JP3120351U - Heat sink fixing structure of central processing unit - Google Patents

Abstract

A heat dissipation fixing structure for a central processing unit is provided.
A heat dissipation fixing structure for a central processing unit according to the present invention is a fixing structure that is engaged with a kind of radiator and a central processing unit, and effectively conducts heat energy generated from the central processing unit to the radiator. The present invention has two through holes at the periphery of the central processing unit slot on the motherboard. A back plate is provided on the back side of the motherboard, and screw fastening holes corresponding to the through holes are provided on the back plate. A fixing member to be fastened to the bottom of the radiator is provided, and this fixing member is further provided with two Z-shaped pintle hooks that extend downward on both sides of the frame; a space is provided at the center of the frame, and the bottom of the radiator Expose the heat-dissipating part and match it with the central processing unit. The end portion of the Z-shaped pintle hook corresponds to a fixing hole provided in the mother board. In order to fix the back plate and the fixing member through the fixing hole and the screw tightening hole, it is constituted by two bolts.
[Selection] Figure 1

Description

  The present invention relates to a heat dissipation fixing structure of a kind of central processing unit. This fixing structure forms a good locking effect between the heat sink and the central processing unit, and the heat energy generated by the central processing unit is effective by the heat sink. To release.

  The central processing unit is a core component that performs calculation processing of enormous data in a computer. In recent years, there has been a continuous improvement due to the need for computation speed of central processing units. For this reason, the generated thermal energy increases as the processing clock improves. Therefore, in order to prevent processing abnormality or damage due to overheating of the central processing unit, a radiator having a more heat radiation effect is required.

  For heat dissipation of a known central processing unit, a heat transfer body is attached to the surface of the central processing unit. Most of the heat transfer bodies use copper, aluminum heat radiation fins or heat pipes, or other high heat transfer metal members. Furthermore, a central processing unit radiator is configured by providing a fan and forcing air to the heat transfer body. In addition, a heat radiating plague or a heat radiating sheet is attached to the surfaces of the heat transfer body and the central processing unit to fill the gaps in the contact space and improve the heat transfer effect.

  In the known technology, heat energy generated from the central processing unit is transported to the outside by the heat transfer body, and the flowing air molecules are brought into contact with the heat transfer body by a fan to accelerate the heat dissipation effect of the heat transfer body. This type of central processing unit heat dissipation technology can be said to be the mainstream technology that can achieve the most economic effect.

  From the above description, it can be seen that the main factors affecting the heat dissipation of the central processing unit are the heat dissipation area of the heat transfer body and the flow rate of air molecules by the fan. For this reason, as the processing speed of the central processing unit increases in recent years, the amount of heat energy released increases, and the volume, shape, and space that the heat transfer body and fan fasten increase, and the weight and volume of the radiator increase. Have come.

  Usually, as a fixing method of the radiator, a spring sheet or a fixing member is connected to an appropriate place on the peripheral edge of the central processing unit slot, and a locking force is formed on the central processing unit by the radiator to fix the radiator. However, the central processor slot is structurally unable to receive a strong amount of locking force. Therefore, for this type of radiator that is directly fixed to the central processing unit slot, the amount of supporting force that can be provided to a radiator having a large volume and weight is limited. For this reason, improper fixing causes problems such as fan rotation vibration, friction between the radiator and the central processing unit, and imbalance in pressure received by the central processing unit. In addition, when the computer is transported, an extra force is applied to the computer slot, causing damage to the central processing unit slot.

  In order to provide a good bearing capacity, in the known technology, a plurality of through holes are provided on the periphery of the central processing unit slot on the motherboard, and the fixing frame is screwed or fastened to the motherboard, and the radiator is centralized by a fastener or the like. Stay in the processing equipment. This type of embodiment can disperse the power from the installation of the radiator to the mother board, and can solve the problem of power receiving imbalance of the central processing unit slot.

  In the known technique, the central processing unit slot or the motherboard itself provides the support capacity for the heatsink. However, because there are many precision electronic circuits between the central processing unit slot and the motherboard, or inside the motherboard, there is a limit to improving the bearing capacity, and there is a risk of damaging the electronic circuit when installing a radiator There is.

  The heat dissipating fixing structure of the central processing unit of the present invention has at least two through holes at the periphery of the central processing unit slot on the motherboard. A back plate is provided on the back side of the motherboard, and screw fastening holes corresponding to the through holes are provided on the back plate. A fixing member to be fastened to the bottom of the radiator is provided, and this fixing member is further provided with two Z-shaped pintle hooks that extend downward from both sides of the frame. A space is provided at the central location of the frame, and the heat radiating portion at the bottom of the radiator is exposed to match the central processing unit. The end portion of the Z-shaped pintle hook corresponds to a fixing hole provided in the mother board. In order to fix the back plate and the fixing member through the fixing hole and the screw tightening hole, it is constituted by two bolts. With this structure, the fixing member and the back plate are directly fastened to avoid damage when the radiator is fastened to the motherboard, and a complete stress structure is formed between the fixing member and the back plate.

  Among them, the end of the Z-shaped pintle hook has an inclined angle on the horizontal surface before the bolt is tightened. When the Z-shaped pintle hook is tightened by the bolt, the bolt is the At this time, since the end portion of the Z-shaped pintle hook is pressed against the end portion, an elastic reaction force in the opposite direction is caused, and the bolt is less likely to come out of the tightening hole due to slack due to vibration.

  Furthermore, an erroneous insertion prevention protrusion is provided on the bottom surface of the frame. When the fixing member is attached to the lower part of the radiator, the fixing member can be attached in the opposite direction due to carelessness of the work. It works to prevent abnormal pressure on the device.

  Note that some commercially available motherboards have a manufacturing process, and the central processing unit slot is provided with soldering leads on the back of the motherboard. The present invention can be provided on the back plate to avoid the recess of the central processing unit slot soldering lead or provide an insulating layer between the back plate and the motherboard to provide an insulating effect and a buffering effect. Depending on the thickness of the layer, the fastening interval between the fixing member and the back plate can be adjusted.

  Further, the fastening hole is provided in the projection plug of the back plate, and this projection plug is projected from the back side of the motherboard through the through hole to the surface of the motherboard to provide convenience when fastening the fixing member.

The invention of claim 1 is a radiator fixing structure of a central processing unit, including two through holes, a back plate, a fixing member and two bolts, and the two through holes are formed at the peripheral edge of the central processing unit slot on the motherboard. Provided, the back plate is installed on the back side of the mother board, the back plate is provided with two fixing holes corresponding to the through holes, the fixing member is fixed to the bottom of the radiator, and the fixing member further includes the frame and both sides of the frame. Provided with two Z-shaped pintle hooks extending downward, providing a space in the center of the frame, exposing the heat transfer part at the bottom of the radiator, corresponding to the central processing unit, A center hole characterized in that a fixing hole is provided at the end of the Z-shaped pintle hook and corresponds to a through hole provided in the mother board, and the two bolts fasten the back plate and the fixing member through the fixing hole and the screw tightening hole. Processing equipment And a heat sink fixed structure.
According to a second aspect of the present invention, there is provided a heat dissipation fixing structure for a central processing unit according to the first aspect, wherein a misinsertion preventing projection is provided at the bottom of the frame.
According to a third aspect of the present invention, there is provided a heat dissipation fixing structure for a central processing unit according to the first aspect, wherein a misinsertion preventing projection is provided at the bottom of the frame.
According to a fourth aspect of the present invention, there is provided a heat dissipation fixing structure for a central processing unit according to claim 1, wherein an insulating layer is provided between the back plate and the mother board.
The invention of claim 5 is the heat dissipating fixing structure of the central processing unit according to claim 1, wherein the screw tightening hole is provided inside the protrusion plug of the back plate, and the protrusion plug protrudes from the back side of the motherboard through the through hole to the surface of the motherboard. The heat treatment fixing structure of the central processing unit is characterized by being provided.
According to a sixth aspect of the present invention, in the heat dissipation fixing structure for the central processing unit according to the first aspect, the heat dissipation of the central processing unit is characterized in that a recess is provided on the back plate for avoiding a solder lead portion of the motherboard slot. It has a fixed structure.
According to a seventh aspect of the present invention, there is provided a heat radiating and fixing structure for a central processing unit according to claim 6, wherein a through hole is provided in the recess.

  The present invention achieves stable anchoring between the radiator and the central processing unit by fastening to the motherboard with a fixing member between the radiator and the central processing unit, and efficiently dissipates the heat energy generated from the central processing unit. There is an effect that can be transmitted to the device.

  FIG. 1 is an exploded view of an embodiment of the present invention. The embodiment of the illustrated fixing structure includes at least two through holes 10 provided at the periphery of the central processing unit slot 101 of the motherboard 100, a back plate 20 provided on the back surface of the motherboard 100, a fixing member 40 provided on the bottom surface of the radiator 30, and the back plate 20 A three-dimensional external view after assembly is shown in FIG. 2, which is composed of an insulating layer 50 provided between the mother board 100 and two bolts 60 for fastening the fixing member 40 and the back plate 20.

  As shown in FIGS. 1 and 3, FIG. 3 is a schematic sectional view of the present invention. Among them, the central processing unit slot 101 is provided in the mother board 100, and the central processing unit 102 is provided on the surface of the central processing unit slot 101.

  Two protrusion plugs 21 corresponding to the through holes 10 are provided on the back plate 20, and screw tightening holes 22 are provided inside the protrusion plugs 21. The protruding plug 21 protrudes from the back side of the mother board 100 through the through hole 10 to the surface of the mother board 100 to facilitate the alignment process when the fixing member 40 is tightened. The back plate 20 is provided with a recess 23 inside the central processing unit slot 101 to avoid contact between the back plate 20 and the soldering lead portion on the back side of the central processing unit slot 101. Furthermore, a through hole 231 may be provided in the recess 23. This through-hole 231 can improve the strength of the back plate 20 and provide a better heat dissipation effect in the back area of the central processing unit slot 101.

The radiator 30 is configured by a combination of a heat transfer body 31 and a fan 32, and a heat transfer section 33 is provided at the bottom of the heat transfer body 31.
The fixing member 40 is fastened to the bottom of the radiator 30 by a fixing screw 401. This fixing member 40 is provided on both sides of the frame 41 and the frame, and a Z-shaped pintle hook 42 extending downward is provided. A space portion 411 is provided at the central location of the frame 41, and the heat transfer portion 33 at the bottom of the radiator 30 is exposed from the space portion 411 and corresponds to the central processing unit. Further, the end of the Z-shaped pintle hook 42 is provided with a fixing hole 421 corresponding to the through hole 10 provided in the mother board 100.

  Further, an erroneous insertion prevention protrusion 412 is provided on the bottom surface of the frame, and when the fixing member 40 is attached to the lower part 30 of the radiator, the erroneous insertion prevention protrusion 412 attaches the fixing member 40 in the opposite direction due to carelessness of work. Thus, there is a function of preventing abnormal pressure on the central processing unit 102.

  The bolt 60 fastens the back plate 20 and the fixing member 40 by the fixing hole 421 and the screw tightening hole 22, and then fastens the fixing member 40 to the back plate 20. A complete stress structure is formed by avoiding damage caused when tightening to the mother board 100.

  FIG. 4 is a schematic view before fastening the fixing member of the embodiment of the present invention. The end portion where the fixing hole 421 is provided in the Z-shaped pintle hook 42 forms an inclined sandwiching angle θ on the horizontal plane before the bolt 60 is tightened. Squeezes the end of the Z-shaped pintle hook 42. At this time, the end portion of the Z-shaped pintle hook 42 causes an elastic reaction force in the opposite direction, and after the bolt 60 is tightened with the screw tightening hole 22, it is unlikely to come out due to loosening of vibration.

1 is an exploded view of a preferred embodiment of the present invention. It is a three-dimensional combination diagram of a preferred embodiment of the present invention. 1 is a schematic cross-sectional view of a preferred embodiment of the present invention. It is the schematic before the fixed piece clamp | tightening of the preferable Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Mother board 101 Central processing unit slot 102 Central processing unit 10 Through-hole 20 Back plate 21 Protrusion plug 22 Screw clamping hole 23 Recessed part 231 Passing hole 30 Radiator 31 Heat transfer body 32 Fan 33 Heat transfer part 40 Fixing member 401 Screw 41 Flexible -411 Space part 42 Z-shaped pintle hook 421 Fixing hole 412 Incorrect insertion preventing protrusion 50 Insulating layer 60 Bolt θ Inclination angle

Claims (7)

  The heat sink fixing structure of the central processing unit includes two through holes, a back plate, a fixing member, and two bolts. The two through holes are provided at the peripheral edge of the central processing unit slot on the motherboard, and the back plate is provided on the motherboard. Installed on the back side, provided with two fixing holes corresponding to the through holes on the back plate, the fixing member is fixed to the bottom of the radiator, the fixing members are further provided on the frame and both sides of the frame, and downward Two extending Z-shaped pintle hooks are provided, a space is provided in the center of the frame, the heat transfer section at the bottom of the radiator is exposed, and corresponds to the central processing unit. A heat sink fixing structure for a central processing unit, wherein a fixing hole is provided at an end, corresponding to a through hole provided in a mother board, and two bolts are fastened to a back plate and a fixing member through the fixing hole and a screw tightening hole. .   2. The radiator fixing structure for a central processing unit according to claim 1, wherein a projection for preventing erroneous insertion is provided at the bottom of the frame.   2. The radiator fixing structure for a central processing unit according to claim 1, wherein a projection for preventing erroneous insertion is provided at the bottom of the frame.   2. The radiator fixing structure for a central processing unit according to claim 1, wherein an insulating layer is provided between the back plate and the mother board.   2. The radiator fixing structure for a central processing unit according to claim 1, wherein the screw tightening hole is provided inside the protrusion plug of the back plate, and the protrusion plug is provided through the through hole from the back side of the motherboard and protrudes from the surface of the motherboard. The radiator fixing structure of the central processing unit.   2. The radiator fixing structure for a central processing unit according to claim 1, wherein a recess for avoiding a soldering lead portion of the motherboard slot is provided on the back plate. 7. The radiator fixing structure for a central processing unit according to claim 6, wherein a through hole is provided in the recess.

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