JP3152572B2 - Method for manufacturing solid electrolytic capacitor - Google Patents

Method for manufacturing solid electrolytic capacitor

Info

Publication number
JP3152572B2
JP3152572B2 JP29017394A JP29017394A JP3152572B2 JP 3152572 B2 JP3152572 B2 JP 3152572B2 JP 29017394 A JP29017394 A JP 29017394A JP 29017394 A JP29017394 A JP 29017394A JP 3152572 B2 JP3152572 B2 JP 3152572B2
Authority
JP
Japan
Prior art keywords
case
capacitor element
solid electrolytic
electrolytic capacitor
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP29017394A
Other languages
Japanese (ja)
Other versions
JPH08148385A (en
Inventor
和浩 末永
哲哉 川久保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saga Sanyo Industry Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Saga Sanyo Industry Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saga Sanyo Industry Co Ltd, Sanyo Electric Co Ltd filed Critical Saga Sanyo Industry Co Ltd
Priority to JP29017394A priority Critical patent/JP3152572B2/en
Priority to US08/562,063 priority patent/US5766271A/en
Priority to DE69508889T priority patent/DE69508889T2/en
Priority to EP95118486A priority patent/EP0714109B1/en
Publication of JPH08148385A publication Critical patent/JPH08148385A/en
Application granted granted Critical
Publication of JP3152572B2 publication Critical patent/JP3152572B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、固体電解コンデンサに
関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid electrolytic capacitor.

【0002】[0002]

【従来の技術】有機半導体の一種であるTCNQ錯塩を
電解質として用いた固体電解コンデンサは、特公昭62
−52939号公報に開示されている。ここでTCNQ
とは、7,7,8,8−テトラシアノキノジメタンを意
味する。
2. Description of the Related Art A solid electrolytic capacitor using a TCNQ complex salt, which is a kind of organic semiconductor, as an electrolyte is disclosed in
-52939. Where TCNQ
Means 7,7,8,8-tetracyanoquinodimethane.

【0003】上記従来技術による固体電解コンデンサ
は、以下のような工程を経て製造される。
[0003] The solid electrolytic capacitor according to the prior art is manufactured through the following steps.

【0004】すなわち、まず図5に示すように、陽極用
エッチドアルミニウム箔1の表面に化成処理を施して誘
電体皮膜を形成し、該陽極箔1を陰極箔2及びセパレ−
タ紙3とともに巻回し、コンデンサ素子7を形成する。
なお図5において、4は巻き止めテープ、51、52は
陽極及び陰極のリード端子、61、62はリードボスで
ある。次に、TCNQ錯塩の粉末を有底筒状のアルミニ
ウムケ−ス内に適量詰め、これを加熱してTCNQ錯塩
を融解液化させる。そして、前記コンデンサ素子を前記
アルミニウムケ−スの開口部から融解液化したTCNQ
錯塩中に挿入浸漬し、コンデンサ素子内部に電解質とし
てのTCNQ錯塩を含浸させ、直ちに急冷してTCNQ
錯塩を固化させる。最後に図6に示すように、前記アル
ミニウムケ−ス90の開口部をエポキシ樹脂8にて封止
する。
[0004] First, as shown in FIG. 5, a surface of an etched aluminum foil 1 for an anode is subjected to a chemical conversion treatment to form a dielectric film, and the anode foil 1 is separated from a cathode foil 2 and a separator.
It is wound together with the tab paper 3 to form the capacitor element 7.
In FIG. 5, reference numeral 4 denotes a winding tape, reference numerals 51 and 52 denote anode and cathode lead terminals, and reference numerals 61 and 62 denote lead bosses. Next, an appropriate amount of the powder of the TCNQ complex salt is packed in a bottomed cylindrical aluminum case, which is heated to melt the TCNQ complex salt. And a TCNQ in which the capacitor element is melted and liquefied from the opening of the aluminum case.
Inserted and immersed in a complex salt, impregnated the TCNQ complex salt as an electrolyte inside the capacitor element, immediately quenched, and
The complex is allowed to solidify. Finally, as shown in FIG. 6, the opening of the aluminum case 90 is sealed with an epoxy resin 8.

【0005】[0005]

【発明が解決しようとする課題】上記従来技術による固
体電解コンデンサは、アルミニウムケ−スの開口部をエ
ポキシ樹脂にて封止したものであるため、温度特性、高
温負荷特性、耐湿特性等に優れ、高信頼性で、かつ耐環
境性にも優れているが、以下のような欠点がある。
The solid electrolytic capacitor according to the prior art described above is one in which the opening of the aluminum case is sealed with epoxy resin, so that it has excellent temperature characteristics, high temperature load characteristics, moisture resistance characteristics and the like. Although it is highly reliable and excellent in environmental resistance, it has the following disadvantages.

【0006】すなわち、融解液化したTCNQ錯塩中に
コンデンサ素子を浸漬した後、TCNQ錯塩を冷却固化
する過程において、コンデンサ素子がアルミニウムケ−
ス内で動き、図7の(b)や(c)に示すようにリ−ド
端子51、52の位置がずれることがある。図7は固体
電解コンデンサの上部平面図であり、(a)はコンデン
サ素子がケース90内の中央に固定されてリード端子5
1、52の位置が正常な例、(b)及び(c)はコンデ
ンサ素子がケース90内の端に固定されてリード端子5
1、52の位置が異常な例を示している。
That is, after immersing the capacitor element in the molten TCNQ complex salt, in the process of cooling and solidifying the TCNQ complex salt, the capacitor element becomes an aluminum casing.
7B, the positions of the lead terminals 51 and 52 may be shifted as shown in FIGS. 7B and 7C. FIG. 7 is a top plan view of the solid electrolytic capacitor, and FIG.
Examples where the positions of 1, 52 are normal, (b) and (c) show that the capacitor element is fixed to the end inside the case 90 and the lead terminal 5
The example where the positions of 1 and 52 are abnormal is shown.

【0007】また、アルミニウムケ−スの開口部をエポ
キシ樹脂にて封止する工程において、ケースの開口端か
らのエポキシ樹脂の盛り上がりの高さが一定しないとい
う問題がある。
Further, in the step of sealing the opening of the aluminum case with epoxy resin, there is a problem that the height of the rise of the epoxy resin from the opening end of the case is not constant.

【0008】上述のような問題点は、そのまま製品とし
ての寸法不良につながるばかりでなく、特に表面実装用
として、エポキシ樹脂の硬化後にリ−ド端子の成形等の
加工を行う場合には、前記寸法誤差を相対的に吸収でき
るような寸法設計が必要になり、表面実装用としては大
型になるし、製品のコストアップにもなる。
[0008] The above-mentioned problems not only lead to dimensional defects as a product as they are, but also in the case where processing such as molding of lead terminals after curing of an epoxy resin for surface mounting is particularly required. A dimensional design that can relatively absorb dimensional errors is required, which results in a large size for surface mounting and an increase in product cost.

【0009】一方、電解液型のコンデンサにおいて慣用
されているゴム封口法を上記固体電解コンデンサの封口
法として単純に転用すると、以下のような問題が発生す
る。
On the other hand, if the rubber sealing method commonly used for electrolyte type capacitors is simply diverted as the sealing method for the solid electrolytic capacitor, the following problems occur.

【0010】すなわち、コンデンサ素子のリード端子部
に封口用ゴムを装着してからTCNQ錯塩を含浸させる
場合、含浸工程における加熱によりゴムが膨張、変質し
てアルミニウムケースに入らなくなる虞れがあり、この
問題を回避するためには耐熱性に優れたゴムが必要とな
ってコスト高となる。
In other words, when the sealing rubber is attached to the lead terminal portion of the capacitor element and then impregnated with the TCNQ complex salt, the rubber may expand and deteriorate due to the heating in the impregnation step and may not enter the aluminum case. In order to avoid the problem, rubber having excellent heat resistance is required, which increases the cost.

【0011】また、コンデンサ素子にTCNQ錯塩を含
浸させた後で封口用ゴムを装着する場合には、アルミニ
ウムケースの開口部からゴムを挿入すると同時に、該ゴ
ムにコンデンサ素子のリード端子を貫通させねばなら
ず、作業性が悪いばかりでなく、不完全な装着による外
観不良が発生する。
When the sealing element is to be mounted after the capacitor element has been impregnated with the TCNQ complex salt, the rubber must be inserted through the opening of the aluminum case and the lead terminal of the capacitor element must be passed through the rubber. In addition, not only workability is poor, but also poor appearance due to incomplete mounting occurs.

【0012】本発明は、固体電解コンデンサに関する上
述のような問題点を解決するものである。
The present invention has been made to solve the above-mentioned problems relating to a solid electrolytic capacitor.

【0013】[0013]

【課題を解決するための手段】本発明による固体電解コ
ンデンサの製造方法は、第1のケ−ス内で融解液化させ
たTCNQ錯塩等の電解質材料の中へコンデンサ素子を
挿入浸漬することにより該コンデンサ素子の内部に前記
電解質材料を含浸させる工程と、前記コンデンサ素子を
前記第1のケ−スから引き抜くことにより該コンデンサ
素子内部の前記電解質材料を冷却固化させる工程と、前
記コンデンサ素子のリード端子の根元部分にケース封口
用の弾性部材を装着する工程と、前記封口部材付コンデ
ンサ素子を第2のケ−ス内に収納する工程とを備えるこ
とを特徴とするものである。
The method of manufacturing a solid electrolytic capacitor according to the present invention comprises inserting and dipping a capacitor element into an electrolyte material such as a TCNQ complex salt melted and liquefied in a first case. A step of impregnating the inside of the capacitor element with the electrolyte material, a step of cooling and solidifying the electrolyte material inside the capacitor element by extracting the capacitor element from the first case, and a lead terminal of the capacitor element A step of mounting an elastic member for sealing the case at the root of the case, and a step of housing the capacitor element with the sealing member in a second case.

【0014】[0014]

【作用】上記本発明の製法によれば、電解質材料を含浸
させたコンデンサ素子を第1のケ−スから引き抜いた状
態で該コンデンサ素子のリード端子の根元部分にケース
封口用の弾性部材を装着するので、その際にリ−ド端子
の位置ずれが矯正され、封口部材付コンデンサ素子が第
2のケース内に精度良く収納される。
According to the method of the present invention, an elastic member for sealing a case is attached to the root of the lead terminal of the capacitor element in a state where the capacitor element impregnated with the electrolyte material is pulled out from the first case. At this time, the displacement of the lead terminal is corrected, and the capacitor element with the sealing member is accurately stored in the second case.

【0015】また、ケースの封口にエポキシ樹脂を用い
ないため、該封口部におけるエポキシ樹脂の盛り上がり
の問題が回避されるばかりでなく、エポキシ樹脂の配合
比、ポットライフ、粘度等の管理も不要となる。
Further, since the epoxy resin is not used for sealing the case, not only the problem of swelling of the epoxy resin in the sealing portion is avoided, but also the management of the mixing ratio of the epoxy resin, the pot life, the viscosity, etc. is unnecessary. Become.

【0016】[0016]

【実施例】以下、本発明の実施例について説明する。Embodiments of the present invention will be described below.

【0017】本発明実施例による固体電解コンデンサの
製造方法においては、まず図5に示すように、陽極用エ
ッチドアルミニウム箔1の表面に化成処理を施して誘電
体皮膜を形成し、該陽極箔1を陰極箔2及びセパレ−タ
紙3とともに巻回してコンデンサ素子7を形成する。ま
た一方で、TCNQ錯塩の粉末を有底筒状の第1アルミ
ニウムケ−ス内に適量詰め、これを加熱してTCNQ錯
塩を融解液化させる。
In the manufacturing method of the solid electrolytic capacitor according to the embodiment of the present invention, first, as shown in FIG. 1 is wound together with the cathode foil 2 and the separator paper 3 to form the capacitor element 7. On the other hand, an appropriate amount of TCNQ complex salt powder is packed in a bottomed first aluminum case, which is heated to melt the TCNQ complex salt.

【0018】そして、図2に示すように、前記コンデン
サ素子7を前記第1アルミニウムケ−ス9の開口部から
融解液化したTCNQ錯塩中に挿入浸漬し、コンデンサ
素子の内部に電解質としてのTCNQ錯塩を含浸させた
後、直ちにコンデンサ素子を第1アルミニウムケ−スか
ら引き抜き、TCNQ錯塩を冷却固化させる。
Then, as shown in FIG. 2, the capacitor element 7 is inserted and immersed in the molten TCNQ complex salt from the opening of the first aluminum case 9, and the TCNQ complex salt as an electrolyte is placed inside the capacitor element. Immediately after the impregnation, the capacitor element is pulled out of the first aluminum case, and the TCNQ complex salt is cooled and solidified.

【0019】その後、図1に示すように、コンデンサ素
子7のリ−ド端子51、52をケース封口用ゴム11の
孔に挿入貫通させて、該封口用ゴム11を前記リード端
子51、52の根元部分にあるリードボス部61、62
に装着固定し、該封口用ゴム付コンデンサ素子を前記第
1アルミニウムケ−スと略同一径の第2アルミニウムケ
−ス10内に収納し、第2アルミニウムケ−スの開口部
付近の側面をカ−ルして前記封口用ゴム11を締め付け
ることにより該ケ−ス10の開口部を封止する。
Thereafter, as shown in FIG. 1, the lead terminals 51 and 52 of the capacitor element 7 are inserted through the holes of the case sealing rubber 11, and the sealing rubber 11 is inserted into the lead terminals 51 and 52. Lead bosses 61, 62 at the root
And the capacitor element with a rubber for sealing is housed in a second aluminum case 10 having substantially the same diameter as the first aluminum case, and the side surface near the opening of the second aluminum case is removed. The opening of the case 10 is sealed by curling and tightening the sealing rubber 11.

【0020】さらに、表面実装用の縦チップ型とする場
合には、図3に示すように、リ−ド端子51、52をプ
ラスチック製の台座12の孔に挿入し、貫通させ、折り
曲げて、コンデンサ本体を台座に固定する。
Further, in the case of a vertical chip type for surface mounting, as shown in FIG. 3, lead terminals 51 and 52 are inserted into holes of the plastic pedestal 12, penetrated, bent, and Fix the capacitor body to the base.

【0021】また、横チップ型とする場合には、図4に
示すように、リ−ド端子51、52を所定の形状に折り
曲げ成形した後、コンデンサ本体を外装用プラスチック
ケ−ス13の空洞部に収納固定する。
In the case of a horizontal chip type, as shown in FIG. 4, after the lead terminals 51 and 52 are bent and formed into a predetermined shape, the capacitor body is hollowed out of the external plastic case 13. Store and fix in the section.

【0022】上記実施例に従って製造される各種縦チッ
プ型固体電解コンデンサにおける第2のアルミニウムケ
−ス、封口用ゴム及び完成品の寸法を、表1に示す。
Table 1 shows the dimensions of the second aluminum case, the sealing rubber and the finished product in various vertical chip type solid electrolytic capacitors manufactured according to the above embodiment.

【0023】[0023]

【表1】 [Table 1]

【0024】[0024]

【発明の効果】本発明によれば、固体電解コンデンサに
おけるリ−ド端子部やケース封口部の寸法精度が向上
し、表面実装用等として好適な小型の固体電解コンデン
サが提供される。
According to the present invention, a dimensional accuracy of a lead terminal portion and a case sealing portion of a solid electrolytic capacitor is improved, and a small solid electrolytic capacitor suitable for surface mounting or the like is provided.

【0025】なお、エポキシ樹脂を封口材として用いた
従来の固体電解コンデンサでは、完成品を半田耐熱試験
した時に、エポキシ樹脂が半田熱により膨張、収縮して
コンデンサ素子内にクラックが発生し、漏れ電流(L
C)が増大することがあったが、本発明による固体電解
コンデンサにおいては、エポキシ樹脂を用いないため半
田熱によりコンデンサ素子が傷つくことがなく、半田耐
熱性も改善されている。
In a conventional solid electrolytic capacitor using an epoxy resin as a sealing material, when a completed product is subjected to a soldering heat test, the epoxy resin expands and contracts due to solder heat, cracks are generated in the capacitor element, and leakage occurs. Current (L
Although C) sometimes increased, in the solid electrolytic capacitor according to the present invention, since the epoxy resin was not used, the capacitor element was not damaged by solder heat, and the solder heat resistance was also improved.

【0026】ゴム封口による本発明実施例とエポキシ樹
脂封口による従来例の固体電解コンデンサについて、1
50℃×120秒のプレヒート後、230℃×10秒の
半田耐熱試験を行った結果を表2に示す。
The solid electrolytic capacitor according to the embodiment of the present invention using rubber sealing and the conventional solid electrolytic capacitor using epoxy resin sealing are:
Table 2 shows the results of a solder heat test at 230 ° C. × 10 seconds after preheating at 50 ° C. × 120 seconds.

【0027】[0027]

【表2】 [Table 2]

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明実施例による固体電解コンデンサの断面
図である。
FIG. 1 is a sectional view of a solid electrolytic capacitor according to an embodiment of the present invention.

【図2】本発明実施例における電解質含浸工程を説明す
るための断面図である。
FIG. 2 is a cross-sectional view for explaining an electrolyte impregnation step in an embodiment of the present invention.

【図3】縦チップ型コンデンサの側面図である。FIG. 3 is a side view of a vertical chip capacitor.

【図4】横チップ型コンデンサの斜視図である。FIG. 4 is a perspective view of a horizontal chip capacitor.

【図5】コンデンサ素子の部分分解斜視図である。FIG. 5 is a partially exploded perspective view of a capacitor element.

【図6】従来例による固体電解コンデンサの断面図であ
る。
FIG. 6 is a sectional view of a conventional solid electrolytic capacitor.

【図7】従来例による固体電解コンデンサの上部平面図
であり、(a)は良品、(b)及び(c)はリ−ド端子
位置不良品を示している。
FIGS. 7A and 7B are top plan views of a conventional solid electrolytic capacitor, in which FIG. 7A shows a non-defective product and FIGS.

【符号の説明】[Explanation of symbols]

1 陽極箔 2 陰極箔 3 セパレ−タ紙 5 リ−ド端子 6 リードボス 7 コンデンサ素子 9 第1のケ−ス 10 第2のケ−ス 11 封口用弾性部材 DESCRIPTION OF SYMBOLS 1 Anode foil 2 Cathode foil 3 Separator paper 5 Lead terminal 6 Lead boss 7 Capacitor element 9 First case 10 Second case 11 Elastic member for sealing

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−167413(JP,A) 特開 昭62−185308(JP,A) (58)調査した分野(Int.Cl.7,DB名) H01G 9/00 H01G 9/028 ────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-60-167413 (JP, A) JP-A-62-185308 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) H01G 9/00 H01G 9/028

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 第1のケース内で融解液化させた電解質
材料の中へコンデンサ素子を挿入浸漬することにより該
コンデンサ素子の内部に前記電解質材料を含浸させる工
程と、 前記コンデンサ素子を前記第1のケ−スから引き抜くと
共に該コンデンサ素子内部の前記電解質材料を冷却固化
させる工程と、 前記コンデンサ素子を第2のケ−ス内に収納する工程と
を備え、 前記第1のケースと前記第2のケースが略同一径の筒状
体であることを特徴とする固体電解コンデンサの製造方
法。
A step of inserting and dipping a capacitor element into an electrolyte material melted and liquefied in a first case to impregnate the electrolyte element into the interior of the capacitor element; Removing the electrolyte material inside the capacitor element from the case and cooling and solidifying the electrolyte material inside the capacitor element; and housing the capacitor element in a second case. The first case and the second case Wherein the case is a cylindrical body having substantially the same diameter.
【請求項2】 前記コンデンサ素子に含浸させた前記電
解質材料を冷却固化させた後、前記コンデンサ素子のリ
ード端子の根元部分にケース封口用の封口部材を装着
し、該封口部材付コンデンサ素子を第2のケ−ス内に収
納する工程を備えることを特徴とする請求項1記載の固
体電解コンデンサの製造方法。
2. After cooling and solidifying the electrolyte material impregnated in the capacitor element, a sealing member for sealing a case is attached to a root portion of a lead terminal of the capacitor element. 2. The method for manufacturing a solid electrolytic capacitor according to claim 1, further comprising a step of housing the solid electrolytic capacitor in a second case.
【請求項3】 前記電解質材料がTCNQ錯塩であるこ
とを特徴とする請求項1記載の固体電解コンデンサの製
造方法。
3. The method according to claim 1, wherein the electrolyte material is a TCNQ complex salt.
JP29017394A 1994-11-24 1994-11-24 Method for manufacturing solid electrolytic capacitor Expired - Fee Related JP3152572B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP29017394A JP3152572B2 (en) 1994-11-24 1994-11-24 Method for manufacturing solid electrolytic capacitor
US08/562,063 US5766271A (en) 1994-11-24 1995-11-22 Process for producing solid electrolyte capacitor
DE69508889T DE69508889T2 (en) 1994-11-24 1995-11-23 Solid electrolytic capacitor and manufacturing process
EP95118486A EP0714109B1 (en) 1994-11-24 1995-11-23 Solid electrolyte capacitor and process for producing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29017394A JP3152572B2 (en) 1994-11-24 1994-11-24 Method for manufacturing solid electrolytic capacitor

Publications (2)

Publication Number Publication Date
JPH08148385A JPH08148385A (en) 1996-06-07
JP3152572B2 true JP3152572B2 (en) 2001-04-03

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JP29017394A Expired - Fee Related JP3152572B2 (en) 1994-11-24 1994-11-24 Method for manufacturing solid electrolytic capacitor

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101311089B (en) * 2007-05-23 2012-10-10 佳能株式会社 Sheet processing apparatus and image forming apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101311089B (en) * 2007-05-23 2012-10-10 佳能株式会社 Sheet processing apparatus and image forming apparatus

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Publication number Publication date
JPH08148385A (en) 1996-06-07

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