JP3122050U - Heat dissipation device with heat dissipation pieces with different densities - Google Patents

Abstract

Disclosed is a heat dissipation device having heat dissipating pieces having different densities, in which heat dissipating pieces are arranged and assembled at different densities, a cool air stream is quickly introduced into the heat dissipating pieces, and an excellent heat dissipation effect is obtained by effectively lowering the temperature. Offer.
A heat radiating piece is formed by combining a large number of small heat radiating pieces, the upper and lower edges of the heat radiating piece are bent, a fitting tank is formed on the heat conducting piece, and the fitting tubs are the same. A fitting part extending in the direction, forming a combined heat dissipating piece set corresponding to the heat dissipating pieces in the front and rear, setting the space between the heat dissipating pieces in the assembly in advance, The width of the heat conduction piece shall be relatively wide, and a heat radiation area with a relatively wide space will be formed at the time of assembly, and the width of the heat conduction piece on the heat radiation piece with a small space at the time of assembly will be appropriately reduced and assembled. Sometimes heat radiation areas with relatively dense intervals are formed, and each heat radiation piece is assembled in one press.
[Selection] Figure 2

Description

The present invention relates to a heat dissipation device having heat dissipating pieces of different densities, and by combining several dozen small heat dissipating pieces, heat dissipating intervals having different densities are formed, corresponding to blowing fans arranged in various directions, The present invention relates to a heat dissipation device that enhances a heat dissipation function that lowers the temperature of a computer electronic member.

Electronic components inside the computer main body generate a large amount of heat during computation or high-speed operation, but heat accumulates and the temperature rises too high, causing damage to the electronic components and affecting the stability of computer operations. In order to prevent this, a heat dissipation piece is generally installed on the electronic member, and the air is forced to cause convection by the fan to increase heat conduction, and the high temperature generated by the electronic member leads the heat source through the heat dissipation piece and dissipates it. The stability of the electronic member is secured. However, as shown in FIG. 1, a commercially available general heat radiating device has a fan 2 installed mainly in an appropriate space near the heat radiating piece 1, and among them, the heat radiating pieces 1 are arranged in a grooved tank shape so that a large number of hot air flows. An outlet 3 is formed in between, whereby a heat radiating device is installed on the surface of the electronic heat generating member, and when the operation of the fan 2 is started, the cooled air is introduced from the wind inlet 4 and blown to the heat radiating piece 1. The heat energy conducted by the electronic member in the upward direction is dissipated and the effect of heat dissipation can be obtained. As is well known, the cool air generated during the operation of the fan moves toward all four sides and promotes the discharge of hot air. The airflow from the fan at the fixed position is absorbed by the heat dissipation piece itself and cannot be diffused quickly, and hot air stays inside the radiator, This is disadvantageous for heat dissipation of the electronic member. Some manufacturers try hard to reduce the distance between the heat dissipation pieces in order to increase the contact area between the heat dissipation pieces and the electronic heating element, but conversely if the density becomes too high The heat dissipation performance of the heat dissipation piece is reduced and the heat dissipation effect deteriorates. At the same time, high-performance computer users must withstand the noise generated when operating with the fan's wind pressure increased, pursuing high performance At the same time, meeting the need for low noise should not be overlooked.

The main purpose of the present invention is to solve the problem of the limited heat dissipation effect of the conventional computer heat dissipation structure, arrange and dissipate the heat dissipation pieces with different densities, quickly introduce the cool air flow into the heat dissipation pieces, Equipped with heat dissipating pieces with different density, which can effectively lower the temperature by radiating the heat and get excellent heat dissipation effect, and at the same time make the fan fully function and reduce fan noise The object is to provide a heat dissipation device.

In view of the situation in which various drawbacks in the structural design of the above-described conventional heat dissipation device have caused many defects in practicality and stability, the design of the heat dissipation piece is not only important in the overall heat dissipation effect, but also the influence I felt that it was very big, and this invention is a heat dissipation device with a heat dissipation piece structure with different density, which has been made through continuous research and improvement, researching various solutions to the above drawbacks. Thus, the drawbacks of the prior art are improved, and the thermal convection problem due to the inhibition of the heat radiation surface area and the heat radiation piece is effectively solved to obtain the best heat radiation effect.

Specifically, the heat dissipating device with heat dissipating pieces of different density according to the present invention is manufactured by first pressing the heat dissipating piece into a single piece press molding, producing an ultra-thin small heat dissipating piece that is close to the limit of current mass production press forming. The air flow when the wind is sent from the fan is made relatively small, and the back flow generated by the air being blocked is reduced, and when the area is the same, the number of heat dissipation pieces is larger than the conventional product. Basically, the contact area with the heat source can be greatly increased, and several tens of these small heat radiation pieces are assembled, and the assembly interval of the predetermined heat radiation pieces is changed from large to small, or The area facing the wind of the heat radiating device can be adjusted according to the installation position of the fan, from small to large, or large and small, and can be completed with a single press. Among them, when the assembly interval of the first half is increased, a relatively relaxed heat dissipation area is formed in the first half, the interval in the second half is relatively dense, and a higher density heat dissipation area is formed. As a result, the cooled air that is sent during the operation of the fan is quickly circulated through the more radiant heat dissipation area without being accumulated in the denser heat radiating pieces in the latter half, and the heat radiating pieces are overcrowded. This solves the problem that the flow of cooled air becomes poor, and at the same time, the heat source generated from the electronic member also has a relatively large area in contact with the heat source in the second half, so that the absorbed heat can be quickly moved upward. Can be led out. In addition, since overheated heat radiation pieces need to increase the wind pressure, the noise of the fan increases as a direct effect, and if the density of the heat radiation pieces is too low, heat cannot be dissipated properly. The idea is to design a heat dissipation device that consists of an ultra-thin small heat dissipating piece assembled with different densities, and the cooled air and hot air flow between the heat dissipating pieces and cross each other, and the flow of air in the air flow process It effectively solves the problem of contact with the heat source and air flow separation without being obstructed, and in the area where the heat dissipation pieces in the latter half are densely packed, the heat dissipation capacity is increased by increasing the heat dissipation area. In addition to improving the effect and providing better heat conduction effect, the heat dissipation action of the heat dissipation piece is maximized, the function of the fan is fully exerted, and the speed of the computer electronic component that is gradually increasing Calculation In addition to solving the overheating problem, it is not necessary to increase the fan's wind pressure, so the fan's noise can be reduced, and the problem of the heat dissipation surface area, airflow blockage of the heat dissipation piece and fan noise can be solved at once. it can.

The structure and implementation method of a heat dissipation device having heat dissipation pieces having different densities according to the present invention will be described below in detail with reference to specific examples and drawings. First, FIGS. 2 and 3 are respectively a three-dimensional exploded view and a three-dimensional external perspective view of the best embodiment of the present invention.

Among them, the heat radiating piece 10 is an ultra-thin short piece formed by press molding. The heat conducting piece 101 is provided by bending the heat conducting piece 101 at the upper and lower edges of the heat radiating piece 10 in the horizontal direction, and is fitted on the heat conducting piece 101. A tank 1011 is formed, the fitting tank 1011 includes a fitting portion 1012 provided in the same direction, a hook portion is formed at a bent portion of the fitting portion 1012, and the heat radiating piece 10 corresponds to the front and rear. It can be prevented from falling off when a heat dissipation piece set is formed by combining and assembling one by one. The present invention mainly increases the width of the heat conduction piece 101 installed in the heat radiation piece 10 in the first half, and the fitting tank 1011 and the fitting portion 1012 are also slightly larger, so that the heat conduction piece 101 is relatively large when assembled. A space is formed so that a low-density heat radiation area 102 having a space is formed, the width of the heat conduction piece 111 installed in the heat radiation piece 11 in the latter half is reduced, and the fitting tank 1111 and the fitting part 1112 are slightly smaller. As a result, the densely spaced high-density heat radiation area 112 can be formed at a relatively small interval during the assembly. In addition, the heat radiating piece 10 and the heat radiating piece 11 form heat conductive pieces 101 and 111 having different widths during pressing, and when the heat radiating pieces 10 and 11 are connected and assembled one by one, the density of the heat radiating pieces is different. A low density heat dissipation area 102 and a high density heat dissipation area 112 are formed.

FIG. 4 shows a plan view of an embodiment of the present invention. Among them, the low-density heat radiation area 102 in the first half of the heat radiation piece 10 is directed to the air outlet side, and when the fan is operated, a large amount of the airflow of the cooled air that starts blowing flows into the low-density heat radiation area 102, Since the interval between the density heat radiation areas 102 is relatively large, the air is less susceptible to interference in the flow process, and the cooled air quickly and smoothly passes through the low density heat radiation area 102 in the first half, and the heat radiation piece 11 in the second half is quickly and smoothly. It flows into the high-density heat radiation area 112 without causing a stay reduction. Thereby, the bad influence with respect to the flow of the cold air by overcrowding of a heat radiating piece can be solved. At this time, since the heat source generated by the electronic member has a relatively large number of the heat radiation pieces 11 in the latter half part and the area where the heat absorption part 13 in the bottom part contacts the heat source is also relatively large, the heat absorbed is constantly radiated in the low density of the first half part. It is possible to flow toward the area 102 and form heat exchange with the cooled air at the same time to quickly guide and release the heat upward, thereby obtaining excellent heat conduction and heat dissipation effects.

FIG. 5 shows another embodiment of the present invention. The radiating pieces 10 and 11 may be formed by being assembled for each divided area. For example, the first divided area is a low density radiating area 102, the second divided area is a high density radiating area 112, and the third divided area is a low density radiating heat. The area 102 and the fourth section area can be alternately arranged with the high-density heat radiation area 112 and the like. As described above, in the assembly of the present invention, a wide area and a narrow area are separated and arranged, and by forming a heat dissipation structure having different densities, the cool air sent from the front is guided and smoothly blown in, and the absorption Regardless of the strength of the wind speed, the strong and weak airflows search for the respective outlets and flow in each low-density heat radiation area 102 and the high-density heat radiation area 112, and the airflows of cold air and hot air sufficiently cross in the heat radiation piece, At the same time, the heat absorbed by the heat absorbing portion 13 on the surface in contact with the heat source at the bottom can be quickly dissipated upward during heat exchange.

In addition, the present invention can install a heat dissipation area appropriately combined with the position of the fan, and at the same time, it can form the best heat dissipation action on the heat dissipation piece, allowing the fan to fully demonstrate its function, It is not necessary to increase the wind pressure of the fan, the fan noise can be reduced, and the problem due to the fan noise can be solved.

The above drawings and names of members are defined for the convenience of description of the present invention, and do not limit the patent scope of the present invention. All diversions are within the scope of protection of the patent of the present invention.

As mentioned above, the heat dissipating device with heat dissipating pieces of different density of the present invention is rational and complete creation, not only has excellent practicality, but also structural space type design so far The structure of the heat dissipating piece, which is new and has a novelty, and is designed and assembled by press technology, can increase the heat dissipating speed and can surely enhance the heat dissipating function of computer electronic components, breaking the conventional technology It is an advanced creation, not a simple diversion that can be easily conceived, but has an inventive step. Therefore, the present invention satisfies the requirements of each item of a utility model registration application, and the application is submitted here.

It is a three-dimensional view of a conventional heat dissipation device. It is a three-dimensional exploded view of Example 1 of the present invention. It is a three-dimensional perspective view of Example 1 of the present invention. It is a side view of Example 1 of the present invention. It is a side view of Example 2 of the present invention.

Explanation of symbols

1 Heat dissipation piece
2 Fan 3 Hot air outlet
4 Windward entrance 10 Heat dissipation piece
101 Heat conduction piece
1011 mating tank
1012 Fitting part
102 Heat dissipation area
11 Heat radiation piece 111 Heat conduction piece
1111 Fitting tank 1112 Fitting part 112 Heat radiation area 13 Heat absorption part

Claims (4)

A combination of a large number of small heat dissipating pieces, the upper and lower edges of the heat dissipating pieces are bent to provide a heat conducting piece, a fitting tank is formed on the heat conducting piece, and the fitting tank extends in the same direction. A hook portion is formed by bending the fitting portion, and a combination heat dissipating piece set is formed by corresponding the heat dissipating pieces to the front and rear, of which the heat dissipating piece is formed by single piece press molding The interval between the heat dissipating pieces at the time of assembly is set in advance, the width of the heat conducting piece provided on the heat dissipating piece having a larger interval at the time of assembling is relatively wide, and the fitting tank and the fitting portion are also relatively large. Provide a heat dissipation area with a relatively wide interval during assembly, and provide a heat conductive piece with a moderately reduced width on the heat dissipation piece with a smaller interval during assembly. Slightly small and spaced during assembly The heat dissipating pieces having different densities are formed, wherein heat dissipating areas having relatively high density are formed, and each heat dissipating piece is assembled by a single press, and intervals between the heat dissipating areas having different densities are formed after the assembly. Heat dissipation device. When assembling the heat dissipating piece, the front half is a low-density heat dissipating area, the latter half is a high-density heat dissipating area, and when assembled, a heat dissipating piece set having a low density at the front and a high density at the back is formed. The heat radiating device provided with the heat radiating piece from which the density differs of Claim 1 characterized by the above-mentioned. When assembling the heat dissipating piece, the front half is a high-density heat dissipating area and the latter half is a low-density heat dissipating area, and when assembled, a heat dissipating piece set having a high front density and a low rear density is formed. A heat dissipating device comprising the heat dissipating pieces having different densities according to claim 1. When assembling the heat dissipating piece, a section area is provided and arranged, the first section area is a low density heat dissipation area, the second section area is a high density heat dissipation area, the third section area is a low density heat dissipation area, and the fourth section area is disposed. The high-density heat dissipation area is arranged in such a manner that the heat-dissipation piece set is formed by arranging the high-density heat-dissipation area and the low-density heat-dissipation area alternately when the assembly is arranged by alternately changing the density. A heat dissipating device comprising the heat dissipating pieces having different densities according to 1.

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