JP3116197B2 - Integrated circuit socket - Google Patents
Integrated circuit socketInfo
- Publication number
- JP3116197B2 JP3116197B2 JP04309902A JP30990292A JP3116197B2 JP 3116197 B2 JP3116197 B2 JP 3116197B2 JP 04309902 A JP04309902 A JP 04309902A JP 30990292 A JP30990292 A JP 30990292A JP 3116197 B2 JP3116197 B2 JP 3116197B2
- Authority
- JP
- Japan
- Prior art keywords
- socket
- upper lid
- integrated circuit
- liquid storage
- storage unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ソケットに関し、特に
半導体用ソケットに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket, and more particularly to a semiconductor socket.
【０００２】[0002]
【従来の技術】従来のＩＣソケットは材質にガラス繊維
入れエポキシ樹脂を用いており図２に示す様に、上部、
下部に分れている。2. Description of the Related Art A conventional IC socket uses glass fiber-filled epoxy resin as a material, and as shown in FIG.
Divided at the bottom.
【０００３】上部はＩＣを固定させる上蓋１の役目をし
ていると共に、ＩＣの端子とソケット側端子３との接続
を固定させる役目も兼ね備えている。The upper part functions as an upper cover 1 for fixing the IC, and also has a function for fixing the connection between the terminal of the IC and the socket side terminal 3.
【０００４】下部の本体１１は、土台の役目をしている
と共に、ＩＣ端子と信号のやりとりを行うための端子１
２と、上蓋を固定させるフック２が備えられている。[0004] A lower body 11 serves as a base and a terminal 1 for exchanging signals with IC terminals.
2 and a hook 2 for fixing the upper lid.
【０００５】[0005]
【発明が解決しようとする課題】第１に、従来のＩＣソ
ケットでは、上蓋１の中心部と下部の中心部に上蓋開口
部９、下部開口部１０があり、上蓋１を閉じた際ソケッ
トが完全に密閉されないため、ソケット内のＩＣに対し
て外部の温度変化による影響が与えられている。First, in the conventional IC socket, an upper lid opening 9 and a lower opening 10 are provided at the center of the upper lid 1 and at the lower center, and when the upper lid 1 is closed, the socket is closed. Since the IC is not completely sealed, the IC in the socket is affected by an external temperature change.
【０００６】また、現在ＩＣソケットの材質がガラス繊
維入りエポキシ樹脂であるが、更に断熱性に富んだ材質
の使用が求められる。[0006] At present, the material of the IC socket is an epoxy resin containing glass fiber, but the use of a material having more heat insulating properties is required.
【０００７】第２に、アルファ線の侵入によりＩＣが誤
動作する恐れがある。Second, there is a possibility that ICs may malfunction due to the penetration of alpha rays.
【０００８】第３に、ＩＣより発生される熱量を測定す
る機構が備えられていないため、測定が不可能であると
いう問題点がある。Third, since there is no mechanism for measuring the amount of heat generated from the IC, there is a problem that measurement is impossible.
【０００９】そこで、本発明は、前記第１ないし第３の
支障を改善しようとするものである。Therefore, the present invention aims to improve the first to third problems.
【００１０】[0010]
【課題を解決するための手段】本発明は、ソケットの材
質として現在用いられているガラス繊維入りエポキシ樹
脂の代りに、断熱性に優れているセラミックを用い、上
蓋開口部９と下部開口部１０を塞ぐ。According to the present invention, an upper lid opening 9 and a lower opening 10 are formed by using ceramics having excellent heat insulating properties instead of the epoxy resin containing glass fiber which is currently used as a material of the socket. Close up.
【００１１】さらに、上蓋の内部に銀鏡部５を設け上蓋
１を閉じた状態でソケットの内部が密閉される構造にな
っていると共に、アルファ線の侵入を防ぐ。Further, a silver mirror portion 5 is provided inside the upper cover, and the inside of the socket is sealed when the upper cover 1 is closed, and the penetration of alpha rays is prevented.
【００１２】また、上蓋１の内側には液体格納部４が設
けられ、内部には温度センサ６が設置されている。A liquid storage unit 4 is provided inside the upper lid 1, and a temperature sensor 6 is provided inside.
【００１３】この液体格納部４は、上蓋１を閉じた際、
液体格納部４下表面とＩＣが密着する機構になってい
る。When the upper lid 1 is closed, the liquid storage section 4
The IC has a mechanism in which the lower surface of the liquid storage unit 4 and the IC are in close contact with each other.
【００１４】[0014]
【実施例】次に本発明の実施例について図面を参照して
説明する。Next, an embodiment of the present invention will be described with reference to the drawings.
【００１５】図１は本発明の１実施例であり、（ａ）は
本発明のソケットの斜視図、（ｂ）はその断面図であ
る。FIG. 1 shows an embodiment of the present invention, in which (a) is a perspective view of a socket of the present invention, and (b) is a sectional view thereof.
【００１６】ＩＣソケットはソケット側端子３によりＬ
ＳＩテスターに接続され、ＩＣ等の特性確認等に用いら
れる。The IC socket is set to L by the socket side terminal 3.
It is connected to an SI tester and used for checking the characteristics of ICs and the like.
【００１７】第１に、ＩＣソケットの断熱性を向上させ
るため、熱伝導率がガラス繊維入りエポキシ樹脂より優
れているセラミックに、材質を変更した。First, in order to improve the heat insulation of the IC socket, the material was changed to ceramic having a thermal conductivity superior to that of the epoxy resin containing glass fiber.
【００１８】次に、ＩＣソケット内部のＬＳＩを密閉さ
せるため、上蓋開口部９と下部開口部１０を塞いでい
る。Next, in order to seal the LSI inside the IC socket, the upper lid opening 9 and the lower opening 10 are closed.
【００１９】これら断熱性を向上させることにより、Ｉ
Ｃへの外部からの温度影響を防ぐ構造になっている。By improving these heat insulating properties, I
It has a structure to prevent external temperature effects on C.
【００２０】第２に、ＩＣに悪影響を与える、アルファ
線の侵入を防ぐために銀鏡部５を、上蓋１の内部に設け
る。Second, a silver mirror section 5 is provided inside the upper cover 1 to prevent alpha rays from penetrating, which adversely affects the IC.
【００２１】これは、アルファ線の侵入を防ぐと共に、
ＩＣからの放射熱を外部に洩らさない役目も担ってい
る。This prevents the penetration of alpha rays and
It also plays a role in preventing radiated heat from the IC from leaking outside.
【００２２】材質の中には、アルファ線源であるＵ、Ｔ
ｈがｐｐｂからｐｐｍオーダの量が含有しており、それ
らの元素からアルファ線が発生する。Some of the materials include U and T which are alpha-ray sources.
h contains ppb to ppm order amounts, and these elements produce alpha rays.
【００２３】アルファ線発生率は、ガラス繊維入りエポ
キシが０．１〜０．３個／ｃｍ2 ｈに対しセラミックは
０．０２個／ｃｍ2 ｈであるため、材質をガラス繊維入
りエポキシからセラミックに変えたことにより、アルフ
ァ線の発生率を減少させた。[0023] alpha incidence, since the glass fiber filled epoxy Whereas 0.1-0.3 pieces / cm 2 h ceramic is 0.02 / cm 2 h, ceramics material from glass-filled epoxy To reduce the incidence of alpha rays.
【００２４】このアルファ線は、素子の微細化に伴って
信号エネルギーが小さくなり、アルファ線が侵入したと
きの発生キャリア量がそれを上回った際、ＬＳＩは誤動
作する。The signal energy of the alpha rays becomes smaller as the element becomes finer, and when the amount of carriers generated when the alpha rays penetrates exceeds that, the LSI malfunctions.
【００２５】この誤動作は、素子がハード的に破壊され
ないためソフトエラーと呼ばれている。This malfunction is called a soft error because the element is not destroyed by hardware.
【００２６】アルファ線は、現在の測定技術（０．００
１〜０．００５個／ｃｍ2 ｈ）の限界を越える値にまで
改良する必要がある。Alpha rays are measured using current measurement techniques (0.00
It is necessary to improve the value to a value exceeding the limit of 1 to 0.005 pieces / cm 2 h).
【００２７】そこで、上蓋１内部に設けた銀鏡部５によ
り、アルファ線の侵入を完全に防ぐことができる。Therefore, the invasion of alpha rays can be completely prevented by the silver mirror portion 5 provided inside the upper cover 1.
【００２８】上述したソケットにＩＣを装着し、上蓋１
を閉じた際、上蓋１をフック２で固定することによりソ
ケット内部は完全に密閉状態となる。The IC is mounted on the above-described socket, and the upper lid 1 is mounted.
When the cover is closed, the inside of the socket is completely sealed by fixing the upper lid 1 with the hook 2.
【００２９】第３に、上蓋１に温度センサ６を有する液
体格納部４を設ける。Third, a liquid storage unit 4 having a temperature sensor 6 is provided on the upper lid 1.
【００３０】液体格納部４は、上蓋１を閉じた際、ＩＣ
のピンを固定させると共に、液体格納部４の下表面がＩ
Ｃ表面に密着させる構造をとる。When the upper cover 1 is closed, the liquid storage section 4
And the lower surface of the liquid storage unit 4 is
A structure to adhere to the C surface is adopted.
【００３１】温度センサ６の下部は、柔軟性に富んだ材
質を用い確実にＩＣ上表面と接触する。The lower part of the temperature sensor 6 is made of a material having a high flexibility and surely comes into contact with the upper surface of the IC.
【００３２】温度センサ６は、１ヶ所だけの設置では、
液体の対流により正確な値を得ることができない。If the temperature sensor 6 is installed in only one place,
Accurate values cannot be obtained due to liquid convection.
【００３３】よって、ＩＣ中心部及びその両端の３ヶ所
に液体の対流等を考慮し設置する。Therefore, the IC is installed at the central part of the IC and three places at both ends thereof in consideration of the convection of the liquid.
【００３４】また、温度センサ６の端子は、ＩＣソケッ
ト外部に出ており、パッドの様な形状の温度測定場所７
になっている。The terminal of the temperature sensor 6 extends out of the IC socket and has a temperature-measuring location 7 having a pad-like shape.
It has become.
【００３５】その温度測定場所を温度測定器につなぐこ
とによりＬＳＩが発生する熱量を正確に測定できるよう
にする。By connecting the temperature measuring location to a temperature measuring instrument, the amount of heat generated by the LSI can be accurately measured.
【００３６】[0036]
【発明の効果】以上説明したように、第１に上蓋１を閉
じることによってソケット内が密閉状態になるという構
造であるため、ソケット内のＩＣに外部の温度変化によ
る影響を与えないようにすることが出来る。As described above, first, since the inside of the socket is hermetically closed by closing the upper cover 1, the IC in the socket is not affected by an external temperature change. I can do it.
【００３７】第２に、上蓋１内部に銀鏡部を設けること
によりＩＣの動作に悪影響を与えるアルファ線を防ぐこ
とができる。Second, by providing a silver mirror inside the upper cover 1, alpha rays which adversely affect the operation of the IC can be prevented.
【００３８】第３に、上蓋１に液体を用いた温度センサ
を設置することによってＩＣ自体の発生した熱量のみを
測定することができるという効果が奏される。Third, by installing a temperature sensor using a liquid on the upper lid 1, there is an effect that only the amount of heat generated by the IC itself can be measured.
【図１】本発明の一実施例の集積回路用ソケットであ
り、（ａ）は斜視図、（ｂ）は断面図である。FIGS. 1A and 1B show an integrated circuit socket according to an embodiment of the present invention, wherein FIG. 1A is a perspective view and FIG.
【図２】従来の集積回路用ソケットであり、（ａ）は斜
視図、（ｂ）は断面図である。FIG. 2 is a conventional integrated circuit socket, in which (a) is a perspective view and (b) is a sectional view.
１ 上蓋 ２ フック ３ ソケット側端子 ４ 液体格納部 ５ 銀鏡部 ６ 温度センサ ７ 温度測定場所 ８ 台座 ９ 上蓋開口部 １０ 下部開口部 １１ 本体 １２ 端子 DESCRIPTION OF SYMBOLS 1 Top cover 2 Hook 3 Socket side terminal 4 Liquid storage part 5 Silver mirror part 6 Temperature sensor 7 Temperature measurement place 8 Pedestal 9 Top cover opening 10 Lower opening 11 Main body 12 Terminal
Claims (3)
鎖時にソケット内を密閉状態にし、外部の熱を遮断する
ことを特徴とする集積回路用ソケット。1. A socket for an integrated circuit, wherein the inside of the socket is sealed to shut off external heat when the upper lid and the main body made of a heat insulating material are closed.
とを特徴とする集積回路用ソケット。2. A socket for an integrated circuit, wherein a silver mirror is stretched around the entire inner surface of the upper lid.
し、液体格納部は被測定ＬＳＩに弾力性を持って密着す
るような構造を持つことを特徴とする集積回路用ソケッ
ト。3. A socket for an integrated circuit, wherein a liquid storage unit with a temperature sensor is provided on an upper lid, and the liquid storage unit has a structure in which the liquid storage unit elastically adheres to an LSI to be measured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04309902A JP3116197B2 (en) | 1992-11-19 | 1992-11-19 | Integrated circuit socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04309902A JP3116197B2 (en) | 1992-11-19 | 1992-11-19 | Integrated circuit socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06163756A JPH06163756A (en) | 1994-06-10 |
| JP3116197B2 true JP3116197B2 (en) | 2000-12-11 |
Family
ID=17998710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04309902A Expired - Fee Related JP3116197B2 (en) | 1992-11-19 | 1992-11-19 | Integrated circuit socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3116197B2 (en) |
-
1992
- 1992-11-19 JP JP04309902A patent/JP3116197B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06163756A (en) | 1994-06-10 |
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