JP3155521U - Heat dissipation module - Google Patents

Abstract

Disclosed is a heat dissipation module that realizes rapid assembly and saves soldering costs. At least a plurality of radiating fins, a support base, and a lower cradle are included. The heat dissipating fins are arranged radially from the inside to the outside, the inner side of the heat dissipating fins is formed in order to form a receiving space and a through hole, and a folding sheet is provided that is bent about 90 degrees around the bottom of the receiving space. An attachment hole is provided on the folding sheet. The support base is provided in the accommodation space, and a projecting pin is provided at a balance position between the support base and each mounting hole, and the projecting pin is combined with the mounting hole. The lower cradle is provided below the through hole and is fixed to the heat radiating fin. Accordingly, the support fin and the lower pedestal are brought into close contact with the heat radiation fin. [Selection] Figure 2

Description

  The present invention relates to a type of heat dissipation module, and in particular, by quickly attaching the support base, the lower cradle and the heat dissipation fin, the heat dissipation module can be assembled quickly, and the heat energy generated from the heat source can be quickly conducted to the outside. For the purpose.

  Computers are already quite popular devices. With the rapid development of computer technology, computer companies are constantly pursuing hardware devices with higher efficiency due to higher calculation speed. On the other hand, the operating speed of these electronic elements becomes higher and the emitted heat becomes higher.

Similarly, lighting devices in daily life are faced with a recession in the market of conventional incandescent lamps that consume a lot of energy due to the trend of energy saving boom. On the other hand, green photoelectric products have become a booming industry in recent years. Therefore, because it excels in conventional light emitting elements such as high efficiency, power saving consumption, long life, cold lighting, fast response, and high color matching, it plays an important role in the development of light emitting diodes (LEDs). Is responsible.
For this reason, the application of light emitting diodes to lighting devices is regarded as the focus of the development of the modern photoelectric industry and lighting industry, and is being replaced by conventional heating lamps.

  A product using a computer or a light-emitting diode as a lighting fixture is closely related to the life and function of the heat dissipation device. Therefore, heat dissipation is also a decisive key.

  Referring to the example of the light emitting diode shown in FIG. 1, it has a heat dissipating body 100 for a kind of light emitting diode, a heat dissipating base 110 is provided on the heat dissipating body 100, and the heat dissipating base 110 is arranged in a ring shape. Consists of.

  The heat dissipating fins 120 are connected to each other by a fastening method, and the heat dissipating fins 120 are gradually spread from the bottom to the top, and the ring 130 is fitted to the outer periphery of the apex of the heat dissipating fins 120. A groove 131 is formed on the ring 130 to balance the plurality of heat dissipating fins 120. The groove 131 is integrally coupled with the heat dissipating fin 120 by fitting, and the apex of the heat dissipating fin 120 is provided. A lamp holder 140 is provided inside, and a frame portion 150 having an opening opposite to the lamp holder 140 is provided in the opposite direction. The inside of the lamp holder 140 and the frame portion 150 includes a light emitting diode and an electronic circuit board (not shown). ).

  In use, the heat sink 100 is anodized for each heat sink 100 so that the heat sink 100 is insulated, and the lamp holder 140 and the frame 150 are attached to the inner ring of the heat sink fin 120 by soldering.

  When this type of device and structure are used, the heat energy generated from the electronic circuit board combined with the light-emitting diode is discharged by the radiator 100.

  However, the heat dissipating body 100 is provided with a recessed groove 160 for accommodating the lamp holder 140 and the frame portion 150 in the intermediate portion. Therefore, only the end portion of the radiating fin 120 of the recessed groove 160 is brought into contact with the lamp holder 140 and the frame portion 150. For this reason, the heat dissipation effect is limited and the usage surface is not ideal.

  In order to improve the drawbacks of the known devices and structures described above, the inventor has devised the heat dissipation module of the present invention as a result of intensive studies and experiments over a long period of time.

  An object of the present invention is to provide a heat dissipating module that realizes rapid assembly and saves soldering costs.

According to the present invention, at least a plurality of radiating fins, a support base and a lower pedestal are included, and the radiating fins are arranged radially outward.
The inner side of the heat radiating fin is formed in order from the top to the bottom, following the concave accommodation space and the through hole, and the accommodation space and the through hole communicate with each other. Each folding fin provided around the bottom of the accommodation space is provided with a folding sheet bent at 90 degrees, and at least one attachment hole is provided on the folding sheet.
The support base is provided inside the accommodation space, and a projecting pin is provided at a balance position between the support base and each mounting hole, and the projecting pin is provided so as to be balanced with the mounting hole. The lower cradle is provided at the lower part of the through hole, and an attachment hole is provided on the opposite side of the lower cradle and the support base to match the protruding pin, and is fixed to the heat radiation fin.
Thereby, the purpose of high-speed assembly of the heat radiation module can be realized and the soldering cost can be saved by tightly coupling the support base, the lower base and the heat radiation fin.

  The lower cradle is further provided with a hollow protrusion pin member, the pin member extends into the through hole, and the periphery of the pin member is brought into contact with the inside of the radiation fin, so that the heat energy inside the hollow protrusion pin is dissipated. It is another object of the present invention to provide a heat dissipation module that can achieve the purpose of rapid heat dissipation by close adhesion of fins.

  Another object of the present invention is to provide a more stable heat radiating module by connecting a connecting member to the lower pedestal and connecting the connecting member to a support for a through hole.

  The support base is composed of a heat transfer member, and the support base is in close contact with the combination of the projection pin and the mounting hole, and heat energy generated from the radiator of the support base is quickly and uniformly radiated by the combination of the mounting hole and the projection pin. It is a further object of the present invention to provide a heat dissipation module that is conducted throughout and realizes the purpose of rapid heat dissipation.

It is the schematic of a preceding apparatus. It is a three-dimensional exploded schematic diagram of the present invention. It is combination sectional drawing of this invention. FIG. 4 is an enlarged schematic view of the local cross section of FIG. 3 of the present invention. FIG. 3 is a schematic exploded view of another embodiment of the present invention. FIG. 6 is a combined sectional view of FIG. 5 of the present invention. It is a top view of another example of the present invention.

  In order to further recognize and understand the object, shape, structure, apparatus, features, and effects of the present invention, the details thereof will be described in conjunction with the following examples and diagrams.

  As shown in FIGS. 2, 3, and 4, the heat dissipation module according to the present invention is applied to a heat dissipation module 10 (the present embodiment is a light emitting diode) using a heat radiator 40 as a heat source. The heat radiation module 10 includes at least a plurality of heat radiation fins 20, a single support base 30, and a lower receiving base 50.

Among them, the heat dissipating fins 20 are arranged radially from the inside to the outside, and the inside of the heat dissipating fins 20 is followed in order from the top to the bottom to form the receiving space 22 and the through hole 23. 23 communicate with each other.
A foldable folding sheet 21 is provided around the bottom of the accommodation space 22 at about 90 degrees.
The folding sheet 21 and the adjacent radiating fin 20 are brought into contact with each other.
An appropriate interval is formed between the heat radiating fins 20 by the folding sheet 21.
At least one attachment hole 201 is provided on the folding sheet 21.

The support base 30 is provided inside the accommodation space 22, and a heat radiating body 40 (in this embodiment, the lamp holder of the light emitting diode shown in FIG. 3) is attached to the support base 30. However, those skilled in the art can attach other radiators.
Further, a projecting pin 31 (this example is a rivet. Other skilled in the art can provide other screws) is provided at a relative position between the support base 30 and each mounting hole 201. As a result, the support base 30 and the heat radiating fins 20 are integrally coupled (FIG. 3).

The lower pedestal 50 is provided below the through hole 23, and an attachment hole 51 is provided on the opposite side of the lower pedestal 50 and the support 30 so as to balance the protruding pins 31. Thereby, the support base 30 and the lower receiving base 50 are integrally fixed, and the radiation fins 20 are integrally connected (shown in FIG. 3) by the support base 30 and the lower receiving base 50.
The lower cradle 50 further has a hollow protruding pin 52 extending therein, and the hollow protruding pin 52 is provided with an electric circuit component for supplying electricity to the radiator 40. The hollow protruding pin 52 extends into the through hole 23, and the periphery of the hollow protruding pin 52 is touched to the inside of the radiating fin 20. The heat energy inside the hollow projecting pin 52 achieves the purpose of rapid heat dissipation by the close contact of the radiation fins 20.

Continuing to refer to another embodiment of the present invention as shown in FIGS. The difference from the above embodiment is that an extension member 60 is provided on the support base 50.
The extension member 60 is a hollow pin member, and the extension member 60 is placed on the hollow projection pin 52, and the lower cradle 50 has various through-holes 23 having different heights depending on the extension length of the extension member 60. And the central portions of the lower cradle 50 and the extension member 60 communicate with each other. Accordingly, the connection member 53 is provided inside the lower cradle 50.
Although this embodiment uses rivets, those skilled in the art can implement other schemes. The connecting member 53 passes through the hollow projecting pin 52, the extending member 60 and the through hole 23 of the radiating fin 20 and contacts the heat radiating body 40 (in this embodiment, the supporting base 30 and the lower pedestal are attached by being attached to the supporting base 30). 50 is closely attached to the radiation fin 20). In this way, the support base 30 and the lower receiving base 50 each achieve the purpose of rapid assembly by bringing the radiating fins 20 into close contact with each other.

The connection member 53 that passes through the lower cradle 50 is made of a heat transfer member. The connection member 53 contacts the heat source (in this embodiment, the lamp holder of the light emitting diode), and the heat source is transmitted to the lower cradle 50 to dissipate heat. Heat is quickly conducted to the entire radiation fin 20 by the lower cradle 50 closely attached to the fin 20.
Similarly, the support base 30 of the present embodiment may be a heat transfer member. Therefore, the heat source generated from the heat radiating body 40 is quickly and uniformly conducted to the entire heat radiating fins by the combination of the mounting hole 201 and the projecting pins 31, thereby realizing the purpose of rapid heat radiation.

  FIG. 7 shows still another embodiment of the present invention. The heat dissipation module 10 may have any shape. Although the present embodiment is oval, the user may change and design according to practical needs.

  As described above, the present invention has novelty in the shape, structure, and apparatus of the article, various disadvantages of the prior art are improved, the use effect can be improved, and there is practicality.

DESCRIPTION OF SYMBOLS 10 Radiation module 20 Radiation fin 21 Folding sheet 201 Mounting hole 22 Accommodating space 23 Through hole 30 Support base 31 Projection pin 40 Radiator 50 Lower cradle 51 Installation hole 52 Hollow projection pin 53 Connection member 60 Extension member

Claims (6)

A heat dissipation module,
Including at least a plurality of radiating fins, a support base, and a lower cradle,
The plurality of radiating fins are arranged radially from the inside to the outside, the radiating fins form a concave accommodation space and a through hole in order from top to bottom, the accommodation space and the through hole communicate with each other, and The radiating fin attached around the bottom of the accommodating space is provided with a 90-degree foldable folding sheet, and provided with at least one attachment hole on the folding sheet,
The support base is accommodated in the accommodation space, and a protruding pin is provided at a relative position between the support base and the mounting hole,
The lower pedestal is provided at the lower part of the through hole, and on the opposite side of the lower cradle and the support base, an attachment hole corresponding to the projecting pin is provided,
The support base and the lower cradle are fixed, and the lower cradle and the radiation fin are integrally coupled by the support base.
Heat dissipation module. The heat dissipation module according to claim 1, wherein an appropriate distance is formed between the heat dissipation fins by partitioning the heat dissipation fins. The heat radiating module according to claim 1, wherein a heat radiating body can be attached to the inside of the support base, and the heat radiating body is a light emitting diode. The lower cradle is further provided with a hollow protruding pin, the hollow protruding pin extends into the through hole, and touches the periphery of the hollow protruding pin and the inside of the radiating fin. The heat dissipation module according to claim 1. 5. The heat dissipation module according to claim 4, wherein an extension member is provided on the lower cradle, the extension member is a hollow projection pin, and the extension member is superposed on the hollow projection pin. 5. A heat dissipation device according to claim 4, wherein a connection member is fitted to the lower cradle, and the connection member contacts the heat dissipating body through the hollow projection pin, the extension member, and the through hole of the heat dissipating fin. module.

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