JP3094661U - Infrared remote control light receiving module mounted on insulating substrate - Google Patents
Infrared remote control light receiving module mounted on insulating substrateInfo
- Publication number
- JP3094661U JP3094661U JP2002008490U JP2002008490U JP3094661U JP 3094661 U JP3094661 U JP 3094661U JP 2002008490 U JP2002008490 U JP 2002008490U JP 2002008490 U JP2002008490 U JP 2002008490U JP 3094661 U JP3094661 U JP 3094661U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- receiving module
- light receiving
- remote control
- insulating circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
(57)【要約】
【課題】 リモコン受光モジュールにおいて、送信
機より送られる信号の受信確認が容易にできる構造を実
現する。
【解決手段】 絶縁回路基板１にフォトダイオード素子
３、及び信号制御用ＩＣ４を実装し、赤外線透過型樹脂
６で封止する。さらに該絶縁回路基板の同一表面上に受
光確認用発光ダイオード素子８を実装し、該発光ダイオ
ード素子の周囲を遮光性樹脂７囲い透明樹脂９で封止す
ることにより、リモコン受光モジュール単体で受信確認
ができる。
(57) [Summary] [PROBLEMS] To realize a structure in a remote control light-receiving module that enables easy confirmation of reception of a signal sent from a transmitter. SOLUTION: A photodiode element 3 and a signal control IC 4 are mounted on an insulated circuit board 1 and sealed with an infrared transmitting resin 6. Further, the light-emitting diode element 8 for confirming light reception is mounted on the same surface of the insulating circuit board, and the periphery of the light-emitting diode element is sealed with the transparent resin 9 surrounding the light-shielding resin 7 so that the remote control light-receiving module alone can confirm reception. Can be.
Description
【０００１】[0001]
【考案の属する技術分野】 本考案は、軽薄短小を追求する電子機器向けに提 供される小型の絶縁基板実装型赤外線リモコン受光モジュール（以下、受光モジ ュールと省略する）に関する。[Technical field to which the invention belongs] The present invention is applied to electronic devices in pursuit of lightness, thinness, shortness and smallness. Infrared remote control light receiving module of the small-sized insulation board mounting type (hereinafter, light receiving module And abbreviated as ").
【０００２】[0002]
【従来の技術】 軽薄短小を追求する電子小型機器に提供される受光モジュー ルの代表的な構造を図１に示す。この受光モジュールは、略直方体形状を成した 絶縁回路基板１の表面に鍍金法などにより形成された金属パターンの電極を有し ている。この電極は、絶縁回路基板１の下面から側面スルーホール電極２を通り 上面まで導通するよう形成されている。ＰＤ素子３及びＩＣ４は該電極パターン 上の上面にダイボンドにて実装され、金線などの金属細線５によりワイヤーボン ディングにて接続され、赤外線透過型樹脂６にてＰＤ素子３及びＩＣ４及び金属 細線５を覆う形で封止した構造をしている。2. Description of the Related Art A light receiving module provided for small electronic devices pursuing lightness, thinness, shortness and smallness. Figure 1 shows the typical structure of the This light receiving module has a substantially rectangular parallelepiped shape. It has an electrode of a metal pattern formed on the surface of the insulating circuit board 1 by a plating method or the like. ing. This electrode passes through the side surface through-hole electrode 2 from the lower surface of the insulating circuit board 1. It is formed so as to conduct to the upper surface. PD element 3 and IC 4 are the electrode patterns It is mounted on the upper surface by die-bonding, and a wire bond is made by a thin metal wire 5 such as a gold wire. Connected with the PD, the infrared ray transmissive resin 6 is used to connect the PD element 3, the IC 4 and the metal. The structure is such that the thin wire 5 is covered and sealed.
【０００３】[0003]
【考案が解決しようとする課題】 しかしながら、前記従来技術における構造 の受光モジュールには、次のような問題が有った。 すなわち、前記従来の受光モジュールにおいては、送信機からの受信確認をす る際、受信信号を視覚的に確認できるように外付けの別回路が必要であり、受光 モジュールを用いた製品の開発、実験及び製品化の際、外付けの別回路の費用及 び取付スペースが必要などの問題があった。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention The light receiving module of the above has the following problems. That is, in the conventional light receiving module, reception confirmation from the transmitter is performed. A separate external circuit is required to visually check the received signal when When developing, testing, and commercializing a product that uses a module, the cost of a separate external circuit There was a problem such as the need for installation space.
【０００４】 本考案は、上記課題を解決しようとするものであり、受光モジ ュールを用いた製品の低価格化及び小型化を実現できる受光モジュールを提供す ることを目的とする。The present invention is intended to solve the above-mentioned problems, and it is We provide a light receiving module that can reduce the price and size of products using tools. The porpose is to do.
【０００５】[0005]
【課題を解決するための手段】 本考案の受光モジュールは、前記課題を解決 するために、次の技術的手段を採用している。本願考案の受光モジュールは、絶 縁回路基板にＰＤ素子及び信号制御用ＩＣ、さらに送信信号の受信確認用として ＬＥＤ素子を実装することにより、外付けの回路を必要としない受光モジュール が実現できる。Means for Solving the Problems The light receiving module of the present invention solves the above problems. In order to do so, the following technical measures have been adopted. The light receiving module of the present invention is PD element and signal control IC on the edge circuit board, and for confirmation of reception of the transmitted signal Light-receiving module that does not require an external circuit by mounting an LED element Can be realized.
【０００６】[0006]
【実施例】 以下、本考案による受光モジュールの実施例を図面に基づいて説 明する。図２は信号確認用のＬＥＤ素子を実装した例である。絶縁回路基板１に は鍍金法などにより金属の電極パターンから成る電極２を形成している。絶縁回 路基板１の上面電極２ａはスルーホール２ｂにより下面電極２ｃに接続されてい る。また、絶縁回路基板１にはＰＤ素子３及びＩＣ４がダイボンディングなどに より実装され、電極パターン２ａに金線などの金属細線５によりワイヤーボンデ ィングにて接続されている。ＰＤ素子３及びＩＣ４そして金属細線５は赤外線透 過型樹脂６により機械的破損などから保護されている。さらに絶縁回路基板１上 には受信確認用ＬＥＤ素子８が実装され、電極パターン２及び金属細線５により 前記ＰＤ素子３及びＩＣ４と電気的に接続されている。またＬＥＤ素子８及び金 属細線５の周囲は、ＬＥＤ素子からの光をＰＤ素子に漏らさないため遮光型樹脂 ７で囲われている。また、ＬＥＤ素子８及び金属細線５は透明樹脂９で覆われ機 械的破損などから保護されている。Embodiment An embodiment of the light receiving module according to the present invention will be described below with reference to the drawings. Reveal FIG. 2 shows an example in which an LED element for signal confirmation is mounted. Insulated circuit board 1 Form an electrode 2 having a metal electrode pattern by a plating method or the like. Insulation times The upper surface electrode 2a of the road substrate 1 is connected to the lower surface electrode 2c by a through hole 2b. It In addition, the PD element 3 and the IC 4 are used for die bonding or the like on the insulating circuit board 1. Mounted on the electrode pattern 2a with a thin metal wire 5 such as a gold wire. It is connected by a swing. The PD element 3, the IC 4 and the thin metal wire 5 are infrared transparent. Protected from mechanical damage and the like by the overmolding resin 6. Furthermore, on the insulated circuit board 1 The LED element 8 for reception confirmation is mounted on the It is electrically connected to the PD element 3 and the IC 4. LED element 8 and gold A light-shielding resin is used around the metal wires 5 to prevent light from the LED elements from leaking to the PD elements. Surrounded by 7. Also, the LED element 8 and the thin metal wire 5 are covered with the transparent resin 9 Protected against mechanical damage.
【考案の効果】 以上説明したように本考案の受光モジュールは、絶縁回路基 板にＰＤ素子及び信号制御用ＩＣ、さらに送信信号の受信確認用としてＬＥＤ素 子を実装することにより、外付けの回路を必要としない受光モジュールが実現で き、本受光モジュールを用いた製品の低価格化、小型化が可能となる。As described above, the light receiving module of the present invention has an insulating circuit board. PD element and signal control IC on the board, and LED element for confirmation of reception of transmission signal By mounting the child, a light receiving module that does not require an external circuit can be realized. Therefore, it is possible to reduce the price and size of the product using this light receiving module.
【図１】 従来の受光モジュールを示す平面図及び断面
図FIG. 1 is a plan view and a sectional view showing a conventional light receiving module.
【図２】 本考案の一実施例を示す断面図FIG. 2 is a sectional view showing an embodiment of the present invention.
１ 絶縁回路基板 ２ 電極 ３ ＰＤ素子（フォトダイオード） ４ ＩＣ ５ 金属細線 ６ 赤外線透過型樹脂 ７ 遮光型樹脂 ８ ＬＥＤ素子（発光ダイオード） ９ 透明樹脂 1 insulated circuit board 2 electrodes 3 PD element (photodiode) 4 IC 5 thin metal wires 6 Infrared transparent resin 7 Light-shielding resin 8 LED element (light emitting diode) 9 Transparent resin
Claims (2)
回路基板と、該回路基板表面上に形成された電極パター
ンと、前記絶縁回路基板上に実装されたフォトダイオー
ド素子（以下、「ＰＤ素子」と省略する）及び信号制御
用ＩＣ（以下、「ＩＣ」と省略する）と、該電極パター
ン及び該ＰＤ素子及びＩＣを電気的に接続するための金
属細線と、前記絶縁回路基板上に実装された該ＰＤ素子
及びＩＣ及び、金属細線を封止保護するための赤外線透
過型樹脂と、前記絶縁回路基板の内部及び端部に形成さ
れたスルーホール電極とから構成された赤外線リモコン
受光モジュールにおいて、前記絶縁回路基板上に発光ダ
イオード素子（以下、「ＬＥＤ素子」と省略する）を実
装し、該ＰＤ素子又はＩＣと該ＬＥＤ素子を電極パター
ン及び金属細線により電気的に接続したことを特徴とす
る絶縁基板実装型赤外線リモコン受光モジュール。1. An insulating circuit board having a single-layer or several-layer structure, an electrode pattern formed on the surface of the circuit board, and a photodiode element mounted on the insulating circuit board (hereinafter referred to as " PD element) and a signal control IC (hereinafter abbreviated as “IC”), the electrode pattern, the thin metal wire for electrically connecting the PD element and the IC, and the insulating circuit board. An infrared remote control light receiving device including the PD element and IC mounted on In a module, a light emitting diode element (hereinafter abbreviated as “LED element”) is mounted on the insulating circuit board, and the PD element or IC and the LED element are connected by an electrode pattern and a thin metal wire. Insulation board mounting type infrared remote control light receiving module characterized by electrical connection.
回路基板において、絶縁回路基板上に実装されたＰＤ素
子及びＩＣと金属細線を保護するために赤外線透過型樹
脂で封止し、前記絶縁回路基板上に実装されたＬＥＤ素
子と金属細線を保護するために遮光型樹脂枠及び透明樹
脂で封止したことを特徴とする絶縁基板実装型赤外線リ
モコン受光モジュール。2. An insulating circuit board having a single-layer or several-layer structure, which is sealed with an infrared transmissive resin to protect the PD element and the IC mounted on the insulating circuit board and the thin metal wires, An infrared remote control light receiving module mounted on an insulating substrate, which is sealed with a light-shielding resin frame and a transparent resin to protect the LED element and the thin metal wire mounted on the insulating circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002008490U JP3094661U (en) | 2002-12-13 | 2002-12-13 | Infrared remote control light receiving module mounted on insulating substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002008490U JP3094661U (en) | 2002-12-13 | 2002-12-13 | Infrared remote control light receiving module mounted on insulating substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3094661U true JP3094661U (en) | 2003-07-04 |
Family
ID=43248625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002008490U Expired - Fee Related JP3094661U (en) | 2002-12-13 | 2002-12-13 | Infrared remote control light receiving module mounted on insulating substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3094661U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103649697A (en) * | 2012-04-23 | 2014-03-19 | 雷特龙有限公司 | Integral optical sensor package |
-
2002
- 2002-12-13 JP JP2002008490U patent/JP3094661U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103649697A (en) * | 2012-04-23 | 2014-03-19 | 雷特龙有限公司 | Integral optical sensor package |
| JP2014523140A (en) * | 2012-04-23 | 2014-09-08 | レイトロン カンパニー リミテッド | Integrated light sensor package |
| CN103649697B (en) * | 2012-04-23 | 2017-02-15 | 雷特龙有限公司 | Integral optical sensor package |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |