JP3150745B2 - Composition for near-infrared absorbing agent, near-infrared absorbing material, and molded article containing them - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a composition for a near-infrared ray absorbent comprising a copper compound, a thiourea derivative or a thioamide derivative, tungsten hexachloride and a trialkyl or triaryl phosphate, and a near-infrared ray absorbing material. The present invention relates to a molded article containing: The near-infrared absorbing material is a functional material that has been actively researched and developed recently, and is a photosensitive material using a semiconductor laser beam having a wavelength in the near-infrared region as a light source, and an information recording material such as a recording material for an optical disc. And optical materials such as infrared cut filters and films, and heat ray absorbing glazing materials.

[0002]

2. Description of the Related Art The near-infrared absorbing materials developed so far include chromium and cobalt complex salts in Japanese Patent Publication No. Sho 60-42269, thiol nickel complex in Japanese Patent Publication No. Sho 60-21294, and Japanese Patent No. 115958 discloses an anthraquinone derivative, and Japanese Patent Application Laid-Open No. 61-218551 discloses a novel squarylium compound having a maximum absorption wavelength in a range of 700 to 800 nm. Also as shown in U.S. Pat. No. 3692688 tungsten hexachloride (WCl ₆₎ and tin chloride (SnCl ₂ · 2H
The ₂ O) was dissolved in methyl methacrylate syrup (monomer), substantially material excellent near-infrared absorptivity without haze obtained by polymerization are known.

[0003]

The conventional near-infrared absorbing material has a problem in that the organic material is poor in durability and its initial performance is deteriorated with changes in environmental conditions and with the passage of time. On the other hand, although the complex type is durable, it has an absorption not only in the near-infrared region but also in the visible region, and there is a problem that the compound itself is strongly colored and its use is often limited. Furthermore, in both systems, an absorption peak was observed at a specific wavelength, and there was almost no absorption ability at a wavelength deviated from the peak. In the case of a recording medium using these materials as a light source, for example, a laser beam having a wavelength in the near infrared region, it is necessary to match the wavelength of the laser beam with the wavelength at the absorption peak of the material. However, since only the wavelength of the laser beam and the absorption wavelength of the near-infrared absorbing material can be obtained, the combinations in which the wavelength of the laser beam and the wavelength at the absorption peak of the near-infrared absorbing material match are extremely limited. I had to become something.

In addition, the above-mentioned prior art WCl ₆ and SnCl ₂ .2H ₂ O
Is dissolved in methyl methacrylate to develop a deep blue color and has a property of absorbing near-infrared rays well, but has a problem of fading during long-term storage in a dark place. Such a slow progress of photochromism is an unfavorable problem in providing industrial products such as optical filters and heat ray absorbing glazing having a certain quality.

[0005]

According to the present invention, there is provided a semiconductor device comprising:
As a result of intensive studies on a near-infrared absorbing material which is uniformly absorbed in the entire near-infrared region, has low coloring and is excellent in durability, a copper compound and a thiourea-based or thioamide-based derivative and hexachloride The present inventors have found that a desired excellent near-infrared absorbing material can be obtained by preparing a composition comprising tungsten and a trialkyl or triaryl phosphate, thereby completing the present invention.

Thus, the present invention provides, (A) the general formula (I) in _{(R-X) n Cu (} I) [wherein, R represents hydrogen, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group and the heterocyclic residue monovalent radical selected from the group consisting of group (each group may have one or more substituents), X is _{-COO, -SO 4, -SO 3,} -PO 4, -O, n Is 1
Or an integer of 4 to 1 part by weight of at least one copper compound selected from the group consisting of copper chlorophyll, copper copper chlorophyllin and copper bisacetylacetonate.

[0007]

Embedded image

(R ₁ , R ₂ , and R ₃ each represent a monovalent group selected from the group consisting of hydrogen, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, and a 5- or 6-membered heterocyclic residue. And each group may have one or more substituents, and R ₁ and
R ₂ or R ₂ and R ₃ may be linked to form a ring) at least one selected from thiourea derivatives represented by 0.05 to 50
Component consisting of parts by weight or the following general formula (III)

[0009]

Embedded image

(R _{4 and} R ₅ represent a monovalent group selected from the group consisting of hydrogen, an alkyl group, an alkenyl group, a cycloalkyl group, an aryl group, an aralkyl group and a 5- or 6-membered heterocyclic residue. , R ₅ further represents an alkoxy group, each group may have one or more substituents, and R ₄ and R ₅ may be linked to form a ring). At least one thioamide derivative selected from 0.05 to
(B) 80 to 20% by weight of a component consisting of 0.05 to 10 parts by weight of trialkyl or triaryl phosphate per 1 part by weight of tungsten hexachloride, The present invention relates to a composition for a near-infrared ray absorbing agent wherein A) + (B) = 100% by weight, a near-infrared ray absorbing material, and a molded article containing them.

Examples of the copper compound represented by the above general formula (I) used in the present invention include, but are not limited to, the following. Copper stearate, copper panaminate, copper oleate, copper behenate, copper laurate, copper caprate, copper caproate, copper valerate, copper isobutyrate, copper butyrate, copper propionate, copper acetate, copper formate, water Copper oxide, copper benzoate, copper orthotoluate, copper metatoluate, copper paratoluate, copper p-tert-butyl benzoate, copper orthochlorobenzoate, copper dichlorobenzoate, copper trichlorobenzoate, copper p-bromobenzoate, p -Copper iodobenzoate, copper o-benzoylbenzoate, copper p-nitrobenzoate, copper anthranilate, copper p-aminobenzoate, copper oxalate, copper malonate, copper succinate, copper glutarate, copper adipate , Copper pimerate, copper suberate, copper azelate, copper sebacate, copper phthalate, copper monoester phthalate, copper naphthenate, copper naphthalenecarboxylate,
Copper tartrate, copper diphenylamine-2-carboxylate, 4-
Copper cyclohexyl butyrate, copper diethyldithiocarbamate, copper gluconate, copper diethoxy, copper di-i-propoxy, copper octylate, copper alkylbenzenesulfonate, p
-Copper toluenesulfonate, copper naphthalenesulfonate, copper naphthylaminesulfonate, copper n-dodecylbenzenesulfonate, copper dodecylsulfate, copper 2,5-dimethylbenzenesulfonate, copper 2-carbomethoxy-5-methylbenzenesulfonate , Copper α-naphthyl phosphate, copper di-2-ethylhexyl phosphate, copper isodecyl phosphate.

The thiourea derivative represented by the general formula (II) used in the present invention can be exemplified by the following, but is not limited thereto. 1-ethyl-3-phenylthiourea, 1,3-diphenylthiourea, 1,3-diethylthiourea, 1-ethyl-3-p-chlorophenylthiourea, 1-ethyl-3- (2-hydroxyethyl) thiourea, 1- (2-thiazolyl) -3-phenylthiourea, 1,3-distearylthiourea, 1,3-
Dibehenylthiourea, 1-ethylthiourea, 1-p
-Bromophenyl-3-phenylthiourea, 1- (2
-Thiophenyl) -3-phenylthiourea, 1,3-bis (2-hydroxyethyl) thiourea, 1-p-aminophenyl-3-phenylthiourea, 1-p-nitrophenyl-3-phenylthiourea, 1-p- Hydroxyphenyl-3-phenylthiourea, 1,3-di-m-
Chlorophenylthiourea, ethylenethiourea, thiourea, 1-methyl-3-p-hydroxyphenylthiourea, 1-phenylthiourea, 1-m-nitrophenylthiourea, 1-p-nitrophenylthiourea,
1-p-aminophenylthiourea, 1,3-dimethylthiourea, 1,3-dicyclohexylthiourea, 1-phenyl-3-p-chlorophenylthiourea, 1-phenyl-3-p-methoxyphenylthiourea, 1,1-diphenyl Thiourea, 1,1-dibenzyl-3-phenethylthiourea, 1-phenyl-3- (2-hydroxyethyl) thiourea.

The thioamide derivative represented by the general formula (III) used in the present invention can be exemplified by the following, but is not limited thereto. N-methylthiobenzamide, N-phenylthiobenzamide, N-ethylthioethylamide, N-ethylthio-p-chlorobenzamide, N-propylthiobenzamide, N-ethylthiostearylamide, N-1- (2 -Thiazolyl) thiobenzamide, N-stearylthiostearylamide, N
-Behenylthiobehenylamide, thioacetamide, N
-Phenyl-thio-p-bromobenzamide, N-1-
(2-thiophenyl) thiobenzamide, N-behenylthioacetamide, N-p-aminophenylthiobenzamide, N-p-nitrophenylthiobenzamide, N
-P-hydroxyphenylthiobenzamide, N-m-
Chlorophenylthiobenzamide, thionicotinamide, thioacetanilide, O-ethyl-N-phenyl (thiocarbamate), thiobenzamide, thio-m-
Nitrobenzamide, thio-p-nitrobenzamide,
Thio-p-aminobenzamide, N-methylthioacetamide, N-cyclohexylbenzamide, N-chlorophenylthiobenzamide, Np-methoxyphenylthiobenzamide, N-stearylthiobenzamide.

The trialkyl or triaryl phosphate used in the present invention can be exemplified by the following, but is not limited thereto. Trimethyl phosphate, triethyl phosphate, tributyl phosphate, tri-2-ethylhexyl phosphate, tributoxyethyl phosphate, trioleyl phosphate, triphenyl phosphate,
Tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate, 2-ethylhexyl diphenyl phosphate.

The copper compound and thiourea derivative or thioamide derivative and tungsten hexachloride and trialkyl or triaryl phosphate used in the present invention are:
The addition amount, type and ratio, heating temperature, and heating time can be changed by setting the near-infrared absorption. The addition amount of the thiourea derivative is 0.05 to 50 parts by weight based on 1 part by weight of the copper compound. Further, the addition amount of the thioamide derivative is 0.05 to 50 parts by weight per 1 part by weight of the copper compound,
Preferably it is 0.05 to 30 parts by weight. Further, the addition amount of the trialkyl or triaryl phosphate is 0.05 to 10 parts by weight, preferably 0.05 to 8 parts by weight based on 1 part by weight of tungsten hexachloride. The component (A) is contained in an amount of 20 to 80% by weight, preferably 40 to 60% by weight. Further, even when the content is the same, the transmittance varies depending on the thickness of the resin material obtained in the present invention, for example, when the resin material is a plate, so that the transmittance is finally obtained at the set thickness. Need to decide.

In the present invention, the addition amount of the thiourea derivative or the thioamide derivative is less than 0.05 part by weight with respect to 1 part by weight of the copper compound, and trialkyl or triarylphosphone is added to 1 part by weight of tungsten hexachloride. When the addition amount of the fate is less than 0.05 part by weight, the improvement of the near-infrared absorbing ability is not sufficient. On the other hand, when the added amount of the thiourea derivative or the thioamide derivative exceeds 5 parts by weight with respect to 1 part by weight of the copper compound, and when the added amount of the trialkyl or triaryl phosphate is 50 parts by weight with respect to 1 part by weight of tungsten hexachloride. When the ratio exceeds the above range, no improvement in near-infrared absorbing power is observed, and haze may be generated in the material. When the component (A) is less than 20% by weight and the component (B) is less than 20% by weight, absorption is not uniformly observed over the entire near infrared region of 800 to 2000 nm. The copper compound and the thiourea derivative or the thioamide derivative and the tungsten hexachloride and the trialkyl or triaryl phosphate may be mixed as they are according to the mixing ratio, and may be mixed with a binder, a thermoplastic resin powder, and the like, and further, if necessary, generally. Additives used, such as flame retardants, heat stabilizers, antioxidants, light stabilizers,
A composition may be prepared by adding an ultraviolet absorber, a lubricant, and a coloring agent.

The composition may be mixed and dissolved or dispersed in an appropriate solvent or dispersion medium, or mixed and dispersed in a medium in which a binder, a coloring agent, and the like are dissolved. The degree of mixing and the amount to be added to the molded body or the amount to be blended with other substances are determined by heat treatment when copper compound and thiourea derivative or thioamide derivative, tungsten hexachloride and trialkyl or triaryl phosphate are combined. It is only necessary that the compound be in a solid state or in such a state that one or both of them are dissolved to be in a state where they can sufficiently contact each other.

A composition containing a copper compound and a thiourea derivative or a thioamide derivative and tungsten hexachloride and a trialkyl or triaryl phosphate according to the present invention, or a near-infrared absorbing material obtained by heat-treating this composition As a method of including in the molded body, a special means, without requiring a mixing order, a general-purpose mixing device, such as a hot roll, a Banbury mixer or an extruder, or a slurry in which each is dispersed is formed into a molded body. What is necessary is just to apply or impregnate by spraying, coating, printing, etc. The molded body is made into a film, sheet or rod by known materials and methods such as pulp, fiber, thermoplastic resin, ceramics, etc. I do.

The heat treatment method is particularly applicable as long as the copper compound can react with a thiourea derivative or a thioamide derivative and tungsten hexachloride with a trialkyl or triaryl phosphate to add thermal energy capable of obtaining near-infrared absorption. There is no limitation, and examples thereof include melt molding such as an electric heater, an infrared lamp, and a film. The heating temperature is generally in the range of 40-400 ° C, preferably 50-350 ° C. The heating time is generally in the range of several milliseconds to tens of minutes. Further, it is a preferable method to increase the frequency of contact between substances by applying agitation, rotation, and vibration, to make the transfer of heat energy uniform, to speed up the reaction, and to make the mixing state uniform.

[0020]

As described above, a copper compound of the general formula (I) or copper chlorophyll, sodium copper chlorophyllin, copper bisacetylacetonate, a thiourea derivative of the general formula (II) or a thioamide derivative of the general formula (III) and By heating and kneading a mixture containing tungsten hexachloride and a trialkyl or triaryl phosphate by the above-mentioned mixing method, near infrared rays can be almost uniformly absorbed over the entire range of 800 to 2000 nm. Although the reason is not clear, as is clear from the following Examples and Comparative Examples, a thiourea derivative, a thioamide derivative, a copper compound, tungsten hexachloride, or a trialkyl or triaryl phosphate is mixed alone as described above. Even if it is heated and kneaded by the method, it does not absorb the near-infrared light almost uniformly and intensely over the entire near-infrared region of 800 to 2000 nm, and it is merely a thiourea derivative, a thioamide derivative, a copper compound, a tungsten hexachloride and a trichloride. Since the same is true even when the alkyl or triaryl phosphate is simply mixed, a mixture containing a thiourea derivative or a thioamide derivative, a copper compound, and tungsten hexachloride and a trialkyl or triaryl phosphate is mixed by the above mixing method. By heating and kneading, thiourea derivative or thioamide derivative It is presumed that some kind of reaction occurred between the compound, the copper compound, tungsten hexachloride and the trialkyl or triaryl phosphate to form a complex.

[0021]

EXAMPLES The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples. In addition, all the addition rates in an Example show a weight part. The transmission spectrum of the obtained resin material was measured with a spectrophotometer (type 323, manufactured by Hitachi, Ltd.). Judgment of near-infrared absorptivity was made when the average of the absorption values at each wavelength of 900, 1000, 1100, and 1500 nm was 80% or more: ◎, 60% or more: ○, 30% or more: Δ, 30% or less X, and performed.

The stability of the near-infrared absorptivity to heat, humidity and light was measured by the following method. Heat / moisture resistance: Near infrared absorbing sheet at 80 ℃, 100%
After standing in a RH oven for 480 hours, near-infrared absorption was measured again with a spectrophotometer (wavelength: 1000 nm). The storability of the sheet was evaluated based on the result calculated by the following equation.

[0023]

(Equation 1)

Lightfastness: After irradiating the near-infrared absorbing sheet with a UV (ultraviolet) tester (super-accelerated lightfastness tester manufactured by Dainippon Plastics Co., Ltd.) for 200 hours, the near-infrared absorbing property was measured again by a spectrophotometer ( (Wavelength: 1000 nm). The storage stability was evaluated based on the result calculated by the following equation.

[0025]

(Equation 2)

The thermal stability was measured after a residence time of 20 minutes at a set temperature of 230 ° C. using an injection molding machine, and the color tone change of the obtained sample was measured with a color difference meter manufactured by Nippon Denshoku Co., Ltd. And
The color difference (ΔE) was determined by the Lab method and determined as follows. ：: excellent ：: good △: no burn (large yellow change) ×: burns Examples 1 to 24 2 parts by weight of thiourea compound, 0.2 parts by weight of copper compound and 0.1 parts by weight of tungsten hexachloride in the combinations shown in Tables 1 and 2 Parts by weight and trialkyl or triaryl phosphate 0.5
The respective parts by weight and 100 parts by weight of the styrene resin were mixed for 20 minutes by a tumbler mixer, kneaded at 220 ° C. by a 40 mmφ extruder, and formed into pellets. Next, the pellets were dried, and a 3 mm-thick green transparent resin sheet having no haze was prepared using an injection molding machine. The transmission spectra at 800 to 2000 nm of the obtained sheets were measured. The results are shown in Table 4, and the absorption ability in the near infrared region was excellent. The heat shielding effect of the near-infrared absorbing sheet obtained in Example 1 was measured using the apparatus shown in FIG. 1 is a 60 W incandescent lamp, 2 is a measurement sample, and 3 is a precision thermometer. The result was as shown in FIG. The heat-shielding effect of the near-infrared absorbing sheet is indicated by A in the figure. From the comparison with B, which shows the heat-shielding effect of a normal polystyrene resin containing no near-infrared absorbing agent shown in FIG. It turns out that it is excellent in heat-shielding ability. Further, the transmission spectrum of the transparent resin sheet obtained in Example 1 is shown by A in FIG. 3 and can be seen from a comparison with the transmission spectrum B of a normal polystyrene resin sheet containing no near-infrared absorber shown in FIG. As shown, this resin plate transmits light in the visible range relatively well,
It had excellent near-infrared absorption capacity not found in ordinary polystyrene resin sheets.

Examples 25 to 29 2 parts by weight of the thioamide compound, 0.2 parts by weight of the copper compound, 0.1 parts by weight of tungsten hexachloride, 0.5 parts by weight of trialkyl or triaryl phosphate and 100 parts by weight of the polystyrene resin in the combination shown in Table 2 Parts by weight, mix with a tumbler mixer for 20 minutes, and use a 40mmφ extruder
After kneading at 220 ° C., the mixture was formed into pellets. Next, the pellets were dried, and a 3 mm-thick green transparent resin sheet having no haze was prepared using an injection molding machine. The transmission spectra at 800 to 2000 nm of the obtained sheets were measured. Tables 4 and 5 show the results. The results were excellent in the near infrared absorption capacity.

[0028]

[Table 1]

Examples 30-35 2 parts by weight of a thiourea compound, 0.2 parts by weight of a copper compound, 0.1 parts by weight of tungsten hexachloride and 1 part by weight of a trialkyl or triaryl phosphate in the combination shown in Table 2 were formulated according to the following formulation. , Component ratio, parts by weight (A) solution Thiourea compound 2 copper compound 0.2 10% aqueous polyvinyl alcohol solution 10 (B) solution tungsten hexachloride 0.1 trialkyl or triaryl phosphate 0.5 ethyl alcohol 10 (A) solution 50 parts by weight And 50 parts by weight of the liquid (B) were mixed, and a coating amount of 5 g /
It was applied and dried to obtain m ² . Each of the obtained polystyrene resin sheets was light blue, and when the coated surface was brought into contact with the metal block at a surface temperature of 160 ° C. for 5 seconds,
It developed a pale green color. About these obtained boards 800-
The transmission spectrum at 2000 nm was measured. The results are shown in Table 5, and the absorption ability in the near infrared region was excellent.

Examples 36 to 41 The thiourea compound, copper compound, tungsten hexachloride and trialkyl or triaryl phosphate were added to 100 parts by weight of the styrene resin in the combinations and parts by weight shown in Table 2, and the mixture was mixed with a tumbler mixer. The mixture was mixed for 20 minutes, kneaded at 220 ° C by a 40 mmφ extruder, and formed into pellets. Then, the pellets were dried, and a 3 mm-thick, haze-free green transparent resin plate was prepared using an injection molding machine. The transmission spectra at 800 to 2000 nm of the obtained plates were measured. The results are shown in Table 5, and the absorption ability in the near infrared region was excellent.

[0031]

[Table 2]

Comparative Examples 1 to 10 Each of a thiourea compound, a thioamide compound, a copper compound, a tungsten hexachloride, a trialkyl or a triaryl phosphate shown in Table 3 was independently added to 100 parts by weight of a polystyrene resin. Mix for 40 minutes,
The mixture was kneaded at 220 ° C. by a mmφ extruder and then formed into pellets. Next, the pellets were dried, and a 3 mm-thick, haze-free green transparent resin plate was prepared using an injection molding machine.
The transmission spectra of these obtained plates were measured. Table 5 shows the results, all of which had a near infrared absorption capacity of 30% or less.

Comparative Examples 11 and 12 0.2 parts by weight of a copper compound shown in Table 3 and 0.5 parts by weight of a trialkyl or triaryl phosphate were mixed with a polystyrene resin.
The mixture was added to 100 parts by weight, mixed with a tumbler mixer for 20 minutes, kneaded at 220 ° C. with a 40 mmφ extrusion molding machine, and formed into pellets. Next, the pellets were dried, and a 3 mm-thick, haze-free green transparent resin plate was prepared using an injection molding machine. The transmission spectra at 800 to 2000 nm of the obtained plates were measured. Table 5 shows the results, all of which had a near infrared absorption capacity of 30% or less.

[0034]

[Table 3]

[0035]

[Table 4]

[0036]

[Table 5]

According to Tables 4 and 5, a molded product obtained by coating or heating and kneading a thiourea compound or a thioamide compound with a copper compound and tungsten hexachloride with a trialkyl or triaryl phosphate has a strong near-infrared absorption. It is clear that it has a function. The near-infrared absorptivity hardly decreases due to heating, humidification, or exposure, and it is understood that the near-infrared absorption is highly stable against changes in environmental conditions of handling and storage. In addition, a molded article obtained by kneading a thiourea compound, a thioamide compound, a copper compound, tungsten hexachloride or a trialkyl or triaryl phosphate alone did not substantially exhibit near-infrared absorption.

[0038]

According to the present invention, the absorbing material obtained by heat-treating the resin composition for near-infrared absorbing agent of the present invention and the molded product thereof have no instability such as discoloration, and have a photochromism that discolors when left in a dark place for a long time. Since it is not seen and exhibits excellent near-infrared absorbing ability, it is industrially useful as an optical filter, a heat ray absorbing glazing material and the like. Moreover, the obtained near-infrared absorbing sheet has strong absorptivity over the entire near-infrared region of 800 to 2000 nm. By utilizing these properties, it can be used as an optical material such as a near infrared cut filter, a recording material, a heat ray shielding material, a heat storage material, a near infrared detection sensor, and the like. Since the composition of the present invention contains a metal but has little coloring, molded articles such as sheets and films containing these have excellent appearance.

[Brief description of the drawings]

FIG. 1 is a schematic view of an apparatus for measuring a heat shielding effect of a near-infrared absorbing sheet.

FIG. 2 is a diagram showing measurement results of a heat shielding effect.

FIG. 3 is a diagram showing a transmission spectrum.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification code FI C08K 5/41 C08K 5/41 5/53 5/53 G02B 5/22 G02B 5/22 G11B 7/24 526 G11B 7/24 526P (58) Field surveyed (Int. Cl. ⁷ , DB name) C09K 3/00 105

Claims (6)

(57) [Claims] (A) A compound represented by the general formula (I) (R-X) _n Cu (I) wherein R is hydrogen, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group and a heterocyclic residue (each monovalent radical groups selected from the group consisting of which may have one or more substituents), X is _{-COO, -SO 4, -SO 3,} -PO 4, -O, n is 1
To an integer of 4 to 1 part by weight of at least one copper compound selected from the group consisting of copper chlorophyll, copper copper chlorophyllin and copper bisacetylacetonate. 1) (R ₁ , R ₂ , and R ₃ each represent a monovalent group selected from the group consisting of hydrogen, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, and a 5- or 6-membered heterocyclic residue. May have one or more substituents, and R ₁ and R ₂ or R ₂
R ₃ may be linked to form a ring) at least one component selected from the group consisting of 0.05 to 50 parts by weight selected from the group consisting of thiourea derivatives represented by the following general formulas (III) : (R ₄ and R ₅ represent hydrogen, an alkyl group, an alkenyl group,
Alkyl group, aryl group, aralkyl group and 5 or 6 members
Represents a monovalent group selected from the group consisting of
And R ₅ also represents an alkoxy group, and each group is at least one
R ₄ and R ₅ may be linked to form a ring
Or a thioamide derivative represented by
0.05 to 50 parts by weight of at least one thioamide derivative
(A) + (A) + (B) 20 to 80% by weight of a component consisting of (B) 0.05 to 10 parts by weight of a trialkyl or triaryl phosphate per 1 part by weight of tungsten hexachloride; B) = 100% by weight
A composition for a near infrared absorber. 2. A near-infrared absorbing material, comprising the composition for a near-infrared absorbing agent according to claim 1 . 3. A near-infrared absorbing material comprising a reaction product obtained by heat-treating the composition for a near-infrared absorbing agent according to claim 1 . 4. A near-infrared absorbing molded article comprising the composition for a near-infrared absorbing agent according to claim 1 while heating. 5. A molded article for absorbing near-infrared rays, comprising the near-infrared ray absorbing material according to claim 3 . 6. A near-infrared absorbing molded product obtained by heating the near-infrared absorbing material according to claim 2 .