate 5 is connected to the collar 1 b of the pin 1. Also,
The outer periphery 2c of the distal end of the sleeve 2 has a shape protruding into the cavity.
【０００５】次に、上記金型装置を用いた従来の成形方
法について説明する。金型内に射出された樹脂はキャビ
ティと接触した面から急速に固化が始まり、固化樹脂１
０となるが、ピン１の先端部１ａではまだ溶融状態であ
る。この時、ガス回路９よりガスを供給すると、ガスは
ピン１とスリーブ２の隙間より、溶融樹脂内空間１１に
注入され、中空体が形成される。Next, a conventional molding method using the above-mentioned mold apparatus will be described. The resin injected into the mold starts to solidify rapidly from the surface in contact with the cavity, and the solidified resin 1
Although it is 0, the tip 1a of the pin 1 is still in a molten state. At this time, when gas is supplied from the gas circuit 9, the gas is injected into the molten resin internal space 11 from the gap between the pin 1 and the sleeve 2 to form a hollow body.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら上記の従
来の構成では、ピン及びスリーブを組み込むのに、その
形状から必ずインサート４に対し、キャビティと反対側
より取り付けた上で組み込む必要があり、金型のメンテ
ナンス、調整の都度、このインサートを分解することに
多くの時間を要する。また、スリーブ、ピンの長さは、
インサートの底からキャビティ面までの長さによって決
定されるため、成形品によってこれらの長さは異なり、
都度、注文生産する必要があった。However, in the above-mentioned conventional construction, in order to incorporate the pin and the sleeve, it is necessary to always attach the insert 4 to the insert 4 from the side opposite to the cavity from the shape thereof. It takes a lot of time to disassemble the insert every time maintenance and adjustment are performed. Also, the length of the sleeve and pin is
Since the length is determined by the length from the bottom of the insert to the cavity surface, these lengths differ depending on the molded product,
Each time, it had to be made to order.
【０００７】本発明は上記従来の問題点を解決するもの
で、ピン及びスリーブの分解、組み立てを容易に行える
ようにするのに加えて、成形品形状の高さに関係なく、
一定のピン及びスリーブのユニットを提供することを目
的とするものである。The present invention solves the above-mentioned conventional problems. In addition to making it easy to disassemble and assemble the pin and the sleeve, the present invention also provides a method that can be used regardless of the height of the molded product.
It is an object to provide a pin and sleeve unit.
【０００８】[0008]
【課題を解決するための手段】この目的を達成するため
に本発明は、ツバ部を有するピンと、このピンの軸部と
嵌合するスリーブとからなり、前記軸部とスリーブとの
嵌合部を、経由して供給されるガスにより樹脂成形材料
にボイドを形成する中空成型用のボイドピンユニットを
金型キャビティ内に持ち、このボイドピンユニットと金
型外部とは、ガスの供給経路でつながっている中空成型
用樹脂成形金型装置において、前記ツバ部はＯ−リング
により気密を保って前記ガスの供給経路に連通する開口
部を有し、前記開口部は前記ピンの内部を通って前記嵌
合部に至る穴と連通し、前記軸部に沿う嵌合部の前記金
型キャビティより遠い側にはガスの漏洩防止用のＯリン
グを設け、前記スリーブは、外周に前記金型キャビティ
にねじ込む為のオネジを備えたことを特徴とする。SUMMARY OF THE INVENTION In order to achieve this object, the present invention comprises a pin having a flange and a sleeve fitted to a shaft of the pin, and a fitting portion between the shaft and the sleeve. A void pin unit for hollow molding for forming a void in the resin molding material by a gas supplied through the mold cavity, and the void pin unit and the outside of the mold are connected by a gas supply path. In the resin molding apparatus for hollow molding, the flange portion has an opening communicating with the gas supply path while maintaining airtightness by an O-ring, and the opening passes through the inside of the pin. An O-ring for preventing gas leakage is provided on a side of the fitting portion along the shaft portion farther from the mold cavity, communicating with a hole reaching the fitting portion, and the sleeve is provided on the outer periphery of the mold cavity. Oh for screwing Characterized by comprising a di.
【０００９】この構成によって、従来はインサートを介
してキャビティの裏面より固定していたボイドピンユニ
ットを、キャビティ表面から直接に、成形品形状に合わ
せた深さまで容易にねじ込む事ができる。With this configuration, the void pin unit, which was conventionally fixed from the back surface of the cavity via the insert, can be easily screwed directly from the surface of the cavity to a depth corresponding to the shape of the molded product.
【００１０】[0010]
【発明の実施の形態】以下本発明の一実施の形態におけ
る樹脂成形金型装置について、図面を参照しながら説明
する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a resin molding apparatus according to an embodiment of the present invention will be described with reference to the drawings.
【００１１】図１において、ピン１２はツバ部２０にＯ
−リング１３が組み込まれ、ツバ部２０からピン１２の
中央を通って外壁に貫通した穴１２ａを有する。そし
て、ピン１２の外周にはスリーブ１４が組み込まれる。
スリーブ１４の内面にはピン１２との間をシールするＯ
−リング１５が組み込まれ、その他の内面は隙間１４ｅ
が設けてある。スリーブ１４の外周はオネジ１４ａにて
可動側型板５にねじ込まれる。スリーブ１４の中央部１
４ｂは成形品の食い切り面で、溶融樹脂がオネジ部１４
ａまで流れないようにしている。スリーブ先端１４ｃ
は、外形が小さくなっており、ここで溶融樹脂が固化し
易くしている。又、スリーブ１４先端にはオネジ部１４
ａのねじ込み用のドライバー溝となる切り欠き１４ｄが
設けてある。このような構成のピン１２とスリーブ１４
をＯ−リング１３を介して可動側型板５に組み込み、固
定側型板６との間にキャビティ７を構成する。又、可動
側型板５よりのガス回路９は、ピン１２のツバ部２０に
つながっている。In FIG. 1, a pin 12 is
The ring 13 is incorporated and has a hole 12a penetrating from the collar 20 through the center of the pin 12 to the outer wall; Then, a sleeve 14 is mounted on the outer periphery of the pin 12.
On the inner surface of the sleeve 14, O
A ring 15 is incorporated and the other inner surface is a gap 14e
Is provided. The outer periphery of the sleeve 14 is screwed into the movable mold plate 5 with a male screw 14a. Central part 1 of sleeve 14
4b is a cut surface of the molded product, and the molten resin is
It does not flow to a. Sleeve tip 14c
Has a smaller outer shape, where the molten resin is easily solidified. A male screw part 14 is provided at the tip of the sleeve 14.
A notch 14d is provided as a driver groove for screwing a. The pin 12 and the sleeve 14 having such a configuration
Is incorporated into the movable mold plate 5 via the O-ring 13 to form the cavity 7 between the movable mold plate 5 and the fixed mold plate 6. The gas circuit 9 from the movable mold plate 5 is connected to the flange 20 of the pin 12.
【００１２】以上のように構成された樹脂成形金型装置
について、図１を用いてその動作を説明する。まず、金
型内に射出された樹脂はキャビティ７と接触した面から
急速に固化が始まり、固化樹脂１０となるが、ピン１２
の先端部ではまだ溶融状態である。この時、ガス回路９
よりガスを供給すると、ガスはピン１２の貫通穴１２ａ
とスリーブ１４との隙間１４ｅより、溶融樹脂内空間１
１に注入され、中空体が形成される。このガスはＯ−リ
ング１３、１５によりピン１２の先端以外に流出するこ
とは無く、従来と同様の成形結果を得ることが出来る。The operation of the resin molding die apparatus configured as described above will be described with reference to FIG. First, the resin injected into the mold is rapidly solidified from the surface in contact with the cavity 7 to become the solidified resin 10.
Is still in a molten state at the tip. At this time, the gas circuit 9
When more gas is supplied, the gas is supplied to the through hole 12a of the pin 12.
From the gap 14e between the sleeve 14 and the
1 to form a hollow body. This gas does not flow out of the tip of the pin 12 by the O-rings 13 and 15, and the same molding result as that of the related art can be obtained.
【００１３】そして、このピン１２とスリーブ１４とか
らなるボイドピンユニットの組み立ては、キャビティ７
表面からピン１２と、Ｏ−リング１５を組み込んだスリ
ーブ１４をねじ込むだけでよく、分解時も逆の手順で容
易に行える。また、ボイドピンユニットの取り付け位置
は、キャビティ７表面から成形品形状より必要となる寸
法１６さえ確保すれば、このボイドピンユニットは成形
品形状に関係無く、常に一定のサイズのものを用いるこ
とができる。The assembly of the void pin unit including the pin 12 and the sleeve 14
It is only necessary to screw the pins 12 and the sleeve 14 incorporating the O-ring 15 from the surface, and disassembly can be easily performed in the reverse order. In addition, as long as the required position 16 of the void pin unit is secured from the surface of the cavity 7 to the shape of the molded product, the void pin unit having a fixed size can be used regardless of the shape of the molded product. it can.
【００１４】以上のように本実施例によれば、ボイドピ
ンユニットをキャビティ表面からねじ込むことにより、
従来と同じ成形成形効果を得つつ、金型の分解、組み立
てが容易になり、且つ、一定サイズのボイドピンユニッ
トを製作して用いることが出来る。As described above, according to this embodiment, by screwing the void pin unit from the cavity surface,
It is easy to disassemble and assemble the mold while obtaining the same molding effect as before, and it is possible to manufacture and use a void pin unit of a certain size.
【００１５】[0015]
【発明の効果】以上のように本発明は、中空成型用のボ
イドピンユニットを金型キャビティ内に持つ中空成型用
樹脂成形金型装置において、従来と同じ成形効果を得つ
つ、ボイドピンユニットの分解、組み立てが容易にな
り、且つ、一定サイズのボイドピンユニットを用いるこ
とが出来るという効果が得られる。As described above, the present invention relates to a resin molding apparatus for hollow molding having a void pin unit for hollow molding in a mold cavity, while obtaining the same molding effect as before, The effect that disassembly and assembly are easy, and that a void pin unit of a certain size can be used can be obtained.
【図１】本発明の実施例におけるボイドピンユニットの
断面図FIG. 1 is a sectional view of a void pin unit according to an embodiment of the present invention.
【図２】従来のボイドピンユニットの断面図FIG. 2 is a sectional view of a conventional void pin unit.
【符号の説明】 ５ 可動側型板 ６ 固定側型板 ７ キャビティ ９ ガス回路 １０ 固化樹脂 １１ 溶融樹脂 １２ ピン １２ａ 貫通穴 １３ Ｏ−リング １４ スリーブ １４ａ スリーブのオネジ １５ Ｏ−リング[Description of Signs] 5 Movable mold plate 6 Fixed mold plate 7 Cavity 9 Gas circuit 10 Solidified resin 11 Molten resin 12 Pin 12a Through hole 13 O-ring 14 Sleeve 14a Male screw of sleeve 15 O-ring
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平６−134790（ＪＰ，Ａ) 特開 平３−124408（ＪＰ，Ａ) 特開 平３−224719（ＪＰ，Ａ) 特開 平７−308941（ＪＰ，Ａ) 特開 平５−177667（ＪＰ，Ａ) 特開 平５−177668（ＪＰ，Ａ) 特開 平７−299835（ＪＰ，Ａ) 実開 平４−47518（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) B29C 45/26 - 45/44 B29C 33/00 - 33/76 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-6-134790 (JP, A) JP-A-3-124408 (JP, A) JP-A-3-224719 (JP, A) JP-A-7- 308941 (JP, A) JP-A-5-177667 (JP, A) JP-A-5-177668 (JP, A) JP-A-7-299835 (JP, A) Japanese Utility Model Laid-open No. 4-47518 (JP, U) (58) Field surveyed (Int.Cl. 7 , DB name) B29C 45/26-45/44 B29C 33/00-33/76
Claims (1)
と嵌合するスリーブとからなり、前記軸部とスリーブと
の嵌合部を経由して供給されるガスにより樹脂成形材料
にボイドを形成する中空成型用のボイドピンユニットを
金型キャビティ内に持ち、このボイドピンユニットと金
型外部とは、ガスの供給経路でつながっている中空成型
用樹脂成形金型装置において、前記ツバ部はＯ−リング
により気密を保って前記ガスの供給経路に連通する開口
部を有し、前記開口部は前記ピンの内部を通って前記嵌
合部に至る穴と連通し、前記軸部に沿う嵌合部の前記金
型キャビティより遠い側にはガスの漏洩防止用Ｏリング
を設け、前記スリーブは、外周に前記金型キャビティに
ねじ込む為のオネジを備えたことを特徴とする樹脂成形
金型装置。1. A pin having a flange portion and a sleeve fitted to a shaft portion of the pin, and a gas supplied through a fitting portion between the shaft portion and the sleeve forms a void in the resin molding material. The void pin unit for hollow molding to be formed is held in a mold cavity, and the void pin unit and the outside of the mold are connected to each other by a gas supply path. An opening that communicates with the gas supply path while maintaining airtightness by an O-ring, the opening communicates with a hole that passes through the inside of the pin to the fitting portion, and fits along the shaft portion; A resin molding die apparatus, wherein an O-ring for preventing gas leakage is provided on a side of the joining portion farther from the mold cavity, and the sleeve has an external thread for screwing into the mold cavity on the outer periphery. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25413996A JP3173388B2 (en) | 1996-09-26 | 1996-09-26 | Resin molding die equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25413996A JP3173388B2 (en) | 1996-09-26 | 1996-09-26 | Resin molding die equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10100203A JPH10100203A (en) | 1998-04-21 |
| JP3173388B2 true JP3173388B2 (en) | 2001-06-04 |
Family
ID=17260769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25413996A Expired - Fee Related JP3173388B2 (en) | 1996-09-26 | 1996-09-26 | Resin molding die equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3173388B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999047334A1 (en) * | 1998-03-20 | 1999-09-23 | Nitrojection Corporation | Pin-in-sleeve device for in-article gas assisted injection molding |
| GB2361892A (en) * | 2000-05-03 | 2001-11-07 | Cinpres Ltd | Method and apparatus for injection moulding plastics material |
| KR102214983B1 (en) * | 2019-11-21 | 2021-02-10 | (주)한국몰드김제 | Mold combined with eject pin to prevent resin from entering |
-
1996
- 1996-09-26 JP JP25413996A patent/JP3173388B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10100203A (en) | 1998-04-21 |
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