JP3110646U - Structure of mini-secure digital memory card or RMC memory card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure of a mini SD memory card or an RS-MMC memory card in which a control chip and a memory die are newly laid out and a plurality of memory dies are installed.
A storage unit includes a case and a storage unit, the case packages the storage unit therein, a substrate is provided in the storage unit, a control chip and a plurality of memory dies are installed on the substrate, and the control chip is mounted on the substrate. Attached to one end with an insertion end, these memory dies are attached below the control chip of the substrate and approach one end opposite the insertion end.
[Selection] Figure 2

Description

  The present invention relates to a kind of memory card, and in particular, a structure of a mini secure digital (mini SD) memory card or an RSMC (RS-MMC) memory card in which a control chip and a memory die are newly laid out and a plurality of memory dies are installed. About.

With the advancement of digital technology, many information products, especially cameras, video cameras, and portable players, are gradually replacing many of their storage facilities with flash memory cards. In addition to increasing the memory capacity of memory card products, the most important is improving the compatibility and occupied volume of memory cards.
Among well-known memory cards, SD (Secure Digital) card and MMC (Multi Media card) card are both standardly different in thickness (2.1 mm and 1.4 mm, respectively), both length and width Are 32 mm and 24 mm, which are very similar in terms of overall structure. For this reason, most SD interface equipment can use MMC cards. However, with miniaturization of information facilities, the volume size of memory cards tends to be miniaturized in accordance with the expansion of functions of multimedia mobile phones. Among them, the mini SD (Mini SD) card is a reduced version of the SD card, and its length, width, and thickness are 21.5 mm, 20 mm, and 1.4 mm, respectively. 60% reduction and 40% baking circuit board area saving. The RS-MMC (Reduced size MMC) card is a reduced version of the MMC card, and its length, width, and thickness are 24 mm, 18 mm, and 1.4 mm, respectively, and its volume is 50% of the volume of the standard MMC card. It is. Mini SD cards and RS-MMC cards both have compatible adapter cards, so they can be used for standard interface equipment, and because of their small volume and light weight, they have a huge business opportunity in the future market. Seems to have.

  The structure of the current mini SD card is as shown in FIG. 1, which comprises a case 10 and a storage unit 20. The case 10 and the storage unit 20 are packaged so as to overlap each other in the direction of the insertion ends 101 and 201. The storage unit 20 includes a substrate 21, a control chip 22 and a memory die 23. The memory die 23 is installed in a rectangular shape in the vertical direction. After being soldered to the substrate 21, the memory die 23 occupies almost the substrate area from the insertion end 201 to the other end of the substrate 21, and the control chip 22 is soldered to the left side of the memory die 23. It is attached. Due to the limitations of chip packaging technology, the control chip 22 is placed beside the memory die 23 with a relatively large distance, and due to the limitation of the width of the substrate 22, the control chip 22 can only use a chip with an area size of 5 mm per side. However, since the chip having such a size is not the size of a control chip which is generally used, it is necessary to manufacture the chip separately, which greatly increases the cost of manufacturing the memory. In addition, a known memory card has only a single memory die, which makes it unusable when the memory die is damaged. In addition, the storage capacity of memory dies will increase with manufacturing technology, but in situations where high-capacity products still do not appear, there is a limitation that the memory card capacity cannot be expanded simply by installing a single storage capacity memory die. Is done.

  In order to make the chip layout on the memory card substrate more efficient, reduce the manufacturing cost, and increase the memory card capacity, the present invention can be obtained on the substrate by modifying the well-known layout method of the control chip and the memory die. Provided are a mini-SD card and an RS-MMC card that increase the use area, allow an appropriate area size and use a known control chip, reduce the manufacturing cost, and increase the storage capacity by installing a plurality of memory dies.

The invention of claim 1 includes a case and a storage unit, the storage unit is packaged in the case, a substrate is provided in the storage unit, and a plurality of memory dies and a control chip are mounted on the substrate. In the structure of digital memory card or RMC memory card,
A mini-secure digital memory card, wherein the control chip is attached to one end of the insertion end of the substrate, and the memory die is attached to the lower side of the control chip of the substrate and approaches one end opposite to the insertion end. Or, it has a structure of an RMC memory card.
The invention of claim 2 is the structure of the mini secure digital memory card or the RMC memory card according to claim 1, wherein the area size of the control chip is 7 mm per side, It has the structure of an RMC memory card.
The invention of claim 3 is the structure of the mini secure digital memory card or the RMC memory card according to claim 1, wherein two memory dies are installed in the storage unit. SMC memory card structure.
The invention of claim 4 is a mini secure digital memory card or an RMC memory card structure according to claim 3, wherein two memory dies are arranged in a left-right manner below the control chip. The structure is a digital memory card or an RMC memory card.
The invention of claim 5 is a mini-secure digital memory card or an RMC memory card structure according to claim 3, wherein two memory dies are arranged below the control chip in a vertical manner. The structure is a digital memory card or an RMC memory card.

The structure of the mini-secure digital memory card or the RMC memory card of the present invention comprises a storage unit and a case, the substrate is provided on the storage unit, a control chip and a plurality of memory dies are installed on the substrate, and the control chip Is attached near the insertion end of the substrate, and a plurality of memory dies are attached below the control chip of the substrate and approach one end opposite the insertion end. The case packages the storage unit inside. Due to the new layout of the control chip and the memory die, a relatively large space is reserved at one end of the insertion end on the substrate after the memory die is attached, which makes it possible to attach a control chip having an area size of 7 mm per side, which is effective. Substrate space can be used, increasing the utilization effect of the substrate. In addition, since the control chip having such a size is a control chip generally used for a well-known memory card, it is not necessary to produce it separately, and the manufacturing cost of the memory card of the present invention can be greatly reduced.
Also, by installing a plurality of memory dies, the overall storage capacity can be increased and the data can be stored separately, reducing the disadvantages of total data loss due to a single memory die failure.

  FIG. 2 is a display diagram of a memory card according to an embodiment of the present invention. In the embodiment of the present invention, the memory card includes a case 10 and a storage unit 30, and the storage unit 30 includes a substrate 31, a control chip 32, and two memory dies 33.

  The case 10 and the substrate 31 have insertion ends 101 and 301, respectively, and are overlapped and packaged in mutually corresponding directions to form a complete memory card. After the memory card is assembled, it is inserted into the slot of the information facility or reading facility in the direction of the insertion ends 101 and 301 to transmit or store data.

  The substrate 31 is a printed circuit board, and two memory dies 33 are attached to one end opposite to the insertion end 301. The memory dies 33 have a rectangular shape and are arranged in a vertical direction to form a left-right arrangement. The above-described memory die 23 is packaged by a WSOP (Very-Very Thin Small Outline Package) method to form an extremely thin memory die, and then soldered to the substrate 31. At the time of attachment, a fixed package gap is reserved at the edge of the substrate 31, and these memory dies 33 occupy the lower part of the entire substrate 31.

On the other hand, the control chip 32 is a chip that controls access to the memory die 33. After the two memory dies 33 are attached to the substrate 31 by the layout method of the present invention, a control chip 32 having an area width of 7 mm per side is attached between the insertion end 301 of the substrate 31 and the memory die 33, and the control chip 32 is inserted into the control die 32. Only a fixed package gap is retained between the ends 301. With reasonable utilization of the aforementioned substrate area, the chip layout of the present invention can achieve the best effect state. The control chip 32 used in the present invention can use a control chip having an area size of 7 mm per side that can be attached to a general memory card. Thus, it is necessary to use a special control chip having a side of 5 mm as in a well-known technique. Therefore, the present invention can save the cost when mounting the chip, and the memory card of the present invention has good competitiveness.
FIG. 3 shows another memory card embodiment of the present invention. In this embodiment, the two memory dies 33 described above are arranged in the horizontal direction and arranged vertically. When these memory dies 33 are installed, a very small bake distance of 0.1 mm is reserved between the control chip 32 and the memory dies 33 and between the two memory dies 33. Occupies the opposite end and holds only a certain package gap at the opposite end to the insertion end 301. At this time, when the control chip 32 is attached, the memory die 33 is considerably approached. As a result, when the control chip 32 is packaged by the TSOP method, the pin may not be soldered. Packaging is performed in a manner that does not expose other pins. When packaged by the BGA method, bumps are laid out by the array method at the bottom of the control chip, and further connected by soldering, which is an alternative to the method using metal conductors as pins. When packaged by the LGA method, the control chip and the substrate 31 are always provided with metal contacts corresponding to each other, and are connected by a bonding method.

  The present invention can increase the storage space of the original memory card by installing a plurality of memory dies 33, for example, two, three, or more memory dies 33, and can perform a shunting process at the time of data access. On the one hand, it can be used as required by the user, and on the other hand, it is possible to prevent the loss of all data due to the damage of a single memory die.

It is a display figure of a known technique. It is a display figure of the Example of this invention. It is a display figure of another Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Case 101 Insertion end 20 Storage unit 201 Insertion end 21 Substrate 22 Control chip 23 Memory die 30 Storage unit 301 Insertion end 31 Substrate 32 Control chip 33 Memory die

Claims (5)

A mini secure digital memory card or an RMC with a case and a storage unit, the storage unit being packaged in the case, the substrate being provided with the storage unit, and a plurality of memory dies and a control chip mounted on the substrate; In the memory card structure,
The mini-secure digital memory card, wherein the control chip is attached to one end of the insertion end of the substrate, and the memory die is attached to the lower side of the control chip of the substrate and approaches one end opposite to the insertion end. Or the structure of an RMC memory card.   2. The structure of the mini secure digital memory card or the RMC memory card according to claim 1, wherein the area size of the control chip is 7 mm per side. .   2. The structure of the mini secure digital memory card or the SMS memory card according to claim 1, wherein two memory dies are installed in the storage unit.   4. The structure of the mini secure digital memory card or the RMC memory card according to claim 3, wherein two memory dies are arranged in a left-right manner below the control chip. Memory card structure. 4. The structure of the mini secure digital memory card or the RMC memory card according to claim 3, wherein two memory dies are arranged in a vertical manner below the control chip. Memory card structure.

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