JP3109197U - Heat dissipation structure for industrial computer CPU - Google Patents

Abstract

An object of the present invention is to provide a heat dissipation structure for an industrial computer CPU that can quickly suck out heat generated by the CPU to the outside of the computer shell.
The heat dissipation structure of an industrial computer CPU is mainly configured by installing a cover body above a power supply unit, forming a ventilation path between the cover body and the power supply unit, and forming a tube body on the side surface of the cover body. A through hole is provided according to the size, and a tube body of a size matched to the heat dissipation piece is installed corresponding to the through hole. Folding pieces are provided, and the heat radiation pieces are completely covered, and the heat radiation pieces and the tube are integrated to form a ventilation path, and a plurality of fans are provided at the outlets of the ventilation paths to suck out heat and discharge it outside the shell. .
[Selection] Figure 4

Description

  The present invention relates to a heat dissipation structure for an industrial computer CPU, and in particular, is a heat dissipation structure that is installed inside a 1U thin industrial computer shell to increase the heat dissipation effect of the CPU. This invention relates to a heat dissipation structure for industrial computer CPUs composed of heat dissipation fans.

  Although the volume of a conventional industrial computer is small, the CPU not only consumes a large amount of power but also generates a large amount of heat, while the heat dissipation space left in the case in advance is limited. The conventional heat dissipating structure employs the same device as shown in FIG. 1, and as shown in FIG. 1, a heat dissipating piece b is installed directly above the CPUa, and all the heat generated by the heat source is provided above it. In this heat dissipation method, the heat is transmitted to the heat dissipation piece b, and further, air is sent to the hot air by the heat dissipation fan c provided in the case or on the heat dissipation piece b, and is guided to the heat dissipation hole d behind the case. In this method, the heat source collects a large amount of heat on the heat radiation piece b of a limited area within a short time and is continuously accumulated, and the flow direction of the air blown by the heat radiation fan c is not the same direction. Furthermore, there is a drawback in that it is obstructed by each component inside the computer, and many heat aggregation points are formed inside the case, making it difficult to dissipate heat. In addition, if a large amount of heat dissipating fans are installed to forcibly discharge the amount of heat from each hot spot to the outside of the case, and the temperature of the electronic components inside the case rises, the computer main body becomes unstable. As described above, most of the conventional heat dissipation structures have the above-described drawbacks, and improvements are required.

  In view of the above-described problems, a main object of the present invention is to provide a heat dissipation structure for an industrial computer CPU that can quickly suck out heat generated by the CPU to the outside of the computer shell.

  In order to achieve the above-mentioned object, the industrial computer CPU heat dissipation structure of the present invention is mainly provided with a cover body above the power supply, and a ventilation path is formed between the cover body and the power supply. In addition, a through hole is provided on the side surface of the cover body in accordance with the size of the tube body, and a tube body having a size corresponding to the heat radiation piece is installed in correspondence with the through hole. The bottom of each side is folded inward, and the radiating piece is directly covered, the radiating piece and the tube are integrated to form a ventilation path, and a plurality of fans are provided at the outlet of the ventilation path. The heat is sucked out and discharged out of the shell.

  With the above structure, the heat dissipation structure of the industrial computer CPU of the present invention is such that the cover body is fixed above the power supply unit, the outer case of the power supply unit inside the cover body forms a barrier, and the CPU inside the cover body By installing multiple heat dissipation fans at the exit location of the ventilation path, a large amount of heat generated by the CPU is exhausted from the ventilation path exit to the outside of the case in the manner of a suction fan, and the computer is When used for a long time, one of the fans will break and heat will not be discharged, or the discharge will be delayed, and other computer parts will be obstructed to form a heat aggregation point, preventing the influence of the overall performance be able to.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the structure, apparatus, and features of the present invention will be described in detail with reference to the drawings according to the best embodiments of the present invention.

  As shown in FIGS. 2, 3, and 4, the heat dissipation structure of the industrial computer CPU of the present invention mainly includes a cover body 10 and a plurality of heat dissipation fans 20. Among them, the cover body 10 is installed above the power supply 2 provided with a case, a ventilation path 6 is formed between the cover body 10 and the power supply 2, and a tube body 12 is provided on the side of the cover body 10. A through hole 11 matching the size of the opening is opened, a tube 12 is installed in correspondence with the through hole 11, connected to the CPU 3, and a partition piece 13 is provided below the through hole 11. When the heat sink is installed and the heat is sucked, the heat of the heat radiating piece 4 is prevented from being released from this portion. Further, a fixing piece 14 that can be screwed onto the computer shell is provided on the rear side of the cover body 10 and on the other side of the through hole 11. The external appearance of the tubular body 12 is a quadrangle with an open bottom, and is sized to fit the heat radiation piece. The tubular body 12 is provided with bent pieces 12a bent at both lower ends on the inside, and the heat radiation piece 4 is directly connected to the tubular body. 12 Cover completely inside and fix.

  The heat radiating fan 20 is installed in the opening at the rear of the cover body 10 and is set to blow out from the inside, and forms a shape like a suction fan together with the cover body 10.

  FIG. 4 shows the internal wind direction when the present invention is used. The cover body 10 is fixed at an appropriate position of the computer shell 5, and the case of the power supply unit 2 forms a barrier inside the cover body 10, so that a ventilation path 6 connected to the CPU 3 is formed inside the cover body 10. The heat radiating fan 20 provided at the outlet of the ventilation path quickly discharges the heat generated by the CPU 3 from the outlet of the ventilation path to the outside of the shell in the manner of the suction fan, and the heat enters the shell 5 again. In addition, the thermal coagulation point is formed due to the blockage of other computer parts, and it is possible to prevent the influence on the overall performance.

  5 and 6 show another embodiment of the present invention. The cover body 10 is formed as the case 10a of the power supply device 2, the through hole 11 is opened in the side surface of the power supply case a, the corresponding tube body 12 is installed, and the tube body 12 is the entire heat radiation piece 4 And is fixed to the upper part of the CPU 3 together with the heat radiating piece 4 so that the bottom surface of the heat radiating piece 4 is attached to the upper surface of the CPU 3, and a plurality of heat radiating fans 20 are provided at the outlet at the rear of the power supply 2 case 10a. Is installed. When the power supply 2 case 10a is fixed at an appropriate position of the computer shell 5, a ventilation path connected to the CPU 3 is formed inside the case 10a, and the heat radiating fan 20 provided behind the case 10a generates the CPU 3 quickly. Heat is discharged from the outlet of the ventilation path to the outside of the shell in the manner of a suction fan, and the heat re-enters the shell 5 and is blocked by other computer parts to form a heat aggregation point, affecting the overall performance. Can be prevented.

  As shown in FIGS. 7A and 7B, the present invention may further include a soft connecting tube 15, which is used when the CPU 3 position and the through hole 11 on the side of the cover body 10 cannot form the same straight line. be able to. The tubular body 12 covers the entire heat radiating piece 4, and the openings on both ends of the flexible connecting tube 15 are fixed to the opening of the tubular body 12 and the through holes 11 on the side of the cover body 10, respectively. And cost for redesigning the cover body 10 can be saved.

  As can be seen from the above, according to the heat dissipation structure of the industrial computer CPU of the present invention, by providing the cover body above the power supply, a ventilation path is formed between the cover body and the power supply. Moreover, heat can be quickly discharged out of the computer shell, and since the present invention has practicality and inventive step, a utility model is filed here.

It is a three-dimensional perspective view of a conventional product. It is a three-dimensional exploded view of the present invention. It is a three-dimensional perspective view of the present invention. It is a three-dimensional perspective view which shows the internal wind direction at the time of use of this invention. It is a three-dimensional exploded view showing another embodiment of the present invention. It is a three-dimensional perspective view which shows the implementation state of the Example of FIG. It is a three-dimensional perspective view which shows the state which used the flexible connecting pipe for this invention. It is a three-dimensional perspective view which shows another state using the flexible connecting pipe for this invention.

Explanation of symbols

2 Power supply 3 CPU
4 Heat radiation piece 5 Computer shell 6 Ventilation path 10 Cover body 11 Through hole 12 Tube 12a Folding piece 13 Partition piece 14 Fixed piece 15 Flexible connecting pipe 10a Case

Claims (4)

  A heat dissipation structure that is installed inside a 1U thin industrial computer shell to enhance the heat dissipation effect of the CPU, and is mainly composed of a cover body, a tube body, and a plurality of heat dissipation fans. Installed above the feeder, forms a ventilation path between the cover body and the power supply, and opens a through hole on the side of the cover body that matches the size of the opening of the tube body. The tube is installed and connected to the CPU, and a partition piece is installed below the through hole.Furthermore, on the other side of the cover body and the side provided with the through hole, An industrial computer CPU is characterized in that a fixing piece for screwing is provided on the computer shell, a heat dissipating fan is installed at the outlet of the above-mentioned ventilation path, and the heat of the CPU is sucked and discharged. Heat dissipation structure.   The heat dissipation structure for an industrial computer CPU according to claim 1, wherein a cover body is directly used as a case for the power supply case.   Appearance of the tube body is a quadrangle with an open bottom and is sized to fit the heat dissipation piece. The tube body has folding pieces bent inward at the lower ends on both sides of the tube. The heat dissipation structure for an industrial computer CPU according to claim 1, wherein:   The industrial body according to claim 1, wherein the cover body and the pipe body are connected by a soft connecting pipe, and openings at both ends of the soft connecting pipe are respectively fixed to an opening of the pipe body and a through-hole on a side surface of the cover body. Computer CPU heat dissipation structure.

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