JP3157316U - Three-layer structure cooler / heater - Google Patents

Abstract

An object of the present invention is to provide a three-layer structure cooling / heating control body capable of simultaneously achieving rapid neutralization and effects of temperature decrease or temperature increase by joining two metal panels using a heat exchange effect after energization of a semiconductor. Is to provide. A three-layer structure cooling control body includes a semiconductor cold plate having upper and lower contact surfaces, a first metal panel coupled to the upper contact surface of the semiconductor cold plate, and the semiconductor cold plate. The semiconductor cold plate 1 communicates with a power source 4 and, after energization, the upper contact surface 11 of the semiconductor cold plate 1 A contact surface can be formed, the lower contact surface 12 of the semiconductor cold plate 1 can form a contact surface with an increased temperature, and the first metal panel 2 conducts the temperature of the upper contact surface 11, The bimetallic panel 3 conducts the temperature of the lower contact surface 12. [Selection] Figure 1

Description

  The present invention relates to a three-layer structure cooling / heating control body, and particularly uses a heat exchange action after energization of a semiconductor. By joining two metal panels to a semiconductor, rapid temperature neutralization and temperature reduction are achieved. Or, it is related to a three-layer structure cooling control body that can achieve the effect of temperature rise, has a simple structure, is compact, does not take up space, has high stability, and is suitable for use in various electrical appliances. is there.

With the remarkable progress of science and technology, various electronic products such as personal computers, notebook computers, and home appliances are indispensable for the lives of modern people.
Furthermore, in both work and home life, the time that a person uses an electronic product is getting longer.
Because current electronic products have a development trend of being compact and lightweight, the requirements for the accuracy and size of each part and processing equipment used by the product are becoming stricter every day.
In each electronic product, the design purpose of the exterior body is to protect the product structure itself, appeal to consumers with the beauty of the appearance, and have another purpose of heat dissipation.

The heat radiation method generally employed is internal heat dissipation or external heat dissipation.
As shown in FIG. 3, the heat dissipation method often found in electronic products uses a metal plate material having a relatively high heat transfer performance, forms a heat dissipation block or heat dissipation fin a, and is combined with the heating element b to effect the heat dissipation. Is achieved.
Alternatively, there are some that achieve a heat dissipation effect by expanding the heat dissipation area, but all can achieve the purpose of heat dissipation, but the effect is still limited.
At the same time, the expansion of the heat radiation block or the heat radiation fin occupies the space of the entire electronic product and increases the weight, often resulting in a situation that must be forced to fit the heat dissipation device using the design of the electronic product.

As a prior art of such an apparatus, for example, there is one described in Patent Document 1. In the thermoelectric conversion device shown in Patent Document 1, the heat absorption side partition plate and the heat dissipation side partition plate that are electrically and thermally insulating are arranged facing each other in parallel, and both leg plate portions of the heat absorption plate formed in a U-shape are the heat absorption side partition. Both legs of the heat sink plate that penetrates the plate and is formed in a U-shape penetrate the heat dissipation side partition plate, and the bottom plate portion of the heat absorption plate and the bottom plate portion of the heat dissipation plate are the first conductivity type thermoelectric element and the second conductivity type. Thermoelectric elements are alternately connected in series. This is intended to efficiently transport heat, but it cannot be used for more efficient use by directly joining various heat-generating components etc. to, for example, the cooling part (temperature lowering side) of the thermoelectric element, Also, the structure is complicated.
The present invention has been made in view of the above-mentioned drawbacks of the conventional three-layer structure cooling / heating control body.

JP-A-5-175556

  The problem to be solved by the present invention is to provide a three-layer structure cooling / heating control body that is simple in structure, compact, takes up little space, and has high stability.

In order to solve the above problems, the present invention provides the following three-layer structure cooling / heating control body.
The three-layer structure cooling / controlling body includes a semiconductor cold plate having an upper and lower contact surface, a first metal panel coupled to the upper contact surface of the semiconductor cold plate, and a second metal panel coupled to the lower contact surface of the semiconductor cold plate. Consists of
The semiconductor cold plate communicates with the power source,
Thus, after energization, the upper contact surface of the semiconductor cold plate can form a contact surface with a temperature drop,
The lower contact surface of the semiconductor cold plate can form a contact surface for temperature rise,
The first metal panel conducts the temperature of the upper contact surface,
The second metal panel conducts the temperature of the lower contact surface;
At the time of implementation, the first metal panel and the second metal panel are both copper alloy plates having a high heat transfer coefficient,
At the time of implementation, a heat radiating device is separately installed on the second metal panel, and the heat radiating device is an aluminum alloy heat radiating fin.

  The three-layer structure cooling / heating control body of the present invention uses a heat exchange action after energization of a semiconductor. By joining two metal panels to the semiconductor, rapid temperature neutralization and temperature decrease or temperature It can achieve the effect of rising at the same time, has a simple structure, is compact, does not take up space, has high stability, and is suitable for use in various electrical appliances.

It is a schematic diagram which shows the use condition of the three-layer structure cooling-heat control body of this invention. It is a schematic diagram which shows another use condition of the three-layer structure cold-heat control body of this invention. It is a schematic diagram which shows the state in which the conventional structure achieves the heat radiation purpose only through the heat radiation block.

  The best mode for carrying out the present invention will be described below in detail with reference to the drawings.

  As shown in FIG. 1, a three-layer structure cooling / controlling body according to the present invention includes a semiconductor cold plate 1 having upper and lower contact surfaces 11 and 12, and a first metal panel 2 coupled to the upper contact surface 11 of the semiconductor cold plate 1. The second metal panel 3 is connected to the lower contact surface 12 of the semiconductor cold plate 1.

The semiconductor cold plate 1 is energized with a power source 4.
Thus, after energization, the upper contact surface 11 of the semiconductor cold plate 1 can form a contact surface that lowers the temperature, and the lower contact surface 12 of the semiconductor cold plate 1 can form a contact surface that increases the temperature. .

The first metal panel 2 conducts the temperature of the upper contact surface 11.
The second metal panel 3 conducts the temperature of the lower contact surface 12.
The first metal panel 2 and the second metal panel 3 are both copper alloy plates having a high heat transfer coefficient.

At the time of implementation, as shown in FIG. 1, first, an upper contact surface 11 which is a temperature lowering contact surface is formed on the semiconductor cold plate 1 and is bonded to the first metal panel 2.
Further, a lower contact surface 13 which is a temperature rising contact surface is also formed on the semiconductor cold plate 1 and coupled to the second metal panel 3.

  As a result, after the semiconductor cold plate 1 is energized, a cooling effect can be immediately generated on the upper and lower contact surfaces 11 and 12.

  When a cooling effect is conducted to the first and second metal panels 2 and 3, the temperature is reduced by about 65 to 70 ° C. on the first metal panel 2, and the temperature is reduced on the second metal panel 3. Increases by about 80-100 ° C.

Therefore, when the three-layer structure cooling / heating control body of the present invention is used for heat dissipation of the CPU 5 or the like of the computer, the high temperature CPU 5 uses the direct contact between the first metal panel 2 design and the CPU 5 to Due to the temperature lowering action of the metal panel 2, the heat and the temperature of the first metal panel 2 are neutralized.
Thus, the purpose of CPU 5 heat dissipation can be achieved.

  On the other hand, when applied to an electronic product that requires a temperature increase, the effect of rapidly increasing the temperature can be achieved by contact with the second metal panel 3 having a temperature increasing action.

In addition, as shown in FIG. 2, when practiced, the present invention can also install a heat dissipation device 6 on the second metal panel 3.
The heat dissipating device 6 is an aluminum alloy heat dissipating fin and dissipates heat of the second metal panel 3.

The present invention has the following advantages.
1. The present invention uses existing advanced semiconductor cold plate technology and combines the semiconductor cold plate with two metal panels to form a three-layer structure with cooling effect, making it compact and precise. When it is applied to electronic products, the temperature and heat dissipation function and effect are not only provided, but the overall structure of the product can be reduced and the use of aluminum alloy material, which is a heat dissipation block, can be reduced. Can be reduced.
2. Since the present invention creates a cooling effect on the semiconductor cold plate by the energization method, the operator can easily and effectively increase or decrease the temperature by changing the amount of current to achieve temperature control. can do.

  The names and contents of the present invention described above are only used for explaining the technical contents of the present invention, and do not limit the present invention. Equivalent applications based on the spirit of the present invention, conversion of parts (structure), replacement, increase / decrease in quantity are all included in the protection scope of the present invention.

  The present invention has a novelty that is a requirement for a utility model registration request, has sufficient progress compared to similar products of the past, has high practicality, meets social needs, and has a very high industrial utility value. Big.

1 Semiconductor cold plate
11 Upper contact surface
12 Lower contact surface
2 First metal panel
3 Second metal panel
4 Power supply
5 CPU
6 Heat dissipation device

Claims (4)

A three-layer structure cooling / controlling body, a semiconductor cold plate having an upper and lower contact surface, a first metal panel coupled to the upper contact surface of the semiconductor cold plate, and a second coupled to the lower contact surface of the semiconductor cold plate Made of metal panels,
The semiconductor cold plate communicates with the power source,
Thus, after energization, the upper contact surface of the semiconductor cold plate can form a contact surface with a temperature drop,
The lower contact surface of the semiconductor cold plate can form a contact surface for temperature rise,
The first metal panel conducts the temperature of the upper contact surface,
The three-layer structure cooling / heating control body, wherein the second metal panel conducts the temperature of the lower contact surface.   The three-layer structure cooling / heating control body according to claim 1, wherein both the first metal panel and the second metal panel are copper alloy plates having a high heat transfer coefficient.   The three-layer structure cooling / heating control body according to claim 1, wherein a heat dissipation device is separately provided on the second metal panel.   The three-layer structure cooling / heating control body according to claim 3, wherein the heat dissipation device is a heat dissipation fin made of an aluminum alloy.

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