JP3166288B2 - A seal glass bonding apparatus for an optical semiconductor device, and a package manufacturing method. - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic for an optical semiconductor device.
Used to attach seal glass to Mick Package
Suitable optical semiconductor device seal glass bonding device and package
The present invention relates to a package manufacturing method.

[0002]

2. Description of the Related Art Ceramic packages for optical semiconductor devices,
For example, CCD (Charge-coupled device)
In a ceramic package for an imager or a linear sensor, it is necessary to seal the ceramic package from the outside by closing an upper opening of the ceramic package with a seal glass for moisture resistance, heat resistance, dust resistance, and the like. In a conventional sealing method of an optical semiconductor device, a sealing glass in which an adhesive such as a solid adhesive resin is applied in advance to an area to be bonded to a ceramic package is placed on an upper opening of the ceramic package with the adhesive interposed therebetween. Then, the seal glass is pressed against the ceramic package by a glass holding jig and then placed in a high-temperature heating furnace. The ceramic package and the sealing glass are tightly adhered to each other with an adhesive melted in a high-temperature atmosphere in a furnace to seal the ceramic package. During the process of melting the adhesive resin in the heating furnace to bond the ceramic package and the sealing glass, and then drying and sealing, a relatively high internal pressure is generated in the ceramic package due to gas expansion due to a high temperature atmosphere in the furnace. And the sealing glass is caused to float from the upper surface of the ceramic package.

The above-mentioned glass holding jig is used to press the seal glass against the ceramic package against such an internal pressure and securely adhere the seal glass. FIG. 7 is a perspective view showing a conventional glass holding jig, and FIG. 8 is a perspective view showing a state where the glass holding jig shown in FIG. 7 is attached to a ceramic package. As shown in FIGS. 7 and 8, a conventional glass holding jig 100 includes a pair of holding arms 102 that engage with both ends of a ceramic package (hereinafter simply referred to as a package) 106, and a seal glass 108 on the package 106. And four leaf springs 104 that come into contact with each other. When the holding arm 102 is engaged with the package 106, the leaf spring 104 is
And positioned at a predetermined position of the four corners, through the leaf spring 104
Then, the sealing glass 108 is elastically pressed onto the package 106.

[0004] The glass holding jig 100 is
A large number of packages 106 attached every 6 and to which the glass holding jig 100 is attached are stacked and put into a heating furnace. The package 106 is placed in a high-temperature atmosphere in a furnace for approximately several hours, during which time the solid adhesive resin applied to the contact area of the seal glass 108 with the package 106 is melted and dried, and the seal glass 108 is dried. It is fixed on the package 106. In the heating process, the above-described internal pressure that causes the seal glass 108 to float is generated in the package 106.
The seal glass 108 is pressed against the package 106 by the leaf spring 104 against the internal pressure in the package, and the adhesion between them is ensured. Therefore, the seal glass 108 is fixed to the upper surface of the package 106.

[0005]

However, when a conventional glass holding jig is used, it is extremely difficult to maintain the shape of each leaf spring in a predetermined state for a long period of time. It was practically impossible to maintain and maintain the elastic restoring force of all the members in a uniform state. For example, 1
If one leaf spring is curved more than the other three leaf springs, the leaf spring cannot urge the seal glass with a uniform force, and the glass surface is distorted with respect to the chip. It gets stuck. If the image is taken by a CCD imager using such a package, the distorted image
Will appear on the monitor screen.

When a conventional glass holding jig is used, the leaf spring directly contacts the glass surface serving as an effective screen of the CCD imager, and strongly presses the sealing glass to be floated. For this reason, the glass surface was easily damaged by the leaf spring. Such scratches on the glass surface appeared as black spots on the monitor screen, deteriorating the image quality. Furthermore, when the package is sealed using this kind of glass holding jig, the quality of the optical semiconductor device depends on the mounting condition when attaching the glass holding jig to the package as described above. Had to spend considerable time carefully attaching the glass hold-down jig to the package. In addition, since the operator has to attach a glass holding jig to each package, the work efficiency is extremely low, and a seal glass bonding apparatus with good workability has been demanded.

The present invention has been made in view of the above circumstances, and an object of the present invention is to seal a seal glass without damaging the surface of the seal glass when sealing a ceramic package for an optical semiconductor device. A seal glass bonding apparatus for an optical semiconductor device, which can be uniformly pressed against a package, and is capable of bonding a seal glass to a ceramic package with ease and high productivity ; and
An object of the present invention is to provide a package manufacturing method.

[0008]

In order to achieve the above object, a seal glass bonding apparatus for an optical semiconductor device according to the present invention comprises a plurality of package guides for inserting and positioning a ceramic package for an optical semiconductor device. A package base having a concave portion on an upper surface; and a pin holding member arranged at a predetermined position on the package base via a positioning pin, wherein the pin holding member includes a plurality of pressing pins.
A ceramic package positioned in the package guide recess when a plurality of pin groups project downward from the lower surface of the pin holding member by urging of an elastic member and the pin holding member is arranged on the package base. A plurality of holding pins are provided so as to abut on a peripheral portion of the seal glass located on the upper surface of the package base, and the package base and the pin holding member superimposed on the package base are engaged with each other, and an engaging means for combining vertically is provided. It is characterized by having.

According to the above configuration of the present invention, the positioning pins secure an accurate positional relationship between the package guide recess of the package base and the pin group of the pin holding member, and the pin group of each set is provided.
The lower ends of the plurality of holding pins constituting the above structure are accurately brought into contact with predetermined positions in the peripheral portion of the seal glass by the bias of the elastic member. This allows each seal glass to be
The pressing pin is pressed with an equal force.

Further, in the package manufacturing method according to the present invention, first, a plurality of ceramic packages are set side by side on the same package base, and then the sealing glass to which an adhesive is applied in advance is attached to each of the ceramic packages. After arranging the adhesive at a predetermined position on the upper surface of the package, a plurality of bullets capable of contacting the peripheral portion of each seal glass
By arranging a pressing member having a plurality of pin groups consisting of sex holding pins on the package table, the sealing glass is pressed against the ceramic package by the plurality of elastic holding pins, and then, The adhesive glass is melted and dried by putting the plurality of ceramic packages together with the package base into a heating furnace while maintaining the pressed state of the seal glass by the plurality of elastic pressing pins. Is adhered to the ceramic package.

In the present invention, the package base, the pin holding member, and the components attached thereto are made of metal, for example, an aluminum base which has been subjected to a plating treatment such as a Kanigen treatment to harden the surface. Preferably, a molded product made of a heat-resistant resin is used at a lower end portion of each pin abutting on the sealing glass surface in order to ease the contact. One example is a heat-resistant resin pin formed by adding 20% of glass fiber to Mitsui Toatsu Engineering Plastic sold under the trade name of Peak and having a seal glass bonding temperature of 130 to 150 °. It has a heat-resistant temperature of 260 ° C. in contrast to C. In a preferred embodiment of the present invention, each of the pins constituting the above-mentioned pin group is arranged so as to abut on a peripheral portion of the seal glass, for example, an intermediate portion between four corners and each side, avoiding an effective surface of the seal glass. Is done. In another preferred embodiment of the present invention, the elastic member includes a compression spring that biases each pin, and each compression spring is disposed inside the pin holding member. Further, in still another preferred embodiment of the present invention, the positioning pin comprises a vertical protruding pin implanted in at least four corners of the package base, and bushes through which each pin penetrates are attached to the pin holding member. Provided. More preferably, the hooking means is configured to automatically hook the pin holding member to the package base as the pin holding member descends.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a plan view of a sealing glass bonding apparatus according to an embodiment of the present invention, and FIG.
2 is a partial cross-sectional side view of the seal glass bonding apparatus shown in FIG.
FIG. 3 is a partially enlarged cross-sectional view of the seal glass bonding apparatus shown in FIGS. 1 and 2, and FIG. 4 is an enlarged cross-sectional view illustrating the relationship between the ceramic package and the package base as viewed from line AA in FIG. is there. A seal glass bonding apparatus 10 (hereinafter, referred to as a bonding apparatus 10) shown in FIGS. 1 and 2 is a combination of a package base 12 and pin holders 14 stacked thereon, each of which is made of a metal and arranged vertically. It is composed of

On the upper surface of the package base 12, a plurality of rectangular recesses 16 are formed at equal intervals in the longitudinal and lateral directions. In this example, the recesses 16 are provided at a total of 20 locations, each row having five longitudinal rows arranged in parallel in four rows in the horizontal direction. The planar dimensions and shape of each recess 16 are set in accordance with the outer dimensions of the ceramic package 50 (hereinafter referred to as package 50) plus the maximum tolerance shown in FIG. It is formed as follows. Therefore, one recess 16
Has one package 50 with outer dimensions within the maximum tolerance.
Each of them can be accurately guided and accommodated at a predetermined position.

In order to accommodate a plurality of leads 52 projecting downward along both long side edges of the package 50,
As shown in FIG. 4, the grooves 18 are engraved along both long side edges of each recess 16 and in such a manner that the inner surfaces of the leads 52 contact the inner surfaces of the groove walls of the grooves 18. . These recesses 16 and grooves 1 formed on the upper surface of package
8 functions as a package guide recess for positioning the package 50. FIG. 2 shows the bonding apparatus 10 in a state where the package 50 is not set, and FIG. 3 shows a part of the bonding apparatus 10 in a state where the package 50 is set and before being put into a heating furnace. It is shown. At the four corners of the package base 12, four positioning pins 20 are fitted upward into the through holes 22 provided at the four corners of the package base 12, and are fixed in a state of projecting vertically upward from the upper surface of the package base 12. ing. Through hole 22
Is precisely drilled at a position precisely positioned with respect to the recess 16, so that the upwardly projecting portion of the positioning pin 20 has a very accurate relative positional relationship with the recess 16.

At four corners of the pin holder 14, through holes 26 each having a bush 24 fitted therein are provided. When the pin holding member 14 is placed on the package base 12, the positioning of the package base 12 is performed on the bush 24. It is drilled at the position where the pin 20 penetrates. In order to withstand repeated insertion and removal of the positioning pin 20 and maintain a strict relative position with respect to the positioning pin 20, the bush 24 is a metal bush that is manufactured with high precision by quenching to secure a strict tolerance. The through-hole 26 is precisely drilled at a precisely positioned position similarly to the above-described through-hole 22. The fitting between the positioning pin 20 and the bush 24 enables the package table 12 and the pin holding member 14 to always overlap at a predetermined position.

When each set of 20 pin groups including eight glass holding pins 30 (hereinafter, referred to as holding pins 30) is stacked with the pin holders 14 on the package base 12 in a predetermined manner, the package base 12 Are arranged on the pin holder 14 so as to be located directly above and facing the respective recesses 16. In addition, each of the eight pins in the set of pins
As shown in FIG. 7, the package 50 is arranged so as to come into contact with predetermined positions at eight peripheral portions of the seal glass 54 on the package 50 positioned in the concave portion 16 of the package base 12. These contact points are shown as contact points a to h in FIGS. 6B and 6C. As is clear from FIG. 6, the holding pins 30 abut at substantially equal intervals at the four corners of the seal glass 54 and in the middle of each side.

Each holding pin 30 is accommodated in a cylindrical guide hole 32 formed in the pin holder 14 and a concentric, larger-diameter cylindrical spring housing hole 34 vertically communicated therewith. In other words, the guide hole 32 is formed at a position accurately positioned based on the position of the bush 24 so that the presser pin 30 is disposed at the above-described position. The holding pin 30 has a short cylindrical head portion 31 provided on the head.
And a main body part contiguous to the head part 31 and formed in a cylindrical shape concentric with the head part 31. In order to ease the contact with the seal glass, the holding pin 30 is a heat-resistant resin pin formed by adding 20% of glass fiber to Mitsui Toatsu Engineering Plastics sold under the trade name of PEAK. The lower end face of the main body is machined at right angles to the longitudinal direction and finished smoothly.

Each of the holding pins 30 has a head portion 31 housed in a spring housing hole 34 and a main body portion housed in a guide hole 32, respectively, and is slidably guided in the vertical direction. The main body projects from the guide hole 32 and hangs down from the lower surface of the pin holder 14. The top of the spring receiving hole 34 is closed by a cover plate 38 extending on the pin holder 14. Closed surface of cover plate 38 and holding pin 30
A compression coil spring 36 is interposed between the head portion 31 and the pressing portion 30 to urge the holding pin 30 downward. FIG.
As shown in the figure, the cover plate 38 has a total of 28 screws 3 including 20 screws 39 at positions substantially corresponding to the center of the recess 16 and eight screws 39 on the outer periphery of the cover plate 38.
9 is fixed to the pin holder 14.

At the center of both longitudinal edges of the bonding apparatus 10, locking mechanisms 40, 40 for locking the package table 12 and the pin holder 14 are arranged in pairs. Each locking mechanism 40 has a locking lever 44 rotatably supported by the pin holder 14 by a pin 42, and a lever receiver attached to an end surface of the package base 12 and engaged with a lower end of the locking lever 44. 46. The latch lever 44 is formed by a claw formed at a lower end of the lever receiver 4.
6, and locks the package base 12 and the pin holder 14 close to each other as shown in FIG. When the pin holder 14 comes close to the package base 12, the holding pin 30 presses the seal glass 54 as shown in FIG.

The upper part of the latch lever 44 and the package base 12
A compression spring 48 is provided between the pin holder 14 and the end face of the lock lever. When the holders 14 are stacked on the package table 12 in a predetermined manner, the locking pins 44 are easily engaged with the lever receivers 46. Note that the latch lever 44 is moved to the package base 1.
2, the locking lever 44 and the lever receiver 46
Is disengaged.

FIG. 5 is a schematic view of a CCD unit to be sealed by the bonding device 10. Package 50
In FIG. 5B, a plurality of leads 52 are provided at lower portions on both long side edges, and have a top opening 51 facing upward at the center of the upper surface. A lower step 58 is formed around the opening 51, and the top opening 5 is closed to close the top opening 51.
A seal glass 54 (FIG. 5A) having the same planar shape as that of 1 is mounted on the step 58 as shown in FIG. 6A. In order to fix the package 50 and the seal glass 54,
A solid adhesive resin 56 is applied as an adhesive to the periphery of the back surface of the seal glass 54 which comes into contact with the step 58 of the opening 51 of the package 50 in advance.

Next, a bonding method using the bonding apparatus 10 will be described. First, the locking of each locking mechanism 40 is released. The upper part of the latch lever 44 is tilted inward toward the pin holder 14 against the elastic force of the compression spring 48 so that the pin 4
2 to rotate the latch lever 44,
By separating the lower end of the lever from the lever receiver 46,
The locking of each locking mechanism 40 is released. After releasing the locking mechanism 40, the pin holder 14 is pulled up along the positioning pins 20 to expose the recess 16 of the package base 12.

The package 50 is set in each recess 16,
Next, the seal glass 54 is placed on the step 58 of the top opening 51 of each package 50 so that the solid adhesive resin 56 applied to the back surface of the seal glass 54 contacts the step 58 of the opening 51 of the package 50. The top opening 51 is closed. Next, the bushing 24 of the pin holder 14 is aligned with the upper protruding portion of the positioning pin 20, and the positioning pin 2
The pin holder 14 is lowered onto the package table 12 along the direction 0. Presser pin 30 hanging from pin holder 14
Is in contact with the seal glass 54 on each package 50.

As shown in FIG. 6A, the holding pins 30 abut on the peripheral portions of the seal glass 54 in contact with the step 58 of the package 50, respectively. When the pin holder 14 is further lowered, the claw portions provided at the lower ends of the respective latch levers 44 come into sliding contact with the inclined upper surface of the lever receiver 46, and the latch levers 44
Is rotated against the compression spring 48, and finally the lever receiver 4
6 and engages with the hook claw. During the lowering of the pin holder 14, the pressing pin 30 in contact with the seal glass 54 receives the reaction force of the seal glass 54 and retreats into the pin holder 14 while compressing the compression coil spring 36. Each presser pin 3
No. 0 abuts on the upper surface of the seal glass 54 with uniform pressing force by the elastic force of the compression coil spring 36,
To the step 58 of the package 50 evenly. This state is shown in FIG.

The package 50 set in the bonding apparatus 10 is placed in a heating furnace and placed in a high-temperature atmosphere in the furnace. The solid adhesive resin 56 is melted and dried, and the peripheral portion of the seal glass 54 is fixed on the step 58 of the package 50. In this bonding stage, the pressing pin 30 presses the peripheral portion of the seal glass 54 against the step portion 58 with substantially uniform force, so that the seal glass 54 has a desired resistance against an increase in pressure in the internal space of the package 50. Hold the pressure contact state,
The molten solid adhesive resin 56 forms a resin layer having a substantially uniform thickness between the seal glass 54 and the step 58. Therefore, good adhesion between the seal glass 54 and the package 50 can be ensured.

According to the bonding apparatus 10 as described above, the operator puts 20 packages 50 at a time into the recess 1.
6, and further, a seal glass 54 is set on each package 50. Then, the bush 24 of the pin holder 14 is aligned with the positioning pin 20, and the pin holder 1 is set.
4 automatically lowers the plurality of presser pins 3
0 can be accurately brought into contact with a predetermined position in the peripheral portion of the seal glass 54, and the elastic force of the compression coil spring 36 that urges the holding pin 30 causes the seal glass 5.
4 can be pressed substantially evenly onto the step 58 of the package 50. Therefore, the operator needs 20 packages 50
Can be accurately and easily attached to the bonding apparatus 10 in a very simple manner. In addition, since the holding pin 30 is made of heat-resistant resin and evenly contacts the seal glass 54, there is no possibility that the surface of the seal glass 30 may be damaged. Further, according to the bonding method described above, the glass holding of 20 packages 50 can be performed at once without attaching a glass holding jig to each package 50. In addition, since individual differences in the work of performing the glass pressing do not affect the degree of the glass pressing, a quick, simple, and reliable glass pressing operation can be performed.

The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various changes or modifications can be made, and the present invention is described in the claims. It is needless to say that the present invention is included in the scope of the present invention. For example, it is also possible to mold only the lower end portion of the holding pin 30 with resin. Further, the shape and size of the concave portion 16 are not limited to those of the above-described embodiment, but are appropriately set according to the shape and size of the ceramic package.

[0028]

According to the present invention, there is provided a seal glass bonding apparatus for an optical semiconductor device , comprising: a package base having a plurality of package guide recesses capable of accurately positioning a ceramic package; By using the pin holding member provided with the pin group of the force and overlapping with the pin via the positioning pin, the pin of each pin group accurately abuts a predetermined position on the peripheral portion of the upper surface of the seal glass so as to be even. Since the pressing is performed by force, the ceramic package can be sealed without damaging the effective surface of the seal glass and fixing the seal glass at a correct position that is not distorted with respect to the chip of the ceramic package. This improves moisture, heat and dust resistance.
Optical semiconductors that are high and have no defects on the surface of the sealing glass
Equipment, eg CCD imagers, ceramics for linear sensors
Mic package can be provided. The package of the present invention
According to the page manufacturing method, a large number of ceramic packages
Conventional glass can be easily sealed at once
Simple, quick and reliable security compared to work using the holding jig
It becomes possible to seal the lamic package.

[Brief description of the drawings]

FIG. 1 is a plan view of a seal glass bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a partial sectional side view of the seal glass bonding apparatus shown in FIG.

FIG. 3 is a partially enlarged cross-sectional view of the sealing glass bonding apparatus shown in FIGS. 1 and 2.

FIG. 4 is a partially enlarged longitudinal sectional view of the ceramic package and the package base as seen from line AA in FIG. 3;

FIGS. 5A and 5B are schematic perspective views of a ceramic package sealing glass and a ceramic package sealed by the sealing glass bonding apparatus shown in FIGS. 1 to 4, respectively. (C) is a side view of the left half of the seal glass.

FIGS. 6 (A), 6 (B) and 6 (C) are partial cross-sectional views showing a state where the glass pressing pins shown in FIGS. 1 to 3 are in contact with the sealing glass on the ceramic package, respectively. It is explanatory drawing, the top view and sectional drawing which show the position of a glass holding pin.

FIG. 7 is a perspective view showing a conventional glass holding jig.

8 is a perspective view showing a state where the glass holding jig shown in FIG. 7 is attached to a ceramic package.

[Explanation of symbols]

 Reference Signs List 10 seal glass bonding apparatus according to the present invention 12 package base 14 pin holder 16 recess 18 groove 20 positioning pin 24 bush 30 glass holding pin 36 compression coil spring 40 locking mechanism 50 ceramic package 51 top opening 54 seal glass 56 solid bonding resin 58 Step

Claims (2)

(57) [Claims] 1. A package base having a plurality of package guide recesses on an upper surface for inserting and positioning a ceramic package for an optical semiconductor device, and are arranged at predetermined positions on the package base via positioning pins. A pin holding member, wherein the pin holding member includes a plurality of sets of pressing pins.
When the pin group projects downward from the lower surface of the pin holding member by the bias of the elastic member, and when the pin holding member is arranged on the package table, the pin group is positioned on the upper surface of the ceramic package positioned in the package guide recess. A plurality of retaining pins provided so as to abut on a peripheral portion of the seal glass located thereover, and a latching means for latching the package base and the pin holding member superimposed thereon to vertically combine them. A seal glass bonding apparatus for an optical semiconductor device, comprising: 2. First, a plurality of ceramic packages are set side by side on the same package base, and then a sealing glass to which an adhesive has been applied in advance is bonded to a predetermined position on the upper surface of each of the ceramic packages. A plurality of sets of elastic pressing pins that can be brought into contact with the peripheral portion of each seal glass after the agent is interposed therebetween
By disposing the pressing member having a group on top of the package base, the plurality of sealing glass of the respective
By pressing the ceramic package with the elastic pressing pins of the above, then, while holding the pressed state of the seal glass by the plurality of elastic pressing pins, the plurality of ceramic packages together with the package table into a heating furnace, the A method of manufacturing a package, comprising melting and drying an adhesive to bond the seal glass to the ceramic package.