JP3158311B2 - Replenishment method of liquid mixture and semiconductor - Google Patents

Replenishment method of liquid mixture and semiconductor

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Publication number
JP3158311B2
JP3158311B2 JP21633292A JP21633292A JP3158311B2 JP 3158311 B2 JP3158311 B2 JP 3158311B2 JP 21633292 A JP21633292 A JP 21633292A JP 21633292 A JP21633292 A JP 21633292A JP 3158311 B2 JP3158311 B2 JP 3158311B2
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JP
Japan
Prior art keywords
replenishment
time
chemical
average
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP21633292A
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Japanese (ja)
Other versions
JPH0645308A (en
Inventor
浩 高木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
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Priority to JP21633292A priority Critical patent/JP3158311B2/en
Publication of JPH0645308A publication Critical patent/JPH0645308A/en
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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、混合液の薬液補充方
法、特に混合されると互いに反応して少なくとも一つが
蒸発する複数の薬液の混合液のその蒸発する薬液の補充
をする混合液の薬液補充方法と、その薬液補充方法に係
る洗浄により洗浄された半導体に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of replenishing a mixture of chemicals, and more particularly to a method of replenishing a mixture of a plurality of chemicals which react with each other when mixed and at least one of which evaporates. The method for replenishing a drug solution and the method for replenishing the drug solution
The present invention relates to a semiconductor that has been cleaned by cleaning .

【0002】[0002]

【従来の技術】半導体ウェハに付着した有機物の除去
(典型例がフォトレジスト膜の剥離除去)、無機物(金
属等)の除去、パーティクルと称される微粒子の除去の
ためにウェハ洗浄液として硫酸と過酸化水素水の混合液
が多く用いられる。元来、硫酸は単独でも洗浄効果を有
するが、それに過酸化水素水を混合すると下記の反応が
生じ、その結果、カロー酸H2 SO5 が発生し強い洗浄
効果を得ることができる。 2H2 SO4 +H2 O2 →H2 SO4 +H2 SO5 +H
2 O(尚、この反応は可逆反応である。)
2. Description of the Related Art Sulfuric acid is used as a wafer cleaning liquid to remove organic substances attached to a semiconductor wafer (typically, peeling-off of a photoresist film), inorganic substances (metals, etc.), and fine particles called particles. A mixed solution of hydrogen oxide water is often used. Originally, sulfuric acid alone has a cleaning effect, but when mixed with a hydrogen peroxide solution, the following reaction occurs. As a result, caroic acid H2 SO5 is generated, and a strong cleaning effect can be obtained. 2H2 SO4 + H2 O2 → H2 SO4 + H2 SO5 + H
2 O (this reaction is a reversible reaction)

【0003】即ち、カロー酸H2 SO5 は強酸化剤であ
るので、有機物等と強く反応して分解、除去の効果を持
つ。そこで、かかるカロー酸H2 SO5 を発生させるべ
く硫酸に過酸化水素水を混合して洗浄液をつくるのであ
り、カロー酸H2 SO5 以外にも硫酸H2 SO4 、過酸
化水素H2 O2 が洗浄効果を持つが、カロー酸H2 SO
5 の効果が最も強いのである。
[0003] That is, since caroic acid H2SO5 is a strong oxidizing agent, it reacts strongly with organic substances and the like to have the effect of decomposition and removal. Therefore, in order to generate such caloic acid H2 SO5, sulfuric acid is mixed with hydrogen peroxide to form a cleaning solution. In addition to caloic acid H2 SO5, sulfuric acid H2 SO4 and hydrogen peroxide H2 O2 have a cleaning effect. Caroic acid H2 SO
The effect of 5 is the strongest.

【0004】ところで、硫酸と過酸化水素水の混合液は
混合開始直後から過酸化水素が蒸発し、過酸化水素濃度
が低下し、過酸化水素濃度が低下すると洗浄力が低下す
る。というのは、過酸化水素H2 O2 は不安定な物質で
分解し易く、そして過酸化水素H2 O2 が分解すると水
H2 Oが残り、水が時間の経過と共に増えてゆき、延い
ては硫酸、カロー酸H2 SO5 の濃度が低くなるからで
ある。従って、過酸化水素水を補充することが必要なの
である。そして、従来における過酸化水素水の補充は、
図4に示すように、ある時間幅t5の過酸化水素水の補
充を一定の周期t6をもって繰返すことにより行われて
いた。そして、その時間幅t5、周期t6は従来におい
ては混合液の混合開始後その混合液を排液処理するまで
変らなかった。
In a mixed solution of sulfuric acid and hydrogen peroxide, hydrogen peroxide evaporates immediately after the mixing is started, and the concentration of hydrogen peroxide decreases. When the concentration of hydrogen peroxide decreases, the cleaning power decreases. This is because hydrogen peroxide H2 O2 is an unstable substance that is easily decomposed, and when hydrogen peroxide H2 O2 is decomposed, water H2 O remains, and water increases with the passage of time. This is because the concentration of the acid H2 SO5 decreases. Therefore, it is necessary to replenish the hydrogen peroxide solution. And the conventional replenishment of hydrogen peroxide solution,
As shown in FIG. 4, replenishment of the hydrogen peroxide solution for a certain time width t5 has been performed by repeating at a constant cycle t6. The time width t5 and the cycle t6 do not change in the related art until the mixed liquid is discharged after the mixing of the mixed liquid is started.

【0005】[0005]

【発明が解決しようとする課題】ところで、図4に示す
ような薬液補充方法によれば、混合液の洗浄力を一定に
保つことができず、洗浄力の経時変化が大きかった。そ
こでその原因を追究したところ次のことが判明した。図
5は従来方法で補充を行った場合の混合液(硫酸過水)
の硫酸と過酸化水素水の濃度変化を示すものであり、過
酸化水素水を単位時間当りの平均薬液補充量が一定
(0.45リットル/時間)であるにも拘らず、過酸化
水素の濃度変化が大きく、当初3wt%もあったものが
2wt%弱まで低下し、そこで落ちつく。即ち、当初洗
浄力が強くても過酸化水素濃度が低下するので洗浄力が
低下するのである。
However, according to the chemical replenishing method shown in FIG. 4, the cleaning power of the mixed solution cannot be kept constant, and the cleaning power has a large change with time. Then, when the cause was investigated, the following became clear. Fig. 5 shows the mixed solution (sulfuric acid and hydrogen peroxide) when replenishment is performed by the conventional method.
The graph shows the change in the concentration of sulfuric acid and hydrogen peroxide in the hydrogen peroxide solution. Although the average replenishment rate of the hydrogen peroxide solution per unit time was constant (0.45 liter / hour), The change in concentration is large, and although the concentration was as high as 3 wt% at the beginning, it is reduced to less than 2 wt%, where it calms down. That is, even if the cleaning power is initially strong, the hydrogen peroxide concentration is reduced, so that the cleaning power is reduced.

【0006】そこで、硫酸過水に対して過酸化水素水の
補充を全く行わなかった場合の過酸化水素濃度の変化を
調べたら図6に示すようになった。即ち、混合開始直後
は硫酸の水和熱により液温が上昇する。そして、混合後
30分経過した頃液温が125℃近辺に達しそれ以後過
酸化水素の分解反応が生じ過酸化水素濃度が激しく低下
する。低下する割合は濃度曲線の傾きから解る。このよ
うに、液温がある段階に達するとその後過酸化水素分解
反応が激しくなり過酸化水素濃度が急激に低下するので
ある。この混合を開始後間もなくの過酸化水素分解反応
が激しい時間帯を混合初期時間帯ということとする。
FIG. 6 shows a change in the concentration of hydrogen peroxide when no replenishment of the aqueous solution of hydrogen peroxide was performed with respect to the aqueous solution of sulfuric acid. That is, immediately after the start of mixing, the liquid temperature rises due to the heat of hydration of sulfuric acid. Then, about 30 minutes after the mixing, the liquid temperature reaches around 125 ° C., after which a decomposition reaction of hydrogen peroxide occurs, and the hydrogen peroxide concentration drops sharply. The rate of decrease can be seen from the slope of the concentration curve. As described above, when the liquid temperature reaches a certain stage, the hydrogen peroxide decomposition reaction becomes intense thereafter, and the hydrogen peroxide concentration drops sharply. A time zone in which the hydrogen peroxide decomposition reaction is intense immediately after starting the mixing is referred to as a mixing initial time zone.

【0007】しかし、過酸化水素分解が常に激しく進行
し続けるわけでなく、ある段階から過酸化水素分解の量
が少なくなり、安定する。図5に示す従来例における濃
度変化図からも明らかなように昇温完了後80分位の頃
から過酸化水素分解量が少なくなる。この過酸化水素分
解量が少なくなる時間帯を消耗安定時間帯ということと
する。ということから、硫酸と過酸化水素水の混合を開
始し昇温後ある時間の間は、即ち、混合初期時間帯にお
いては過酸化水素の消耗が激しいが、その時間経過後、
即ち消耗安定時間帯においては過酸化水素の消耗が激し
くなくなるが、にも拘らず従来においては単位時間当り
の平均薬液補充量を常に一定にしていたため過酸化水素
濃度を一定にすることができなかったということが解
る。
However, the decomposition of hydrogen peroxide does not always proceed violently, and the amount of decomposition of hydrogen peroxide is reduced from a certain stage and is stabilized. As is clear from the concentration change diagram in the conventional example shown in FIG. 5, the amount of hydrogen peroxide decomposed decreases from about 80 minutes after the completion of the temperature rise. The time zone in which the hydrogen peroxide decomposition amount is reduced is referred to as a consumption stabilization time zone. Therefore, during a certain time after the start of mixing the sulfuric acid and the hydrogen peroxide solution and heating, that is, during the initial mixing time period, the consumption of hydrogen peroxide is severe, but after the elapse of the time,
That is, during the consumption stabilization time period, the consumption of hydrogen peroxide becomes intense. Nevertheless, in the past, the hydrogen peroxide concentration could not be kept constant because the average amount of chemical replenishment per unit time was always kept constant. It turns out that it was.

【0008】図5に示す従来例においては、消耗安定時
間帯での過酸化水素の消耗量を基準に補充量を決めてい
たので、即ち混合初期時間帯経過後の状況から補充条件
を選んでいたので、混合初期時間帯における過酸化水素
の激しい消耗分を補充できず、結局硫酸過水の過酸化水
素濃度は低くなり、やがて低い値のまま安定し、洗浄力
は充分に高くできなかった。また、もし、混合初期時間
帯における消耗分を補充するように補充条件を設定した
としたら、混合初期時間帯経過後における過酸化水素水
補充量が過剰になり、硫酸が低くなるのでやはり洗浄力
が低下することになり好ましくない。
In the conventional example shown in FIG. 5, the replenishment amount is determined based on the consumption amount of hydrogen peroxide during the consumption stabilization time period, that is, the replenishment condition is selected from the situation after the initial mixing time period. As a result, the intense consumption of hydrogen peroxide during the initial period of mixing could not be replenished, and eventually the hydrogen peroxide concentration of the sulfuric acid peroxide became low, eventually stabilizing at a low value, and the cleaning power could not be sufficiently increased. . Also, if the replenishment conditions were set so as to replenish the depleted amount in the initial mixing period, the replenishment amount of the hydrogen peroxide solution after the initial mixing period became excessive, and the sulfuric acid became low. Is undesirably reduced.

【0009】本発明はこのような問題点を解決すべく為
されたものであり、混合されると互いに反応して少なく
とも一つが蒸発する複数の薬液の混合液のその蒸発する
薬液の補充をする混合液の薬液補充方法において、薬液
の組成比が常に略一定になるように補充できるようにす
ることを目的とし、更には、そのような補充方法に係る
洗浄方法により常に均一な洗浄力で洗浄された洗浄度の
強い半導体を提供することを目的とする。
The present invention has been made to solve such a problem, and replenishes a mixture of a plurality of chemicals which react with each other and evaporate at least one of them when they are mixed. In the method of replenishing a mixed solution, the object is to enable replenishment so that the composition ratio of the solution is always substantially constant.
Detergency of washing that is always washed with uniform washing power by the washing method
The purpose is to provide a strong semiconductor .

【0010】[0010]

【課題を解決するための手段】請求項1の混合液の薬液
補充方法は、混合液の薬液の蒸発が激しい混合初期時間
帯には単位時間当りの平均薬液補充量が多く、それ以降
の薬液の蒸発の比較的少ない消耗安定時間帯には単位時
間当りの平均薬液補充量が少なくなる条件で薬液補充を
することを特徴とする。請求項2の混合液の薬液補充方
法は、ある時間幅の補充をある時間間隔毎に繰返すこと
により薬液を行い、単位時間当りの平均薬液補充量を上
記時間幅と上記時間間隔によって変化させることを特徴
とする。請求項3の半導体は、混合液の薬液の蒸発が激
しい混合初期時間帯には単位時間当たりの平均薬液補充
量が多く、それ以降の薬液の蒸発が比較的少ない消耗安
定時間帯には単位時間当たりの平均薬液補充量が少なく
なる条件で薬液補充をして洗浄したことを特徴とする。
According to a first aspect of the present invention, there is provided a method for replenishing a mixed solution, wherein the average amount of the replenished solution per unit time is large during the initial mixing period when the mixed solution is rapidly evaporated. It is characterized in that the chemical solution is replenished under the condition that the average amount of the chemical solution replenished per unit time is reduced during the consumption stable time period in which the evaporation of the liquid is relatively small. In the method of replenishing a mixed solution according to claim 2, the replenishment of a certain time width is repeated at certain time intervals to perform the chemical solution, and the average replenishment amount per unit time is changed according to the time width and the time interval. It is characterized by. In the semiconductor according to the third aspect, the chemical solution of the mixed solution is rapidly evaporated.
Average liquid replenishment per unit time during new initial mixing period
Consumption is relatively large and the subsequent evaporation of the chemical solution is relatively small.
Low average replenishment rate per unit time during fixed hours
It is characterized by replenishing the solution under the following conditions and washing.

【0011】[0011]

【作用】請求項1の混合液の薬液補充方法によれば、薬
液の補充を、薬液の蒸発が激しい混合初期時間帯におい
ては単位時間当りの平均薬液補充量を多くし、薬液の蒸
発が少なくなった時は単位時間当りの平均薬液補充量を
少なくして行うので、薬液の組成比を終始略一定に保つ
ことが可能になる。請求項2の混合液の薬液補充方法に
よれば、補充時間と補充サイクルによって簡単に単位時
間当りの平均薬液補充量を、例えば電子回路を用いて補
充ポンプをコントロールするというような簡単な方法で
混合初期時間帯とそれ以後とで切換えることができる。
請求項3の半導体によれば、混合液の薬液の蒸発が激し
い混合初期時間帯には単位時間当たりの平均薬液補充量
が多く、それ以降の薬液の蒸発が比較的少ない消耗安定
時間帯には単位時間当たりの平均薬液補充量が少なくな
る条件で薬液補充をして洗浄したので、洗浄中常に一定
の洗浄力で洗浄することができ、延いては洗浄度にばら
つきのない半導体を提供できる。
According to the method for replenishing a chemical solution of the mixed liquid according to the first aspect, the replenishment of the chemical solution is increased by increasing the average amount of the chemical solution replenished per unit time during the initial mixing period when the evaporation of the chemical solution is intense. When this happens, the average chemical replenishment amount per unit time is reduced, so that the composition ratio of the chemical can be kept substantially constant from beginning to end. According to the method of replenishing a mixed solution of claim 2, the replenishment time and the replenishment cycle can be used to easily determine the average replenishment amount per unit time, for example, by controlling the replenishment pump using an electronic circuit. It is possible to switch between the mixing initial time zone and thereafter.
According to the semiconductor of the third aspect, the chemical solution of the mixed solution evaporates intensely.
Average replenishment volume per unit time during initial mixing period
Consistent consumption, with relatively little evaporation of the chemical afterwards
During the time period, the average replenishment volume per unit time decreases.
Cleaning was performed under the following conditions, so it was always constant during cleaning
Cleaning power, and the degree of cleaning varies.
A solid semiconductor can be provided.

【0012】[0012]

【実施例】以下、本発明混合液の薬液補充方法を図示実
施例に従って詳細に説明する。図1は本混合液の薬液補
充方法の実施に用いる洗浄装置の一例を示すものであ
る。図面において、1は液槽、2は還流経路で、液槽1
から混合液を取り出して液槽1内に還流する。3は還流
経路に設けられたポンプ、4は同じくダンパ、5は同じ
くフィルタである。6aは硫酸タンク、6bは過酸化水
素水タンクであり、各タンク6a、6b内の薬液は補充
ライン7a、7bによって上記液槽1に供給される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for replenishing a mixed solution according to the present invention will be described below in detail with reference to the drawings. FIG. 1 shows an example of a cleaning apparatus used for carrying out the method of replenishing the mixed solution with a chemical solution. In the drawing, 1 is a liquid tank, 2 is a reflux path, and a liquid tank 1
And the mixture is refluxed into the liquid tank 1. Reference numeral 3 denotes a pump provided in the reflux path, 4 denotes a damper, and 5 denotes a filter. 6a is a sulfuric acid tank, 6b is a hydrogen peroxide solution tank, and the chemicals in each tank 6a, 6b are supplied to the liquid tank 1 through replenishment lines 7a, 7b.

【0013】8a、8bは補充ライン7a、7bに設け
られたポンプであり、これを図示しない電子回路により
コントロールして動作させることにより、薬液の混合、
補充を行うことができる。9は混合液の液温を所定温度
に高めるヒーターである。
Numerals 8a and 8b denote pumps provided in the replenishment lines 7a and 7b, which are controlled and operated by an electronic circuit (not shown) to mix and discharge the chemicals.
Replenishment can be performed. Reference numeral 9 denotes a heater for increasing the temperature of the mixed solution to a predetermined temperature.

【0014】図2は本発明混合液の薬液補充方法の一つ
の実施例を示すタイムチャートである。本混合液の薬液
補充方法は、過酸化水素の蒸発の激しい混合初期時間帯
x(液温の昇温完了後時間x、例えば80分経過するま
で)内においては、時間幅t1の硫酸補充を時間間隔
(周期)t2経過する毎に繰返し、そして、混合初期時
間帯x経過後の消耗安定時間帯においては、時間幅t3
の硫酸補充を時間間隔t4経過する毎に繰返し、混合初
期時間帯内と混合初期時間帯経過毎で単位時間当りの平
均薬液補充量が異なるようにする。xは混合を開始し昇
温が終了した後混合初期時間帯が終了するまでの時間を
いう。
FIG. 2 is a time chart showing one embodiment of the method for replenishing a mixed solution of the present invention. In the method of replenishing the mixed solution with the chemical solution, sulfuric acid is replenished for a time width t1 within the initial mixing time zone x in which the hydrogen peroxide evaporates violently (time x after completion of the temperature rise, for example, until 80 minutes have elapsed). It repeats every time the time interval (cycle) t2 elapses, and in the consumption stable time zone after the elapse of the mixing initial time zone x, the time width t3
Is repeated each time the time interval t4 elapses, so that the average chemical solution replenishment amount per unit time is different in the mixing initial time zone and every elapse of the mixing initial time zone. x indicates the time from the start of mixing to the end of the initial mixing time zone after the end of the temperature rise.

【0015】即ち、混合初期時間帯x内における単位時
間当りの平均薬液補充量をその激しく蒸発する分に見合
った大きな値になるようにする。そして、混合初期時間
帯x経過後、即ち消耗安定時間帯に入ると単位時間当り
の平均薬液補充量を過酸化水素の蒸発量が少ない分少な
くする。すると、図3に示すように過酸化水素濃度が終
始略一定の値になるようにすることができる。
That is, the average replenishing amount of the chemical per unit time in the mixing initial time zone x is set to a large value corresponding to the violent evaporation. Then, after the elapse of the initial mixing time zone x, that is, when the consumption stabilization time zone is entered, the average chemical solution replenishment amount per unit time is reduced by the smaller amount of hydrogen peroxide evaporated. Then, as shown in FIG. 3, the hydrogen peroxide concentration can be made to be a substantially constant value throughout.

【0016】尚、図2のタイムチャートのパルスの立っ
ている期間(t1あるいはt2)電子回路によるコント
ロールによってポンプ8bを動作させることにより過酸
化水素水の補充を行うのであり、このパルスのパルス幅
及びパルス周期を変えることにより単位時間当りの平均
薬液補充量を簡単に変化させることができる。
In the time chart (t1 or t2) in the time chart of FIG. 2, the hydrogen peroxide is replenished by operating the pump 8b under the control of the electronic circuit. By changing the pulse period and the pulse period, the average replenishing amount of the chemical per unit time can be easily changed.

【0017】尚、上記実施例では硫酸過水を作った後、
過酸化水素水の補充のみを行っているが、硫酸も適宜補
充することにより硫酸濃度も一定に保つようにすること
ができる。ところで、本発明は硫酸過水のみならず、水
酸化アンモニウムNH4 OH+過酸化水素H2 O2 +水
H2 Oの過酸化水素水補充方法、塩酸HCl+過酸化水
素H2 O2 +水H2 Oの過酸化水素水補充方法にも適用
できる。即ち、本発明は混合されると互いに反応して少
なくとも一つが蒸発する複数の薬液の混合液のその蒸発
する薬液の補充をする混合液の薬液補充方法一般に適用
することができる。
In the above embodiment, after the sulfuric acid / hydrogen peroxide was prepared,
Although only the replenishment of the hydrogen peroxide solution is performed, the sulfuric acid concentration can be kept constant by appropriately replenishing the sulfuric acid. By the way, the present invention is not only a method for replenishing hydrogen peroxide with ammonium hydroxide NH4 OH + hydrogen peroxide H2 O2 + water H2 O, but also a method for replenishing hydrogen peroxide with hydrochloric acid HCl + hydrogen peroxide H2 O2 + water H2 O. It can be applied to the replenishment method. That is, the present invention can be generally applied to a method of replenishing a mixture of a plurality of chemicals which react with each other when mixed and at least one of which evaporates to replenish the evaporated liquid.

【0018】[0018]

【発明の効果】請求項1の混合液の薬液補充方法は、混
合液の薬液の蒸発が激しい混合初期時間帯には単位時間
当りの平均薬液補充量が多く、それ以降の薬液の蒸発の
比較的少ない時間帯には単位時間当りの平均薬液補充量
が少なくなる条件で薬液補充をすることを特徴とするも
のである。従って、請求項1の混合液の薬液補充方法に
よれば、薬液の補充を、薬液の蒸発が激しい混合初期時
間帯においては単位時間当りの平均薬液補充量を多く
し、薬液の蒸発が少なくなった時は単位時間当りの平均
薬液補充量を少なくするので、薬液の組成比を終始略一
定に保つことが可能になる。
According to the method for replenishing a mixed solution of chemicals according to the first aspect of the present invention, the average amount of replenished chemical per unit time is large during the initial mixing period when the mixed solution is rapidly evaporated. It is characterized in that the chemical solution is replenished under the condition that the average amount of the chemical solution replenished per unit time is reduced in a time zone that is extremely small. Therefore, according to the method for replenishing a mixed solution according to the first aspect, the replenishment of the chemical is increased by increasing the average amount of the replenished solution per unit time during the initial mixing period when the evaporation of the chemical is intense, and the evaporation of the chemical is reduced. In this case, the average replenishing amount of the chemical per unit time is reduced, so that the composition ratio of the chemical can be kept substantially constant throughout.

【0019】請求項2の混合液の薬液補充方法は、ある
時間幅の補充をある時間間隔毎に繰返すことにより薬液
を行い、単位時間当りの平均薬液補充量を上記時間幅と
上記時間間隔によって変化させることを特徴とするもの
である。従って、請求項2の混合液の薬液補充方法によ
れば、補充時間と補充サイクルによって簡単に単位時間
当りの平均薬液補充量を例えば電子回路を用いて補充ポ
ンプをコントロールするというような簡単な方法で混合
初期時間帯とそれ以後とで切換えることができる。
According to a second aspect of the present invention, in the method for replenishing a mixed solution, the replenishment for a certain time width is repeated at certain time intervals to perform the chemical solution, and the average replenishing amount per unit time is determined by the time width and the time interval. It is characterized by being changed. Therefore, according to the method for replenishing a mixed solution according to the present invention, the average replenishing amount per unit time can be easily controlled by a replenishing time and a replenishing cycle, for example, by controlling a replenishing pump using an electronic circuit. Can be switched between the mixing initial time zone and thereafter.

【0020】請求項3の半導体は、混合液の薬液の蒸発
が激しい混合初期時間帯には単位時間当たりの平均薬液
供給量が多く、それ以降の薬液の蒸発が比較的少ない消
耗安定時間帯には単位時間当たりの平均薬液補充量が少
なくなる条件で薬液補充をして洗浄したことを特徴とす
る。 従って、請求項3の半導体によれば、混合液の薬液
の蒸発が激しい混合初期時間帯には単位時間当たりの平
均薬液供給量が多く、それ以降の薬液の蒸発が比較的少
ない消耗安定時間帯には単位時間当たりの平均薬液補充
量が少なくなる条件で薬液補充をして洗浄したので、洗
浄中常に一定の洗浄力で洗浄することができ、延いては
洗浄度にばらつきのない半導体を提供できる。
According to a third aspect of the present invention, the semiconductor of the mixed solution is evaporated.
The average chemical per unit time during the initial mixing
Supply is large, and the evaporation of the chemical after that is relatively small.
During the wear stabilization period, the average replenishment rate per unit time is small.
It is characterized by cleaning with replenishment of chemicals under the condition that disappears
You. Therefore, according to the semiconductor of the third aspect, the chemical liquid of the mixed liquid is used.
In the initial period of mixing when the evaporation of
The supply of chemicals is large, and the evaporation of chemicals is relatively small after that.
Average replenishment per unit time during stable consumption time
Replenishment was performed under conditions where the amount was small, and cleaning was performed.
It can be washed with a constant detergency during cleaning,
A semiconductor having no variation in the degree of cleaning can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明混合液の薬液補充方法の実施に用いるこ
とのできる洗浄装置の一例を示す構成図である。
FIG. 1 is a configuration diagram showing an example of a cleaning apparatus that can be used for performing a method of replenishing a mixed solution of the present invention.

【図2】本発明混合液の薬液補充方法の一つの実施例を
示すタイムチャートである。
FIG. 2 is a time chart showing one embodiment of a method for replenishing a mixed solution of the present invention.

【図3】上記実施例における混合液(硫酸過水)の過酸
化水素及び硫酸の濃度変化を示す濃度変化図である。
FIG. 3 is a concentration change diagram showing a concentration change of hydrogen peroxide and sulfuric acid in a mixed solution (sulfuric acid / hydrogen peroxide) in the above embodiment.

【図4】混合液の薬液補充方法の従来例を示すタイムチ
ャートである。
FIG. 4 is a time chart showing a conventional example of a method of replenishing a mixed solution with a chemical solution.

【図5】上記従来例における問題点を説明するための混
合液(硫酸過水)の過酸化水素及び硫酸の濃度変化を示
す濃度変化図である。
FIG. 5 is a concentration change diagram showing a concentration change of hydrogen peroxide and sulfuric acid in a mixed solution (sulfuric acid / hydrogen peroxide) for explaining a problem in the conventional example.

【図6】無補充における混合液(硫酸過水)の過酸化水
素及び硫酸の濃度変化を示す濃度変化図である。
FIG. 6 is a concentration change diagram showing changes in concentrations of hydrogen peroxide and sulfuric acid in a mixed solution (sulfuric acid / hydrogen peroxide) without replenishment.

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 混合されると互いに反応して少なくとも
一つが蒸発する複数の薬液の混合液のその蒸発する薬液
の補充をする混合液の薬液補充方法において、 上記混合液の上記薬液の蒸発が激しい混合初期時間帯に
は単位時間当りの平均薬液補充量が多く、それ以降の薬
液の蒸発の比較的少ない消耗安定時間帯には単位時間当
りの平均薬液補充量が少なくなる条件で薬液補充をする
ことを特徴とする混合液の薬液補充方法
1. A method of replenishing a mixture of a plurality of chemicals which react with each other when mixed and at least one of which evaporates is replenished with the evaporating chemical. Replenish the chemical under the condition that the average chemical replenishment volume per unit time is large during the intense mixing initial time zone, and the average chemical replenishment volume per unit time decreases during the consumption stabilization time when the chemical solution evaporation is relatively small thereafter. For replenishing a mixture with a chemical solution
【請求項2】 ある時間幅の補充をある時間間隔毎に繰
返すことにより薬液を行い、単位時間当りの平均薬液補
充量を上記時間幅と上記時間間隔によって変化させるこ
とを特徴とする請求項2記載の混合液の薬液補充方法
2. The method according to claim 2, wherein the replenishment of a certain time width is repeated at certain time intervals to perform the liquid medicine, and an average liquid medicine replenishment amount per unit time is changed according to the time width and the time interval. Replenishment method of the described mixture
【請求項3】 混合されると互いに反応して少なくとも
一つが蒸発する複数の薬液の混合液を用いて洗浄した半
導体において、 上記混合液の上記薬液の蒸発が激しい混合初期時間帯に
は単位時間当たりの平均薬液補充量が多く、それ以降の
薬液の蒸発が比較的少ない消耗安定時間帯には単位時間
当たりの平均薬液補充量が少なくなる条件で薬液補充を
して洗浄した ことを特徴とする半導体
3. When mixed, they react with each other and at least
Half washed with a mixture of several chemicals, one of which evaporates
In the conductor, during the mixing initial time zone when the chemical solution of the mixed solution is strongly evaporated
Has a large average replenishment rate per unit time,
Unit time during the consumption stabilization time period where the chemical solution evaporates relatively little
Replenish the solution under the condition that the average
Semiconductor characterized by being cleaned
JP21633292A 1992-07-21 1992-07-21 Replenishment method of liquid mixture and semiconductor Expired - Fee Related JP3158311B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21633292A JP3158311B2 (en) 1992-07-21 1992-07-21 Replenishment method of liquid mixture and semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21633292A JP3158311B2 (en) 1992-07-21 1992-07-21 Replenishment method of liquid mixture and semiconductor

Publications (2)

Publication Number Publication Date
JPH0645308A JPH0645308A (en) 1994-02-18
JP3158311B2 true JP3158311B2 (en) 2001-04-23

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Country Link
JP (1) JP3158311B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1493713A4 (en) * 2002-04-05 2006-10-04 Sony Corp System for recycling spent sulfuric acid, method for recycling sulfuric acid waste, and recycled sulfuric acid
JP2006278365A (en) * 2005-03-28 2006-10-12 Tokyo Electron Ltd Liquid-treating apparatus, program thereof, and recording medium thereof
WO2009114964A1 (en) * 2008-03-17 2009-09-24 Acm Research (Shanghai) Inc. Solution preparation apparatus and method for treating individual semiconductor workpiece
JP2011210976A (en) * 2010-03-30 2011-10-20 Dainippon Screen Mfg Co Ltd Substrate processing apparatus and method of detecting supply abnormality using the substrate processing apparatus
CN110747452A (en) * 2019-12-12 2020-02-04 汉德车桥(株洲)齿轮有限公司 Phosphorization method for precision forging gear

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