JP3097073B2 - Liquid crystal display element mounting structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a liquid crystal display element having a plurality of electrode leads in rows on a circuit board.

[0002]

2. Description of the Related Art A conventional mounting structure of a liquid crystal display element is disclosed in Japanese Utility Model Laid-Open No. 4-65484. The mounting structure of this type of liquid crystal display element has a case in which a transmission type liquid crystal display element having electrode leads arranged in a row on one side, and the electrode leads being lead-formed in a substantially vertical direction from a liquid crystal display portion, is provided. Along with being disposed on the upper end, the electrode leads of the liquid crystal display element are disposed on the circuit board so as to correspond to a partition having a plurality of grooves or insertion holes disposed separately from each other. After the electrode lead is inserted into the insertion hole, the electrode lead and the circuit board are fixed by soldering. Further, the liquid crystal display element has a structure which is inserted from the back surface side of the circuit board corresponding to a place where the case is provided, and is electrically connected to the circuit board, for example, transmitted and illuminated by a lighting bulb. is there.

[0003] In the mounting structure of the liquid crystal display element on the circuit board, when the electrode leads are provided in the insertion holes of the circuit board, the electrode leads are provided in a row and the electrode leads are provided in a row. However, there is a problem that it is difficult to set in the insertion hole unless a dedicated jig is used, since it is easily deformed. In consideration of this problem, the electrode lead is formed so that the forming angle of the electrode lead is inward of the vertical direction (vertical direction) as compared with the related art in which the electrode lead is formed so as to be substantially vertical from the liquid crystal display unit. When the liquid crystal display element is disposed at the upper end of the case, the electrode lead is brought into contact with the partition portion, so that the case is formed on the case. Positioning arrangement, in this state, the electrode lead is inserted through the insertion hole of the circuit board,
After arranging the case on the circuit board, a structure is adopted in which the electrode leads protruding from the back side of the circuit board are electrically fixed to connection lands formed on the circuit board by soldering.

[0004]

For example, when a liquid crystal display device having the above-described mounting structure is used as a display device for a vehicle, if the ambient temperature changes due to various use environments,
Due to a difference in thermal expansion coefficient between the circuit board and the case, stress distortion occurs between both members. In the above-described mounting structure of the liquid crystal display element, since the electrode leads are disposed in a state of being in contact with the case (partition portion) even after being soldered to the circuit board, the stress of the electrode leads is reduced. The amount of displacement due to strain is greater than when the electrode leads are disposed free from the circuit board because the electrode leads fluctuate with the case, and the amount of soldering between the electrode leads and the circuit board is larger. There was a risk that solder cracks would occur at the attachment part.

Accordingly, the present invention focuses on the above problem, and does not generate solder cracks at the soldered portions between the electrode leads of the liquid crystal display element and the circuit board even when stress distortion occurs due to thermal expansion. Another object of the present invention is to provide a liquid crystal display element mounting structure capable of improving assembly workability in a manufacturing process.

[0006]

In order to solve the above-mentioned problems, the present invention has electrode leads arranged in a row on one side.
The liquid crystal display element is disposed in the case body, and the electrode leads are
Insert the cable into the insertion hole provided on the circuit board.
Mounting of a liquid crystal display element in which a base body is disposed on the circuit board
A through hole penetrating the front and back of the circuit board.
And a second member provided in the case body and engaged with the through hole.
A boss body having a second guide portion;
When the guide is engaged with the through hole, the electrode lead is moved forward.
While guiding the insertion hole, the second guide portion is
When the electrode lead is engaged with the through hole, the electrode lead
This is a transition from a contact state to a separated state .

Further, the case body is provided with a partition for disposing the electrode leads at a distance from each other.

[0008]

[0009] The invention further comprises a connecting portion for connecting between the first guide portion and the second guide portion, and determining a moving amount for separating the electrode lead from the case body. is there.

In addition, the case body and the circuit board have a second
First and second locking portions are formed, and the locking portions are engaged with each other.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a mounting structure for mounting a liquid crystal display element 1 on a circuit board 4. In the liquid crystal display element 1, a plurality of electrode leads 2 are provided in a row on one side, and the case body 3 is placed in a state where the electrode leads 2 are in contact with grooves (partitions) 7 of a holder 8 provided in the case body 3. It is disposed on the mounting section 6. When the first guide portions (tip portions) 11 (18, 23) are disposed (engaged) in the through holes 16 (26) of the circuit board 4, the electrode leads 2 are attached to the case body 3. 4 and the second guide portion (rear end) 12 (21, 24) is inserted into the through hole 16 (2).
6), the electrode lead 2 is inserted into the groove 7
The boss body 9 (19, 22) is mounted on the circuit board 4 while being shifted from the state of contact with the boss to the state of separation. Therefore, in a state where the liquid crystal display element 1 is arranged in the case body 3, the electrode leads 2 can be easily arranged in the insertion holes 14 of the circuit board 1 without using a dedicated jig or the like. Can be improved. Further, since the electrode leads 2 can be mounted on the circuit board 4 in a state where the electrode leads 2 are separated from the case body 3,
Even when stress distortion due to thermal expansion occurs, it is possible to prevent the occurrence of cracks in the solder joint between the electrode lead 2 and the land 15 of the circuit board 4.

Further, the boss body 9 is provided with a first guide portion 11 (1).
8, 23) and the second guide portion 12 (21, 24), and an offset portion (connecting portion) 13 (2) for determining a moving amount for separating the electrode lead 2 from the groove portion 7 of the holder portion 8.
0, 25), and the case body 3 is moved with respect to the through hole 16 (26) of the circuit board 4 by the amount of movement of the offset portion 13 in the direction opposite to the direction in which the electrode leads 2 are arranged. The electrode lead 2 can be easily mounted on the circuit board 4 in a state where the electrode lead 2 is separated from the case body 3 simply by sliding the case.

Further, by forming a locking claw (first locking portion) 10 and a locking hole (second locking portion) 17 on the case body 3 and the circuit board 4 respectively, the electrode lead 2 is connected to the case 3. The case body 3 can be arranged and fixed on the circuit board 4 while maintaining the state of being separated from the body 3.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the accompanying drawings.

FIG. 1 is a perspective view showing a mounting structure of a liquid crystal display device according to a first embodiment of the present invention, FIG. 2 is a side view showing the liquid crystal display device of the present invention, and FIGS. FIGS. 5 and 6 show the mounting state of the liquid crystal display element according to the second embodiment of the present invention, and FIGS. 7 and 8 show the third embodiment of the present invention.
It is a figure showing the mounting state of the liquid crystal display element of an example.

The first embodiment will be described with reference to FIGS.

The mounting structure of the liquid crystal display element according to the present invention includes a liquid crystal display element 1, electrode leads 2 for applying a voltage of the liquid crystal display element 1, a case body 3, and a circuit board 4.
And an illumination light source 5.

The liquid crystal display element 1 has liquid crystal sealed between a pair of light-transmitting substrates, and the direction of the molecular alignment of the liquid crystal is controlled by selectively applying a voltage between electrodes formed on the light-transmitting substrates. , And is controlled by the relationship with the polarization axes of the polarizing plates provided on both sides of the display unit, and is of a transmission type that performs a predetermined display using the illumination light of the illumination light source 5 provided behind. .

A plurality of electrode leads 2 are arranged in a row on one side in the longitudinal direction of the liquid crystal display element 1 by applying a voltage between the electrodes of the liquid crystal display element 1. As shown in FIG. 2, the electrode lead 2 is connected to an electrode portion (not shown) of the liquid crystal display element 1 and is lead-homed in a vertical direction X from a display surface 1a of the liquid crystal display element 1; 1
A predetermined angle from the mounting position of the electrode lead 2 (when the liquid crystal display element 1 is
The electrode lead 2 is formed to be bent inward from the vertical direction X at an angle (an angle at which the electrode lead 2 contacts the groove of the case body 3).

The case body 3 is made of, for example, P.O. It is formed of a resin material such as P and is made of a housing. This case body 3
A frame-shaped mounting portion 6 for disposing the liquid crystal display element 1 is formed at the upper end of the case body 3 and a plurality of groove portions (partition portions) 7 for disposing the electrode leads 2 at a distance from each other. The holder portion 8 provided is formed on the entire surface side of the case body 3. A guide portion (not shown) for guiding the illumination light from the illumination light source 5 to the liquid crystal display element 1 is formed inside the case body 3, and the case body 3 is configured as a light box of the liquid crystal display element 1. Is done.

At the lower end of the case 3, a pair of bosses 9, which is a feature of the present invention, is provided adjacent to the boss 9, and the case 3 is disposed and fixed to the circuit board 4. And a pair of locking claws (first locking portions) 10 are formed extending toward the circuit board 4.

The boss body 9 communicates with the first guide portion 11 having a substantially inverted L-shape at the tip end with respect to the circuit board 4, and communicates with the first guide portion 11. Tip width W
1 and a second guide portion 12 having substantially the same width W2, and an offset portion (connection portion) 13 described later in detail is provided between the first guide portion 11 and the second guide portion 12. Has formed.

The circuit board 4 is made of an insulating material such as paper phenol or a resin containing glass fiber. Insertion holes 14 penetrating the front and back of the insulating board are formed in rows so as to correspond to the respective electrode leads 2. I have. A land portion 15 electrically connected to the electrode lead 2 is formed around the insertion hole 14 on the back surface side of the circuit board 4. Also, the circuit board 4
A through hole 16 corresponding to the boss 9 of the case body 3 described later and a locking hole (second locking portion) 17 corresponding to the locking claw 10 of the case body 3 are formed. I have. The circuit board 4 has a mounting hole 4a for the illumination light source 5 disposed from the back side of the circuit board 4.

The illumination light source 5 is composed of, for example, an incandescent light bulb such as a tungsten lamp, and emits an illumination light beam of the liquid crystal display element 1.

Next, the mounting structure of the liquid crystal display element 1 in the first embodiment will be described with reference to FIGS.

Since the electrode leads 2 of the liquid crystal display element 1 disposed on the mounting portion 6 of the case body 3 are homed at a predetermined angle, they are in contact with the lower end of the groove 7 of the case body 3. It is held in a state where it is done. First, when the first guide portion 1 of the boss body 9 formed on the case body 3 is disposed (engaged) in the through hole 17 of the circuit board 4, the electrode lead 2 is inserted into the insertion hole 14 of the circuit board 4. Guided "FIG. 3 (a)". In this case, the electrode lead 2 remains in contact with the lower end of the groove 7 of the case body 3. “FIG. 3 (c)”.

Next, the first guide portion 11 of the boss body 9 is inserted into the through hole 16 by the width W3 of the offset portion 13 in the vertical direction, and the case body 3 is attached to the circuit board 4 by the boss body 9
The width W4 of the offset portion 13 in the horizontal direction, the electrode lead 2
4 (a), the second guide portion 12 of the case body 3 is disposed (engaged) in the through hole 16 by sliding in the direction opposite to the direction in which FIG. In this case, the electrode lead 2 is inserted and held in the insertion hole 15 of the circuit board 4 and is shifted from a state in which it comes into contact with a lower end of the groove 7 of the case body 3 to a state in which the electrode lead 2 is separated as shown in FIG. ". Therefore, the electrode lead 2 is
The land portion 1 of the circuit board 4 is separated from the case body 3.
5 is soldered.

The distance from the upper end surface of the first guide portion 11 to the lower end surface of the second guide portion 12, that is, the offset portion 13
Is set to be equal to or greater than the thickness W5 of the circuit board 4. The size of the through hole 16 through which the boss body 9 passes depends on the width of the boss body 9 (the first and second guide portions 1).
1, 12), and the size of the locking hole 17 corresponding to the locking claw 10 is such that when the case body 3 slides based on the amount of movement set by the offset portion 13, the locking claw 10 It is formed in a size that can move within the locking hole 17. Also, the width W4 of the offset portion 13 in the horizontal direction
The (movement amount) is set to a length at which the electrode lead 2 is separated from the lower end of the groove 7 of the case body 3.

In the first embodiment described above, the electrode lead 2 is held in the case body 3 in contact with the lower end of the groove 7 formed in the case body 3, and the boss body formed in the case body 3 When the first guide portion 9 is disposed in the through hole 16 of the circuit board 4, the tip of the electrode lead 2 in the above-described state is guided to the insertion hole 14 of the circuit board 4, and the first guide is provided. By inserting the portion 11 into the through hole 16, sliding the case body 3 with respect to the circuit board 4 by the offset portion 13 of the boss body 9, and disposing the second guide portion 12 in the through hole 16, the electrode lead 2 is formed. Can be held on the circuit board 4 while being separated from the case body 3. Accordingly, the plurality of electrode leads 2 arranged in a row can be easily arranged in the insertion hole 14 of the circuit board 4 by the first guide portion 11 of the boss body 9, and the offset portion 13 and the second By providing the two guide portions 12, the electrode leads 2 can be disposed and fixed on the circuit board 4 in a state where the electrode leads 2 do not abut on the case body 3 (the electrode leads 2 are free). Even if stress distortion occurs due to a difference in thermal expansion coefficient between the electrode lead 2 and the circuit board 4, the electrode lead 2 does not fluctuate with the case body 3. Since the stress distortion at the soldered portion can be suppressed as compared with the conventional structure, the occurrence of solder cracks can be eliminated.

By forming the locking claw 10 in the case body 3 and the locking hole 17 in the circuit board 4, respectively, the state in which the electrode lead 2 is separated from the case body 3 is maintained. Can be arranged and fixed on the circuit board 4.

Next, a second embodiment will be described with reference to FIGS. 5 and 6. The same or corresponding parts as those in the first embodiment are denoted by the same reference numerals, and a detailed description thereof will be omitted.

The difference from the first embodiment is that the boss 9 of the first embodiment has a first guide portion 11 having a size substantially equal to the size of the through hole 16 of the circuit board 4. However, the difference is that a boss 19 having a first guide portion 18 smaller in diameter than the outer diameter of the through hole 16 is provided.

The mounting structure in the second embodiment will be described.
The electrode lead 2 of the liquid crystal display element 1 provided with the mounting portion 6 of the case body 3 is held in a state of being in contact with the lower end of the groove 7 of the case body 3 as in the first embodiment. First, the end (the outer periphery of the first guide portion 18) of the first guide portion 18 of the boss body 19 formed in the case body 3 on the electrode lead 2 side is aligned with the wall of the through hole 16. When the first guide portion 18 is disposed (engaged) in the through hole 16, the electrode lead 2 is guided into the insertion hole 14 of the circuit board 4 (FIG. 5A). In this case, the electrode lead 2 remains in contact with the lower end of the groove 7 of the case body 3. “FIG. 5 (b)”.

Next, the first guide portion 18 of the boss 19 is inserted through the through hole 16, and the case 3 is connected to the circuit board 4 by the lateral width W of the offset portion 20 of the boss 19.
6 (equivalent to W3), slide in the direction opposite to the direction in which the electrode leads 2 are provided, and slide the second guide portion 2 of the boss body 19.
1 is disposed (engaged) in the through hole 16 as shown in FIG.
(A) ”, the electrode lead 2 is inserted and held in the insertion hole 14 of the circuit board 4, and shifts from a state in which it comes into contact with the lower end of the groove 7 of the case body 3 to a state in which it is separated. 6 (b). " Therefore, the electrode lead 2 is
Is soldered to the land 15 of the circuit board 4 in a state of being separated from the substrate.

In the second embodiment described above, the electrode leads 2 are separated from the case body 3 and the circuit board 4
Since the electrode leads 2 can be arranged on the upper side, the electrode leads 2 arranged in a row can be easily arranged in the insertion holes 14 of the circuit board 4 and the occurrence of solder cracks can be eliminated. A mounting structure can be obtained.

Next, the first and second embodiments described above with reference to FIGS.
A description will be given of a third embodiment in which the same effects as those of the second embodiment can be obtained.

In the third embodiment, the boss 22 of the case 3 is
First and second guide portions 23 and 24 protruding from the surface of the boss body 22 by a predetermined amount, and first and second guide portions 2
Offset part 25 which connects between 3 and 24 and becomes an inclined part
7B, a notch 27 corresponding to the first and second guide portions 22 and 23 is provided in a through hole 26 formed in the circuit board 4. The vertical width (height from the lower end to the upper end of the first and second guide portions 23 and 24) W7 of the first and second guide portions 23 and 24 in the third embodiment is the thickness of the circuit board 4. Is set substantially equal to W8.

The mounting structure in the third embodiment will be described.
The electrode lead 2 is held in a state of being in contact with the lower end of the groove 7 of the case body 3 as in the first and second embodiments. First, the first guide portion 23 of the boss body 22 is disposed (engaged) so as to correspond to the cutout portion 27 of the through hole 26 of the circuit board 4.
Then, the electrode lead 2 is guided into the insertion hole 14 of the circuit board 4 (FIG. 7A). In this case, the electrode lead 2 remains in contact with the lower end of the groove 7 of the case body 3 (FIG. 7C).

Next, the boss 22 is inserted into the through hole 26 so that the first guide portion 23 corresponds to the notch 27, and the offset portion 25 of the boss 22 is aligned with the notch 27. , The horizontal width W9 of the offset portion 25
Then, the case body 3 is slid with respect to the circuit board 4 in a direction opposite to the direction in which the electrode leads 2 are provided, and the through holes are formed so that the second guide portions 24 of the boss body 22 correspond to the cutout portions 27. 26, the electrode lead 2 is inserted and held in the insertion hole 14 of the circuit board 4 and is in contact with the lower end of the groove 7 of the case body 3 (FIG. 8A). 8 (b). Therefore, the electrode lead 2 is soldered to the land 15 of the circuit board 4 while being separated from the case body 3.

Therefore, the third embodiment has the same effects as the first and second embodiments.

According to the above-described embodiments, the electrode lead 2
Is positioned in the case body 3, and the first guide portions 11, 18, 23 of the boss bodies 9, 19, 22 are disposed in the through holes 16, 26 formed in the circuit board 1, so that the circuit board 4 is inserted. Since the electrode lead 2 can be guided to the hole 14,
It is possible to improve the assembly workability in the manufacturing process. Further, by disposing the second guide portions 12, 21, and 24 provided on the bosses 9, 19, and 22 in the through holes 16 and 26, the electrode leads 2 are separated from the state in which they are in contact with the case body 3. Because it is possible to transfer
Even if stress distortion due to thermal expansion occurs, it is possible to obtain a mounting structure that can prevent cracks in a solder portion between the electrode lead 2 and the land 15 of the circuit board 4.

The boss members 9, 19, 22 have first guide portions 11, 18, 23 and second guide portions 12, 21, 22, respectively.
4 and offset parts 13 and 2 for determining the amount of movement for separating the electrode lead 2 from the groove part 7 of the holder 8.
0, 25, the case body 3 is connected to the circuit board 4.
The electrode lead 2 was easily separated from the case body 3 by simply sliding the electrode lead 2 in the direction opposite to the direction in which the electrode lead 2 was provided by the amount of movement of the offset portions 13, 20, 25 with respect to the through hole 16 of FIG. It can be mounted on the circuit board 4 in the state.

Further, by forming the locking claws 10 and the locking holes 17 on the case body 3 and the circuit board 4, respectively, the case body 3 is maintained while the electrode lead 2 is kept separated from the case body 3. It can be arranged and fixed on the circuit board 4.

In the boss body of the present invention, when the front end is engaged with the through hole of the circuit board, the electrode lead is guided into the insertion hole, and the rear end is engaged with the through hole. At this time, any shape may be used as long as the state is such that the electrode lead is moved from a state in which the electrode lead is in contact with the case body to a state in which the electrode lead is separated from the case body, and is not limited to the shape of each embodiment described above.

The partition in each of the above-described embodiments is constituted by the groove portion 7 in which the electrode leads 2 are spaced from each other on the case body 3. The electrode leads 2 may be provided in a row so as to be separated from each other, or may be constituted by insertion holes for disposing the respective electrode leads 2 in a separated manner. It is not limited.

In each of the above-described embodiments, the case 3
The locking claw 10 and the locking hole 17 are formed in the circuit board 4. For example, a pair of locking claw (first locking portion) is provided on the circuit board 4 side, and the case body 3 is formed. May be provided with a groove (second locking portion) corresponding to the locking claw.

In the case body 3 of each of the above-described embodiments, a groove 7 for disposing the electrode leads 2 apart from each other is provided.
However, the present invention according to claim 1 does not necessarily need to provide a partition portion.

[0048]

According to the present invention, the electrode lead of the liquid crystal display element can be positioned and disposed in the insertion hole of the circuit board, and the electrode lead is separated from the case body on which the liquid crystal display element is disposed. While being able to mount and improving the assembly workability in the manufacturing process,
Cracks can be prevented from occurring due to stress distortion in a soldered portion between the circuit board and the electrode leads.

[0049] Also, the said case body and said circuit board
1, by forming a second locking portion, by engaging the respective locking portion, while maintaining the state where the electrode lead is separated from the case body, the case body on the circuit board It can be arranged and fixed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a mounting structure of a liquid crystal display element according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a forming state of electrode leads in the liquid crystal display element of the present invention.

FIG. 3 is a diagram showing a mounting state of the first embodiment.

FIG. 4 is a diagram showing a mounting state of the first embodiment.

FIG. 5 is a diagram showing a mounting state of a second embodiment of the present invention.

FIG. 6 is a diagram showing a mounting state of the second embodiment.

FIG. 7 is a diagram showing a mounting state of a third embodiment of the present invention.

FIG. 8 is a diagram showing a mounting state of the third embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal display element 2 Electrode lead 3 Case body 4 Circuit board 6 Mounting part 7 Groove part (partition part) 8 Holder part 9,19,22 Boss body 10 Locking claw (1st locking part) 11,18,23 First guide part 12, 21, 24 Second guide part 13, 20, 25 Offset part (connection part) 14 Insertion hole 16, 26 Through hole 17 Locking hole (second locking part) 27 Notch

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G02F 1/1333 G02F 1/1345

Claims (4)

(57) [Claims] An electrode lead is provided on one side in a row.
The liquid crystal display element to be disposed
Is inserted into an insertion hole provided in the circuit board,
The case of the liquid crystal display device in which the case body is disposed on the circuit board
A instrumentation structure, a through hole penetrating the front and back of the circuit board, the case body
, And the first and second guide portions engaging with the through holes
And a boss having the first guide portion.
Guides the electrode lead into the insertion hole when engaged with the hole.
And the second guide portion is engaged with the through hole.
Then, from the state where the electrode lead is in contact with the case body
A liquid crystal display element mounting structure characterized in that the liquid crystal display element shifts to a separated state . 2. The mounting structure for a liquid crystal display element according to claim 1, wherein said case body includes a partition for disposing said electrode leads at a distance from each other. 3. The first guide section and the second guide section.
2. The mounting structure of a liquid crystal display element according to claim 1 , further comprising a connecting portion that connects the first and second electrode leads and determines a moving amount for separating the electrode lead from the case body. 4. The method according to claim 1, wherein the case body and the circuit board have first and
The mounting structure of a liquid crystal display device according to any one of claims 1 to 3 , wherein a second locking portion is formed and the locking portions are engaged with each other.