JP3111932B2 - Manufacturing method of memory card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC mounted with an IC.
The present invention relates to a method for manufacturing a C card.

[0002]

2. Description of the Related Art FIG. 2 is a perspective view of a conventional memory card exploded into parts. 1 is a circuit module on which IC2 is mounted. Reference numeral 3 denotes a frame which is provided with a relief 4 for the IC 2 and is formed of a resin serving as a base material of a memory card in which one circuit module is to be fitted. Reference numeral 5 denotes a pair of plates which are attached to each other so that the frame and the circuit module are fitted to each other after the frame and the circuit module are fitted.

[0003] Many types of memory cards can be manufactured depending on the type of IC. Therefore, the types of ICs to be used are various, and the sizes of the ICs are also various. At the stage of designing the frame, the escape of the IC is made so as to be compatible with various types of ICs. However, in order to secure the strength of the memory card, it is inevitable to form a certain amount of 6. For this reason, a sudden escape from the initially manufactured frame has to use a circuit module that cannot be used. In this case, a new frame must be formed or a resin must be removed by a grinding machine or the like. It takes several months to make a new frame, and the schedule cannot be dealt with, and even if the frame is ground, the quantity cannot be adjusted, and the grinding cost becomes high.

An object of the present invention is to provide a memory card frame which can cope with various circuit modules at a low cost by eliminating such a problem.

[0005]

The manufacturing method of the present invention comprises the steps of:
A memory having a circuit module provided with C and a frame provided with a first hole and a second hole for escape of the mounted IC, and a pair of plates sandwiching the circuit module and the frame from both sides. In the method for manufacturing a card, a step of preparing the frame in which a groove is provided in a part connecting the first hole and the second hole, and forming the groove according to a position of the IC to be mounted. Forming a frame corresponding to the circuit module by removing the frame by using the module, a step of fitting the circuit module and the frame, and using the pair of plates for the circuit module and the frame after the fitting. A step of sandwiching from both sides.

[0006]

FIG. 1 shows an embodiment of a frame according to the present invention. Hole 8 for escape of IC mounting part in frame 7
a, 8b, 8c and 8d are formed. Further, grooves 10a, 10b, 10c, 10
d is formed. The circuit module corresponding to the frame 7 is the circuit module 1 shown in FIG.
However, when the circuit module 11 shown in FIG. 1 has to be manufactured due to the dimensions of the IC, it is conventionally necessary to recreate the frame type or to cut off the frame to form a frame as shown in FIG. However, when the frame of the present invention is used, since the groove is formed, the extra portions 9a and 9b can be easily removed manually from the groove portion, and the frame 9 corresponds to the circuit module 11. The frame 12 can be formed.

FIG. 4 shows another embodiment. In the case of this embodiment, all the grooves are provided, and the shape of the holes can be arbitrarily changed as necessary.

FIG. 5 shows still another embodiment. In the case of this embodiment, only the groove 1
This is an embodiment in which No. 3 is formed. In this way, the escape of the frame can be handled even if the IC mounting part comes to a completely unexpected part.

[0009]

As described above, by using the memory card frame of the present invention, it is possible to quickly cope with various circuit modules at low cost, and to remove the restrictions on the design of the circuit modules. To be able to offer more memory cards faster.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of one embodiment of the present invention.

FIG. 2 is an exploded perspective view of a conventional example.

FIG. 3 is a perspective view of a frame after processing.

FIG. 4 is a perspective view of another embodiment of the present invention.

FIG. 5 is a perspective view of an embodiment of the present invention.

[Explanation of symbols]

 1, 11 ... circuit module 2 ... 1C mounting part 3, 7, 12 ... frame 4, 8a, 8b, 8c, 8d ... relief hole of IC mounting part 5 ... board 6 , 9a, 9b, ... 10a, 10b, 10C, 10d, 13, groove

Claims (1)

(57) [Claims] 1. A circuit module having an IC mounted thereon and a frame provided with a first hole and a second hole for escape of the mounted IC, and a pair sandwiching the circuit module and the frame from both sides. A method of manufacturing a memory card having a plate, wherein: a step of preparing the frame having a groove formed in a part of a portion connecting the first hole and the second hole; Forming a frame corresponding to the circuit module by using the groove to form a frame corresponding to the circuit module; fitting the circuit module to the frame; and forming a pair with the circuit module and the frame after the fitting. A method for manufacturing a memory card, comprising the steps of: