JP3117656B2 - Platinum-iridium alloy plating - Google Patents
Platinum-iridium alloy platingInfo
- Publication number
- JP3117656B2 JP3117656B2 JP09036008A JP3600897A JP3117656B2 JP 3117656 B2 JP3117656 B2 JP 3117656B2 JP 09036008 A JP09036008 A JP 09036008A JP 3600897 A JP3600897 A JP 3600897A JP 3117656 B2 JP3117656 B2 JP 3117656B2
- Authority
- JP
- Japan
- Prior art keywords
- platinum
- iridium
- alloy plating
- salt
- iii
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title claims description 31
- 229910000566 Platinum-iridium alloy Inorganic materials 0.000 title claims description 14
- HWLDNSXPUQTBOD-UHFFFAOYSA-N platinum-iridium alloy Chemical class [Ir].[Pt] HWLDNSXPUQTBOD-UHFFFAOYSA-N 0.000 title claims description 14
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 48
- 229910052697 platinum Inorganic materials 0.000 claims description 24
- 239000002244 precipitate Substances 0.000 claims description 16
- 150000003839 salts Chemical class 0.000 claims description 14
- 229910052741 iridium Inorganic materials 0.000 claims description 12
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 12
- -1 monocarboxylic acid salt Chemical class 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 4
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 claims description 4
- 150000002504 iridium compounds Chemical class 0.000 claims description 4
- MILUBEOXRNEUHS-UHFFFAOYSA-N iridium(3+) Chemical compound [Ir+3] MILUBEOXRNEUHS-UHFFFAOYSA-N 0.000 claims description 4
- 229920006395 saturated elastomer Polymers 0.000 claims description 4
- 150000001450 anions Chemical class 0.000 claims description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 2
- 239000004202 carbamide Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 claims description 2
- HRGDZIGMBDGFTC-UHFFFAOYSA-N platinum(2+) Chemical compound [Pt+2] HRGDZIGMBDGFTC-UHFFFAOYSA-N 0.000 claims description 2
- 150000003140 primary amides Chemical class 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims 2
- SNPHNDVOPWUNON-UHFFFAOYSA-J platinum(4+);tetrabromide Chemical compound [Br-].[Br-].[Br-].[Br-].[Pt+4] SNPHNDVOPWUNON-UHFFFAOYSA-J 0.000 claims 1
- 238000003756 stirring Methods 0.000 claims 1
- VFKKSKGQZDULMV-UHFFFAOYSA-J tetrafluoroplatinum Chemical compound F[Pt](F)(F)F VFKKSKGQZDULMV-UHFFFAOYSA-J 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 159000000000 sodium salts Chemical class 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 150000003058 platinum compounds Chemical class 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 159000000001 potassium salts Chemical class 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- IRXRGVFLQOSHOH-UHFFFAOYSA-L dipotassium;oxalate Chemical compound [K+].[K+].[O-]C(=O)C([O-])=O IRXRGVFLQOSHOH-UHFFFAOYSA-L 0.000 description 1
- AXZAYXJCENRGIM-UHFFFAOYSA-J dipotassium;tetrabromoplatinum(2-) Chemical compound [K+].[K+].[Br-].[Br-].[Br-].[Br-].[Pt+2] AXZAYXJCENRGIM-UHFFFAOYSA-J 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- PRWXGRGLHYDWPS-UHFFFAOYSA-L sodium malonate Chemical compound [Na+].[Na+].[O-]C(=O)CC([O-])=O PRWXGRGLHYDWPS-UHFFFAOYSA-L 0.000 description 1
- IRJFCWPVAMSCQM-UHFFFAOYSA-H trisodium;iridium(3+);hexabromide Chemical compound [Na+].[Na+].[Na+].[Br-].[Br-].[Br-].[Br-].[Br-].[Br-].[Ir+3] IRJFCWPVAMSCQM-UHFFFAOYSA-H 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Description
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【０００１】[0001]
【発明の属する技術分野】この発明は白金イリジウム合
金めっきに関する。[0001] 1. Field of the Invention [0002] The present invention relates to platinum-iridium alloy plating.
【０００２】[0002]
【従来の技術】イリジウムは、高い硬度を有するととも
に、高濃度の酸や王水、もしくはハロゲン類に対しても
優れた耐腐食性を示す金属である。近年、めっき技術の
発展に伴い、イリジウムめっきを装飾品のみならず防腐
食材及び電気接点等の材料として工業的に広く利用する
技術が開発されてきている。また、その優れた特性か
ら、イリジウムの単体めっきに限らず、イリジウムと白
金との合金めっきが、ソーダアルカリ水製造や電気めっ
きの用いられる電極分野において採用されている（類似
技術として、特開昭４８−６５１２８号公報参照）。2. Description of the Related Art Iridium is a metal having high hardness and excellent corrosion resistance to a high concentration of acid, aqua regia, or halogens. In recent years, with the development of plating technology, a technology for industrially widely using iridium plating as a material for not only decorative articles but also anti-corrosion materials and electrical contacts has been developed. Due to its excellent properties, not only iridium plating alone but also alloy plating of iridium and platinum has been adopted in the field of electrodes for producing soda alkaline water and electroplating (as a similar technique, Japanese Patent Laid-Open Publication No. 48-65128).
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
白金イリジウム合金めっき浴は強酸性であり、イリジウ
ムと白金との共析があまり良好でなく実用的でなかっ
た。また、浴の寿命もあまり長くなかった。However, the conventional platinum-iridium alloy plating bath is strongly acidic, and the co-deposition of iridium and platinum is not so good and is not practical. The service life of the bath was not very long.
【０００４】本発明は、このような従来の技術に着目し
てなされたものであり、良好な析出物を得ることができ
る実用的な白金イリジウム合金めっき浴及びめっき方法
を提供するものである。The present invention has been made in view of such prior art, and provides a practical platinum-iridium alloy plating bath and a plating method capable of obtaining a good precipitate.
【０００５】[0005]
【課題を解決するための手段】この発明に係る白金イリ
ジウム合金めっき浴は、アニオン成分がハロゲンである
イリジウム(III) 錯塩に、飽和モノカルボン酸、飽和モ
ノカルボン酸塩、飽和ジカルボン酸、飽和ジカルボン酸
塩、ヒドロキシカルボン酸、ヒドロキシカルボン酸塩、
第一アミド、尿素の群より選ばれた一種以上の化合物を
加えて撹拌したイリジウム化合物をイリジウム量として
１〜３０ｇ／ｌ含有し、且つアニオン成分がハロゲンで
ある白金(II)錯塩を白金量として０．１〜３０ｇ／ｌ含
有している。The platinum iridium alloy plating bath according to the present invention is characterized in that an iridium (III) complex salt in which an anionic component is halogen is added to a saturated monocarboxylic acid, a saturated monocarboxylic acid salt, a saturated dicarboxylic acid, a saturated dicarboxylic acid, Acid salts, hydroxycarboxylic acids, hydroxycarboxylic acid salts,
Primary amide, one or more compounds selected from the group of urea are added and stirred, and the iridium compound is contained in an amount of 1 to 30 g / l as an iridium amount, and a platinum (II) complex salt in which an anion component is a halogen is defined as an amount of platinum. It contains 0.1 to 30 g / l.
【０００６】[0006]
【発明の実施の形態】イリジウム化合物の含有量は、前
述のように、金属イリジウム濃度で１〜３０ｇ／ｌの範
囲で使用可能であるが、好ましくは５〜２０ｇ／ｌの範
囲が良い。１ｇ／ｌより少ないと電流密度の上限が小さ
くなって実用に供することが難しくなり、３０ｇ／ｌよ
り多いとコストが高くなり実用上不適となる。DETAILED DESCRIPTION OF THE INVENTION As described above, the content of the iridium compound can be used in the range of 1 to 30 g / l in terms of metal iridium concentration, but is preferably in the range of 5 to 20 g / l. If it is less than 1 g / l, the upper limit of the current density becomes small and it becomes difficult to put it to practical use. If it is more than 30 g / l, the cost becomes high and it becomes practically unsuitable.
【０００７】イリジウム(III) 錯塩としては、ヘキサク
ロロイリジウム(III) 酸塩（好ましくはナトリウム
塩）、ヘキサブロモイリジウム(III) 酸塩（好ましくは
ナトリウム塩）、ヘキサフルオロイリジウム(III) 酸塩
が良い。As iridium (III) complex salts, hexachloroiridium (III) salts (preferably sodium salts), hexabromoiridium (III) salts (preferably sodium salts), and hexafluoroiridium (III) salts are good. .
【０００８】白金化合物の含有量としては、前述のよう
に、金属白金濃度で０．１〜３０ｇ／ｌであるが、好ま
しくは０．５〜２０ｇ／ｌの範囲が良い。０．１ｇ／ｌ
より低いと、有意な合金比率が得られず、１５ｇ／ｌよ
り高いと、くみ出しによる白金の消費が多くなる。As described above, the content of the platinum compound is 0.1 to 30 g / l, preferably 0.5 to 20 g / l in terms of metal platinum concentration. 0.1 g / l
If it is lower, a significant alloy ratio is not obtained, and if it is higher than 15 g / l, the consumption of platinum by extraction is increased.
【０００９】白金化合物としては、テトラクロロ白金(I
I)酸塩（好ましくはカリウム塩、ナトリウム塩）、テト
ラブロモ白金(II)酸塩（好ましくはカリウム塩、ナトリ
ウム塩）、テトラフルオロ白金(II)酸塩が良い。As the platinum compound, tetrachloroplatinum (I
I) acid salts (preferably potassium salts and sodium salts), tetrabromoplatinates (preferably potassium salts and sodium salts), and tetrafluoroplatinates (II) are good.
【００１０】本発明のめっき方法は、ｐＨ１〜８（最も
良いのはｐＨ４〜５）の弱酸性浴で行うのが特徴であ
る。ｐＨ１〜８としたのは、ｐＨが１より小さいと電流
密度の上限が小さくなり、また浴の寿命も短くなる。ｐ
Ｈが８より大きいと水酸化物を生成し沈殿が生ずるから
である。[0010] The plating method of the present invention is characterized in that the plating is performed in a weakly acidic bath having a pH of 1 to 8 (the best being pH 4 to 5). The reason for setting the pH to 1 to 8 is that if the pH is lower than 1, the upper limit of the current density becomes smaller, and the life of the bath also becomes shorter. p
This is because if H is larger than 8, a hydroxide is formed and precipitation occurs.
【００１１】他の操作条件としては、温度５０〜９８℃
（好ましくは、温度８０〜９０℃）で、電流密度０．１
〜３．０Ａ／ｄｍ2 （好ましくは、電流密度０．５〜
２．０Ａ／ｄｍ2 ）である。温度が５０℃より低いと極
端に析出が起こりにくくなり、温度が９８℃より高いと
水の蒸発が激しくなり実用上好ましくなくなる。そして
また、電流密度が０．１Ａ／ｄｍ2 より低い場合は析出
速度が極端に小さくなり、３．０Ａ／ｄｍ2 より高い電
流密度の場合は水素の発生が起こり、析出物が析出しな
くなる。[0011] Other operating conditions include a temperature of 50 to 98 ° C.
(Preferably at a temperature of 80 to 90 ° C.) and a current density of 0.1
To 3.0 A / dm 2 (preferably, a current density of 0.5 to
2.0 A / dm 2 ). If the temperature is lower than 50 ° C., precipitation is extremely unlikely to occur, and if the temperature is higher than 98 ° C., evaporation of water becomes severe, which is not practically preferable. When the current density is lower than 0.1 A / dm 2 , the deposition rate becomes extremely low. When the current density is higher than 3.0 A / dm 2 , hydrogen is generated, and no precipitate is deposited.
【００１２】また、本発明のめっき方法では、浴中の白
金濃度を変化させたり、電流密度を変化させたりするこ
とにより、白金とイリジウムとの比率を制御することが
できる。すなわち、浴中の白金濃度を高めれば、析出物
中における白金の比率を高めることができ、電流密度を
高めれば析出物中における白金の比率を低くすることが
できる。従って、めっきを行っている最中に上記のよう
な２つの要因を変化させることにより、析出物の組成に
傾斜機能を与えることができる。すなわち、所定の厚さ
を有した析出物の厚さ内において、下地層側から表層側
へかけて徐々に白金比率を変化させることができる。従
って、用途に応じた白金イリジウム合金めっき層を得る
ことができる。In the plating method of the present invention, the ratio of platinum to iridium can be controlled by changing the concentration of platinum in the bath or changing the current density. That is, if the concentration of platinum in the bath is increased, the ratio of platinum in the precipitate can be increased, and if the current density is increased, the ratio of platinum in the precipitate can be reduced. Therefore, a gradient function can be given to the composition of the precipitate by changing the above two factors during plating. That is, within the thickness of the precipitate having a predetermined thickness, the platinum ratio can be gradually changed from the base layer side to the surface layer side. Therefore, a platinum-iridium alloy plating layer suitable for the intended use can be obtained.
【００１３】[0013]
【実施例】以下の組成及び条件で実施例を行った。尚、
イリジウム化合物及び白金化合物はそれぞれメタル濃度
を示している。EXAMPLES Examples were carried out under the following compositions and conditions. still,
The iridium compound and the platinum compound each indicate a metal concentration.
【００１４】 実施例１： ＊ヘキサクロロイリジウム(III) 酸ナトリウム １０ｇ／ｌ ＊ホウ酸 ４０ｇ／ｌ ＊マロン酸二ナトリウム ０．０２ｍｏｌ／ｌ ＊テトラクロロ白金(II)酸カリウム ０．５〜３ｇ／ｌ ＊ｐＨ ５ ＊温度 ８５℃ ＊電流密度 ０．５Ａ／ｄｍ2 Example 1: * Sodium hexachloroiridate (III) 10 g / l * Boric acid 40 g / l * Disodium malonate 0.02 mol / l * Potassium tetrachloroplatinate (II) 0.5-3 g / l * PH 5 * Temperature 85 ° C * Current density 0.5A / dm 2
【００１５】 実施例２： ＊ヘキサブロモイリジウム(III) 酸ナトリウム １０ｇ／ｌ ＊ホウ酸 ４０ｇ／ｌ ＊シュウ酸カリウム ０．０２ｍｏｌ／ｌ ＊テトラブロモ白金(II)酸カリウム ７ｇ／ｌ ＊ｐＨ ２ ＊温度 ８５℃ ＊電流密度 ０．５Ａ／ｄｍ2 Example 2: * Sodium hexabromoiridium (III) 10 g / l * 40 g / l boric acid * 0.02 mol / l potassium oxalate * 7 g / l potassium tetrabromoplatinate (II) * pH 2 * Temperature 85 ° C * Current density 0.5A / dm 2
【００１６】予め真鍮片に金ストライクめっきを施し、
更にその上に１μｍの金めっきを施した試験片に、上記
の各組成の白金イリジウム合金めっき浴でめっきを行な
ったところ、光沢ある析出物が得られた。そしてこの析
出物は硬度、密着性、耐熱性、ボンディング性等におい
て良好な特性を備えていることが確認できた。また、電
流効率は１００％であった。浴の寿命も従来に比べて長
くなった。A gold strike plating is applied to a brass piece in advance,
Further, when a 1 μm gold-plated test piece was further plated with a platinum-iridium alloy plating bath of each of the above compositions, a glossy precipitate was obtained. And it was confirmed that the precipitate had good properties in hardness, adhesion, heat resistance, bonding property and the like. The current efficiency was 100%. The service life of the bath is longer than before.
【００１７】また、実施例１の浴の白金濃度を変化させ
て実験したが、図１に示すように、合金めっき浴の白金
濃度が高い方が、析出物の白金比率が高いことが判明し
た。従って、めっきを行っている最中に白金濃度を変化
させれば、析出物中の表層側と下地層側とで異なった白
金比率を有する析出物を得ることができる。Further, experiments were conducted by changing the platinum concentration of the bath of Example 1. As shown in FIG. 1, it was found that the higher the platinum concentration of the alloy plating bath, the higher the platinum ratio of the precipitate. . Therefore, if the platinum concentration is changed during plating, a precipitate having a different platinum ratio between the surface layer side and the underlayer side in the precipitate can be obtained.
【００１８】[0018]
【発明の効果】本発明によれば、良好な析出物を得るこ
とができると共に、めっき浴の寿命を長くでき、更に析
出物の白金比率を容易に変化させることができるため、
産業上大変に有益である。According to the present invention, a good precipitate can be obtained, the life of the plating bath can be extended, and the platinum ratio of the precipitate can be easily changed.
It is very useful in industry.
【図１】めっき浴中の白金濃度と析出物の白金比率との
関係を示すグラフ。FIG. 1 is a graph showing a relationship between a platinum concentration in a plating bath and a platinum ratio of precipitates.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) C25D 3/56 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 7 , DB name) C25D 3/56
Claims (5)
ム(III) 錯塩に、飽和モノカルボン酸、飽和モノカルボ
ン酸塩、飽和ジカルボン酸、飽和ジカルボン酸塩、ヒド
ロキシカルボン酸、ヒドロキシカルボン酸塩、第一アミ
ド、尿素の群より選ばれた一種以上の化合物を加えて撹
拌したイリジウム化合物をイリジウム量として１〜３０
ｇ／ｌ含有し、且つアニオン成分がハロゲンである白金
(II)錯塩を白金量として０．１〜３０ｇ／ｌ含有してい
ることを特徴とする白金イリジウム合金めっき浴。1. An iridium (III) complex salt in which an anion component is a halogen, a saturated monocarboxylic acid, a saturated monocarboxylic acid salt, a saturated dicarboxylic acid, a saturated dicarboxylic acid salt, a hydroxycarboxylic acid, a hydroxycarboxylic acid salt, a primary amide. And an iridium compound obtained by adding and stirring one or more compounds selected from the group consisting of urea to an iridium amount of 1 to 30.
g / l and platinum whose anion component is halogen
(II) A platinum-iridium alloy plating bath containing a complex salt in an amount of 0.1 to 30 g / l in terms of platinum.
イリジウム(III) 酸塩、ヘキサブロモイリジウム(III)
酸塩、ヘキサフルオロイリジウム(III) 酸塩の群より選
ばれた一種以上である請求項１記載の白金イリジウム合
金めっき浴。2. The iridium (III) complex salt is hexachloroiridium (III) salt, hexabromoiridium (III)
The platinum iridium alloy plating bath according to claim 1, which is at least one member selected from the group consisting of an acid salt and hexafluoroiridium (III) acid salt.
酸塩、テトラブロモ白金(II)酸塩、テトラフルオロ白金
(II)酸塩の群より選ばれた一種以上である請求項１又は
請求項２記載の白金イリジウム合金めっき浴。3. The platinum (II) complex salt is tetrachloroplatinum (II)
Acid salt, tetrabromoplatinate (II) salt, tetrafluoroplatinum
3. The platinum-iridium alloy plating bath according to claim 1, which is at least one selected from the group of (II) acid salts.
金イリジウム合金めっき浴をｐＨ１〜８で使用し、浴中
の白金濃度を変化させながらめっきを行うことにより、
白金とイリジウムとの比率を析出物の厚さ内で変化させ
る白金イリジウム合金めっき方法。4. A plating method using the platinum-iridium alloy plating bath according to claim 1 at a pH of 1 to 8 and performing plating while changing the platinum concentration in the bath.
A platinum-iridium alloy plating method in which the ratio of platinum to iridium is changed within the thickness of the precipitate.
金イリジウム合金めっき浴をｐＨ１〜８で使用し、電流
密度を変化させながらめっきを行うことにより、白金と
イリジウムとの比率を析出物の厚さ内で変化させる白金
イリジウム合金めっき方法。5. The platinum-iridium alloy plating bath according to claim 1 is used at a pH of 1 to 8 and plating is performed while changing a current density, so that the ratio of platinum to iridium is reduced. Platinum-iridium alloy plating method that varies within the thickness of the precipitate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09036008A JP3117656B2 (en) | 1997-02-20 | 1997-02-20 | Platinum-iridium alloy plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09036008A JP3117656B2 (en) | 1997-02-20 | 1997-02-20 | Platinum-iridium alloy plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10237686A JPH10237686A (en) | 1998-09-08 |
| JP3117656B2 true JP3117656B2 (en) | 2000-12-18 |
Family
ID=12457747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09036008A Expired - Fee Related JP3117656B2 (en) | 1997-02-20 | 1997-02-20 | Platinum-iridium alloy plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3117656B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100291312A1 (en) | 2007-10-22 | 2010-11-18 | National Institute For Materials Science | Electroless plating method for alloy coating film and plating liquid |
| JP4855494B2 (en) * | 2009-04-14 | 2012-01-18 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Iridium plating solution and plating method thereof |
-
1997
- 1997-02-20 JP JP09036008A patent/JP3117656B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10237686A (en) | 1998-09-08 |
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