JP3160696B2 - Metal composite material, method of manufacturing the same, and package having the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode material for supporting a semiconductor element, a metal composite material used for a substrate for mounting a semiconductor element, or the like, which is disposed around a semiconductor element or used in contact with a semiconductor element. More specifically, the present invention relates to a metal heat-dissipating substrate having high heat dissipation used for heat radiation of a semiconductor chip such as a heat sink housed in a ceramic package or a plastic package, or a metal heat-dissipating component, and a method for producing them. And packages using them.

[0002]

2. Description of the Related Art Generally, in a ceramic package or a plastic package formed by packaging a semiconductor chip, a so-called heat sink (radiation substrate) is used to dissipate heat generated from the semiconductor element. A material such as a heat sink disposed around the outer periphery of such a semiconductor chip needs to balance properties such as thermal expansion and heat conduction with ceramic or plastic used for the semiconductor element and the package body. Also, the electrode material for supporting the semiconductor element or the substrate for mounting the semiconductor element used in such a package also has a high heat dissipation effect, and a heat dissipation board having a similar thermal expansion coefficient to the semiconductor element and its surrounding materials is required. ing. Further, it is required to select a process and a material capable of obtaining a cheap and stable quality. For example, a material having an uneven shape is generally inferior in mass productivity because it is manufactured by cutting or punching a plate material or by combining both. Further, since the sheet material is usually manufactured by rolling, the cost becomes extremely expensive when the processing cost is taken into account.

The heat sink usually has a flat plate shape (rectangular shape). However, a heat sink having a shape other than rectangular shape (hereinafter, referred to as an irregular shape) is used depending on a package to be accommodated. Are also required.

[0004] In view of the above, after the powder is pressed, it is densified by sintering or, if necessary, by sizing or hot isostatic pressing (HIP).
It is necessary to inexpensively manufacture a heat dissipation board having desired thermal characteristics.

[0005] By the way, packages for packaging semiconductor elements include ceramic packages and plastic packages. However, plastic packages are industrially produced or consumed in an extremely large amount due to their versatility. As a material for the outer periphery of such a heat dissipation substrate and a semiconductor chip, a stable copper in both quality and quantity is often considered. Most of the copper is used, but the copper is inferior in rigidity. A method in which rigidity is provided by the method described above is being studied.

[0006]

However, when copper is used as a deformed part, it is difficult to reduce the weight due to its density, disadvantageous in terms of price, and not suitable for mass production.

The power and high reliability, which are also excellent characteristics of the ceramic package, are naturally required for the plastic package. The plastic package has the same power and high reliability as the ceramic package, and is inexpensive. It is necessary to also have

[0008] In the future, the above tendency is expected to become stronger.
In particular, with regard to products having irregular shapes such as those having a step, no satisfactory products have been found that satisfy both performance and cost.

In general, in order for the product itself to be inexpensive, it can be said that it is advantageous to use rolling, punching, or the like if it is a flat plate. When a mounting hole is required, it is also required that the hole can be easily processed by a press without using difficult processing such as cutting, shearing, and drilling.

As one method of producing a copper-molybdenum composite material, after a powder obtained by mixing a copper powder and a molybdenum powder is press-molded, a sintered body is produced and rolled. Although the relative density of the sintered body at this time is 95 to 96%, a sufficiently densified composite plate can be obtained by the subsequent rolling. This composite plate is composed of a matrix of copper around the molybdenum particles, so machining is easy,
By cutting or punching, irregular shapes including rectangular shapes can be easily machined.

However, the machining cost is expensive, the overall cost is not low, and the mass productivity is poor.

[0012] Another manufacturing method is a CMSH (registered trademark) (M series; manufactured by Sumitomo Electric Industries, Ltd.) which is already commercially available.
Mo-based sintered composites by the infiltration method), but first, a molybdenum skeleton (skeleton) is created and melted and impregnated with copper, resulting in poor rollability and machinability. Also, the punching workability is remarkably inferior to the former. Therefore, even if it is machined into a rectangular or irregular shape, it becomes very expensive.

[0013] Further, in manufacturing a flat plate-shaped part, the sintering method using powder metallurgy cannot be easily densified. Therefore, even if the raw material can be prepared by using a low-cost process such as rolling, as described above, the number of manufacturing steps increases by adding steps such as cutting steps and holes and cutting. In fact, it is actually an expensive part.

Accordingly, a first technical object of the present invention is to provide a metal composite material having 99% or more of the theoretical density and having an overall average thermal expansion coefficient in the range of 7 to 16 × 10 ⁻⁶ / ° C. Manufacturing method.

A second technical object of the present invention is to provide a heat dissipation board material using the metal composite material, a method of manufacturing the same, and a package using the same.

Further, a third technical problem of the present invention is that it has high heat dissipation (heat conductivity of 190 W / m · K or more), has a rigidity equal to or higher than that of copper, and has a stepped portion. An object of the present invention is to provide a metal deformed part made of a lightweight metal material and suitable for mass production, a method of manufacturing the same, and a package having the same.

[0017]

According to the present invention, in terms of mass,
30 or more copper and 0.1 to 1.0% by mass based on the copper
And a balance of molybdenum as a balance , wherein the sintering aid comprises iron, nickel,
The sintered body has at least a relative density of 99% or more and a density of 10 g / c.
m ³ or less, an average thermal expansion coefficient of overall 7 to 16 × ^{10 -6}
/ ℃ in the range of, the package thermal conductivity and having a heat sink made of a heat radiating substrate material with a different shape having a 150 W / m · K or more properties.

According to the present invention, more than 30% by mass
, And a sintered body of a raw material powder containing molybdenum as a balance , wherein the sintered body has a relative density of 99% or more and 0.1 to 1.0 mass% with respect to the copper. A sintering aid comprising at least one of iron, nickel, cobalt and manganese ,
The heat radiation board material characterized by having the above is obtained.

According to the present invention, more than 30% by mass
And copper, a sintered body of material powder containing a molybdenum balance, the sintered body to have a relative density of 99% or more
With sintering of 0.1 to 1.0% by mass with respect to the copper
Agent, wherein the sintering aid comprises iron, nickel, cobalt,
Consist of at least one of the manganese, at least 19
A metal deformed part having a thermal conductivity of 0 W / m · K, which is used for a package and is in contact with or arranged around a semiconductor chip, is obtained.

[0020]

According to the present invention, there is provided a metal deformed part characterized by having at least a stepped portion in any of the above-mentioned metal deformed parts.

Further, according to the present invention, there is provided a package using any one of the above-mentioned metal deformed parts.

Here, as the package in which the metal shaped part of the present invention is used, at least one of a ceramic package and a plastic package, or a package as it is, other than the present invention, is an insulator and has a high heat dissipation property. It has a thermal conductivity equal to or higher than that of AlN having

[0024]

On the other hand, according to the present invention , 30% or more by mass
In a method for producing a sintered body, a raw material powder containing copper powder and a molybdenum powder as the remainder is mixed, molded and sintered, wherein the raw material powder is 0.1 to 2.0% by mass with respect to copper.
Sintering aid, wherein the sintering aid is iron powder, nickel powder
Powder, selected from cobalt powder and manganese powder
A method of producing a metal composite material, which is at least one kind, is characterized by obtaining a sintered body having a relative density of 99% or more by performing HIP after the sintering.

[0026]

According to the present invention, there is provided a method of manufacturing a metal composite material according to any one of the above-described methods of manufacturing a metal composite material, wherein sizing is performed after the HIP.

According to the present invention, in any one of the above-described methods for producing a metal composite material, the sintered body has a density of 10%.
g / cm ³ or less, and the overall average thermal expansion coefficient is 7 to 16 × 1
A method for manufacturing a heat-radiating substrate material, wherein the heat-radiating substrate material is in the range of 0 ⁻⁶ / ° C., has a thermal conductivity of 150 W / m · K or more, and is processed into a rectangular or uneven heat-radiating substrate. Is obtained.

According to the present invention, in any one of the above-described methods for producing a metal composite material, the metal composite material has a characteristic that at least a thermal conductivity is 190 W / m · K or more. A method of manufacturing a part is obtained.

Here, in the present invention, the copper content depends on the type and amount of the sintering aid, but is required to be 30% by mass or more. The sintering aid is added to promote densification in sintering, and is at least one selected from Fe, Mn, Ni, and Co. In effect, copper is sintered and densified. It is added in order to release the gas contained therein when it is used. If the amount is less than 0.1% with respect to the amount of copper, it is ineffective, and considering that the thermal conductivity decreases, it is better not to add it. Good. If it is 2% or more, the thermal conductivity similarly decreases, so it is preferable that the content is contained in the range of 0.1 to 2%.
Furthermore, the range of 0.3 to 1.0 mass% is more preferable.
The reason is that, when the content exceeds 1.0% by mass, not only the effect of densification as a sintering agent is reduced, but also the thermal conductivity is reduced to 150 W / m · K or less, and the effectiveness as a heat dissipation substrate is reduced. Will be gone. In addition, the sintered body is hardened, and machining such as unevenness becomes difficult, so that it is impossible to punch through a rectangular shape, and productivity is reduced.

When the sintering aid is added in the form of fine metal powder, it is effective to add 0.5 to 1.0% by mass with respect to the amount of copper in view of the balance between density and thermal conductivity. is there.

Specifically, in the method for producing a metal composite material of the present invention, when a process of mixing and pressing and sintering copper and molybdenum powder to obtain a desired heat-radiating board material or a deformed part, When or after mixing molybdenum thoroughly, iron (Fe), manganese (M
n), at least one of nickel (Ni) and cobalt (Co) is added, and sintering is performed in a reducing atmosphere. If necessary, a hot isostatic press (hereinafter referred to as HIP)
And / or sizing to obtain sufficient densification and shape accuracy. Insufficient density after sintering
Densification by IP and deformation of sintering can be easily corrected by sizing.

[0033]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing the relationship between the amount of iron added and the relative density of a sintered body which is a metal composite material according to an embodiment of the present invention. FIG. 2 is a diagram showing the relationship between the amount of iron added and the thermal conductivity of the sintered body of FIG.

As shown in FIG. 1 and FIG.
Within the range of 01 to 1% by mass, the relative density of the sintered body is 95%.
As described above, the content reaches 99% at 0.5 to 1% by mass. And, within this range, the thermal conductivity is 150 W / m.
K or more.

The metal composite material shown in FIGS. 1 and 2 is manufactured as follows. Iron is added to the same mass of copper and molybdenum powder, mixed, pressed and sintered.

When the sintered body shown in FIGS. 1 and 2 is subjected to hot isostatic pressing (HIP), a metal composite material having desired characteristics according to the embodiment of the present invention is obtained.

Hereinafter, specific production of the metal composite material according to the embodiment of the present invention will be described.

(Embodiment 1) FIG. 3 is a view showing a metal deformed part according to Embodiment 1 of the present invention.
(B) is a plan view. FIG. 4 is a perspective view showing a semiconductor package using the metal deformed part of FIG. FIG.
As shown in (1), the metal deformed part 10 is provided with a flat plate-shaped projection 1 which is formed in a square plate shape and has a step at the center.
A semiconductor chip (not shown) is mounted on the convex portion 1, and FIG.
Is housed in the package shown.

As shown in FIG. 4, the semiconductor element 12 is fixed on the projection 1. The odd-shaped component 10 is accommodated in a socket 15 having terminal pins 14 and
2 and the pin terminal 14 are connected by the bonding wire 13 and further covered by the socket lid 16 to complete the semiconductor package.

The metal deformed part 10 shown in FIGS. 3A and 3B is manufactured as follows.

Molybdenum powder (3.2 μm) and copper powder (8 μm)
m) was mixed for 30 hours in a ball-mixer using alcohol as a dispersant. Here, the ratio of molybdenum to copper is 7: 3 by mass, and 0.3 mass% of Ni is contained with respect to the amount of copper. After removal of the balls, solid-liquid separation and drying, granules were formed using camphor. After the decamphor, the convex portion 1 shown in FIGS. 3A and 3B was press-molded downward. After sintering the press-formed product in hydrogen at 1230 ° C. for 3 hours, 1.8 ton / cm by HIP
^2. Treat at 1060 ° C for 1 hour.
Sizing was performed in the thickness direction of 20 to 25 μm. As a result, the density reached 99.8% of the theoretical density, the coefficient of thermal expansion was 8.8 × 10 ⁻⁶ / K, the thermal conductivity was 194 W / m · K, and the convex portion to be mounted on the semiconductor chip had a surface roughness of Rmax. The thickness was 2 μm, and an excellent metal deformed part as a metal heat dissipation material used for a semiconductor package was obtained.

(Embodiment 2) FIG. 5 is a view showing a metal deformed part according to Embodiment 2 of the present invention.
(B) is a plan view. As shown in FIGS. 5A and 5B, the metal deformed part 20 has a flat concave portion 2 at the center.

The metal deformed part 20 shown in FIG. 4 is manufactured as follows.

By the same treatment as in Example 1, a composite powder having a molybdenum / copper ratio of 4: 6 and containing 1% by mass of Fe with respect to the amount of copper was obtained. Next, a granulated powder was formed by using soft wax as a binder, and after debinding, press-molded with the concave portion 2 shown in FIG. 4 down, and sintered in hydrogen at 1100 ° C. for 3 hours. Sizing by pressing in the thickness direction of the bottom plate 1.2mm, thickness variation ± 0.
025 mm and a top and bottom parallelism of 0.03 were obtained. As a result, the density reached 99.4% of the theoretical density, the coefficient of thermal expansion was 12.7 × 10 ⁻⁶ / K, and the thermal conductivity was 249.
A good metal deformed part as a metal heat dissipation material of W / m · K was obtained. Also, in the same manner as in Example 2, when Mn was contained in the same mass% instead of Fe, the same result as that containing Fe was obtained.

(Embodiment 3) FIG. 6 is a view showing a metal deformed part according to Embodiment 3 of the present invention.
(B) is sectional drawing which follows the AA line of (a). Also,
FIG. 7 is a diagram showing a semiconductor package using the metal deformed part of FIG.

As shown in FIGS. 6A and 6B, the base 5 is plate-shaped and has four rounded corners. A square plate-shaped projection 6 is provided at the center of one surface of the base 5.
Further, through holes 7 are formed at four corners of the substrate.

Further, the metal deformed part according to the third embodiment of the present invention has holes at the four corners in the same manner as in the first embodiment using the same material as in the first embodiment and using a mold having rounded corners. Press molding, sintering, and then sizing.

Referring to FIG. 7, a box-shaped support portion 32 is fixed to the projecting portion of metal deformed part 30, and a semiconductor element 31 is fixed via a support plate 32 made of AlN. The wires 35 are connected to each other, and the lid wires 35 are made to protrude outward from the support portions 32 to form a semiconductor package.

(Embodiment 4) FIG. 8 is a view showing a metal deformed part according to Embodiment 4 of the present invention.
(B) is sectional drawing which follows the BB line.

As shown in FIGS. 8 (a) and 8 (b), the metal deformed part 40 has a base 8 having the same shape as in the first and second embodiments, and has a central portion at a height of T1 from the plate surface of the base. A protruding quadrangular cylindrical protruding wall portion 11 is provided. On both sides of the protruding wall portion 11, a protruding portion having a columnar cross section protruding at a height of T2 smaller than T1 and separated from the protruding wall portion 11. 9 is provided.

This metal deformed part 40 is press-formed using the same material as that of the second embodiment so that the protruding portion 9 and the convex wall portion 11 face down and sintered, similarly to the first embodiment. The sizing process is performed in the same manner as in Example 1.

(Embodiment 5) FIGS. 9A and 9B are views showing a metal composite material according to Embodiment 5 of the present invention, showing a heat dissipation substrate. As shown in FIG. 9, the heat dissipation board 50 has a recessed portion 52 formed in the center of the base 51. Next, a method for manufacturing the heat dissipation board 50 according to the fifth embodiment of the present invention will be described.

The molybdenum powder and the electrolytic copper powder were mixed at a ratio of 3: 1.
, And iron powder was mixed as a sintering aid in an amount of 0.8% by mass in terms of copper. As shown in FIG.
Press molding, sintering in a hydrogen atmosphere,
IP processed. The relative density of this sintered body is 99.6%, and the deformation during sintering and HIP is corrected by sizing.
It was sufficient for a dimensional tolerance of ± 0.05.

The density (ρ) at this time was 9.8 g / cm ³ ,
Regarding the coefficient of thermal expansion (α), α = 8.2 × 10 ⁻⁶ /
° C and thermal conductivity (κ) were 163 W / m · K.

Further, after this was subjected to electrolytic plating of 3 μm Ni, it was treated at 850 ° C. × 20 minutes in a hydrogen atmosphere.
There were no defects such as blistering, discoloration, and stain of the plating.

(Example 6) Molybdenum powder and electrolytic copper powder were mixed at a ratio of 1: 1 and nickel powder as a sintering aid was mixed at 0.5% by mass in a copper ratio. A sintered body was produced. The relative density of this sintered body is 99.8
%, The deformation during sintering is corrected by sizing, ±
A dimensional tolerance of 0.05 was sufficient.

The characteristics at this time are: ρ = 9.5 g / cm ³ ,
α = 11.0 × 10 ⁻⁶ / ° C., κ = 181 W / m · K.

Further, as in the case of the fifth embodiment, after the Ni plating, the substrate was treated in a hydrogen atmosphere at 850 ° C. for 20 minutes.
There were no defects such as blistering, discoloration, and stain of the plating.

(Example 7) A molybdenum powder and an electrolytic copper powder were mixed at a ratio of 1: 1 to produce a sintered body in the same manner as in Example 5. The relative density of this sintered body is 94.0
% In an argon gas atmosphere;
When HIP processing was performed under the conditions of 050 ° C. and a pressure of 1 ton / cm ² , the relative density was 99.7%. Sintering ・ H
The deformation at the time of IP was corrected by sizing, and was sufficient for the dimensional tolerance of ± 0.05.

The characteristics at this time are: ρ = 9.5 g / cm ³ ,
α = 11.1 × 10 ⁻⁶ / ° C., κ = 245 W / m · K.

As in the case of the fifth embodiment, after the Ni plating, the substrate was treated in a hydrogen atmosphere at 850 ° C. for 20 minutes.
There were no defects such as blistering, discoloration, and stain of the plating.

Example 8 Molybdenum powder and electrolytic copper powder were mixed at a ratio of 2: 1 and 10 × 12 × T1.2
(Rectangle) and then sintered in a hydrogen atmosphere. The relative density of this sintered body was 92.5%,
HIP treatment was performed in an argon gas atmosphere under the conditions of temperature: 1050 ° C., pressure: 1 ton / cm ² ,
The relative density was 99.5%. The deformation during sintering was corrected by sizing, which was sufficient for the dimensional tolerance of ± 0.05.

The characteristics at this time are: ρ = 9.7 g / cm ³ ,
α = 8.8 × 10 ⁻⁶ / ° C. and κ = 205 W / m · K.

Although the copper-molybdenum composite material of this composition cannot be densified and is therefore very difficult to roll, the productivity is low, but the above-mentioned method improves the machinability and the productivity. Go up. In addition, as in Example 5, even after the Ni plating, the plating was not swelled, discolored, stained, etc., even when treated in a hydrogen atmosphere at 850 ° C. for 20 minutes.

(Embodiment 9) FIGS. 10A and 10B are views showing a metal composite material according to Embodiment 9 of the present invention, showing a heat dissipation substrate. As shown in FIG. 8, the heat dissipation board 60 has a base 62 formed at the center of a base 61. Next, a method for manufacturing the heat dissipation board 60 according to the ninth embodiment will be described.

The molybdenum powder and the electrolytic copper powder were mixed at a ratio of 1: 4
□ 28 × T1.3 as shown in FIG.
After being pressed into a (convex) shape, it was sintered in a hydrogen atmosphere. The relative density of this sintered body was 94.3%, but in an argon gas atmosphere, the temperature: 1000 ° C., the pressure:
After HIP processing under the condition of 0.8 ton / cm ² ,
The relative density was 99.7%. When the deformation during sintering was corrected by sizing, the dimensional tolerance of ± 0.05 was sufficient.

The characteristics at this time are as follows: ρ = 9.2 g / cm ³ ,
α = 14.7 × 10 ⁻⁶ / ° C., κ = 320 W / m · K.

Further, as in the case of the fifth embodiment, after the Ni plating, the substrate was treated in a hydrogen atmosphere at 850 ° C. for 20 minutes.
There were no defects such as blistering, discoloration, and stain of the plating.

[0070]

As described above, according to the present invention, a metal composite material having a theoretical density of 99% or more and an overall average thermal expansion coefficient in the range of 7 to 16 × 10 -6 / ° C. And a manufacturing method thereof and a package using the same.

Further, according to the present invention, it is possible to provide a heat dissipation board material using the metal composite material and a method of manufacturing the same.

Further, according to the present invention, a metal composite material of 190 W / m · K or more, a heat-dissipating substrate material, and a highly heat-dissipating metal deformed part can be obtained by the copper-molybdenum system, and the density is substantially reduced. It is possible to provide a metal deformed part which is less than 10 in weight, a method of manufacturing the same, and a package having the same.

Further, according to the present invention, the components are sufficiently densified, and if sizing is added, parts having precise dimensions can be easily mass-produced at low cost (with general-purpose equipment). It is possible to provide a deformed metal part that can be used as a consumer part, a method of manufacturing the same, and a package including the same.

Further, according to the present invention, since it is made of copper and molybdenum, it can be plated and soldered, and can be used without essentially changing the conventional package production equipment, which is economical. A metal deformed part, a method of manufacturing the same, and a package including the same can be provided.

[Brief description of the drawings]

FIG. 1 is a diagram showing the relationship between the amount of iron added and the relative density of a sintered body that becomes a metal composite material according to an example of the present invention.

FIG. 2 is a diagram showing the relationship between the amount of iron added and the thermal conductivity of the sintered body of FIG.

FIG. 3A is a front view of a metal deformed part according to the first embodiment of the present invention. (B) is a top view of the metal deformed part of (a).

FIG. 4 is a perspective view showing a semiconductor package using the metal deformed part of FIG. 3;

FIG. 5A is a cross-sectional view of a metal deformed part according to a second embodiment of the present invention. (B) is a top view of the metal deformed part of (a).

FIG. 6A is a plan view of a metal deformed part according to a third embodiment of the present invention. (B) is A- of the metal deformed part of (a).
FIG. 3 is a sectional view taken along line A.

FIG. 7 is a perspective view showing a semiconductor package using the metal deformed part of FIG. 6;

FIG. 8A is a plan view of a metal deformed part according to Embodiment 4 of the present invention. (B) is B- of the metal deformed part of (a).
It is a B sectional view.

FIG. 9A is a plan view of a metal deformed part according to Embodiment 5 of the present invention. (B) is a front view of the metal deformed part of (a).

FIG. 10 (a) is a plan view of a metal deformed part according to Embodiment 9 of the present invention. (B) is a front view of the metal deformed part of (a).

[Explanation of symbols]

 1,6 convex portion 2 concave portion 5,8 base 7 through hole 10,20,30,40 metal deformed part 11 convex wall 50,60 radiating substrate 51,61 base 52 concave portion 62 base

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI C22C 9/00 C22C 9/00 (72) Inventor Yoshihiko Doi 5--24-8 Higashi-Ueno, Taito-ku, Tokyo Tokyo Tungsten Co., Ltd. JP-A-4-180534 (JP, A) JP-A-4-34862 (JP, A) JP-A-6-248493 (JP, A) JP-A-4-349650 (JP, A) (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 23/373 C22C 1/00 C22C 9/00 B22F 1/00 B22F 3/00

Claims (9)

(57) [Claims] 1. Copper having a mass of 30 or more, and said copper
A sintered body of a raw material powder containing 0.1 to 1.0% by mass of a sintering aid and the balance of molybdenum, wherein the sintering aid is iron, nickel, cobalt, At least as little as manganese
The sintered body has a relative density of 99% or more, a density of 10 g / cm ³ or less, an overall average thermal expansion coefficient in the range of 7 to 16 × 10 ⁻⁶ / ° C., and a thermal conductivity of the rate is 1
A package comprising a heat sink made of a heat-dissipating substrate material having a different shape having a characteristic of 50 W / m · K or more. 2. A sintered body of a raw material powder containing at least 30% by mass of copper and the balance of molybdenum, wherein said sintered body has a relative density of at least 99%, The sintering aid contains 0.1 to 1.0% by mass with respect to the copper, and the sintering aid is made of at least one of iron, nickel, cobalt, and manganese, and has a different shape. radiating substrate material characterized in that there. 3. A 30% or more copper in mass, a sintered body of material powder containing a motor <br/> Ribuden the balance, the sintered body as well as have a relative density of 99% or more the Against copper
0.1 to 1.0% by mass of the sintering aid,
The agent is less of iron, nickel, cobalt and manganese
A metal deformed part comprising at least one kind , having a thermal conductivity of at least 190 W / m · K, being used for a package, being in contact with a semiconductor chip or being arranged around a semiconductor chip. 4. The metal deformed part according to claim 3 ,
A metal variant having at least a stepped portion. 5. A package using the metal deformed part according to claim 3 or 4 . 6. A method for producing a sintered body in which a raw material powder containing 30% by mass of copper powder and a balance of molybdenum powder is mixed, molded and sintered, wherein the raw material powder is Against copper
Containing 0.1 to 2.0% by mass of a sintering aid,
Auxiliaries include iron powder, nickel powder, cobalt powder and manganese.
At least selected from among the down powder consists kind, after the sintering, a relative density of 99 by performing the HIP treatment
%. A method for producing a metal composite material, comprising obtaining a sintered body having at least 7. The method for producing a metal composite material according to claim 6 , wherein the sizing is performed after the HIP. 8. The method for producing a metal composite material according to claim 6 , wherein the sintered body has a density of 10 g / cm ³ or less and an overall average thermal expansion coefficient of 7 to 16 × 10 ⁻⁶ / ° C. A method for manufacturing a heat-dissipating board material, wherein the heat-dissipating board material is in a range, has a thermal conductivity of 150 W / m · K or more, and is processed into a heat-dissipating board having a complicated shape such as a rectangular shape or an uneven shape. 9. The method of manufacturing a metal composite material according to claim 6 , wherein the metal composite material has a thermal conductivity of at least 190 W / m · K. A method for producing a deformed metal part having the following characteristics.