JP3139441B2 - Electron beam drawing equipment - Google Patents

Electron beam drawing equipment

Info

Publication number
JP3139441B2
JP3139441B2 JP10018541A JP1854198A JP3139441B2 JP 3139441 B2 JP3139441 B2 JP 3139441B2 JP 10018541 A JP10018541 A JP 10018541A JP 1854198 A JP1854198 A JP 1854198A JP 3139441 B2 JP3139441 B2 JP 3139441B2
Authority
JP
Japan
Prior art keywords
deflector
deflection
aperture plate
electron beam
aperture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP10018541A
Other languages
Japanese (ja)
Other versions
JPH10209043A (en
Inventor
康成 早田
秀男 戸所
博之 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10018541A priority Critical patent/JP3139441B2/en
Publication of JPH10209043A publication Critical patent/JPH10209043A/en
Application granted granted Critical
Publication of JP3139441B2 publication Critical patent/JP3139441B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】電子線描画装置に係わり、特に複
雑な図形のアパーチャーを用いる一括露光方式の電子線
描画装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electron beam lithography apparatus, and more particularly to a batch exposure type electron beam lithography apparatus using an aperture of a complicated figure.

【0002】[0002]

【従来の技術】従来は複雑な図形のアパーチャーは坂本
等が特開昭平2−122518号公報で述べているよう
に複数の電磁偏向器を用いて電子ビームを照射してい
た。
2. Description of the Related Art Conventionally, an aperture of a complicated figure has been irradiated with an electron beam by using a plurality of electromagnetic deflectors as described by Sakamoto et al. In Japanese Patent Application Laid-Open No. 2-122518.

【0003】[0003]

【発明が解決しようとする課題】しかし上記の方法では
電磁偏向を用いるために偏向に時間を要する。従って種
々の図形を用いて描画する場合はこの偏向が律速となり
スループットが低下してしまう。また、特開昭59−1
69131号公報に一つの電磁偏向器と一つの静電偏向
器の組み合わせについて開示されてるものの偏向中心を
一致させること及び高速偏向については何等触れておら
ず電子軌道が複雑であった。
However, in the above method, since electromagnetic deflection is used, time is required for deflection. Therefore, when drawing is performed using various figures, the deflection is rate-limiting and the throughput is reduced. Also, Japanese Unexamined Patent Publication No.
No. 69131 discloses a combination of one electromagnetic deflector and one electrostatic deflector, but does not mention anything about matching the deflection center and high-speed deflection, and the electron trajectory is complicated.

【0004】[0004]

【課題を解決するための手段】成形偏向用の静電偏向器
と図形選択用の静電偏向器を設ける。さらに両者の偏向
中心を一致させる為に例えば図1に示す分割した静電偏
向器構造を採用する。
An electrostatic deflector for shaping deflection and an electrostatic deflector for selecting figures are provided. Further, for example, a divided electrostatic deflector structure shown in FIG.

【0005】[0005]

【作用】可変成形用の偏向器は高速度動作が要求される
ために低電圧で動作することが要求され、余り偏向量を
大きく出来ない。しかし高電圧の静電偏向器を用いれば
可変成形用の偏向器より遅くとも電磁偏向器よりは高速
で電磁偏向器並の偏向量を得ることが可能である。また
両者の偏向中心を一致させれば実質的に1つの偏向器で
偏向したこととなり電子軌道の制御が簡単になる。静電
偏向器は重ねて使用することが出来ないため、図1に示
すように片方の偏向器(この場合は図形選択用偏向器
2)を2分割して配置することにより偏向中心を一致さ
せれば良い。また、2分割した偏向器においては後段の
偏向板上での電子の離軸が大きくなる。これにより発生
する偏向歪を低減するためには2分割した偏向器の偏向
板の間隔を中央の偏向器の偏向板の間隔より大きくする
ことが有効である。
The deflector for variable shaping is required to operate at a low voltage because of high speed operation, and the deflection amount cannot be increased too much. However, if a high-voltage electrostatic deflector is used, it is possible to obtain a deflection amount equivalent to that of an electromagnetic deflector at a speed higher than that of an electromagnetic deflector, at the latest, even more slowly than a deflector for variable shaping. In addition, if the deflection centers of the two coincide, the deflection is substantially performed by one deflector, and the control of the electron trajectory is simplified. Since the electrostatic deflectors cannot be used in an overlapping manner, as shown in FIG. 1, one of the deflectors (in this case, the deflector 2 for figure selection) is divided into two parts so that the deflection centers are matched. Just do it. In the deflector divided into two, the off-axis of the electrons on the subsequent deflection plate becomes large. In order to reduce the deflection distortion caused by this, it is effective to make the interval between the deflection plates of the deflector divided into two larger than the interval between the deflection plates of the central deflector.

【0006】[0006]

【実施例】図2は本発明の1実施例として電子線描画装
置に組み込んだ構成図である。図3にはアパーチャーの
構成図を示す。図3より明らかなように図形選択の場合
は、第1アパーチャーの像は単に第2アパーチャーの照
明として用いられている。従って第1アパーチャーの像
歪は第2アパーチャーが第1アパーチャーの像をはみ出
さない限り問題とならない。これに対して成形偏向の場
合は第1アパーチャーの像歪が直接描画する図形に影響
する。従って第1アパーチャー像の偏向は成形偏向の方
を精度良く行なう必要がある。前に述べた様に2分割し
た偏向器の方が偏向収差が大きくなりやすいので本実施
例では成形偏向用偏向は中央の偏向器で行なうこととし
た。従って成形偏向は偏向器6で図形選択の偏向は偏向
器7で行なう。成形偏向は20Vの電圧で動作し偏向時
間は50nsと高速である。これに対して図形選択偏向
では偏向角が大きいことから50Vの電圧が必要であ
り、このために偏向時間は1μsとなる。両者の偏向中
心は上段の転写レンズのクロスオーバー像9と一致させ
ており偏向によるクロスオーバー位置の移動はない。本
装置では縮小レンズ10のクロスオーバー像面に対物絞
り11を配置しているためクロスオーバーと偏向中心を
一致させることはウェハ上の電流密度を一定に保つため
に必要である。この点から両偏向器の偏向中心を一致さ
せることの必要性が分かる。図形選択を行なった場合は
やはり下段の転写レンズのクロスオーバー像面上で振り
戻し偏向器12により電子ビームの軸を元に戻す。この
結果図形選択による軌道変化は図形選択偏向器から振り
戻し偏向器までの間に限定され軌道変化に伴う歪や非点
などの描画精度の低下を最小限に抑えることができる。
この後電子ビームは縮小レンズと対物レンズによりウェ
ハ上に結像される。
FIG. 2 is a block diagram showing an embodiment of the present invention incorporated in an electron beam drawing apparatus. FIG. 3 shows a configuration diagram of the aperture. As is clear from FIG. 3, in the case of the figure selection, the image of the first aperture is simply used as illumination of the second aperture. Therefore, the image distortion of the first aperture is not a problem as long as the second aperture does not protrude from the image of the first aperture. On the other hand, in the case of shaping deflection, the image distortion of the first aperture has an effect on a figure to be drawn directly. Therefore, the deflection of the first aperture image needs to be performed with higher precision in the shaping deflection. As described above, since the deflection aberration tends to be larger in the two-divided deflector, in this embodiment, the deflection for forming deflection is performed by the central deflector. Therefore, the shaping deflection is performed by the deflector 6 and the deflection of the figure selection is performed by the deflector 7. The molding deflection operates at a voltage of 20 V, and the deflection time is as fast as 50 ns. On the other hand, a voltage of 50 V is required in the graphic selection deflection because the deflection angle is large, and the deflection time is 1 μs. The center of deflection of both is aligned with the crossover image 9 of the upper transfer lens, and the crossover position does not move due to deflection. In this apparatus, since the objective aperture 11 is arranged on the crossover image plane of the reduction lens 10, it is necessary to match the crossover with the center of deflection in order to keep the current density on the wafer constant. From this point, it is understood that it is necessary to match the deflection centers of both deflectors. When the figure is selected, the axis of the electron beam is returned to the original position by the return deflector 12 on the crossover image plane of the lower transfer lens. As a result, the trajectory change due to the figure selection is limited between the figure selection deflector and the return deflector, and a decrease in drawing accuracy such as distortion and astigmatism due to the trajectory change can be minimized.
Thereafter, the electron beam is imaged on the wafer by the reduction lens and the objective lens.

【0007】またこの様な偏向板を用いると必然的に可
変成形のみの場合より偏向器が大きくなる。このために
外側の偏向器(本実施例では図形選択偏向器)が転写レ
ンズの磁場中に入り込んでしまう。磁場の存在するなか
での偏向では電子の軌道が回転するために偏向器の中心
が必ずしも偏向中心とはならない。この影響があると2
つの偏向器の偏向中心を合わせるのが難しくなる。この
影響を避けるためには2つある転写レンズでその影響を
相殺する必要がある。その為に上下レンズの励磁を反対
にして偏向器電場とレンズ磁場は上下対称にする。同様
の影響は振り戻し偏向器にも現われる。本実施例では振
り戻し偏向器も2つに分割し上下の偏向方向を変えるこ
とによりクロスオーバー像と偏向中心を合わせた。さら
に図形選択により発生した非点を補正するために振り戻
し偏向器を8極静電偏向器として、同時に非点補正も行
なえるようにした。
When such a deflecting plate is used, the size of the deflector is inevitably larger than in the case of only variable shaping. For this reason, the outer deflector (the figure selecting deflector in this embodiment) enters the magnetic field of the transfer lens. In the deflection in the presence of a magnetic field, the center of the deflector does not always become the center of deflection because the trajectory of electrons rotates. With this effect, 2
It becomes difficult to align the deflection centers of the two deflectors. In order to avoid this effect, it is necessary to cancel the effect with two transfer lenses. Therefore, the excitation of the upper and lower lenses is reversed, and the electric field of the deflector and the lens magnetic field are vertically symmetric. A similar effect is manifested in the return deflector. In this embodiment, the return deflector is also divided into two and the upper and lower deflection directions are changed to align the crossover image with the deflection center. Furthermore, in order to correct the astigmatism generated by the figure selection, the return deflector is an 8-pole electrostatic deflector so that the astigmatism can be corrected at the same time.

【0008】従来の電磁偏向器をやはり成形偏向と偏向
中心を一致させて配置した結果、偏向時間は10μsと
静電偏向の約10倍の時間が掛った。0.5μm 寸法
のSRAMを描画した結果、静電偏向の場合には10枚
/時間のスループットが得られたのにたいして電磁偏向
では7枚/時間のスループットしか得ることが出来なか
った。
[0008] As a result of arranging the conventional electromagnetic deflector so that the center of deflection is the same as the center of deflection, the deflection time is 10 µs, which is about ten times longer than the electrostatic deflection. As a result of drawing an SRAM having a size of 0.5 μm, a throughput of 10 wafers / hour was obtained in the case of electrostatic deflection, whereas a throughput of 7 wafers / hour was obtained in the case of electromagnetic deflection.

【0009】[0009]

【発明の効果】本発明によれば一括露光方式の電子線描
画装置において高速の図形選択が可能である。これによ
り半導体回路やホトレチクルの描画工程の高速化を図る
ことができ、生産性の向上に寄与する。
According to the present invention, a figure can be selected at a high speed in an electron beam lithography system of the batch exposure system. Accordingly, the speed of the drawing process of a semiconductor circuit or a photo reticle can be increased, which contributes to an improvement in productivity.

【図面の簡単な説明】[Brief description of the drawings]

【図1】静電偏向器構造図。FIG. 1 is a structural diagram of an electrostatic deflector.

【図2】電子線描画装置構成図。FIG. 2 is a configuration diagram of an electron beam drawing apparatus.

【図3】アパーチャー構成図。FIG. 3 is an aperture configuration diagram.

【符号の説明】[Explanation of symbols]

1…成形偏向用偏向器、2…図形選択用偏向器、3…電
子銃、4…第1アパーチャー、5…転写レンズ、6…成
形偏向用偏向板、7…図形選択用偏向器、8…第2アパ
ーチャー、9…クロスオーバー像、10…縮小レンズ、
11…対物絞り、12…振り戻し偏向器、13…対物レ
ンズ、14…対物偏向器、15…ウェハ、16…ステー
ジ、17…成形偏向用アパーチャー、18…図形アパー
チャー、19…第1アパーチャー像原点、20…図形選
択時の第1アパーチャー像、21…成形偏向時の第1ア
パーチャー像。
DESCRIPTION OF SYMBOLS 1 ... Deflector for shaping | deflection, 2 ... Deflector for figure selection, 3 ... Electron gun, 4 ... 1st aperture, 5 ... Transfer lens, 6 ... Deflection plate for shaping | deflection, 7 ... Deflector for figure selection, 8 ... 2nd aperture, 9 ... crossover image, 10 ... reduction lens,
Reference numeral 11: Object diaphragm, 12: Back deflector, 13: Objective lens, 14: Object deflector, 15: Wafer, 16: Stage, 17: Aperture for shaping / deflection, 18: Graphic aperture, 19: Origin of the first aperture image , 20... A first aperture image when a figure is selected, 21.

フロントページの続き (56)参考文献 特開 平4−100203(JP,A) 特開 平2−122518(JP,A) (58)調査した分野(Int.Cl.7,DB名) H01L 21/027 G03F 7/20 504 G03F 7/20 521 H01J 37/147 H01J 37/305 Continuation of the front page (56) References JP-A-4-100203 (JP, A) JP-A-2-122518 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 21 / 027 G03F 7/20 504 G03F 7/20 521 H01J 37/147 H01J 37/305

Claims (5)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】電子源と、前記電子源からの電子線を所定
の形状にするための開口部を有する第1の開口板と、前
記第1の開口板の下流に設けられた第1の転写レンズ
と、前記複数の開口図形を有する第2の開口板と、前記
第1の開口板と前記第2の開口板との間に成形偏向用と
図形選択用の偏向器を有し、前記図形選択用偏向器と前
記成形偏向用偏向器の偏向中心を合わす如く第1の図形
選択用偏向器と、前記第1の図形選択用偏向器の下に前
記成形偏向用偏向器と、前記成形偏向用偏向器の下に第
2の図形選択用偏向器と、前記第1の転写レンズの励磁
を逆転した第2の転写レンズと、を配置したことを特徴
とする電子線描画装置。
An electron source, a first aperture plate having an opening for making an electron beam from the electron source into a predetermined shape, and a first aperture plate provided downstream of the first aperture plate. A transfer lens, a second aperture plate having the plurality of aperture figures, and a deflector for forming deflection and figure selection between the first aperture plate and the second aperture plate; A first figure selecting deflector such that the deflection centers of the figure selecting deflector and the shaping deflector are aligned, a shaping deflector below the first figure selecting deflector; An electron beam lithography apparatus, comprising a second deflector for selecting a figure and a second transfer lens in which the excitation of the first transfer lens is reversed below the deflector for deflection.
【請求項2】 前記第1の転写レンズのクロスオーバー像
と前記成形偏向用偏向器と前記図形選択用偏向器の偏向
中心を一致させるごとく前記成形偏向用偏向器と前記図
形選択用偏向器とを配置したことを特徴とする請求項1
記載の電子線描画装置。
2. The deflector for forming and deflecting the figure so that the crossover image of the first transfer lens coincides with the deflection center of the deflector for forming and deflecting the figure. 2. An arrangement according to claim 1, wherein
An electron beam lithography apparatus according to claim 1.
【請求項3】 前記図形選択用偏向器の内側に前記成形偏
向用偏向器を配置したことを特徴とする請求項2記載の
電子線描画装置。
3. The electron beam lithography apparatus according to claim 2, wherein said shaping deflector is arranged inside said figure selecting deflector.
【請求項4】 前記成形偏向用偏向器は静電偏向器で有る
ことを特徴する請求項1乃至3記載の電子線描画装置。
Wherein said shaping deflecting deflector the electron beam drawing apparatus according to claim 1 to 3, wherein features that there in the electrostatic deflector.
【請求項5】 電子源と、前記電子源からの電子線を所定
の形状にするための開口部を有する第1の開口板と、前
記第1の開口板の下流に設けられた第1の転写レンズ
と、前記第1の転写レンズの下流に設けた第2の転写レ
ンズと、前記複数の開口図形を有する第2の開口板とを
用い、 前記第1の開口板と前記第2の開口板との間に成形偏向
用偏向器を挟んで図形選択時に、前記第1の開口板で電
子線を矩形ビームにする工程と、前記第1の開口板を通
過した矩形ビームを第1の図形選択用偏向器で偏向する
第1の偏向工程と、第2の図形選択用偏向器で前記成形
偏向用偏向器の偏向中心とが一致する如く偏向する第2
の偏向工程と、前記第1の転写レンズの励磁と前記第2
の転写レンズの励磁とを逆方向に駆動する工程と、を有
することを特徴する電子線描画方法。
5. A electron source, a first aperture plate having an opening for the electron beam into a predetermined shape from the electron source, the first disposed downstream of said first aperture plate Using a transfer lens, a second transfer lens provided downstream of the first transfer lens, and a second aperture plate having the plurality of aperture figures, wherein the first aperture plate and the second aperture A step of transforming the electron beam into a rectangular beam by the first aperture plate at the time of selecting a graphic with a shaping deflector between the plate and the first aperture plate; A first deflecting step of deflecting by the selecting deflector; and a second deflecting step of deflecting by the second figure selecting deflector so that the deflection center of the shaping deflector coincides.
Deflection step, excitation of the first transfer lens and the second
Driving the excitation of the transfer lens in the opposite direction.
JP10018541A 1998-01-30 1998-01-30 Electron beam drawing equipment Expired - Fee Related JP3139441B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10018541A JP3139441B2 (en) 1998-01-30 1998-01-30 Electron beam drawing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10018541A JP3139441B2 (en) 1998-01-30 1998-01-30 Electron beam drawing equipment

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP03011916A Division JP3139025B2 (en) 1990-10-05 1991-02-01 Electron beam drawing equipment

Publications (2)

Publication Number Publication Date
JPH10209043A JPH10209043A (en) 1998-08-07
JP3139441B2 true JP3139441B2 (en) 2001-02-26

Family

ID=11974503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10018541A Expired - Fee Related JP3139441B2 (en) 1998-01-30 1998-01-30 Electron beam drawing equipment

Country Status (1)

Country Link
JP (1) JP3139441B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6080540B2 (en) * 2012-12-26 2017-02-15 株式会社ニューフレアテクノロジー Charged particle beam lithography system

Also Published As

Publication number Publication date
JPH10209043A (en) 1998-08-07

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