JPH03112143A - Socket for testing semiconductor element - Google Patents

Abstract

PURPOSE:To temporarily connect a semiconductor element to be tested in a state capable of testing, and then disconnect it for repetitive use by holding a tape carrier using an attaching spring between an insulating lower case and an insulating upper retaining cover, and coupling them by connecting means. CONSTITUTION:An insulating lower case 1 is placed in a predetermined position of a TAB automatic mounting machine, and a semiconductor element 10 to be tested is inserted into a recess. Then, the inner leads 4a of a tape carrier 4 are engaged with the positioning groove 1b of the case 1 (a resin film 4c is disposed at butting surfaces), and so held by supporting means as not move on the butting surfaces of the case 1. An air chuck 12 is moved down in this state to suck the element 10, slightly floated, and the element 10 is so moved in the recess 1a in directions X and Y that the electrodes 10a of the element 10 coincide with the protrusions 4a-1 of the inner leads 4a of the carrier 4 to be positioned. Then, a cover 2 is moved down, layed on the case 1, the carrier 4 is pressed by an attachment spring 5 to bring the electrode 10a into contact with the protrusion 4a-1 of the lead 4a.

Description

[Detailed Description of the Invention] [Summary] Regarding a socket for testing a semiconductor device, the purpose is to temporarily connect a semiconductor device under test so that it can be tested, and to enable repeated use by attaching and detaching the semiconductor device under test. The electrodes of the set semiconductor device under test are placed between an insulating lower case having a recess in the center of the surface for inserting and setting the semiconductor device under test, and an insulating upper cover having a viewing window for monitoring the conductive contact status. A tape carrier formed by forming an inner lead in conductive contact and an outer lead protruding outward so as to come in conductive contact with an electrode of an external test device on a resin film, and a support spring that presses the tape carrier are sandwiched, and by a fastening means. Constructed in a superimposed manner so that they can be combined and separated.

[Industrial application field]

The present invention relates to a socket for testing semiconductor devices.

Semiconductor elements (chips) have electrodes but no leads, so it is desired to be able to perform tests easily and without waste.

[Conventional technology]

Conventionally, semiconductor devices have electrodes but no leads, so
Commercially available test sockets for semiconductor devices with leads exposed by pan-caging the semiconductor element cannot be used because the tests are performed using the leads. For this reason, semiconductor devices are first mounted on modules, printed wiring boards, etc., then tested, and defective products are rejected.

[Problem to be solved by the invention]

However, according to the above-mentioned test method, modules, printed wiring boards, etc. can no longer be used along with defective semiconductor elements, resulting in a large amount of waste.

In view of the above-mentioned problems, an object of the present invention is to provide a socket for testing a semiconductor device, which can temporarily connect a semiconductor device under test for testing, and can be used repeatedly by attaching and detaching the semiconductor device under test.

[Means to solve the problem]

In order to achieve the above object, the semiconductor device testing socket of the present invention includes an insulating lower case having a recess in the center of the mating surface for inserting and setting the semiconductor device under test, and a viewing window for monitoring the conductive contact status. An inner lead that makes conductive contact with the electrode of the set semiconductor device under test and an outer lead that protrudes outward so as to make conductive contact with the electrode of the external test device are formed on a resin film between the insulating upper holding lid and the set semiconductor device under test. A tape carrier formed by the above-mentioned tape carrier and a spring for pressing the tape carrier are sandwiched between the tape carrier and the spring that presses the tape carrier.

[Effect]

The tape carrier and its support spring that presses the tape carrier are sandwiched between an insulating lower case that holds the semiconductor device under test and an insulating upper cover having a viewing window, and are connected by a fastening means. Attach the inner lead of the tape to the electrode of the semiconductor element and the outer lead of Toyaria to the electrode of the external test device and press them with a spring to temporarily establish pressure contact and conduct an electrical test, and release the fastening means. By separating the insulating upper cover, the semiconductor device under test can be easily taken out and used repeatedly.

〔Example〕

The gist of the present invention will be explained in detail below based on embodiments shown in the drawings.

Figure 1 is an external perspective view of the combined state, Figure 2 is A- in Figure 1.
3 is an exploded side sectional view of the semiconductor device under test shown in FIG. 2 before being set.

As shown in the drawing, the test socket 11 includes an insulating lower case 1 in which a semiconductor device under test 10 is set, an insulating upper cover 2, a transparent glass 3, and an insulating lower case 1.
The tape carrier 4 and the support spring 5 are sandwiched between the insulating upper presser cover 2 and the tape carrier 4 and the attachment spring 5 are connected by a fastening means 6, that is, a fastener.
Configured to separate.

The insulating lower case 1 is made of molded synthetic resin material, and has a rectangular recess la in the center of the mating surface into which the semiconductor device under test 10 is inserted, and an inner lead 4a of the tape carrier 4 on the mating surface around the recess 1a. A positioning groove 1b for insertion is provided. The depth of this positioning Ilb is made slightly shallower than the thickness of the inner lead 4a of the tape carrier 4 so that it can be pressed from above, and the inserted inner lead 4a is attached to the semiconductor device under test 10 set in the recess Ia. The electrode 10a is positioned so as to correspond to the electrode 10a. The planar view size (vertical and horizontal) of the rectangular recess 1a is such that the semiconductor device under test 10 has inner leads 4a.
The inner circumferential edge of the recess 1a is chamfered so that the inner circumferential edge of the recess 1a can be chamfered. An inclined surface 1a-1 is attached so that the lead 4a is gently bent.

The insulating upper retainer 2 is made of molded synthetic resin material, and when stacked on the insulating lower case 1, the electrode 10a of the semiconductor device under test 10 inserted into the recess 1a and the inner lead 4a of the tape carrier 4 are connected to each other. Protrusion 4a-1
A viewing window 2a is provided through which a transparent glass 3 is inserted so that the alignment status can be seen (however, the transparent glass 3 is inserted after the semiconductor device under test IO has been set), and a tape carrier 4 is placed on the mating surface. After molding, the pressing spring 5 is provided by adhesion (or insert molding) with an epoxy resin adhesive (as shown). As shown in the plan view of Fig. 4, this additional spring 5 is made by punching or etching a metal spring plate to form a lead frame 5', and the inner and outer frames 5a' + 5b' are made of an insulating upper part. After being fixed to the holding lid 2, it is cut along cutting lines E and D by punching, and after cutting, the inner tip elastically presses the inner lead 4a to bend it slightly so as to make pressure contact with the electrode 10a of the semiconductor device under test 10. Bend and form downward.

As shown in the plan view of FIG. 5, the tape carrier 4 has an inner lead 4a that is in conductive contact with an electrode 10a of a semiconductor device under test 10 inserted into a recess 1a of an insulating lower case l, and an electrode of an external test device (not shown). A well-known TAB (Tape Auto
ed Bonding) technology.

The tips of the inner leads 4a are each provided with a protrusion 4a-1 having a copper hemisphere bonded by pressure.

A commercially available tape carrier 4 may be used depending on the shape and dimensions.

The fastening means 6, that is, the fastener (see the perspective view of FIG. 6) is made of molded synthetic resin material, and is inserted from the side into the corner of the overlapping insulating lower case 1 and insulating upper cover 2. A hemispherical protrusion 6a-1 protrudes from the fitting surface and has a notch 6a which is inserted into the fitting surface. Therefore, hemispherical recesses 1 cm 1 and 2b-1 that engage with the projections and depressions are also formed on the fitting surfaces of the four corner notches Ic and 2b of the insulating lower case 1 and the insulating upper presser M2, respectively. put.

Using this test socket 11, the semiconductor device under test 10
When testing, the cents to test sockets 1-11 are '
Using an automatic mounting machine, proceed as follows.

First, the insulating lower case 1 is placed on a predetermined position on the table (the path shown in the figure) of the TAB automatic mounting machine, and the semiconductor device under test 10 is
Insert into the recess.

Next, fit the inner lead 4a of the tape carrier 4 into the positioning groove 1b of the insulating lower case (resin film 4
c is on the mating surface), and is held by a support means (not shown) attached to the TAB automatic mounting machine so as not to move on the mating surface of the insulating lower case l.

In this state, as shown in the side cross-sectional view of FIG. 7, the air chuck 12 is lowered to adsorb the semiconductor device 10 to be tested, and the semiconductor device 10 is slightly lifted up and placed under test by a pattern recognition means (not shown) attached to the TAB automatic mounting machine. The semiconductor device under test 10 is moved and adjusted in the orthogonal directions of arrows X and Y within the recess lc so that the electrode 10a of the semiconductor device 10 and the protrusion 4a-1 of the inner lead 4a of the tape carrier 4 are aligned.

Then, the relative positions of the insulating lower case I and the tape carrier 4 are adjusted in advance, and the insulating upper presser cover 2 with the spring 5 adsorbed on the air chuck 12 is lowered and the tape is superimposed on the insulating lower case 1. The carrier 4 is pressed by the support spring 5 to bring the electrode 10a of the semiconductor device under test 10 into contact with the protrusion 4a-1 of the inner lead 4a.

Finally, connect the fasteners 6 by sandwiching them between the corner notches lc and 2b from the sides, and insert the transparent glass 3 into the viewing window 2a.The transparent glass 3 can be removed as needed by simply placing it on it. ), the setting of the semiconductor device under test 10 is completed.

In this way, the test socket for semiconductor devices is configured such that the tape carrier and the spring are sandwiched between the insulating lower case in which the semiconductor device under test is set and the insulating upper presser, so that they can be connected and separated by the fastening means. As a result, the semiconductor device under test can be easily attached and detached, and the test socket can be used repeatedly.By using the tape carrier in conjunction with the support spring, the semiconductor device under test and the electrodes of the external test equipment can be easily attached and removed. Leads can be reliably connected to conductive voltage.

For example, a commercially available IC socket can be used in an external test device, and the test socket of the present invention can be inserted into it, or it can be directly attached to the electrodes of a test module or printed wiring board, etc., and leads can be temporarily attached to those electrodes. The conductive contact allows the tape carrier to be tested without soldering in each case. Therefore, if the semiconductor device under test is defective, only the defective semiconductor device can be rejected and the other device can use it repeatedly.

In addition, since the tape carrier is simply held between the support spring and the insulating lower case, it can be easily replaced if the tape carrier becomes damaged and cannot be used. Advantageously, commercially available tape carriers can also be used. Note that alignment of the tape carrier and the electrodes of the semiconductor device under test can be easily performed by using a conventional TAB automatic mounting machine and applying pattern recognition technology.

〔Effect of the invention〕

As described in detail above, according to the present invention, a tape carrier using a spring is held between an insulating lower case and an insulating upper holding lid to form a test socket that can be connected and separated by a fastening means. By using this configuration, paired chip level semiconductor devices, which were conventionally difficult to test individually, can be easily inserted into and removed from test sockets and tested using the same handling as pancaged semiconductor devices. Since there is no connection, only defective semiconductor elements can be rejected, and productivity can be improved, which is extremely useful in practice.

[Brief explanation of drawings]

FIG. 1 is an external perspective view of an embodiment of the present invention, FIG. 2 is a sectional view taken along the line A-B-C in FIG. 1, and FIG. 3 is an exploded side of the semiconductor device under test shown in FIG. 4 is a plan view of the support spring shown in FIG. 3, FIG. 5 is a plan view of the tape carrier shown in FIG. 3, and FIG. 6 is a perspective view of the fastener shown in FIG. 3. FIG. 7 is a side sectional view showing the position adjustment state of the semiconductor device under test shown in FIG. 2. FIG. In the figure, 1 is an insulating lower case, 1a is a recess, 2 is an insulating upper cover, 2a is a viewing window, 4 is a tape carrier, 4a is an inner lead, 4b is an outer lead, 4c is a resin film, and 5 is a support spring. , 6 is a fastening means (fastener), 1O is a semiconductor device to be tested, and 10a is an electrode.・′? Tape carrier ball (attachment means) fastener 6

Claims (1)

[Claims] An insulating lower case (1) having a recess (1a) for inserting and setting a semiconductor device under test (10) in the center of the mating surfaces, and an insulating upper holding lid (2) having a viewing window (2a) for monitoring the conductive contact status. ), an inner lead (4a) is in conductive contact with the electrode (10a) of the set semiconductor device under test (10), and an outer lead (4b) extends outward so as to be in conductive contact with the electrode of the external test device. and a tape carrier (4) formed on a resin film (4c) and a spring (5) that presses the tape carrier (4) are sandwiched between the tape carrier (4) and the spring (5) that presses the tape carrier (4). A socket for testing semiconductor devices, which is characterized by the following characteristics: