JP3117439B1 - Pinching socket - Google Patents

Abstract

An object of the present invention is to improve the reliability of contact between a pin-type socket and an electrode pad of a printed circuit board. In particular, appropriately remove glass dust on the surface of the electrode pad on the substrate,
Ensure sound contact with the socket. Kind Code: A1 A first and second upper contact sandwiching piece which sandwiches an end portion of a printed circuit board and makes pressure contact with upper portions of first and second electrode pads disposed opposite to both surfaces of the end portion. First and second lower contact holding pieces having pressure contact with the lower portions of the first and second electrode pads 2 and 3 immediately below the first and second upper contact holding pieces 4 and 5, respectively. The first contact 8 is provided by the first upper contact holding piece 4 and the first lower contact holding piece 6, and the first contact 8 is provided by the second upper contact holding piece 5 and the second lower contact holding piece 7. A second contact 9 is formed, and an end of the substrate 1 is connected to the first and second upper contact holding pieces 4.
After being interposed between the first and second lower contact holding pieces 6, 7,
A pinched socket interposed between them.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pin-type socket used for connecting a printed circuit board on which electronic components are mounted or an electronic component itself to another printed circuit board, for example, for use in burn-in inspection.

[0002]

2. Description of the Related Art As shown in FIG. 1, an end of a printed circuit board 1 is sandwiched between contact pads of this type, and pressure contact is made to electrode pads 2 and 3 which are arranged on both sides of the end. The first and second contact holding pieces 4 and 5 are provided, and the first contact holding piece 4 constitutes the first contact 6 and the second contact holding piece 5 constitutes the second contact 7.

[0003]

However, since the contacts in the above-mentioned pinched socket are of a single point contact type with a single electrode pad, it is difficult to secure a contact area.
The allowable current that can flow is limited.

Further, this type of wiring circuit board uses a synthetic resin containing glass fiber as an insulating substrate to increase heat resistance and strength. However, dust of the glass fiber adheres to the surface of the electrode pad. There is a problem that only the adhering dust is swept up to the final press contact position, which remains between the press contact portion of the contact and the electrode pad, thereby impairing the reliability of the contact. This problem also applies to the removal of the oxide film formed on the surface of the electrode pad.

Further, there is a fear that the printed circuit board may be inclined with the contact point of the first and second contact holding pieces as a fulcrum,
There is a problem inferior to the upright holding function.

[0006]

SUMMARY OF THE INVENTION The present invention provides a pinched socket for a printed circuit board which ameliorates the above problems.

[0007] In this sandwiching type socket, first and second first and second opposing faces are arranged on both sides of the end of the printed circuit board while sandwiching the end.
First and second upper contact holding pieces that are in pressure contact with the upper portions of the electrode pads are provided, and an end of the printed circuit board is held immediately below the first and second upper contact holding pieces. , The first and second pressure contact with the lower part of the second electrode pad
A lower contact clamping piece was provided.

A first contact is formed by the first upper contact holding piece and the first lower contact holding piece, and a second contact is formed by the second upper contact holding piece and the second lower contact holding piece. And the end of the printed circuit board is the first,
After intervening between the second upper contact holding pieces, it is configured to intervene between the first and second lower contact holding pieces.

The first and second upper contact holding pieces are arranged so that the punched plate faces are spaced apart from each other.
The second lower contact holding pieces are arranged so that the punched plate faces are opposed to each other and are separated from each other. Further, the first upper contact holding piece and the first lower contact holding piece forming the first contact have the punched plate faces inside and outside. A second upper contact holding piece and a second lower contact holding piece which are arranged side by side so as to be opposed to each other in the direction, and whose lower ends are connected to each other by a connecting portion on a plate thickness surface, and which similarly form the second contactor. Are arranged side by side so that the punched plate surfaces face and separate from each other in the inner and outer directions, and each lower end is connected to each other by a connecting portion on a plate thickness surface,
The first and second contacts are implanted and held at the bottom of the socket body at the portion having each of the connecting portions, and the first and second upper contact holding pieces and the first and second contacts are implanted from the implanted portion.
The lower contact holding piece was raised, and the mounting terminals were respectively lowered from the respective implanted portions.

[0010] With the structure of the sandwich type socket, two-point contact is formed at the upper and lower portions of the single electrode pad to increase the contact area, and the glass dust adhering to the surface of the electrode pad is removed. Cleaning is performed with the first and second upper contact holding pieces, and the first and second lower contact holding pieces are brought into sound contact with the cleaning surface.

The interval between the press contact portions of the first and second lower contact sandwiching pieces is set to be larger than the interval between the press contact portions of the first and second upper contact sandwiching pieces. It is configured to be placed in a state.

The present invention also provides a pinched socket for electronic components having the same meaning as described above. Similar to the above, this pinching type socket is provided with first and second upper contact pinching pieces for pinching a male terminal protruding from an electronic component typified by an IC package and pressing and contacting the upper part of the male terminal. In addition, there are provided first and second lower contact holding pieces that hold the male terminal immediately below the first and second upper contact holding pieces and press-contact the lower part of the male terminal.

A first contact is constituted by the first upper contact holding piece and the first lower contact holding piece, and a second contact is formed by the second upper contact holding piece and the second lower contact holding piece. The male terminal is interposed between the first and second upper contact holding pieces and then interposed between the first and second lower contact holding pieces.

Further, the first and second upper contact holding pieces are arranged so that the punched plate faces are spaced apart from each other.
The second lower contact holding pieces are arranged so that the punched plate faces are opposed to each other and are separated from each other. Further, the first upper contact holding piece and the first lower contact holding piece forming the first contact have the punched plate faces inside and outside. A second upper contact holding piece and a second lower contact holding piece which are arranged side by side so as to be opposed to each other in the direction, and whose lower ends are connected to each other by a connecting portion on a plate thickness surface, and which similarly form the second contactor. Are arranged side by side so that the punched plate surfaces face and separate from each other in the inner and outer directions, and each lower end is connected to each other by a connecting portion on a plate thickness surface,
The first and second contacts are implanted and held at the bottom of the socket body at the portion having each of the connecting portions, and the first and second upper contact holding pieces and the first and second contacts are implanted from the implanted portion.
The lower contact holding piece was raised, and the mounting terminals were respectively lowered from the respective implanted portions.

[0015] With the structure of the sandwich type socket, a four-point contact is formed at the upper and lower portions of a single male terminal to increase the contact area, and an oxide film formed on the surface of the male terminal Is cleaned with the first and second upper contact holding pieces, and the first and second lower contact holding pieces are brought into sound contact with the cleaning surface.

The interval between the press contact portions of the first and second lower contact sandwiching pieces is set to be larger than the interval between the press contact portions of the first and second upper contact sandwiching pieces, and the standby state is established. It is configured to be placed in a state.

The first and second lower contact holding pieces do not need to be provided with a cleaning function, and the reduced contact pressure is applied to the surface of the electrode pad or the male terminal cleaned by the first and second upper contact holding pieces. The pressure contact can be made soundly, and the insertion force of the printed circuit board or the electronic component can be reduced.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to FIGS.

The first and second electrode pads 2 and 3 which press the first and second electrode pads 2 and 3 which are opposed to both sides of the end of the printed circuit board 1 while holding the end of the printed circuit board 1 in the sandwiching type socket. The second upper contact holding pieces 4 and 5 are provided.

In addition, the first and second upper contact holding pieces 4, 4
5, first and second lower contact holding pieces 6 and 7 which hold the end of the printed circuit board 1 and press contact with the lower portions of the first and second electrode pads 2 and 3 are provided.

The first upper contact holding piece 4 and the first lower contact holding piece 6 constitute a first contact 8 and the second upper contact holding piece 5 and the second lower contact holding piece 7.
Constitutes the second contact 9 and the printed circuit board 1
Is interposed between the first and second upper contact holding pieces 4 and 5 and then interposed between the first and second lower contact holding pieces 6 and 7.

With the structure of the above-mentioned pinched socket, two-point contact is formed at the upper and lower portions of the single electrode pads 2 and 3 to increase the contact area, and the surface of the electrode pads 2 and 3 is increased. The attached glass dust is cleaned by the first and second upper contact holding pieces 4 and 5, and the first and second lower contact holding pieces 6 and 7 are brought into sound contact with the cleaning surface.

As a suitable example, the first and second upper contact holding pieces 4 and 5 and the first and second lower contact holding pieces 6 and 7 are arranged symmetrically and the first and second upper contact holding pieces 4 and 5 are arranged in the left and right directions. The interval W2 between the pressing contact portions of the first and second lower contact sandwiching pieces 6 and 7 is set to be larger than the interval W1 between the pressing contact portions of the sandwiching pieces 4 and 5, and is placed in a standby state. Configuration.

The present invention also provides a pinched socket for electronic components having the same meaning as described above. Similarly to the above, first and second upper contact holding pieces 4 for holding the male terminal 10 protruding from an electronic component typified by an IC package and making pressure contact with the upper part of the male terminal 10 in this sandwich type socket. , 5,
In addition, first and second lower contact holding pieces 6 and 7 are provided immediately below the first and second upper contact holding pieces 4 and 5 to hold the male terminal 10 and make pressure contact with a lower portion of the male terminal 10. I was sorry.

The first upper contact holding piece 4 and the first lower contact holding piece 6 constitute a first contact 8, and the second upper contact holding piece 5 and the second lower contact holding piece 7.
Constitutes the second contact 9, and after the male terminal 10 is interposed between the first and second upper contact holding pieces 4 and 5, the male terminal 10 is interposed between the first and second lower contact holding pieces 6 and 7. Configuration.

With the structure of the sandwich type socket, a four-point contact is formed at the upper and lower portions of the single male terminal 10 to increase the contact area, and is formed on the surface of the male terminal 10. The oxide film is cleaned by the first and second upper contact holding pieces 4 and 5, and the first and second lower contact holding pieces 6 and 7 are brought into sound contact with the cleaning surface.

As a suitable example, while the first and second upper contact holding pieces 4 and 5 and the first and second lower contact holding pieces 6 and 7 are symmetrically arranged, the first and second upper contact holding pieces 4 and 5 are arranged symmetrically. The interval W2 between the pressing contact portions of the first and second lower contact sandwiching pieces 6 and 7 is set to be larger than the interval W1 between the pressing contact portions of the sandwiching pieces 4 and 5, and is placed in a standby state. Configuration.

The first and second lower contact holding pieces 6 and 7 do not need to have a cleaning function, and the electrode pads 2 and 3 or the male terminals 10 cleaned by the first and second upper contact holding pieces 4 and 5 are not required. Can be soundly pressed against the surface of the printed circuit board with a reduced contact pressure, and the insertion force of the printed circuit board 1 or the electronic component can be reduced.

The socket body 13 holding the contacts 8, 9 is made of an insulating material, and the socket body 13 receives the end of the printed circuit board 1 or the male terminal 10 of the electronic component.
It has a receptacle 14 that opens at the center of the upper surface.

The receiving port 14 is connected to the printed circuit board 1
Is a long groove that receives the end of the printed circuit board 1 and extends along the upper surface of the socket body 13. When the contact target is the male terminal 10 of an electronic component, each male terminal 10 is Small holes to accept individually or male terminal 1
A groove similar to that described above, which accepts 0s in a lump.

The first and second upper contact holding pieces 4 and 5 and the first and second lower contact holding pieces 6 and 7 are arranged so as to be vertically coaxial with each other when viewed from the facing surface side. And the printed circuit board 1 is disposed in the receiving port 14 so as to face each other.
And the male terminal 10 in the insertion direction.

The first and second contacts 8, 9 are individually inserted into the contact accommodating grooves 15, 16, respectively.
Are separated by partition walls 17 and 18 between the grooves.
5 and 16 extend upward from below.

When the object to be contacted is the printed circuit board 1, the contact receiving grooves 15, 16 are formed as receiving holes 14 formed of long grooves.
Are arranged side by side along the longitudinal direction of the
The pressure contact portions 29, 30, 31, 32 of 6, 7 project from the contact accommodating grooves 15, 16 into the receptacle 14.

The first contact 8 comprising the first upper contact holding piece 4 and the first lower contact holding piece 6 is punched from a metal strip and bent. Similarly, the second contact 9 comprising the second upper contact holding piece 5 and the second lower contact holding piece 7 is punched from a metal strip and bent.

The first and second upper contact holding pieces 4, 5
Are arranged so that the punched plate faces face each other and are separated from each other. Similarly, the first and second lower contact holding pieces 6 and 7 are arranged so that the punched plate surfaces are opposed to and separated from each other.

The surface of the punched plate means the surface of the metal strip, that is, the surface of the strip on which the punching blade is driven and punched.

The first upper contact holding piece 4 and the first lower contact holding piece 6 forming the first contact 8 are arranged side by side so that the punched plate faces are separated from each other in the inside and outside directions, and each lower end thereof Are punched out so that they are connected to each other by a connecting portion 19 on a plate thickness surface which is originally a punched shearing surface, and one is bent 180 degrees to the other via the connecting portion 19 to form the above-mentioned facing state in the inside and outside directions. doing.

The second upper contact holding piece 5 and the second lower contact holding piece 7 forming the second contactor 9 are juxtaposed with each other such that the punched plate faces are spaced apart from each other in the inner and outer directions. Are punched out so that they are connected to each other by a connecting portion 20 on a plate thickness surface that is originally a punched shearing surface, and one is bent 180 degrees to the other via the connecting portion 20 to form the above-mentioned facing state in the inside and outside directions. doing. Both the connecting portions 19 and 20 are arranged on the same side in the contact arrangement direction.

The first and second contacts 8, 9 have mounting terminals 11, 12 which penetrate the socket body 13 and protrude downward at the bottom of the socket 14. The mounting terminals 11, 1
Reference numeral 2 denotes mounting means for connecting the printed circuit board 1 or the electronic component to another printed circuit board.

The mounting terminals 11 and 12 extend downward from the lower ends of the first and second upper contact holding pieces 4 and 5 in the direction in which the mounting terminals 11 and 12 extend. 2 The connecting portion 19,
20 are provided.

Expanding pieces 23, 24, 27, and 28 that expand upward are connected to the upper ends of the contact holding pieces 4, 5, 6, and 7, respectively. Guide the insertion of 10.

Further, the first and second upper contact holding pieces 4, 4
5 a restricting piece 2 extending outward at the upper end of the expanding pieces 23 and 24
The free ends of the restriction pieces 21 and 22 are received in the restriction grooves 25 and 26 formed in the socket main body 13 to prevent steadying.

On the other hand, the expanded ends 27 and 28 of the first and second lower contact holding pieces 6 and 7 have their free ends connected to the press contact portions 29 and 30 of the first and second upper contact holding pieces 4 and 5. Dispose outside and arrange. Thus, the lower end surface of the end portion of the printed circuit board 1 or the lower end surface of the male terminal 10 that has passed through the pressure contact portions 29, 30 does not interfere with the expanded pieces 27, 28.

The above-mentioned press contact portions 29 and 30 are
The pressure contact portions 31 and 32 are similarly provided at the lower ends of the expanding pieces 27 and 28.

The distance W between the upper pressure contact portions 29 and 30
1, the distance W2 between the lower pressure contact portions 31 and 32
Is set slightly larger.

The first and second contacts 8 and 9 are firmly implanted and held at the bottom of the socket body 13 at the portions having the coupling portions 19 and 20, and the first and second upper contact sandwiches from the implanted portion. The pieces 4, 5 and the first and second lower contact holding pieces 6, 7 are raised, and the mounting terminals 11, 12 are lowered from the implanted portion.

As shown in FIGS. 2 and 3, the printed circuit board 1
Is inserted into the receptacle 14 and interposed between the upper pressure contact portions 29 and 30. By this intervention, the first and second upper contact holding pieces 4 and 5 are displaced outward against their elasticity, and the restoring force causes the electrode pads 2 and 2 to move outward.
3 or both sides of the male terminal 10 under pressure.

As shown in FIG. 4, when the insertion of the electrode pads 2 and 3 of the printed circuit board 1 or the male terminal 10 of the electronic component is continued, both receive the pressure contact by the pressure contact portions 29 and 30. The first and second lower contact sandwiching pieces 6 and 7 are interposed between the press contact portions 31 and 32, and come into press contact with both lower sides of the electrode pads 2 and 3 or the male terminal 10 by the restoring force.

The glass dust adhered to the surfaces of the electrode pads 2 and 3 or the oxide film formed on the surface of the male terminal 10 is removed by the upper press contact portions 29 and 30.
Thereafter, the lower pressure contact portions 31 and 32 soundly contact the cleaning surface.

[0050]

According to the structure of the above-mentioned pinched socket, two-point contact is formed at the upper and lower portions of each of the electrode pads disposed opposite to the front and back surfaces of the end of the printed circuit board to be contacted. And the glass dust adhering to the surface of the electrode pad is cleaned by the first and second upper contact holding pieces, and the first and second lower contact holding pieces are brought into sound contact with the cleaning surface. be able to.

Further, the structure of the above-mentioned pinching type socket forms four-point contact at the upper and lower parts with respect to the male terminal of the electronic component to be contacted, thereby increasing the contact area and forming on the surface of the male terminal. The oxide film is cleaned with the first and second upper contact holding pieces, and the first and second lower contact holding pieces can be brought into sound contact with the cleaning surface.

The first and second lower contact holding pieces do not need to be provided with a cleaning function, and are applied to the surfaces of the electrode pads or the male terminals cleaned by the first and second upper contact holding pieces with reduced contact pressure. The pressure contact can be made soundly, and the insertion force of the printed circuit board or the electronic component can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view of a conventional pinching socket.

FIG. 2 is a longitudinal sectional view in the lateral direction showing an initial process of pressurized contact by the pinching socket according to the present invention.

FIG. 3 is a longitudinal sectional view showing an intermediate process of pressurized contact by the sandwich type socket according to the present invention.

FIG. 4 is a longitudinal sectional view showing a state where pressure contact by the sandwiching socket according to the present invention is completed.

FIG. 5 is a plan view of the pinching socket.

FIG. 6 is a longitudinal sectional view in the longitudinal direction showing the sandwich type socket in a state of pressurized contact with a contact object.

FIG. 7 is a cross-sectional view of the pinching socket.

FIG. 8 is a perspective view of a contact held by the pinching socket.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring circuit board 2, 3 Electrode pad 4 1st upper contact holding piece 5 2nd upper contact holding piece 6 1st lower contact holding piece 7 2nd lower contact holding piece 8 1st contact 9 2nd contact 10 Male terminal 11, 12 Mounting terminal 13 Socket body 14 Receptacle 15, 16 Contact receiving groove 17, 18 Partition wall 19, 20 Connecting part 21, 22 Restricting piece 23, 24 Expanding piece 25, 26 Restricting groove 27, 28 Expanding piece 29, 30 pressure contact part 31, 32 pressure contact part

──────────────────────────────────────────────────続 き Continuing on the front page (72) Eiji Kobori 3-28-7 Nakamagome, Ota-ku, Tokyo Inside Yamaichi Electric Co., Ltd. (72) Takumi Nishikido 1-1-1 Yawata, Kumamoto City, Kumamoto Prefecture Inside Kyushu NEC Corporation (72) Inventor Toshihiro Fujishita 1-1-1, Hachiman, Kumamoto City, Kumamoto Prefecture Inside Kyushu NEC Corporation (72) Mikihisa Shirakami 1-1-1, Yawata, Kumamoto City, Kumamoto Prefecture Kyushu Japan Inside Electric Co., Ltd. (56) References Japanese Utility Model Sho 58-7747 (JP, U) Japanese Utility Model Sho 51-7633 (JP, U) Japanese Utility Model Sho 48-30755 (JP, U) (58) Fields surveyed (Int .Cl. ⁷ , DB name) H01R 12/18 H01R 12/16

Claims (2)

(57) [Claims] A first and a second upper contact holding piece for holding an end of the printed circuit board and pressing the upper and lower electrode pads opposed to each other on both sides of the end; A first and a second lower contact holding piece for holding an end of the printed circuit board immediately below the first and the second upper contact holding pieces and for pressing and contacting the lower part of the first and the second electrode pads; The first upper contact holding piece and the first lower contact holding piece form a first
A contact is formed, and a second contact is formed by the second upper contact holding piece and the second lower contact holding piece, and an end of the printed circuit board is located between the first and second upper contact holding pieces. After being intervened, the pinching socket is configured to be interposed between the first and second lower contact holding pieces.
The contacting holding pieces are arranged with the punched plate faces facing each other and separated
Then, similarly, the first and second lower contact holding pieces are struck together.
The punched plate surfaces are arranged facing each other and separated from each other.
The first upper contact holding piece and the first lower contact holding piece to be formed
The punched plate faces are separated from each other in the inside and outside directions
So that the lower ends are mutually
Connected by a connecting portion to form the second contact in the same manner
The second upper contact holding piece and the second lower contact holding piece
The punched plate surfaces are opposed to each other in the inside and outside directions.
And the lower ends are connected to each other on the thick surface
The first and second contacts are connected by a
Implanted at the bottom of the socket body at the site with the joint
And holding the first and second upper contact pins from the implanted portion.
The holding piece and the first and second lower contact holding pieces are raised, and
The mounting terminals are individually lowered from each of the implanted portions,
The distance between the press contact portions of the second upper contact holding piece is the first,
The distance between the press contact portions of the second lower contact holding piece becomes large.
Characterized in that the socket is set so as to form a standby state . 2. A method according to claim 1, further comprising: first and second upper contact holding pieces for holding the male terminal protruding from the electronic component and pressing and contacting the upper part of the male terminal. Immediately below, there are first and second lower contact holding pieces that hold the male terminal and make pressure contact with a lower part of the male terminal, and the first upper contact holding piece and the first lower contact holding piece make a first contact. And a second contact formed by the second upper contact holding piece and the second lower contact holding piece. After the male terminal is interposed between the first and second upper contact holding pieces, Clamping type buckle configured to intervene between the first and second lower contact clamping pieces
The first and second upper contact holding pieces are mutually
The punched plate surfaces are arranged facing each other and separated from each other.
The second lower contact holding pieces are stamped and the plate faces are separated from each other.
And a first upper contact forming the first contact
The holding piece and the first lower contact holding piece are mutually stamped
The surfaces are arranged side by side so as to be opposed to each other in the inward and outward directions, and
Are connected to each other by connecting parts
And a second upper contact clamp similarly forming the second contact
The piece and the second lower contact holding piece have the punched plate surface
Are arranged side by side so as to face each other in the inward and outward directions, and
The lower ends are connected to each other on a plate thickness surface by a connecting portion,
The first and second contacts are provided at the portions having the respective connection portions.
And implanted and held at the bottom of the socket body.
From the first and second upper contact holding pieces and the first and second upper contact holding pieces.
Start up the lower contact holding piece and mount from each implanted part
The terminals are respectively lowered, and the first and second upper contact holding pieces are
Of the first and second lower contact holding pieces with respect to the interval between the pressure contact portions.
Set the interval between the pressure contact parts to be large and set the standby state.
A sandwich type socket characterized in that it is configured to be formed .