JP3150051B2 - Ink jet head and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet head and a method for manufacturing the same. More specifically, the present invention relates to an ink jet head that discharges ink droplets from the inside of the ink chamber to the outside by applying pressure to the ink filling the inside of the ink chamber using a pressure generating member, and a method of manufacturing the same.

[0002]

2. Description of the Related Art As ink jet heads, those based on various droplet discharge principles have been commercialized. For example, a method in which ink is ejected from a nozzle hole in an ink chamber by mechanical deformation of a piezoelectric element (piezoelectric element method), bubbles are formed by boiling ink by heating with a heater, and a pressure change caused by the generation of the bubbles is used. There is a type in which ink is ejected from a nozzle (bubble jet method).

In such a situation, recently, as shown in FIG.
No. 1 has been proposed (JP-A-2-30543). In the ink jet head 510, a pair of electrodes 513b, 513b are provided at both ends of a nozzle plate 511 having a nozzle opening 511a via insulating films 513a, 513a, and a plate-like pressure generating member 5 is provided on the electrodes 513b, 513b.
In this example, a cover member 515 is provided so as to span and connect the first and the second members. In operation, the ink 80 is supplied from the preliminary ink chamber 532, and the gap 530 between the nozzle plate 511 and the pressure generating member 501 and the back side 531 of the pressure generating member 501 are filled with the ink 80. Then, during the heating period, the pressure generating member 501 is energized through the electrodes 513b, 513b to generate heat. Due to this heat generation, the pressure generating member 501 receives thermal stress due to the coefficient of thermal expansion, and the central portion is displaced in a direction perpendicular to the plate surface to generate pressure in the ink chamber. Is discharged in the form of particles. After the heating period ends, when the cooling period starts, the energization is stopped, and the pressure generating member 501 is cooled and returns to its original shape (position). Such a heating period and a cooling period are repeated,
The displacement and return of the pressure generating member 501 are repeated.

Further, the above document (Japanese Patent Laid-Open No. 2-30543)
In Japanese Patent Application Laid-Open No. H11-209, the pressure generating member 501 is composed of a single layer of heat generating member and a thin layer of Ni plating or the like covering the periphery of the heat generating member to prevent corrosion of the heat generating member by the ink 80. It has been proposed.

[0005]

However, the pressure generating member 501 is combined with a single heat generating member (heater layer).
In the case where the heat generating member is constituted by a thin film layer of Ni plating or the like covering the periphery of the heat generating member, thermal stress is applied between the heat generating member and the thin film layer due to heat generated by the heat generating member during operation. Then, there is a problem that the thin film layer peels off and shortens the life of the inkjet head. In addition, mechanical stress is applied between the heat generating member and the thin film layer due to displacement of the entire pressure generating member 501, and the influence of the mechanical stress itself on peeling is smaller than that of the thermal stress. Very few.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an ink jet head capable of preventing a layer constituting a pressure generating member from peeling off due to thermal stress and extending the life. Another object of the present invention is to provide a method of manufacturing an ink jet head suitable for manufacturing such an ink jet head.

[0007]

According to a first aspect of the present invention, there is provided an ink jet head having a nozzle plate having a nozzle opening and an ink chamber including a substrate facing the nozzle plate as a part of a peripheral wall. A pressure generating member provided in the ink chamber and opposed to the nozzle plate. A pressure is generated in the ink chamber by deformation of the pressure generating member, and the ink liquid in the ink chamber is discharged outside the chamber through the nozzle opening. An ink jet head that discharges to the pressure generating member is made of a substantially plate-shaped material that shows corrosion resistance to the ink, and a portion that forms both ends in at least one direction of a peripheral portion is attached to the substrate, A first buckling state which can take a non-displacement state having substantially no thermal stress and a buckling state in which buckling is caused by thermal expansion.
And a second buckling member, and first and second insulating layers provided between the first buckling member and the second buckling member along the two buckling members. A heater layer that is provided between the first insulating layer and the second insulating layer along the two insulating layers and generates heat when energized; and a heater layer that is provided between the first insulating layer and the heater layer. A first adhesion layer for adhering the first insulation layer and the heater layer, and a first adhesion layer provided between the second insulation layer and the heater layer, wherein the second insulation layer and the heater layer And a second adhesion layer for adhering to the substrate.

According to a second aspect of the present invention, in the inkjet head according to the first aspect, the first and second insulating layers and the first and second adhesion layers are formed at respective interfaces. It is characterized by being linked by a reaction.

According to a third aspect of the present invention, in the ink jet head according to the first or second aspect, the heater layer is formed in a belt-like pattern, and the first and second pressure generating members are formed of a band. The first buckling member is located on the inner side of the peripheral portion of the buckling member and has no pattern of the heater layer.
Characterized in that a slit penetrating up to the buckling member is provided.

According to a fourth aspect of the present invention, in the ink jet head according to any one of the first to third aspects, the pressure generating member is made of a substantially plate-shaped flexible material. A diaphragm provided along the second buckling body on the side facing the nozzle plate, with the peripheral portion and the central portion attached to the peripheral portion and the central portion of the second buckling member, respectively. Wherein the substrate is provided with a refrigerant circulation hole which penetrates the substrate and faces a portion of the pressure generating member which is located inside the peripheral portion of the first buckling member. And

According to a fifth aspect of the present invention, there is provided a method of manufacturing an ink jet head according to any one of the first to fifth aspects, wherein the first buckling member is provided on a surface of a substrate. The first insulating layer made of an oxide of the first element, the first adhesion layer, the heater layer, the second adhesion layer, and the oxidation of the second element. Forming a first insulating layer made of an oxide of the first element in a method of manufacturing an ink jet head in which the second insulating layer made of a material and a layer to be a second buckling body are sequentially stacked; After that, the first adhesion layer is formed by using a metal element having a property of being more easily combined with oxygen than the first element constituting the first insulating layer as a material, and the heater layer is formed of a metal element. Formed as a material, and the second adhesion layer is formed of the second insulating layer. Forming a metal element having a property of easily combine with oxygen than the second elements constituting a material,
Subsequently, a second insulating layer made of an oxide of the second element is formed.

According to a sixth aspect of the present invention, in the method of manufacturing an inkjet head according to the fifth aspect, the first adhesion layer, the heater layer, and the second adhesion layer are formed by sputtering. It is characterized by being formed continuously by a method.

[0013]

According to the first aspect of the present invention, a first adhesive layer is provided between the first insulating layer and the heater layer so as to make the layers adhere to each other, and between the second insulating layer and the heater layer. Since the second contact layer for adhering these layers is provided, thermal stress was applied between the first and second insulating layers and the heater layer due to heat generated by the heater layer during operation of the inkjet head. In this case, the separation between the first and second insulating layers and the heater layer is effectively prevented. Therefore, the reliability of the inkjet head is improved, and the life is extended. Note that thermal stress applied between the first buckling member and the first insulating layer or between the second buckling member and the second insulating layer does not directly contact the heater layer. Since it is not provided, it is smaller than the thermal stress applied between the first and second insulating layers and the heater layer. Therefore, separation between the first buckling member and the first insulating layer or separation between the second buckling member and the second insulating layer does not actually pose a problem.

In the ink jet head according to the second aspect, the first and second insulating layers and the first and second adhesion layers are respectively bonded at the interfaces by a chemical reaction. No separation occurs between the insulating layer and the first and second adhesion layers. Therefore, the reliability of the inkjet head is further improved, and the life is further extended.

In the ink jet head according to the third aspect, when the pressure generating member is displaced toward the nozzle plate during operation, the ink in the ink chamber flows to the back side of the pressure generating member through the slit penetrating the pressure generating member. Therefore, the cooling rate of the first buckling member of the pressure generating member increases. As a result, the response characteristics of the pressure generating member are improved, and high-speed printing can be performed.

In the ink jet head according to the fourth aspect, during operation, the refrigerant can be circulated to the first buckling member side of the pressure generating member through the refrigerant circulation hole penetrating the substrate. The body cools faster. As a result, the response characteristics of the pressure generating member are improved, and high-speed printing can be performed. Also, thanks to the diaphragm, the ink present in the gap between the nozzle plate and the pressure generating member (diaphragm) is prevented from flowing around the back side of the pressure generating member (diaphragm) during operation. Therefore, the ejection force and ejection speed of the ink increase.

According to a fifth aspect of the invention, there is provided a method for manufacturing an ink jet head, wherein the first adhesion layer is formed of the first insulating layer.
Since the metal element having a property of being more easily combined with oxygen than the element is formed as a material, the first insulating layer and the first adhesion layer are easily bonded at the interface by a chemical reaction. That is, the metal element which is the material of the first adhesion layer at the interface is
An oxide is combined with oxygen in the first insulating layer. Therefore, separation does not occur between the first insulating layer and the first adhesion layer. Similarly, the second adhesion layer is formed of a metal element having a property of being more easily combined with oxygen than the second element forming the second insulating layer, so that the second insulating layer and the second The metal element that is the material of the second adhesion layer at the interface with the adhesion layer is combined with oxygen of the second insulating layer to form an oxide. Therefore, separation does not occur between the second insulating layer and the second adhesion layer. In addition, since the first adhesion layer, the heater layer, and the second adhesion layer are all formed using metal elements as materials, by appropriately selecting the types of these metal elements, the adhesion between these layers can be improved. Is kept good. Therefore, according to this manufacturing method,
The layer constituting the pressure generating member is effectively prevented from peeling off due to thermal stress, and a long-life inkjet head can be manufactured.

According to the sixth aspect of the invention, a chemical reaction is caused at each interface between the first adhesion layer, the heater layer, and the second adhesion layer by the ion impact energy accompanying the sputtering. be able to. Therefore, the adhesion between the layers constituting the pressure generating member is further increased, and the life of the inkjet head can be extended.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an ink jet head and a method of manufacturing the same according to the present invention will be described in detail with reference to embodiments.

FIG. 1 shows an ink jet head 9 according to one embodiment.
0 shows the entire configuration.

The ink jet head 90 has a substrate 9 including a surface protection film 8.

On the front side of the substrate 9, a first buckling member 1 is provided.
The first insulating layer 3, the first adhesion layer 5, the heater layer 7, and the second
The adhesion layer 6, the second insulating layer 4, and the second buckling body 2 are provided in this order. The first buckling body 1 and the second buckling body 2;
A first insulating layer 3, a second insulating layer 4, a first adhesion layer 5,
The adhesion layer 6 and the heater layer 7 constitute the pressure generating member 20. A nozzle plate 11 is mounted on the front side of the substrate 9 via a spacer 10. Electrode pads 13a and 13b are provided on both sides of the pressure generating member 20.

FIG. 3 shows the ink jet head in a disassembled state as viewed obliquely, and FIG. 4 shows a state in which the pressure generating member 20 in FIG. 3 is further disassembled.

In this example, the substrate 9 shown in FIG. 3 is a single crystal silicon (Si) substrate having a silicon oxide film formed by thermal oxidation as a surface protection film 8. The first and second buckling bodies 1 and 2 shown in FIG. 4 are made of a metal material such as nickel. The first and second insulating layers 3 and 4 are made of an insulating material such as silicon oxide or silicon nitride. First and second insulating layers 3 and 4
This prevents the current flowing through the heater layer 7 from leaking to the first and second buckling bodies 1 and 2.

As shown in FIGS. 3 and 4, the first and second buckling bodies 1 and 2 and the first and second insulating layers 3 and 4 have four "K" s penetrating these rectangular surfaces.ス リ ッ ト -shaped slits 40 are provided. The four slits 40 are spaced apart from each other with the bent portion of the “ku” facing the center. As a result, the first and second insulating layers 3 and 4 and the first and second buckling bodies 1 and 2 have a cross-shaped portion 1a at the center.
2a, 3a and 4a are formed. In particular, the first and second
The ends of the sides 1b and 2b of the cross portions 1a and 2a of the buckling members 1 and 2 are connected to the peripheral portions 1c and 1c of the first and second buckling members 1 and 2, respectively.
2c, each side 1b of the cross portions 1a, 2a,
2b actually buckles when subjected to heating.

The heater layer 7 is made of, for example, a material such as nickel and tungsten. The heater layer 7 includes a strip-shaped electrode portion 7c extending in parallel along the periphery of the first and second insulating layers 3 and 4, and a center of the cross portions 3a and 4a of the first and second insulating layers 3 and 4. A circular portion 7a sandwiched between the portions (intersections of the sides 1b and 2b) and the first and second insulating layers 3 and 4
Are sandwiched between the sides 1b and 2b of the cross portions 3a and 4a, and share a band-shaped resistance portion 7b that connects the electrode portions 7c and 7c and the circular portion 7a in a meandering U-shape. On the electrode portion 7c, electrode pads 13a and 13b made of the same layer as the second buckling body 2 are connected via a second adhesion layer 6 described later. Thus, the pressure generating member 2
Since the first and second buckling members 1 and 2 and the heater layer 7 are separate layers, the heater layer 7 is independent of the shape of the first and second buckling members 1 and 2. , Can be formed in an elongated pattern. Therefore, it is possible to reduce the amount of electricity required to obtain the required amount of heat, and to reduce power consumption.
Further, since the slit 40 is formed in a portion where the pattern of the heater layer 7 does not exist, it is possible to completely prevent the heater layer 7 from coming into contact with the ink when the ink chamber is filled with the ink.

The first and second adhesion layers 5 and 6 have the same pattern as the heater layer 7. The first adhesion layer 5 makes the first insulation layer 3 and the heater layer 7 adhere to each other, while the second adhesion layer 6 is a layer for making the second insulation layer 4 and the heater layer 7 adhere to each other. It is made of Ti, Cr, Nb or the like.

Here, the present inventors have selected the materials of the first and second adhesion layers 5 and 6 based on the following experiment. That is, Tables 1 and 2 below show that when the material of the heater layer 7 is nickel and the material of the first and second insulating layers 3 and 4 is SiO ₂ or SiN, various materials are interposed therebetween. The results show that the adhesion (peeling load) when the first and second adhesion layers 5 and 6 are inserted is relatively evaluated by a scratch test (scratch test).

[Table 1]

[Table 2] As shown in Table 1, the peeling load when Ni (heater layer 7) was directly provided on SiO ₂ (first insulating layer 3) was 19.4.
gf, the peeling load when Ta and Ti are inserted between them increases to 72.2 gf and 73.9 gf, respectively. The peeling load when Ta and Ti were inserted between Si ₃ N ₄ (first insulating layer 3) and Ni (heater layer 7) was also a high level of 71.3 gf, 72 and 3 gf, respectively. Become. Further, as shown in Table 2, when the SiO ₂ (second insulating layer 4) was directly provided on the Ni (heater layer 7), the peeling load was 27.8 gf.
The peeling load when a, Cr and Nb were inserted was 4
It increases to 9.5 gf, 54.2 gf, and 35.3 gf.
It is considered that the larger the peeling load is, the stronger the adhesion is.
These Ta and T are used as materials for the first and second adhesion layers 5 and 6.
By using i, Cr, Nb, or the like, the adhesion between the layers can be effectively increased.

Here, the materials of the first and second adhesion layers 5 and 6 tested in Tables 1 and 2 were not selected from various materials, but were selected from the first and second insulating layers 3 and 6. When a certain amount of activation energy is given to a material that easily reacts with SiO ₂ or Si ₃ N ₄ as the material of No. 4,
A material which reacts chemically at the interface in contact with the material of the second insulating layers 3 and 4 to form a stronger bond (adhesion) is selected. For example, the material of the first and second insulating layers 3 and 4 is SiO ₂
In this case, a material that reacts with oxygen O more easily than Si in SiO ₂ (forms an oxide) is selected. Specifically, referring to the following Table 3 (showing the free energy difference ΔF ⁰ between various materials and their oxides), the generated energy ΔF ⁰ when forming an oxide is negative, and its absolute value is It can be selected from materials larger than those of Si.

[Table 3] The spacer 10 shown in FIG. 3 is made of an insulating film material such as a polyimide or acrylic photosensitive adhesive having a predetermined thickness. The spacer 10 is provided with a circular through-hole 10 a in order to form a gap 31 between the second buckling body 2 and the nozzle plate 11 to be filled with ink. Further, in order to supply ink into the gap 31, the ink supply path 1 penetrates the spacer insulating film in a thickness direction with a predetermined width and extends from the end of the film into the through hole 10a.
4 are formed.

The nozzle plate 11 has a thickness of, for example, 0.2
mm or glass sheet material. At a substantially center of the nozzle plate 11, a nozzle orifice 12 as a nozzle opening is formed. The nozzle orifice 12 is a hole having a circular cross section penetrating the nozzle plate 10, and the inner diameter of the nozzle orifice 12 is set so as to gradually decrease from the back side to the front side of the nozzle plate 10.

As shown in FIG. 1, in the completed state, the first and second buckling bodies 1 and 2, the first and second insulating layers 3 and 4,
The first and second adhesion layers 5 and 6 provided between them are:
It is completely close to each other. Only the respective peripheral portions (the portions forming both ends in one direction in the peripheral portion in FIG. 1) are bent and attached to the substrate 9 side, and are supported by the substrate 9. Portions of the first and second buckling bodies 1 and 2, the first and second insulating layers 3 and 4, and the first and second adhesion layers 5 and 6 that are inside the peripheral edge are separated from the substrate 9. In addition, a gap 32 is formed between the surface protection film 8 of the substrate 9 and a portion of the first buckling member 1 inside the peripheral edge. The gap 32 corresponds to the slit 4 shown in FIG.
0 communicates with the gap 31 between the second buckling body 2 and the nozzle plate 11. Further, the electrode pads 13a,
13b is located outside the spacer 10, that is, outside the ink chamber. The electrode pad 13a is connected to the switch 52 via the wiring 51a. The switch 52 switches between the power supply 50 and the ground.
The electrode pad 13b is connected to the ground via a wiring 51b.

The ink jet head 90 is driven as follows.

In operation, as shown in FIG. 1, the ink 15 is supplied to the gap 31 between the nozzle plate 11 and the second buckling body 2 through the ink supply path 14 in advance. The ink 15 not only fills the gap 31 but also fills the gap 32 between (the surface protection film 8 of) the substrate 9 and the first buckling body 1 through the slit 40 shown in FIG. Thereby, the entire ink chamber is filled with the ink 15.

Next, the switch 52 is switched to the power supply 50 side, a voltage is applied between the electrodes 13a and 13b, and the heater layer 7 is energized to generate heat (heating period). 1st, 2nd
Each side 1b, 2b of the cross portions 1a, 2a of the buckling bodies 1, 2 receives the heat of the strip-shaped resistance portion 7b of the heater layer 7, and thermally expands from a non-displaced state to expand in the longitudinal direction. However, since both ends (peripheral portions) 1c and 2c of the first and second buckling members 1 and 2 in the longitudinal direction are fixed to the substrate 9, the two buckling members cannot extend in the longitudinal direction. Therefore, a compression force P0 is generated and accumulated inside the first and second buckling bodies 1 and 2 as a reaction. When the compression force P0 exceeds the buckling load, as shown in FIG.
The buckling bodies 1 and 2 buckle, and a buckling state occurs in which the central portions 1a and 2a are displaced toward the nozzle plate 11 side. The reason for displacement toward the nozzle plate 11 side is mainly that the first buckling body 1
The first buckling body 1 side becomes the second buckling body 2 due to the heat radiation effect to the side.
This is because the temperature is lower than the side. As a result of the first and second buckling members 1 and 2 buckling, the pressure generating member 20 is deformed as a whole, and pressure is generated in the ink chamber 31. By this pressure, the ink liquid 15 in the ink chamber 31 is jetted out of the chamber through the nozzle plate 11 as an ink droplet 15a. By the ejection of the ink droplets 15a, printing is performed on a print surface provided to face the nozzle plate 11.

Since the gap 32 widens at the same time that the pressure generating member 20 is displaced to the nozzle plate 11 side, a part of the ink 15 existing in the gap 31
Through zero, it flows into the widened gap 32. Therefore, the cooling speed of the first buckling body 1 is increased, and high-speed printing is possible.

Next, the switch 52 is returned to the ground side to stop the energization of the heater layer 7 (cooling period). Then, the first and second buckling bodies 1 and 2 are cooled and return to the original non-displaced state together with the heater layer 7. Thereby, the pressure generating member 20 returns to the original position as a whole (standby state). Such a heating period and a cooling period are repeated, and the displacement and return of the pressure generating member 20 are repeated.

When the use of the ink jet head 90 is continued, as described above, the temperature of the heater layer 7 becomes high, and the heater layer 7 and the first and second insulating layers 2 and 3 are heated by the thermal stress. Tend to peel off easily.
However, in the inkjet head 90, the first adhesive layer 5 is provided between the first insulating layer 3 and the heater layer 7, and the second adhesive layer 6 is provided between the second insulating layer 4 and the heater layer 7. Therefore, the peeling resistance between the first and second insulating layers 3 and 4 and the heater layer 7 can be increased. As a result, the life of the inkjet head can be extended.

Next, a method for manufacturing the ink jet head 90 will be described.

FIGS. 5 to 8 show a process of forming the pressure generating member 20 which is a main part of the ink jet head 90. FIG. The left side (X) and right side (Y) of the divisional diagrams (a) to (l) in these figures respectively correspond to the XX line section and the YY line section in FIG. In order to make it easier to see, the pattern of the heater layer 7 in FIG.
The pattern of the heater layer 7 in FIGS. 6 to 8 (process sectional views) is slightly changed.

(I) First, as shown in FIG. 5A, the surface and the back surface of the single crystal silicon substrate 9 are thermally oxidized.
The silicon oxide films 8 are formed to a predetermined thickness (for example, 1 to 2 μm).
m). Further, an aluminum film 120 having a thickness of, for example, 0.1 to 1 μm is formed as a sacrificial layer on the thermal oxide film 8 on the substrate surface side by, for example, a sputtering method. Subsequently, photolithography and etching are performed thereon, thereby forming the aluminum film 120 into the gap 32 shown in FIG.
Process into a pattern corresponding to. The sacrificial layer 12
The distance of the gap 32 is determined according to the thickness of 0.

(Ii) Next, as shown in FIG. 5B, a Ni / Ta film 121 in this example is formed as a plating seed layer by, for example, a sputtering method. The above-mentioned Ta functions as a lowermost adhesion layer for adhering the thermal oxide film 8 and the first buckling body 1 to be formed next. As a material of the lowermost adhesion layer, a metal having good adhesion to SiO ₂ , for example, Cr, Ti, Fe, Nb, etc. may be used other than Ta.

(Iii) Next, as shown in FIG.
A frame pattern 122 for the cross portion 1a (see FIG. 4) of the buckling body 1 is formed. That is, the aluminum film 120
A photoresist is applied thereon, and photolithography is performed, and a portion 122 of the photoresist is formed to a predetermined height above the surface of the aluminum film 120 with a constant pattern width (a height exceeding the nickel plating film described below). ). Subsequently, a nickel plating film is provided thereon by, for example, electroplating, and the seed layer 121 is formed.
First buckling member 1 made of a nickel plating film and having a cross portion 1a between frame patterns 122, 122.
To form For the sake of simplicity, the seed layer is omitted in the figures after the formation of the following plating films.

(Iv) As shown in FIG. 6D, after the photoresist 122 is removed, a silicon oxide film 3 in this example is formed thereon as a first insulating layer by, for example, a sputtering method.
Is formed. As a material of the first insulating layer 3, a heater layer 7
SiO ₂ or SiN is desirable from the viewpoint of adhesion to the material and workability.

(V) Subsequently, a three-layer film 19 composed of the first adhesion layer 5 / heater layer 7 / second adhesion layer 6 is continuously formed on the silicon oxide film 3 by, for example, a sputtering method. . It is desirable to form the three-layer film 19 continuously from the viewpoints of workability and cleanliness. The sputtering conditions are such that a high-frequency power of 1 kW is applied between the anode and the cathode in an Ar atmosphere at a pressure of 8 × 10 ⁻³ Torr.

As a material of the heater layer 7, Ni, W, Ni-Cr, or the like is used from the viewpoint of resistivity and the like. The material of the first and second adhesion layers 5 and 6 is Ti, T
a, Cr, etc. are used. As shown in Tables 1 and 2, the presence of the first and second adhesion layers 5 and 6 can enhance the adhesion between the first and second insulation layers 3 and 4 and the heater layer 7. it can. Further, in this example, since the three-layer film 19 is formed by the sputtering method, the interface between the three layers of the first adhesion layer 5 / the heater layer 7 / the second adhesion layer 6 is generated by the ion impact energy accompanying the sputtering. A chemical reaction can be caused, and the adhesion can be further improved.

When the three-layer film 19 is formed by a method other than the sputtering method, the reaction at each interface between the first adhesion layer 5 / heater layer 7 / second adhesion layer 6 is promoted. For,
It is desirable to perform a predetermined heat treatment during or after film formation. The heat treatment conditions are, for example, a temperature of 200 ° C. in a nitrogen atmosphere,
20 minutes.

(Vi) Subsequently, photolithography and etching are performed to pattern-process the three-layer film 19 collectively. Thus, the heater layer 7 having a U-shaped meandering pattern on the first insulating layer 3 and the heater layer 7
The first and second adhesion layers 5 and 6 having the same pattern as those described above are produced.

(Vii) Next, as shown in FIG. 6E, a silicon oxide film 4 in this example is formed thereon as a second insulating layer by, for example, a sputtering method. As the material of the second insulating layer 4, similarly to the material of the first insulating layer 3, the heater layer 7
SiO ₂ or SiN is desirable from the viewpoint of adhesion to the material and workability. Subsequently, photolithography and etching are performed to collectively pattern the first and second insulating layers 3 and 4 covering the heater layer 7. The pattern of the first and second insulating layers 3 and 4 completely covers the region where the heater layer 7 is present, and is slightly recessed from the slit 40 so that the layer cross section is not exposed to the slit 40. Further, as shown in FIG. 6F, an electrode outlet 160 is formed in the silicon oxide film 4 by performing photolithography and etching.

(Viii) Next, as shown in FIG. 7G, a Ni / Ta film 123 in this example is formed thereon as a plating seed layer by, for example, a sputtering method. T above
“a” functions as an uppermost adhesion layer for adhering the silicon oxide film 4 and the second buckling body 2 to be formed next. As the material for the uppermost adhesion layer, a metal having good adhesion to SiO ₂ , for example, Cr, Ti, Fe, Nb, etc., other than Ta, may be used in the same manner as the material for the lowermost adhesion layer. . At this time, the seed layer 123 for plating is also formed on the aluminum film 120 in the slit 40 (this portion is referred to as 123a).
). Since this portion 123a is unnecessary and hinders a later process, it is removed by photolithography and etching as shown in FIG.

(Ix) Next, as shown in FIG.
A frame pattern 124 for the cross portion 2a (see FIG. 4) of the buckling body 2 is formed. That is, a photoresist is applied on the seed layer 123, photolithography is performed,
A portion 124 of the photoresist fills the slit portion of the first buckling member 1 and has a predetermined pattern width larger than the slit width and a predetermined height above the surface of the seed layer 123 (the nickel plating described below). (Height exceeding the membrane). Here, the reason why the width of the frame pattern 124 for the second buckling body 2 is made wider than the slit width of the first buckling body 1 is to cover misalignment, thermal shrinkage of the photoresist, and the like. This is for making the slit portion of the buckling member 1 communicate with the slit portion of the second buckling member 2. Subsequently, as shown in FIG. 8 (j), a nickel plating film is provided thereon by, for example, electroplating, and is composed of the seed layer 123 and the nickel plating film. Second with 2a
The buckling body 2 is formed.

(X) Next, as shown in FIG. 8 (k), grooves 125, 125 are formed in the nickel plating film 2 by performing photolithography and etching to form a part of the nickel plating film 2. The electrodes 13a and 13b are formed. At this stage, the photoresist 12 shown in FIG.
4 is removed, and the slit 40 is exposed there.

(Xi) Next, as shown in FIG. 8 (l), the sacrifice layer 120 is removed through the slit 40 using an etching solution such as a KOH aqueous solution or a strong alkali developing solution to oxidize the substrate 9. A gap 32 is formed between the silicon film 8 and the first buckling body 1. The gap 32 is formed by using the sacrifice layer 120.
Is formed, the silicon oxide film 8 on the substrate 9 and the first
The distance from the buckling body 1 can be set with high accuracy. As a result, the response speed of the inkjet head can be improved, and high-speed printing can be realized.

(Xii) Finally, as shown in FIG. 1, the nozzle plate 11 is attached via the spacer 10 to the front surface side of the substrate 9 in this state. Thereby, the ink jet head 90 is completed.

Thus, according to this manufacturing method,
It is possible to manufacture the ink jet head 90 that can increase the adhesiveness of the layers constituting the pressure generating member 20, prevent the layers constituting the pressure generating member 20 from peeling off due to thermal stress, and extend the life. .

FIG. 9 shows a modification of the ink jet head 90 viewed obliquely in a disassembled state corresponding to FIG. Note that the reference numerals in the figure are obtained by adding 200 to the reference numbers of the corresponding components in FIG.

This ink jet head is different from the ink jet head 90 in that a coolant circulation hole 216 is provided in the substrate 209 and a diaphragm 250 is attached to the nozzle plate 2211 side of the pressure generating member 220. The other components are the same as those in FIG. 3, and the individual description is omitted.

In this example, a substrate 209 shown in FIG.
Made of a single crystal silicon (Si) substrate. A coolant circulation hole 216 is formed substantially at the center of the substrate 209. The coolant circulation hole 216 is a hole having a rectangular cross section that penetrates the substrate 209, and the dimension (cross-sectional dimension) of each rectangular side of the coolant circulation hole 216 gradually decreases from the back side of the substrate 209 toward the front side. It is set to be. The reason for this is that the facing area between the pressure generating member 220 and the surface of the substrate 209 is not reduced as much as possible when the coolant circulation hole 216 does not exist. As described above, since the pressure generating member 220 and the substrate 209 face each other over a wide area, the pressure generating member 22
The heat of 0 can be efficiently released outside the ink chamber through the substrate 209.

The diaphragm 250 is made of an elastic material such as nickel, and is formed in a substantially disk shape. In the completed state, the center of the diaphragm 250 is the buckling body 30
2 is attached to the central portion 202a. Diaphragm 2
The peripheral portion of 50 is attached to the peripheral portion 202c of the buckling body 302, attached to the substrate 209 together with the peripheral portions of other components of the pressure generating member 220, and supported by the substrate 209. Middle part 250b of diaphragm 250
(A portion between the central portion 250a and the peripheral portion 250c) is separated from the second buckling member 202, and a gap 2 is provided between the second buckling member 202 and the intermediate portion 250b of the diaphragm 250.
33 (see FIG. 15 (r)) are formed. This gap 233
Is a gap 232 between the surface protection film 208 of the substrate 209 and the first buckling body 201 through the slit 240 (FIG. 1).
5 (r)), and further through a refrigerant circulation hole 216 to a refrigerant reservoir (not shown).

In operation, when the pressure generating member 220 is displaced toward the nozzle plate 211 shown in FIG. 9, the ink existing in the gap 231 between the nozzle plate 211 and the pressure generating member 220 generates pressure due to the diaphragm 5. It can be prevented from going around the back side of the member 220. Therefore, the ejection force and ejection speed of the ink can be increased. Note that the pressure generating member 220 is
At the same time, the refrigerant (or ink) existing in the refrigerant reservoir flows into the gap 32 between the substrate 209 and the pressure generating member 220 (the first buckling member 201) through the refrigerant circulation hole 216. Then, it flows into the gap 233 between the second buckling body 202 and the diaphragm 250 through the slit 240. Therefore, the cooling speed of the entire pressure generating member 220 increases. As a result, the pressure generating member 22
The response characteristic of 0 is improved, and high-speed printing is possible.

Next, a method for manufacturing the ink jet head 290 will be described.

FIGS. 10 to 15 show a process of manufacturing the pressure generating member 220 which is a main part of the ink jet head 290. The division diagrams (a), (b),
The left side (X) and right side (Y) of..., (R) correspond to the XX line section and the YY line section in FIG. 9, respectively.

(I) First, as shown in FIG. 10A, silicon oxide films 208, 208 are thermally oxidized to a predetermined thickness (for example, on the front and back surfaces of the silicon substrate 209 at both positions (100)). 1 μm). Then, the substrate 2
A photoresist (not shown) is applied to the rear surface of the substrate 09, and photolithography and dry etching using CHF ₃ are performed to form an opening 208a in the silicon oxide film 208 on the rear surface. Then, etching using potassium hydroxide (KOH) is performed using the oxide film 208 as a mask to form a coolant circulation hole 216 halfway. The reason for forming the coolant circulation hole 216 halfway at this stage is that a small amount of etching is required when the coolant circulation hole 216 is completed in a later step.

(Ii) Next, as shown in FIG. 10B, an aluminum film having a thickness of, for example, 0.1 to 1 μm as a first sacrificial layer is formed on the thermal oxide film 208 on the substrate surface side by, for example, sputtering. A film 320 is formed. Subsequently, photolithography and etching are performed thereon to process the aluminum film 320 into a pattern corresponding to the gap 232 shown in FIG. The distance of the gap 232 is determined according to the thickness of the first sacrificial layer 320.

(Iii) Next, as shown in FIG. 10C, a Ni / Ta film 321 in this example is formed as a plating seed layer by, for example, a sputtering method. The above-mentioned Ta functions as a lowermost adhesion layer for adhering the thermal oxide film 208 and the first buckling member 201 to be formed next. As a material of the lowermost adhesion layer, a metal having good adhesion to SiO ₂ , for example, Cr, Ti, Fe, Nb, etc. may be used other than Ta.

(Iv) Next, as shown in FIG. 11D, a frame pattern 322 for the cross portion of the first buckling member 201 is formed. That is, a photoresist is applied on the aluminum film 320 and photolithography is performed, and a portion 322 of the photoresist is formed at a predetermined height from the surface of the aluminum film 320 with a fixed pattern width (the nickel plating described below). (Height exceeding the membrane). Subsequently, a nickel plating film is provided thereon by, for example, electroplating, and is composed of the seed layer 321 and the nickel plating film.
A first buckling member 201 having a cross portion 201a between the first and second ridges 22 is formed. For the sake of simplicity, the seed layer is omitted in the figures after the formation of the following plating films.

(V) As shown in FIG. 11E, after removing the photoresist 322, a silicon oxide film 203 in this example is formed thereon as a first insulating layer by, for example, a sputtering method. As a material of the first insulating layer 203,
From the viewpoint of adhesion and workability with the material of the heater layer 207,
SiO ₂ or SiN is desirable.

(Vi) Subsequently, the silicon oxide film 203
A three-layer film 219 composed of the adhesion layer 205 / the heater layer 207 / the adhesion layer 206 is continuously formed thereon by, for example, a sputtering method. It is desirable to form the three-layer film 219 continuously from the viewpoints of workability and cleanliness. The sputtering conditions are such that a high-frequency power of 1 kW is applied between the anode and the cathode in an Ar atmosphere at a pressure of 8 × 10 ⁻³ Torr.

As a material of the heater layer 207, Ni, W, Ni—Cr, or the like is used from the viewpoint of resistivity and the like.
The first and second adhesion layers 205 and 206 are made of Ti, Ta, Cr, or the like. As shown in Tables 1 and 2, due to the presence of the first and second adhesion layers 205 and 206, the first and second insulating layers 203 and 204 and the heater layer 207 are provided.
Can be improved. Further, in this example, since the three-layer film 219 is formed by the sputtering method, a chemical reaction occurs at each interface between the three layers of the adhesion layer 205 / the heater layer 207 / the adhesion layer 206 due to the ion impact energy accompanying the sputtering. And the adhesion can be further improved.

When the three-layer film 219 is formed by a method other than the sputtering method, the adhesion layer 205 / heater layer 7 /
In order to promote a reaction at each interface between the three layers of the second adhesion layer 6, it is preferable to perform a predetermined heat treatment during or after film formation. The heat treatment condition is, for example, a temperature of 200 in a nitrogen atmosphere.
C. for 20 minutes.

(Vii) Subsequently, photolithography and etching are performed to collectively pattern the three-layer film 219. Thus, a heater layer 207 having a U-shaped meandering pattern and first and second adhesion layers 205 and 206 having the same pattern as the heater layer 207 are formed on the first insulating layer 203.

(Viii) Next, as shown in FIG.
On this, a silicon oxide film 204 in this example is formed as a second insulating layer by, for example, a sputtering method. Like the material of the first insulating layer 203, the material of the second insulating layer 204 is preferably SiO ₂ or SiN from the viewpoint of adhesion to the material of the heater layer 207 and workability. Subsequently, photolithography and etching are performed to form the heater layer 2.
The first and second insulating layers 203 and 204 covering the layer 07 are collectively patterned. The first and second insulating layers 20
The patterns 3 and 204 completely cover the region where the heater layer 207 is present, and are slightly recessed from the slit 240 so that the layer cross section is not exposed to the slit 240. Further, as shown in FIG. 12 (g), photolithography and etching are performed to form the silicon oxide film 204.
An electrode outlet 360 is formed in the substrate.

(Ix) Next, as shown in FIG. 12 (h), a Ni / Ta film 323 in this example is formed thereon as a plating seed layer by, for example, a sputtering method. T above
“a” functions as an uppermost adhesion layer for adhering the silicon oxide film 204 and the second buckling body 202 to be formed next. In addition,
As the material of the uppermost adhesion layer, similarly to the material of the lowermost adhesion layer, other than Ta, a metal having good adhesion to SiO ₂ , for example, Cr, Ti, Fe, Nb, or the like may be used.
At this time, the seed layer 323 for plating is also formed on the aluminum film 320 in the slit 340 (the portion is indicated by 323a). Since the portion 323a is unnecessary and obstructs in a later process, it is removed by performing photolithography and etching as shown in FIG.

(X) Next, as shown in FIG. 13 (j), a frame pattern 324 for the cross portion 202a (see FIG. 9) of the second buckling body 202 is formed. That is, the seed layer 3
23, a photoresist is applied, photolithography is performed, and a part 324 of the photoresist is filled in the slit portion of the first buckling member 201, and the seed layer 323 is formed with a constant pattern width wider than the slit width. Is formed to protrude upward from the surface by a predetermined height (a height exceeding a nickel plating film described below). Here, the second buckling body 2
02 for the first buckling body 20
The reason for making the slit width wider than 1 is that the slit portion of the first buckling member 201 and the slit portion of the second buckling member 202 communicate with each other in order to cover misalignment and thermal contraction of the photoresist. It is. Subsequently, FIG.
As shown in FIG. 5, a nickel plating film is provided thereon by, for example, electroplating, and is formed of the seed layer 323 and the nickel plating film.
4 to form a second buckling body 202 having a cross portion 202a.

(Xi) Next, as shown in FIG. 13 (l), an aluminum film 325 in this example is formed thereon as a second sacrificial layer by, for example, a sputtering method. Subsequently, photolithography is performed, and etching is performed using a potassium hydroxide solution as an etching solution to process the aluminum film 325 into a pattern corresponding to the gap 233 shown in FIG. The distance of the gap 233 is determined according to the thickness of the second sacrificial layer 325.

(Xii) Next, as shown in FIG. 14 (m), a nickel film 326 is formed thereon as a plating seed layer by, for example, a sputtering method. Subsequently, FIG.
As shown in (n), a nickel plating film 325 is formed by an electrolytic plating method. The seed layer 326 and the nickel plating film 325 are the material of the diaphragm 250 shown in FIG.

(Xiii) Next, as shown in FIG.
The substrate 209 in this state is immersed in a potassium hydroxide solution,
The silicon substrate 209 is etched using the nickel film 325 on the front surface of the substrate and the thermal oxide film 208 on the rear surface of the substrate as masks. Thereby, the coolant circulation hole 216 penetrating from the back surface to the front surface of the substrate 209 is completed. The etching stops at the surface protection film 208 of the substrate 209.

(Xiv) Next, as shown in FIG. 15 (p), grooves 328 and 328 are formed in the nickel plating films 302 and 327 by photolithography and etching, and the nickel plating films 302 and 327 are formed. The electrodes 213a and 213b are formed, and the diaphragm 250 is patterned.

(Xv) Next, as shown in FIG. 15 (q), etching is performed to remove the thermal oxide film 208 on the back surface of the substrate, thereby forming an opening 329. Subsequently, as shown in FIG. 15 (r), using an etching solution such as a potassium hydroxide solution or an alkali developing solution, an aluminum film 320 as a first sacrifice layer, a resist 324, and a second sacrifice layer as a sacrifice layer. The aluminum film 325 is removed by etching. Thereby, a gap 232 is formed between the surface protection film 6 of the substrate 7 and the first buckling member 201, and a gap 233 is formed between the first buckling member 201 and the diaphragm 250 through the slit 240. .

(Xvi) First and second sacrificial layers 320 and 325
Is used to form the gaps 232 and 233, so that the pressure generating member 220 can be manufactured with high accuracy. Further, the silicon oxide film 208 of the substrate 209 and the first buckling body 2
01 can be accurately set. This improves the response speed of the inkjet head,
High-speed printing can be realized.

(Xvii) Finally, the nozzle plate 211 is mounted on the surface of the substrate 209 in this state via the spacer 210 shown in FIG. Thus, the inkjet head 290 is completed.

As described above, according to this manufacturing method,
It is possible to manufacture the ink jet head 290 capable of increasing the adhesiveness of the layers constituting the pressure generating member 220, preventing the layers constituting the pressure generating member 220 from peeling off due to thermal stress, and extending the life. .

[0082]

As apparent from the above description, the ink jet head according to the first aspect of the present invention is provided with a first adhesion layer for adhering these layers between the first insulating layer and the heater layer. Since the second adhesion layer for adhering these layers is provided between the insulating layer and the heater layer, the first and second insulating layers and the heater layer are separated by the heat generated by the heater layer during the operation of the inkjet head. Even if a thermal stress is applied between the first and second insulating layers, the separation between the first and second insulating layers and the heater layer can be effectively prevented. Therefore, the reliability of the inkjet head can be improved, and the life can be extended.

In the ink jet head according to the second aspect, since the first and second insulating layers and the first and second adhesion layers are bonded to each other by a chemical reaction at the interfaces, the first and second insulating layers are bonded. No separation occurs between the insulating layer and the first and second adhesion layers. Therefore, the reliability of the ink jet head can be further improved, and the life can be further extended.

In the ink jet head according to the third aspect, when the pressure generating member is displaced toward the nozzle plate during operation, the ink in the ink chamber goes around the back side of the pressure generating member through the slit penetrating the pressure generating member. The cooling rate of the first buckling member is increased. As a result, the response characteristics of the pressure generating member can be improved, and high-speed printing can be realized.

In the ink jet head according to the fourth aspect, the refrigerant can be circulated to the first buckling member side of the pressure generating member through the refrigerant circulation hole penetrating the substrate during operation. The body cools faster. As a result, the response characteristics of the pressure generating member can be improved, and high-speed printing can be realized. Also, thanks to the diaphragm,
Since the ink present in the gap between the nozzle plate and the pressure generating member (diaphragm) is prevented from sneaking into the back side of the pressure generating member (diaphragm) during operation, the ejection force and the ejection speed of the ink can be increased. .

In the method for manufacturing an ink jet head according to the fifth aspect, the first adhesion layer is formed by the first insulating layer constituting the first insulating layer.
Since the metal element having a property of being more easily combined with oxygen than the element is formed as a material, the first insulating layer and the first adhesion layer are easily bonded at the interface by a chemical reaction. That is, the metal element which is the material of the first adhesion layer at the interface is
An oxide is combined with oxygen in the first insulating layer. Therefore, separation does not occur between the first insulating layer and the first adhesion layer. Similarly, the second adhesion layer is formed of a metal element having a property of being more easily combined with oxygen than the second element forming the second insulating layer, so that the second insulating layer and the second The metal element that is the material of the second adhesion layer at the interface with the adhesion layer is combined with oxygen of the second insulating layer to form an oxide. Therefore, separation does not occur between the second insulating layer and the second adhesion layer. In addition, since the first adhesion layer, the heater layer, and the second adhesion layer are all formed using metal elements as materials, by appropriately selecting the types of these metal elements, the adhesion between these layers can be improved. Is kept good. Therefore, according to this manufacturing method,
The layer constituting the pressure generating member can be effectively prevented from peeling off due to thermal stress, and a long-life inkjet head can be manufactured.

According to the method of manufacturing an ink jet head of claim 6, a chemical reaction is caused at each interface between the first adhesion layer, the heater layer and the second adhesion layer by the ion impact energy accompanying the sputtering. be able to. Therefore, the adhesion between the layers constituting the pressure generating member can be further increased, and the life of the inkjet head can be extended.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view schematically showing an overall configuration of an inkjet head according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating the operation of the inkjet head.

FIG. 3 is a perspective view showing the inkjet head in an exploded state.

FIG. 4 is a perspective view schematically showing layers constituting a pressure generating member in FIG. 3;

FIG. 5 is a process sectional view of the inkjet head.

FIG. 6 is a process diagram illustrating a method for manufacturing the inkjet head.

FIG. 7 is a process chart illustrating a method for manufacturing the ink jet head.

FIG. 8 is a process chart illustrating a method for manufacturing the ink jet head.

FIG. 9 is a perspective view showing an ink jet head according to another embodiment of the present invention in an exploded state.

FIG. 10 is a process chart illustrating a method for manufacturing the ink jet head.

FIG. 11 is a process diagram illustrating a method for manufacturing the ink jet head.

FIG. 12 is a process chart illustrating a method for manufacturing the ink jet head.

FIG. 13 is a process chart illustrating a method for manufacturing the ink jet head.

FIG. 14 is a process chart illustrating a method for manufacturing the ink jet head.

FIG. 15 is a process chart illustrating a method for manufacturing the ink jet head.

FIG. 16 is a cross-sectional view illustrating a conventional inkjet head.

[Explanation of symbols]

 1,201 First buckling body 2,202 Second buckling body 3,203 First insulating layer 4,204 Second insulating layer 5,205 First adhesion layer 6,206 Second adhesion layer 7,207 Heater layer 9 , 209 Single crystal silicon substrate 10 Spacer 11 Nozzle plate 250 Diaphragm

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Susumu Hirata 22-22 Nagaikecho, Abeno-ku, Osaka-shi, Osaka Inside Sharp Corporation (72) Inventor Shoji Kimura 22-22 Nagaikecho, Abeno-ku, Osaka-shi, Osaka Sharp Corporation (72) Inventor Horinaka Dai 22-22 Nagaikecho, Abeno-ku, Osaka City, Osaka Sharp Corporation (72) Inventor Shingo 22-22 Nagaikecho, Abeno-ku, Osaka City, Osaka Sharp Corporation (72) Invention Person Onda Hiroshi 22-22 Nagaikecho, Abeno-ku, Osaka City, Osaka Prefecture Inside Sharp Corporation (56) References JP-A-7-125203 (JP, A) JP-A 8-142323 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) B41J 2/045 B41J 2/055 B41J 2/16

Claims (6)

(57) [Claims] An ink chamber including a nozzle plate having a nozzle opening and a substrate facing the nozzle plate in a part of a peripheral wall, and a pressure generating member provided in the ink chamber and facing the nozzle plate, An ink jet head that generates pressure in the ink chamber by deformation of the pressure generating member and discharges the ink liquid in the ink chamber to the outside of the chamber through the nozzle opening, wherein the pressure generating member has corrosion resistance to the ink. The peripheral edge portion is attached to the substrate at both ends in at least one direction, and is in a non-displacement state having substantially no thermal stress, and a buckling buckled by thermal expansion. A first and a second buckling member capable of taking a state, and a first buckling member provided between the first buckling member and the second buckling member along the two buckling members. And a second insulating layer; a heater layer provided between the first insulating layer and the second insulating layer along the two insulating layers and generating heat when energized; A first adhesive layer provided between the heater layer and the first insulating layer and the heater layer, and provided between the second insulating layer and the heater layer; 2. An ink jet head comprising: a second insulating layer for adhering the second insulating layer and the heater layer. 2. The ink jet head according to claim 1, wherein the first and second insulating layers and the first and second adhesion layers are respectively bonded at interfaces at a chemical reaction. Inkjet head. 3. The ink jet head according to claim 1, wherein the heater layer is formed in a belt-like pattern, and is located inside a peripheral portion of the first and second buckling members of the pressure generating member. An ink jet head, wherein a slit penetrating from the first buckling member to the second buckling member is provided in a portion where the pattern of the heater layer does not exist. 4. The ink jet head according to claim 1, wherein the pressure generating member is made of a substantially plate-like flexible material, and the second pressure generating member is provided on a side facing the nozzle plate. A diaphragm provided along the buckling body of the second buckling body and attached to the peripheral part and the central part of the second buckling body, respectively. An ink jet head having a refrigerant circulation hole facing a portion of the pressure generating member that is located inside the peripheral portion of the first buckling member. 5. A method for manufacturing an ink jet head according to claim 1, further comprising: forming a first buckling layer on a surface of a substrate; The first insulating layer made of an oxide, the first adhesion layer, the heater layer, the second adhesion layer, and the second insulation layer made of an oxide of a second element; In the method for manufacturing an ink-jet head in which layers to be formed as the second buckling members are sequentially stacked, after forming a first insulating layer made of an oxide of the first element, the first adhesion layer is formed by: The first layer constituting the first insulating layer
Forming a metal element having a property of being more easily combined with oxygen than the element described above, forming the heater layer using a metal element as a material, forming the second adhesion layer as the second insulating layer Second
A method of forming a metal element having a property of being more easily combined with oxygen than an element of (a) as a material, and subsequently forming a second insulating layer made of an oxide of the second element. . 6. The ink-jet head manufacturing method according to claim 5, wherein the first contact layer, the heater layer, and the second contact layer are continuously formed by a sputtering method. Head manufacturing method.