JP3147873B2 - Semiconductor manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a CVD (Chemical Vapor Deposition) method for supplying a vaporized liquid material to a semiconductor substrate to cause a vapor phase growth accompanied by a chemical reaction in a reaction chamber. Chemical Vapor Depositio
The present invention relates to a semiconductor manufacturing apparatus for performing n).

[0002]

2. Description of the Related Art A canister tank used in a conventional semiconductor manufacturing apparatus for vaporizing a liquid material and supplying it to a reaction chamber is:
The one shown in FIG. 4 is known. In the figure,
The canister tank is a tank frame 1 with an open top.
A tank cover 3 attached to the tank frame 1 with an O-ring 2 while maintaining airtightness, and a pressurized gas introduction unit 4 attached through the tank cover 3.
And a liquid material discharge portion 5 having an open end near the bottom of the tank frame 1 is attached through the tank cover 3.

[0003] The canister tank constructed as described above fills the inside of the tank frame 1 with the liquid material 6, and then enters the pressurized space 7 formed by the tank frame 1 and the tank cover 3 from the pressurized gas introducing section 4. An inert gas such as He, Ar, or N ₂ is supplied. When the pressurized space 7 is pressurized by the inert gas, the liquid material 6 is discharged from the liquid material discharge unit 5.

FIG. 5 is a sectional view showing another example of a canister tank used in a conventional semiconductor manufacturing apparatus. Here, the canister tank has a tank frame 1 having an open upper end, a tank cover 3 attached to the tank frame 1 while maintaining airtightness by an O-ring 2, and a pressurization attached through the tank cover 3. It has a gas inlet 4 and a liquid material outlet 5 attached through the tank frame 1. A piston 9 airtightly held by an O-ring 8 is slidably disposed inside the tank frame 1.

In the canister tank configured as described above, a working gas is introduced from a pressurized gas introduction unit 4 into a pressurized space 7 formed between the inside of the tank cover 3 and the upper surface of the piston 9. Then, the piston 9 descends, and the liquid material 6 in the tank frame 1 is discharged from the liquid material discharge unit 5.

[0006]

However, each of the above-described conventional semiconductor manufacturing apparatuses using a canister tank has a problem. That is, in the canister tank shown in FIG. 4, since the liquid material 6 is directly pressurized with the inert gas, the gas and impurities in the gas are dissolved in the liquid material, and the high purity of the liquid material 6 cannot be maintained. There was a problem. When the purity of the liquid material is reduced, there is a problem that the quality of a film formed on a semiconductor substrate to be manufactured is abnormal. The second problem is that the He, A
This is because inert gases such as r and N ₂ are expensive and costly.

In the canister tank used in the conventional semiconductor manufacturing apparatus shown in FIG. 5, since the piston 9 slides on the inner peripheral surface of the tank frame 1, the liquid material 6 is worn by the abrasion and the pressurized space 7 is removed. In some cases.
Further, the pressurized gas dissolves in the liquid material 6 and the liquid material 6
However, there was a disadvantage that the high purity of the compound could not be maintained. Furthermore,
There is the disadvantage that the worn pieces of the O-ring 8 of the piston 9 melt into the liquid material 6 and reduce the purity of the liquid material. Further, as shown in Japanese Patent Application Laid-Open No. 7-249615, there is a type in which a bellows is filled with a liquid material. However, when the tank is replaced with a vacuum, the old liquid deteriorated between the bellows folds and folds. However, there was a defect that high purity could not be maintained. In addition, there is a disadvantage in that the direction in which the liquid material projects is limited, and the degree of freedom in design is limited.

An object of the present invention is to improve the above-mentioned disadvantages of the prior art, to provide a semiconductor manufacturing apparatus having a canister tank which maintains high purity of a liquid material and does not require an expensive inert gas. Things.

[0009]

In order to achieve the above-mentioned object, the present invention employs the following basic technical structure. That is, as an embodiment according to the present invention,
Liquid material stored in the nysta tank is vaporized from the outlet
After supplying to the device and vaporizing by the vaporizing device, the reaction
Semiconductors that supply film to the chamber and form a coating on the surface of the semiconductor substrate
In a manufacturing apparatus, the semiconductor manufacturing apparatus stores a liquid material.
And a tank frame for storage
A pressure-feed bellows part that is attached in an airtight
Facing the inner surface of the bellows,
And a tank cover forming a pressurized space between
A pressure introducing section for supplying a working fluid to the space;
Between the outer part of the closed part and the tank frame.
Liquid material responds to the displacement of the pumping bellows section.
Liquid material discharge section discharged from inside the tank frame section
Semiconductor manufacturing with a canister tank composed of
Device .

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to solve the above-mentioned problems in the prior art, a semiconductor manufacturing apparatus according to the present invention has a pressure-feeding bellows section mounted in an airtight manner in a tank frame section for storing a liquid material. A canister for supplying a working fluid from the pressurized space above the pressure-feeding bellows portion to the inside of the bellows, pressurizing the liquid material using the outer surface of the bellows, and discharging the pressurized liquid material from the tank frame portion. Since the tank is provided, the working fluid can be supplied to the reaction chamber without directly contacting the liquid material.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor manufacturing apparatus according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a sectional view showing a first embodiment of a canister tank used in a semiconductor manufacturing apparatus according to the present invention. As is apparent from the figure, as a first specific example of the semiconductor manufacturing apparatus according to the present invention, the liquid material contained in the canister tank was supplied to the vaporizer from the outlet, and vaporized by the vaporizer. Later, in a semiconductor manufacturing apparatus for supplying a reaction chamber and forming a film on a surface of a semiconductor substrate, the semiconductor manufacturing apparatus includes a tank frame portion for storing a liquid material, and a pressure-feeding bellows attached to the tank frame in an airtight state. Unit, a tank cover that forms a pressurized space above the pressure-feeding bellows unit, a pressurizing introduction unit that supplies a working fluid to the pressurized space, and a liquid material discharge that discharges the pressurized liquid material from inside the tank frame unit. And a canister tank including a canister.

That is, the canister tank used in the semiconductor manufacturing apparatus of the present invention includes a tank frame section 10 for storing the liquid material 6, a pressure-feeding bellows section 11 attached to the tank frame 10 in an airtight state, and Tank cover 1 forming pressurized space 12 on pressure-feeding bellows 11
3 and a pressurizing introduction unit 1 for supplying a working fluid to the pressurizing space 12
4 and a liquid material discharging portion 15 for discharging the pressurized liquid material 6 from the inside of the tank frame portion 10.

The tank frame 10 has a cylindrical shape with an open upper end, and is made of stainless steel (SUS304, 316, etc.) in consideration of corrosion resistance, heat resistance, and chemical resistance. Also, on the periphery of the upper end of the tank frame portion 10,
A flange 10a is formed. A first O-ring groove 16 and a second O-ring groove 17 are provided on the upper surface of the flange 10a.
Are formed substantially concentrically. In the first O-ring groove 16 and the second O-ring groove 17, the O-ring 1
8, 19 are provided.

Further, a liquid material discharge section 15 is formed at an appropriate position of the tank frame section 10. The liquid material discharge part 15 is attached near the lower end of the tank,
A valve 15a is provided. With this valve 15a, it is possible to open and close the conduit of the discharge section. Here, the liquid material discharge portion 15 can be attached not only to the lower end portion of the canister tank but also to other portions.

The pressure-feeding bellows portion 11 includes a bellows 11a, a mounting flange plate 11b, a bottom plate 11c, and the like. The mounting flange plate 11b is placed on the flange 10a of the tank frame portion 10 and is fixed by fixing fittings such as bolts and clamps. The O-ring 19 maintains the airtightness. Bellows 11a
Is deformed when pressure is applied, it has corrosion resistance, heat resistance,
It is formed of a member having chemical resistance. The bottom plate 11
It is attached to the bottom of the bellows 11a, and moves up and down with expansion and contraction of the bellows 11a. Further, like the bellows, it is formed of a member having corrosion resistance, heat resistance, and chemical resistance.

Further, a tank cover 13 is fixed on the pressure-feeding bellows portion 11 with a bolt, a clamp, or the like via an O-ring 18 to form a pressurizing space 12. Therefore, the pressurized gas supplied to the pressurized space 12 through the pressurizing introduction unit 14 presses only the bellows 11a without leaking to the outside.

The pressurizing introduction section 14 includes an operation valve 14 a and supplies a pressurized gas into the pressurizing space 12 through the tank cover 13.

Next, the operation of the canister tank configured as described above will be described. First, in the canister tank, the operation valve 14a of the pressurization introduction unit 14 and the valve of the liquid material discharge unit 15 are closed, and the pressure P1
And the pressure P2 of the liquid material 6 are in an equilibrium state (P1 =
P2).

When the liquid material 6 is supplied to the reaction chamber of the semiconductor manufacturing apparatus, the pressure introducing section 14 supplies the working pressure P3 in the reaction chamber of the semiconductor manufacturing apparatus, the pressure P1 in the pressurized space, and the pressure of the liquid material. Assuming that P2, a pressurized gas pipe capable of introducing a gas having a constant pressure P0 higher than the pressure P2 of the liquid material is attached (P0 ≧ P1 = P2 ≧ P3). Further, a liquid material supply pipe connected to a process gas control unit of the semiconductor manufacturing apparatus is attached to the liquid material discharge unit 15.

After connecting the pressurized gas pipe and the liquid material supply pipe to the canister tank, the liquid material supply pipe line is suctioned by a vacuum pump to remove gas from the pipe (P0 ≧
P1 = P2> P3). Next, the operating valve 1 of the pressurizing introduction section 14
4 a is opened, and a pressurized gas is introduced into the pressurized space 12. Then, the pressurized gas is introduced into the pressurized space 12, and the pressure P0 of the pressurized gas, the pressurized space P1, the pressure P2 of the liquid material, the liquid material discharge unit 15 side (the process gas control side of the semiconductor manufacturing apparatus). The pressure-feeding bellows portion 11 expands such that the relationship with the pressure P3 satisfies P0 = P1 = P2> P3.

Next, the liquid material 6 is pressure-fed by opening the valve of the liquid material discharge section 15 (P1> P2 = P3).
When the semiconductor manufacturing apparatus does not consume the liquid material 6, the pressure on the OUT side of the liquid material discharge unit 15 does not decrease.
0 = P1 = P2 = P3, and the liquid material 6 is not pumped. When the semiconductor manufacturing apparatus consumes the liquid material 6, the pressure relationship is P0 = P1> P2 = P3, and the pumping pressure P0
The liquid material 6 continues to be pressure-fed to the reaction chamber of the semiconductor manufacturing apparatus due to the difference between the pressure P3 and the OUT-side pressure P3 of the liquid material discharge unit 15.

When the pumping of the liquid material 6 is stopped to replace the canister tank, the use of the liquid material 6 in the semiconductor manufacturing apparatus is stopped. Next, the valve of the liquid material discharge section 15 is closed, and the operation valve 14a of the pressurization introduction section 14 is closed. afterwards,
The liquid supply pipe connected to the process gas control unit of the semiconductor manufacturing apparatus and the pressurized gas pipe connected to the pressurization introduction unit 14 are evacuated from the semiconductor manufacturing apparatus and the like. Next, purging is performed with a purge gas such as N ₂ . By repeatedly evacuating and purging, the liquid material 6 and the pressurized gas are extracted from the piping,
After filling the purge gas, the connection between the pressurizing introduction unit 14 and the liquid material discharge unit 15 is disconnected. In this way, the canister tank can be replaced.

As described above, in the semiconductor manufacturing apparatus of the present invention,
Since the pressurized gas does not directly touch the liquid material 6, the gas and impurities in the gas do not dissolve into the liquid material.
Therefore, the purity of the liquid material can be kept high,
It does not affect the film on the surface of the semiconductor substrate to be manufactured. Moreover, it is not necessary to use an expensive inert gas, and ordinary air (dry air), water, oil or the like can be used.

FIG. 2 is a schematic configuration diagram showing the entire configuration of the semiconductor manufacturing apparatus of the present invention. Here, the semiconductor manufacturing apparatus detects the canister tank 24 that discharges the liquid material from the liquid material discharge unit 15 by the pressurized gas supplied from the pressurization introduction unit 14 and the flow rate of the liquid material discharged from the canister tank 24. A liquid flow controller 22, a vaporizer 25 for vaporizing the supplied liquid material, and a processing chamber 26 for forming a film on the semiconductor substrate surface with the vaporized liquid material.
And a vacuum pump 27 for sucking gas in the piping.

In such a semiconductor manufacturing apparatus, the processing chamber 2 is maintained while maintaining the high purity which is almost the same as when the liquid material filled in the canister tank 24 is filled by the manufacturer.
6 is important.

FIG. 3 is a sectional view showing a second embodiment of the canister tank used in the semiconductor manufacturing apparatus of the present invention. In this embodiment, a check valve 20 is provided in a part of the pressurizing introduction part 14 and a pressure reducing valve 21, a liquid flow controller 22 and a check valve 23 are provided in a part of the liquid material discharge part 15. I have. Further, the liquid flow controller 22 is not limited to one stage, and may be arranged in a two-stage configuration.

In the case of the above configuration, when pulsation by a vacuum pump or the like or a temperature gradient due to an endothermic reaction occurs, backflow of the liquid material into the canister tank can be prevented. Liquid material with reduced purity in the piping does not flow into the canister tank.

The present invention is not limited to the above-described embodiment, and various design changes can be made based on the technical concept of the present invention.

[0029]

The first effect is that there is no possibility that the pressurized gas (pressurized fluid) dissolves in the liquid material, and it is possible to prevent the purity of the liquid material from lowering. The reason is that there is no direct contact between the liquid material and the pressurized gas. Also, high purity can be maintained without leaving old liquid deteriorated when the tank is replaced.

The second effect is that leakage of the liquid material into the pressurized space can be prevented. The reason is that there is no sliding portion in the portion where the liquid material is pressed. The third effect is that there is no need to use expensive inert gas such as He, Ar, or N ₂ as the pressurized fluid, and it is economical. The reason is that there is no direct contact between the liquid material and the pressurized gas. Also, the discharge direction of the liquid material is not limited,
Large degree of freedom in equipment design.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of a canister tank used in a semiconductor manufacturing apparatus of the present invention.

FIG. 2 is a schematic configuration diagram showing an overall configuration of a semiconductor manufacturing apparatus of the present invention.

FIG. 3 is a sectional view showing a second embodiment of the canister tank used in the semiconductor manufacturing apparatus of the present invention.

FIG. 4 is a longitudinal sectional view showing an example of a canister tank used in a conventional semiconductor manufacturing apparatus.

FIG. 5 is a longitudinal sectional view showing another example of a canister tank used in a conventional semiconductor manufacturing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tank frame 2 O-ring 3 Tank cover 4 Pressurized gas introduction part 5 Liquid material discharge part 6 Liquid material 7 Pressurized space 8 O-ring 9 Piston 10 Tank frame part 10a Flange 11 Pressure bellows part 11a Bellows 11b Mounting flange plate 11c Bottom plate DESCRIPTION OF SYMBOLS 12 Pressurized space 13 Tank cover 14 Pressurized introduction part 14a Operation valve 15 Liquid material discharge part 16 First O-ring groove 17 Second O-ring groove 18 O-ring 19 O-ring 20 Check valve 21 Pressure reducing valve 22 Liquid flow rate Controller 23 Check valve 24 Canister tank 25 Vaporizer 26 Processing chamber 27 Vacuum pump

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/31 H01L 21/205

Claims (7)

(57) [Claims] 1. A semiconductor manufacturing apparatus for supplying a liquid material contained in a canister tank to a vaporizer through an outlet, vaporizing the liquid material through the vaporizer, supplying the vaporized material to a reaction chamber, and forming a film on the surface of a semiconductor substrate. In the semiconductor manufacturing apparatus, a tank frame for storing a liquid material,
And pumping the bellows portion mounted airtightly to the tank frame, facing the inner surface of the pumping bellows portion, the pumping
Tank that forms a pressurized space between the bellows and the inner surface
Pressurization for supplying working fluid to the cover and the pressurized space
Part, the outer part of the pumping bellows part and the tank frame
The liquid material held between the bellows
Discharged from the tank frame in response to the displacement of the
And a liquid material discharge section
A semiconductor manufacturing apparatus comprising: 2. The semiconductor manufacturing apparatus according to claim 1, wherein said pressure-feeding bellows portion is fixed to a part of a canister tank by a mounting flange plate. 3. The semiconductor manufacturing apparatus according to claim 1, wherein said pressure-feeding bellows portion has a bottom plate at a bottom portion. 4. The semiconductor manufacturing apparatus according to claim 1, wherein a check valve is provided in said pressurizing introduction section. 5. The semiconductor manufacturing apparatus according to claim 1, wherein a pressure reducing valve is provided in the liquid material discharge section. 6. The semiconductor manufacturing apparatus according to claim 1, wherein said canister tank is made of a corrosion-resistant material. 7. The semiconductor manufacturing apparatus according to claim 1, wherein said tank frame is made of stainless steel.