JP3162336U - Lighting device - Google Patents

Abstract

Provided is an LED lighting device capable of improving the degree of freedom of design and extending the lifetime of an LED. An aluminum substrate, an LED module that is detachably engaged with the aluminum substrate and configured to be slidable on the aluminum substrate, an LED chip attached to the LED module, and an aluminum substrate are provided. And a power supply line 22 for supplying power to the LED chip attached to the LED module engaged with the aluminum substrate. [Selection] Figure 1

Description

  The present invention relates to a lighting device. Specifically, the present invention relates to an illuminating device that uses an LED (Light Emitting Diode) as a light source.

  Conventionally, a straight tube type lighting device composed of a fluorescent lamp has been used as a lighting device for facilities such as offices, factories and warehouses.

  Here, about the straight tube | pipe type illuminating device which consists of a fluorescent lamp, the use life is about 6000-10000 hours, and the improvement of durability was calculated | required. In addition, reduction of power consumption has been demanded.

  In order to meet such demands, lighting fixtures using LEDs have been proposed (see, for example, Patent Document 1).

  Specifically, as shown in FIG. 4, an elongated cylindrical straight pipe portion 111 made of acrylic resin, a base 112 fixed to both ends of the straight pipe portion 111, and a straight pipe inside the straight pipe portion 111. A straight tube luminaire having a light emitter 113 provided along the shape of the portion 111 has been proposed. The light emitters 113 are arrayed on the surface side of the substrate unit 114 formed by combining a plurality of elongated substrates 114a, 114b, 114c, 114d, 114e, and 114f in a hexagonal cylinder shape. LED 115 is provided.

JP 2009-170186 A

  However, conventional lighting fixtures using LEDs use LEDs in the form of lighting fixtures that do not use LEDs (for example, lighting fixtures using fluorescent lamps, lighting fixtures using incandescent lamps, etc.). It was a thing. For example, the lighting fixture described in Patent Literature 1 also adopts a conventional lighting fixture using an incandescent lamp as it is.

  Therefore, the form of the lighting fixture is the same as that of a conventional lighting fixture that does not use an LED, and the degree of freedom in design is restricted.

  In addition, since the light from the LED chip hardly emits light other than visible light, the LED itself, the lighting fixture, the power supply unit, etc. generate heat, although it does not radiate heat to the irradiated object. And since efficiently dissipating such heat greatly affects the life of the LED, it is technically very important how efficiently the heat is dissipated in the lighting fixture using the LED.

  However, as described above, since the form of the lighting fixture is the same as that of the conventional lighting fixture that does not use the LED, it is necessary to take a heat dissipation measure on the premise of a very restricted form, It was difficult to achieve enough. Note that it has been difficult to realize a long life of the LED due to insufficient heat dissipation measures.

  The present invention was devised in view of the above points, and it is an object of the present invention to provide a lighting device capable of improving the degree of freedom of design and extending the life of LEDs. is there.

  In order to achieve the above object, an illumination device according to the present invention includes a board, an engagement member detachably engaged with the board, and configured to be slidable on the board, and the engagement member. An LED chip attached; and a power supply member that is provided on the substrate and supplies power to the LED chip attached to an engaging member that engages with the substrate.

  Here, since the engaging member is detachably engaged with the substrate and is configured to be slidable on the substrate, the design freedom of the lighting device is greatly improved. Moreover, since the form of the lighting device is not premised on the conventional form, it is possible to take a sufficient heat dissipation measure, and the life of the LED chip can be extended.

  In addition, when the power supply member is configured to be able to supply power to the engagement member that engages with an arbitrary position of the substrate, it becomes possible to supply power regardless of the positional relationship between the substrate and the engagement member. The degree of freedom in designing the lighting device will be further improved.

  As an example of a heat dissipation measure, for example, it is conceivable that at least a part of the substrate is formed of a heat dissipation material (for example, an aluminum material) having a high thermal conductivity and the heat dissipation is performed through the substrate. In addition, adopting a substrate having a heat dissipation structure such as circulating cooling water inside the substrate can be cited as an example of a heat dissipation measure.

  In the lighting device to which the present invention is applied, the degree of freedom in design can be improved, and the life of the LED chip can be extended.

It is a schematic diagram for demonstrating the LED lighting apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating the attachment state of the LED lighting apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating the LED lighting apparatus which concerns on 2nd Embodiment. It is a schematic diagram for demonstrating the lighting fixture using the conventional LED.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the invention (hereinafter referred to as “embodiments”) will be described with reference to the drawings. The description will be given in the following order.
1. First Embodiment 2. FIG. Second Embodiment 3. FIG. Modified example

<1. First Embodiment>
Fig.1 (a) is a schematic diagram for demonstrating the LED illuminating device which is an example of the illuminating device to which this invention is applied, and FIG. 2 is a schematic diagram for demonstrating the attachment state. The LED lighting device 1 shown here has a flat aluminum substrate 2 made of an aluminum material and an LED module 3 that can be detachably engaged with the aluminum substrate 2.

  The aluminum substrate 2 has a convex portion 21 formed at a substantially central portion of its upper surface (the surface facing the LED module), and power supply lines 22 connected to a power source are provided on both side surfaces thereof.

  The LED module 3 includes a rectangular module main body 31 and an engaging portion 32 that is connected to the module main body 31 and engages with the aluminum substrate 2. When the LED module 3 is engaged with the aluminum substrate 2, the module main body 31 is positioned on the upper surface of the aluminum substrate 2, and the engaging portions 32 are disposed outside both side surfaces of the aluminum substrate 2. The state which supports the aluminum substrate 2 from the lower surface of 2 will be comprised.

  An LED chip 33 is attached to the upper surface of the module main body 31 (the surface opposite to the surface facing the aluminum substrate 2). Specifically, each LED module 3 is attached with three LED chips 33 arranged substantially in parallel with the longitudinal direction of the aluminum substrate 2.

  Furthermore, a recess 34 is provided on the lower surface of the module body 31 (the surface facing the aluminum substrate 2). When the LED module 3 is engaged with the aluminum substrate 2, the recess is formed in the aluminum substrate 2. It will be engaged with the convex portion 21.

  In the LED lighting device according to the first embodiment, the LED module 3 can be attached to an arbitrary position of the aluminum substrate 2. Specifically, the number of LED modules 3 attached to the aluminum substrate 2 is also free, and the position of the LED chip module 3 attached to the aluminum substrate 2 is also free. As a result, the degree of freedom in designing the LED lighting device can be greatly improved.

  Further, in the LED lighting device according to the first embodiment, since the LED chip 33 is mounted substantially in parallel with the longitudinal direction of the aluminum substrate 2, as shown in FIG. When it is mounted so that there is no clearance, so-called line illumination can be realized.

Furthermore, in the LED lighting device according to the first embodiment, when a defect of the LED chip is found, only the corresponding LED module 3 needs to be replaced, and an improvement in manufacturing yield can be realized.
That is, even if the LED chip is manufactured in the same process, blurring such as color development inevitably occurs. In such a case, in the illumination device using the conventional LED chip, it is not possible to replace only the LED chip in which the problem has occurred. On the other hand, in the LED lighting device according to the first embodiment, it is possible to replace only the LED module 3 to which the defective LED chip is attached. As a result, as described above, An improvement in manufacturing yield can be expected.

  In addition, since the LED lighting device according to the first embodiment can dissipate heat through the aluminum substrate 2, it contributes to the long life of the LED chip, and as a result, the long life of the LED lighting device can be expected.

<2. Second Embodiment>
FIG. 3 is a schematic diagram for explaining an LED lighting device which is another example of the lighting device to which the present invention is applied. The LED lighting device 1 shown here is a substantially circular aluminum substrate made of an aluminum material. 2 and an LED module 3 that can be detachably engaged with the aluminum substrate 2. In addition, the same code | symbol is attached | subjected about the same member as 1st Embodiment, and FIG. 1 is referred to about the abbreviate | omitted code | symbol.

  The aluminum substrate 2 is configured in a circular shape with a slit 23 provided in a part thereof, and a convex portion 21 is formed at a substantially central portion of the upper surface (a surface facing the LED module), and on both side surfaces thereof. Is provided with a power supply line 22 connected to a power source. Here, the reason why the slit 23 is provided is to secure an area in which the LED module 3 is attached and detached.

  The LED module 3 includes a rectangular module main body 31 and an engaging portion 32 that is connected to the module main body 31 and engages with the aluminum substrate 2. When the LED module 3 is engaged with the aluminum substrate 2, the module main body 31 is positioned on the upper surface of the aluminum substrate 2, and the engaging portions 32 are disposed outside both side surfaces of the aluminum substrate 2. The state which supports the aluminum substrate 2 from the lower surface of 2 will be comprised.

  An LED chip 33 is attached to the upper surface of the module main body 31 (the surface opposite to the surface facing the aluminum substrate 2).

  The LED modules 3 engaged with the aluminum substrate 2 have different LED chip states. In other words, the LED module 3a and the LED module 3b have different numbers of attached LED chips (the LED module 3a has three LED chips attached, whereas the LED module 3b has two LED chips attached. LED module 3a and LED module 3c have different LED chip arrangements (LED module 3a has LED modules arranged in the circumferential direction of aluminum substrate 2, whereas LED module 3c, LED chips are arranged in the radial direction of the aluminum substrate 2).

  Furthermore, a recess 34 is provided on the lower surface of the module body 31 (the surface facing the aluminum substrate 2). When the LED module 3 is engaged with the aluminum substrate 2, the recess is formed in the aluminum substrate 2. It will be engaged with the convex portion 21.

  In the LED lighting device according to the second embodiment, the LED module 3 can be attached to an arbitrary position of the aluminum substrate 2 in the same manner as the LED lighting device according to the first embodiment described above. The degree of freedom in designing the lighting device can be greatly improved.

  Further, in the LED lighting device according to the second embodiment, the LED module 3 attached to the aluminum substrate 2 has a different state (the number of LED chips, the arrangement of LED chips), thereby further free design. It can be realized.

  In addition, the point which can implement | achieve the improvement of the manufacture yield of a LED lighting apparatus, and the point which can radiate | emit heat through the aluminum substrate 2 are the same as that of the LED lighting apparatus which concerns on 1st Embodiment mentioned above.

<3. Modification>
In the LED lighting device of the first embodiment described above, a case where the state of the LED chip attached to the LED module 3 engaged with the aluminum substrate 2 is the same in all the LED modules 3 is taken as an example. Although described, the LED module 3 in which the state of the attached LED chip is different may be engaged with the aluminum substrate 2 as in the LED lighting device of the second embodiment described above.
In other words, the LED modules 3 having different LED chip states may be engaged with the flat aluminum substrate 2.

Similarly, in the LED lighting device according to the second embodiment described above, the case where the states of the LED chips attached to the LED module 3 engaged with the aluminum substrate 2 are different from each other will be described as an example. However, the LED module 3 in which the state of the attached LED chip is the same may be engaged with the aluminum substrate 2 as in the LED lighting device of the first embodiment described above.
That is, the LED module 3 having the same LED chip state may be engaged with the substantially circular aluminum substrate 2.

Further, in the LED lighting device of the second embodiment described above, as an example in which the state of the LED chip attached to the LED module 3 is different, the case where the number of LED chips is different and the arrangement of the LED chips are different are taken as examples. In addition, the case where the illuminance of the LED chip is different or the wavelength of light emitted from the LED chip is different can be mentioned.
That is, even if the number and arrangement of the LED chips attached to the LED module 3 are the same, a free design can be realized by changing the illuminance and the wavelength of emitted light. In addition, when the wavelength of the light emitted from the LED chip is made different, light of various wavelengths is emitted from the LED illumination device, and it is possible to realize light approximate to sunlight.

  Furthermore, in the LED lighting device of the first embodiment described above, an example is given in which the aluminum substrate 2 has a flat plate shape. In the LED lighting device of the second embodiment described above, the aluminum substrate 2 is substantially circular. Although a case has been described as an example, the shape of the aluminum substrate 2 is not limited to such a shape, and may be any shape.

  In addition, in the LED illumination device of the first embodiment and the LED illumination device of the second embodiment described above, the explanation is given by taking a case where the substrate is made of an aluminum material as an example. The substrate may be composed of other than aluminum material. However, since the substrate is made of a material having high thermal conductivity, the heat dissipation effect is improved, and the life of the LED chip can be extended. Therefore, the substrate is preferably made of a heat dissipation material. As a method for obtaining the heat dissipation effect, a heat dissipation structure (for example, circulating cooling water inside the substrate) may be employed for the substrate.

  Furthermore, in the LED lighting device according to the first embodiment and the LED lighting device according to the second embodiment described above, the power supply line 22 is arranged on both side surfaces (entire surface) of the aluminum substrate 2, thereby the LED module 3. The description is given by taking as an example a configuration that can supply power as a drive source to the LED chip attached to the LED module 3 via the power supply line 22 regardless of the engagement position. However, it is sufficient for the power supply line 22 to be able to supply power to the LED chip attached to the LED module 3, and it is not always necessary to be disposed on both sides (entire surface) of the aluminum substrate 2. It may be arranged. However, if power is supplied only when the LED module 3 is arranged at a specific position on the aluminum substrate 2, the degree of freedom in designing the LED lighting device may be limited. It is preferable that the power supply lines 22 are formed on both side surfaces (entire surface) of the aluminum substrate 2 as in the LED lighting device of the first embodiment and the LED lighting device of the second embodiment.

1 LED lighting device 2 Aluminum substrate 3 LED module 21 Convex part 22 Power supply line 23 Slit 31 Module body 32 Engagement part 33 LED chip

Claims (9)

A substrate,
An engaging member configured to be detachably engaged with the substrate and slidable on the substrate;
An LED chip attached to the engaging member;
A power supply member that is provided on the substrate and supplies power to the LED chip attached to an engagement member that engages with the substrate. The lighting device according to claim 1, wherein the power supply member is configured to be able to supply power to an engagement member that engages with an arbitrary position of the substrate. The lighting device according to claim 1, wherein at least a part of the substrate is made of a heat dissipation material. The lighting device according to claim 1, wherein the substrate includes a heat dissipation structure. The engagement member has a plurality of LED chips attached thereto, and the plurality of LED chips are arranged substantially in parallel with the sliding direction of the engagement member. Item 5. The lighting device according to Item 4. A plurality of engagement members are engaged with the substrate, and the number of LED chips attached to one engagement member is different from the number of LED chips attached to another engagement member. The lighting device according to claim 2, 3, 4, or 5. A plurality of engaging members are engaged with the substrate, and an arrangement of LED chips attached to one engaging member is different from an arrangement of LED chips attached to another engaging member. The lighting device according to claim 2, 3, 4, or 5. A plurality of engaging members are engaged with the substrate, and the illuminance of the LED chip attached to one engaging member is different from the illuminance of the LED chip attached to the other engaging member. The lighting device according to claim 2, 3, 4, or 5. A plurality of engaging members are engaged with the substrate, and the wavelength of light emitted from the LED chip attached to one engaging member is the wavelength of light emitted from the LED chip attached to the other engaging member. The illumination device according to claim 1, claim 2, claim 3, claim 4 or claim 5, which is different from the wavelength.

Images