JP3121065U - Memory module improvements - Google Patents

Abstract

An object of the present invention is to easily assemble and repair a large-capacity IC memory without using a cream solder / welding aid, and to contribute to environmental conservation.
A board in which a plurality of sets of printed circuits are provided on a plate surface of a memory module, and conductive spring rubber is also laid inside the board, and is electrically connected to the corresponding printed circuit. The conductive spring rubber laid inside the IC housing frame, including one or more IC housing frames that can be built into the memory in a removable manner, can be used as a connector, has a silicon rubber layer for insulation, and has a flexible structure for insulation. By installing a conductive spring array configured in a matrix arrangement by a conductive spring group on the silicon rubber layer and electrically connecting to a corresponding printed circuit via the installed conductive spring, the IC memory is placed inside the housing frame. Incorporate and configure electrical connection with the corresponding printed circuit.
[Selection] Figure 2

Description

  The present invention relates to an improvement of a memory module, and more particularly, to a memory module that uses a conductive spring rubber and is assembled by a method capable of detaching an IC memory of a ball grid array package.

  The structure of the conventional memory module 10 shown in FIG. 1 is usually formed by welding several ICs (Integrated Circuits) and a memory 70 on one or both sides of a printed circuit board (PCB) 11.

  Taking the case where the memory module 10 of the IC memory 70 is provided on one side as an example, a plurality of sets of printed circuits 12 are provided on the substrate surface of the printed circuit board 11, and a plurality of circuit contacts are provided on each set of printed circuits 12. 13, one IC memory 70 can be welded onto the printed circuit board 11, and electrical connection with the corresponding printed circuit 12 can be configured. Thus, the memory module 10 is configured after the plurality of IC memories 70 are integrated and installed on the printed circuit board 11.

  The IC memory 70 is a main component of the memory module 10, and the packaging method of the IC memory 70 is gradually becoming a ball grid array (BGA, Ball Grid Array) package mainstream from TSOP (Thin Small Outline Package). Has progressed.

  For the sake of brevity, BGA memory will be referred to in the text below, that is, an IC memory with a ball grid array package (BGA) and solder balls (Pads) or circuit contacts on the bottom.

  As shown in FIG. 1, when the memory module 10 uses the BGA memory 70, the solder balls (pads) provided on the bottom surface of each BGA memory 70 are printed on the printed circuit board 11 using surface mounting technology (SMT). These are fixed to the printed circuit board 11 by being welded so as to be integrated with the circuit contacts 13 of the printed circuit 12 of each set.

  However, the drawback of welding the BGA memory 70 to the printed circuit board 11 with solder balls is that the BGA memory 70 is not easily repaired or replaced. When the BGA memory 70 is taken out and repaired, the solder must be melted at a high temperature to remove the original solder ball. In addition, after the BGA memory 70 is repaired and replaced, the solder ball is mounted and positioned again. It is very difficult to mount and fix the solder balls.

  In particular, in the repair process of removing the solder balls at a high temperature, the BGA memory 70 which is not originally damaged is often damaged by receiving the high temperature. Also, in the process of mounting the solder balls removed in the repair process and the solder balls again, the use of cream solder and welding aids causes environmental pollution and does not meet the demand for environmental conservation.

  In order to overcome the inconvenience of repairing and replacing the BGA memory in the existing memory module, the main object of the present invention is to provide an improvement of the memory module, and the memory in such a manner that the BGA memory can be detached. It can be assembled into a module, and it is not necessary to use cream solder and welding aid, and it has the feature that can easily assemble, repair or replace the BGA memory, and also has the effect of environmental conservation.

  The memory module of the present invention is a system in which a BGA memory including a board provided with a plurality of sets of printed circuits having the same function on the board surface and one or more IC housing frames and provided with solder balls on the bottom surface can be attached and detached. Can be fitted into the IC housing frame or taken out from the inside of the IC housing frame, so that a conductive spring rubber is provided inside each IC housing frame, Configure electrical connection. The conductive spring rubber provided inside each IC housing frame is a substance having elasticity and conductive characteristics, and also includes a soft silicon rubber layer for insulation, and the soft silicon rubber layer for insulation is arranged in a matrix by conductive spring groups. A conductive spring array comprising: a plurality of circuit contacts of a printed circuit of any one of the substrates via the conductive spring array provided on the conductive spring rubber; and reliability And having a stable electrical connection.

  That is, even after the BGA memory is fitted into the BGA housing frame of the memory module of the present invention, it is not necessary to use cream solder and welding aid, and the BGA memory can be connected to the solder balls or circuit contacts provided on the bottom surface. An electrical connection is established immediately with the conductive spring row of the conductive spring rubber provided inside the BGA housing frame, and the process proceeds one step further through the electrical conduction of the conductive spring row of the conductive spring rubber. A secure connection.

In such an assembling method, the memory module of the present invention can be assembled in such a manner that the BGA memory can be detached, and when it is necessary to repair or replace the BGA memory, it is not necessary to perform solder melting at a high temperature, and the defective BGA The memory can be removed and replaced with a new BGA memory. Alternatively, even if it is necessary to upgrade to a relatively large-capacity BGA memory, the user can easily replace the BGA memory with a relatively large-capacity BGA memory. As a result, it has the following advantages over the memory module of the present invention.
I. Convenient for repair or replacement of BGA memory.
B. Again, the cost or difficulty of remounting the solder balls can be omitted.
C. The BGA memory can be replaced at any time, and there is no problem in positioning and fixing.
two. It is possible to avoid the BGA memory from being damaged by high temperature.
E. The user can easily replace the BGA memory or upgrade to a large capacity.
F. Since the amount of cream solder and welding aid used can be reduced, it has an environmental conservation effect.

  Referring to FIG. 2, the memory module 20 according to the present invention is a memory module assembled in such a manner that the BGA memory 70 can be attached / detached. The memory module 20 includes a substrate 21 and one provided on one or both sides of the substrate 21. The above-described IC housing frame 30 is included, and a conductive spring rubber 40 is provided as a connector inside each IC housing frame 30 so that it is not necessary to use cream solder and a welding aid, and the BGA memory 70 can be easily attached and detached. Further, it is possible to freely take out the BGA memory 70 which is assembled inside the IC housing frame 30 and fitted from the inside of each IC housing frame 30.

  A printed circuit 22 having a plurality of sets of similar functions is provided on one surface or both surfaces of the substrate 21, and a plurality of circuit contacts 23 are provided in each set printed circuit 22. After the IC housing frame 30 is assembled on the substrate 21, the IC housing frame 30 is positioned inside the IC housing frame 30, and the conductive spring rubber 40 is provided in addition to the conductive spring rubber 40 inside the IC housing frame 30. Can be used as a connector by being electrically connected to a corresponding printed circuit 22 via a plurality of circuit contacts 23.

  Referring to FIGS. 2 and 3, the conductive spring rubber 40 disclosed in the present invention includes an insulating soft silicon rubber layer 41, and the insulating soft silicon rubber 41 is configured in a matrix arrangement by conductive spring groups. A conductive spring row 45 is provided, and when the insulating soft silicone rubber 41 is pressed by an external force, the conductive spring row 45 of the conductive spring rubber 40 of the present invention has a buffering action and immediately after the external force disappears, It is possible to return to a position where no external force is applied. The conductive spring rubber 40 of the present invention has conductive characteristics through the conductive springs of the conductive spring row 45, and each conductive spring of the conductive spring row 45 is covered and protected by a soft silicone rubber 41 for insulation, so that an external force can be obtained. Since no distortion or bending occurs when receiving, the original function can be maintained even when used over a long period of time.

  As a result, such a conductive spring rubber 40 becomes a rubber connector having elasticity and conductive characteristics, and achieves the purpose of passing the circuit conduction and current through the circuit that is interrupted or de-energized by the conductive spring of the installed conductive spring row 45. Can be made.

  2 and 4, when the BGA memory 70 is fitted into the IC housing frame 30 of the memory module 20 of the present invention, the BGA memory 70 is provided with solder balls 75 or circuit contacts provided on the bottom surface. Are formed into an electrical connection with the corresponding plurality of conductive springs of the conductive spring row 45 of the conductive spring rubber 40, and further the plurality of conductive springs of the conductive spring rubber 40 in contact with each other and the plurality of circuits of the corresponding printed circuit 22. By forming the contact 23 as a bridge, the fitted BGA memory 70 can have a reliable and stable electrical connection with the corresponding printed circuit 22.

  2 and 4, the IC housing frame 30 disclosed in the present invention is also provided with a movable lid 50, and the inside of the IC housing frame 30 exhibits an open or closed state by opening and closing the movable lid 50. Can do.

When the inside of the IC housing frame 30 is opened, the BGA memory 70 can be assembled in such a manner that the BGA memory 70 can be attached and detached, and the BGA memory 70 fitted from the inside of the IC housing frame 30 can be taken out freely. be able to.

  When the movable lid 50 closes the upper surface of the IC housing frame 30, the BGA memory 70 cannot be detached from the inside of the IC housing frame 30 due to the effect of fixing the BGA memory 70 with the movable lid 50.

  As a result, the memory module 20 of the present invention does not require the use of surface mounting technology when assembling the BGA memory 70, and does not require the use of cream solder and welding aids. The BGA memory 70 can be repaired and replaced at any time, and there is no problem in positioning and fixing.

  When the memory module 20 of the present invention has a defective BGA memory 70 and needs to be repaired or replaced, the defective BGA memory 70 can be taken out of the IC housing frame 30 to be fitted and replaced with a new BGA memory 70. it can. Therefore, it is not only very convenient for repairing or replacing the BGA memory 70, but it is not necessary to melt the solder at a high temperature, and the BGA memory 70 can be prevented from being damaged by the high temperature.

  When the memory module 20 of the present invention is to be upgraded with the use of a BGA memory 70 having a relatively large capacity, the substrate 21 of the present invention has a reusable characteristic, and the BGA memory fitted to the IC accommodating frame 30 of the substrate 21. The purpose of the upgrade can be achieved simply by taking out 70 and replacing the BGA memory 70 having a relatively large capacity. In particular, there is no arbitrary obstacle to the user himself, and it can be easily replaced.

  Other applications are possible for the memory module 20 of the present invention, and the memory module 20 of the present invention can be provided with conductive rubber having other different structures inside each IC housing frame 30. Such a conductive rubber having a small pitch on the housing frame 30 and a gold-plated conductor line can be used as a connector. Alternatively, as shown in FIG. 5, the memory module 20 of the present invention is not a ball grid array package, but a flat type IC memory 80 having an electrical contact 85 on the bottom surface can be attached and detached. The flat type IC memory 80 can be taken out from the inside of the IC housing frame 30.

  The content disclosed above is an optimum specific embodiment, and constitutes a so-called similar effect or equality to the devised purpose of the present invention and the effect that can be achieved, and is familiar with the technology of the item. Any simple modifications, modifications, improvements or alterations that can be easily completed shall fall within the scope of the utility model registration claim claimed by the present invention.

It is a structure sketch of the conventional memory module. The memory module disclosed in the present invention for explaining that the memory module of the present invention is assembled on the substrate of the memory module of the present invention in such a manner that the IC memory of the ball grid array package can be detached by using the conductive spring rubber as a connector. It is a structure sketch. FIG. 3 is an enlarged view of a local structure of the conductive spring rubber shown in FIG. 2. FIG. 4 is an enlarged view of a cross-sectional structure portion taken along a line 4-4 in FIG. 2. The memory module disclosed in the present invention is also a structural sketch that can be assembled in such a manner that a flat type IC memory can be attached and detached.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Conventional memory module 11 Printed circuit board 12 Printed circuit 13 Circuit contact 20 Memory module 21 Board | substrate 22 Printed circuit 23 Circuit contact 30 IC accommodation frame 40 Conductive spring rubber 41 Soft silicon rubber for insulation 45 Conductive spring row 50 Movable lid 70 BGA memory 75 Solder ball 80 Flat type IC memory 85 Electrical contact

Claims (3)

In the memory module,
A board provided with a plurality of sets of printed circuits on the plate surface, and provided on one or both sides of the board, and also provided with a conductive spring rubber, and electrically connected to the corresponding printed circuit 1 The conductive spring rubber including at least one IC housing frame and provided inside the IC housing frame includes a soft silicon rubber layer for insulation, and the soft silicon rubber layer for insulation is arranged in a matrix by conductive spring groups. A memory module comprising: a configured conductive spring array; and an electrical connection with a corresponding printed circuit via the installed conductive spring.   2. The memory module according to claim 1, wherein the IC accommodating frame installed on the substrate can accommodate a BGA memory or a flat type IC memory, and the BGA memory or the flat type IC memory is provided on the bottom surface thereof. Alternatively, the memory module is configured to be electrically connected to a plurality of corresponding conductive springs of conductive spring rubber provided on the IC housing frame via circuit contacts.   3. The memory module according to claim 1, wherein the IC housing frame provided on the substrate is also provided with a movable lid, and the inside of the IC housing frame is opened or closed with the movable lid. Memory module.

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