JP3090348B2 - Manufacturing method of tape wound insulated wire - Google Patents
Manufacturing method of tape wound insulated wireInfo
- Publication number
- JP3090348B2 JP3090348B2 JP03206055A JP20605591A JP3090348B2 JP 3090348 B2 JP3090348 B2 JP 3090348B2 JP 03206055 A JP03206055 A JP 03206055A JP 20605591 A JP20605591 A JP 20605591A JP 3090348 B2 JP3090348 B2 JP 3090348B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- insulated wire
- film
- polyamic acid
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Organic Insulating Materials (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、接着剤層を持たない高
耐熱用ポリイミドテープ巻き絶縁電線の製造方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a polyimide tape insulated wire having high heat resistance and having no adhesive layer.
【0002】[0002]
【従来の技術】従来の高耐熱用絶縁電線は、フッ素樹脂
系の接着剤などの付いたカプトン(東レ・デュポン社
製)フィルムなどの市販のポリイミドテープを心線外周
に巻き付け、焼成したり、心線をポリイミドの前駆体で
あるポリアミック酸ワニスに直接浸漬した後、加熱・乾
燥イミド化することにより製造されているが、前者は接
着剤としてフッ素樹脂などを用いることから耐熱性が充
分とはいえず、また後者はワニス中に心線を浸漬するこ
とからポリイミド層の厚みを任意にコントロールするこ
とが難しかった。2. Description of the Related Art Conventional insulated wires for high heat resistance are produced by winding a commercially available polyimide tape such as a Kapton (made by Toray DuPont) film with a fluororesin adhesive or the like around the core wire and firing it. It is manufactured by directly immersing the core wire in a polyamic acid varnish that is a precursor of polyimide, and then heating and drying and imidizing it.However, the former is not sufficient in heat resistance because it uses a fluororesin or the like as an adhesive. In the latter, it is difficult to arbitrarily control the thickness of the polyimide layer because the core is immersed in the varnish.
【0003】[0003]
【発明が解決しようとする課題】本発明の目的とすると
ころは、ポリイミドの本来持っている耐アルカリ性、耐
溶剤性、耐熱性、電気特性をそのまま生かした、接着剤
層のないポリイミドテープ巻き絶縁電線の製造方法を提
供するものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a polyimide tape wound insulation without an adhesive layer, which makes use of the inherent alkali resistance, solvent resistance, heat resistance and electric characteristics of polyimide. An object of the present invention is to provide a method for manufacturing an electric wire.
【0004】[0004]
【課題を解決するための手段】本発明は、心線外周にポ
リアミック酸テープを巻き付け加熱・乾燥イミド化する
ことを特徴とするテープ巻き絶縁電線の製造方法であ
る。SUMMARY OF THE INVENTION The present invention is a method for producing a tape-wound insulated wire, comprising winding a polyamic acid tape around the outer periphery of a core wire and heating and drying to imidize the tape.
【0005】即ち、離型フィルム上にもしくは離型ドラ
ム上にポリアミック酸溶液を塗布し、タックフリー状態
になるまで乾燥し、ポリアミック酸フィルムを形成す
る。その後このフィルムは、離型フィルムごと或はアミ
ック酸フィルムのみを所定の幅にスリットし、ポリアミ
ック酸テープとする。このテープを心線外周に巻き付け
た後、充分に加熱・乾燥させることによりイミド化を行
う。That is, a polyamic acid solution is applied on a release film or a release drum, and dried until a tack-free state is obtained, thereby forming a polyamic acid film. Thereafter, this film is slit into a predetermined width together with the release film or only the amic acid film to form a polyamic acid tape. After winding the tape around the core wire, the tape is sufficiently heated and dried to perform imidization.
【0006】本発明において、ポリアミック酸溶液を乾
燥させ、半硬化状態のポリアミック酸フィルムを形成さ
せる条件としては、フィルムがタックフリーになり作業
性に問題がなくなる状態にすればよく、80〜200℃、5〜
30分が適当である。これより温度が低く時間が短い場
合、フィルム中に残る残存溶剤量が多く、被覆厚みのバ
ラツキも大きくなり、所定の厚みにコントロールするこ
とが難しい。またこれより温度が高く時間が長い場合、
イミド化が進みすぎ、フィルムの流動性がなくなり、心
線との密着性及びフィルム同志の密着性が不充分とな
る。In the present invention, the conditions for drying the polyamic acid solution to form a semi-cured polyamic acid film may be such that the film is tack-free and there is no problem in workability. ,Five~
30 minutes is appropriate. If the temperature is lower than this, and the time is short, the amount of the residual solvent remaining in the film is large, and the variation in the coating thickness becomes large, and it is difficult to control the thickness to a predetermined value. If the temperature is higher and the time is longer,
The imidization proceeds too much, the fluidity of the film is lost, and the adhesion to the core wire and the adhesion between the films become insufficient.
【0007】本発明におけるポリアミック酸は、通常ジ
アミンと酸無水物とを反応させることにより得られる。
ジアミンとしては、フェニレンジアミン、ジアミノジフ
ェニルメタン、ジアミノジフェニルスルホン、ジアミノ
ジフェニルエーテルなどを、酸無水物としては、トリメ
リット酸無水物、ピロメリット酸二無水物、ビフェニル
テトラカルボン酸二無水物、ベンゾフェノンテトラカル
ボン酸二無水物などを使用することができ、それぞれ1
種又は2種以上を適宜組み合わせて用いることができ
る。ポリアミック酸フィルムの状態におけるイミド化率
は10〜50%、望むべくは20〜40%が好ましい。[0007] The polyamic acid in the present invention is usually obtained by reacting a diamine with an acid anhydride.
Examples of the diamine include phenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, and diaminodiphenylether.Examples of the acid anhydride include trimellitic anhydride, pyromellitic dianhydride, biphenyltetracarboxylic dianhydride, and benzophenonetetracarboxylic acid. Dianhydrides and the like can be used.
Species or a combination of two or more can be used as appropriate. The imidation ratio in the state of the polyamic acid film is preferably from 10 to 50%, and more preferably from 20 to 40%.
【0008】離型フィルムとして用いることのできる材
料としては、ポリプロピレン、ポリエステル、ポリエー
テルサルフォン、ポリイミド、ポリエチレン等のプラス
チックフィルムがあげられる。Examples of the material that can be used as the release film include plastic films such as polypropylene, polyester, polyethersulfone, polyimide, and polyethylene.
【0009】電線の心線として用いることのできる材料
としては、銅、アルミニウム、コンスタンタン、ニッケ
ル等が挙げられる。Materials that can be used as the core of the electric wire include copper, aluminum, constantan, nickel and the like.
【0010】[0010]
【作用】本発明は、ポリアミック酸フィルムの易成型性
および機械的強度を生かし、心線外周にポリアミック酸
テープを巻き付け加熱・乾燥イミド化することを特徴と
することにより、容易に、生産性・収率よく、ポリイミ
ドの本来持っている耐アルカリ性、耐溶剤性、耐熱性、
電気特性をそのまま生かした、接着剤層のないポリイミ
ドテープ巻き絶縁電線を得ることができる。According to the present invention, by utilizing the ease of molding and the mechanical strength of the polyamic acid film, a polyamic acid tape is wound around the outer periphery of the core wire and heated and dried to form an imidized film. Good yield, the inherent alkali resistance, solvent resistance, heat resistance of polyimide,
It is possible to obtain a polyimide tape wound insulated wire having no adhesive layer and utilizing the electrical characteristics as it is.
【0011】[0011]
【実施例】温度計、撹拌装置、還流コンデンサー及び乾
燥窒素ガス吹込み口を備えた4つ口セパラブルフラスコ
に、精製した無水のパラフェニレンジアミン108gと4,
4'-ジアミノジフェニルエーテル200gをとり、これに無
水のN-メチル-2-ピロリドン90重量%とトルエン10重量
%の混合溶剤を、全仕込原料中の固形分割合が20重量%
になるだけの量を加えて溶解した。乾燥窒素ガスは反応
の準備段階より生成物取り出しまでの全工程にわたり流
しておいた。次いで、精製した無水の3,3',4,4'-ビフェ
ニルテトラカルボン酸二無水物294gとピロメリット酸
二無水物218gを撹拌しながら少量ずつ添加するが、発
熱反応であるため、外部水槽に約15℃の冷水を循環させ
てこれを冷却した。添加後、内部温度を20℃に設定し、
5時間撹拌し、反応を終了してポリアミック酸溶液を得
た。EXAMPLE A 4-neck separable flask equipped with a thermometer, a stirrer, a reflux condenser and a dry nitrogen gas inlet was charged with 108 g of purified anhydrous paraphenylenediamine and 4,
Take 200 g of 4'-diaminodiphenyl ether, add a mixed solvent of 90% by weight of anhydrous N-methyl-2-pyrrolidone and 10% by weight of toluene to a solid content ratio of 20% by weight in all the raw materials.
Was added and dissolved. Dry nitrogen gas was allowed to flow throughout the entire process from the preparation of the reaction to the removal of the product. Next, 294 g of purified anhydrous 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride and 218 g of pyromellitic dianhydride are added little by little with stirring, but the reaction is exothermic. This was cooled by circulating cold water at about 15 ° C. After the addition, set the internal temperature to 20 ° C,
After stirring for 5 hours, the reaction was completed to obtain a polyamic acid solution.
【0012】市販のポリエステルフィルム上に、このポ
リアミック酸溶液をバーコーターでイミド化後の厚みが
50μmになるように塗布し、110℃、15分乾燥を行い、
離型フィルムの付いたポリアミック酸フィルムを得た。
本フィルムをスリッターを用いて離型フィルムを剥しな
がら20mm幅にスリットし、ポリアミック酸テープとし
た。このテープを心線上に3重になるように巻き付けた
後、380℃で1時間加熱乾燥・イミド化して、ポリイミ
ドテープ巻き絶縁電線を得た。得られたテープ巻き絶縁
電線の特性は、ポリイミド本来の持つ優れた耐熱性(半
田耐熱、360℃・1分)、耐薬品性を有していた。The thickness of this polyamic acid solution after imidization with a bar coater on a commercially available polyester film is
Apply to 50 μm, dry at 110 ° C for 15 minutes,
A polyamic acid film with a release film was obtained.
This film was slit to a width of 20 mm while peeling off the release film using a slitter to obtain a polyamic acid tape. After winding this tape three times on the core wire, it was heated and dried at 380 ° C. for 1 hour and imidized to obtain a polyimide tape wound insulated wire. The properties of the obtained tape wound insulated wire were excellent heat resistance (solder heat resistance, 360 ° C., 1 minute) and chemical resistance inherent to polyimide.
【0013】[0013]
【発明の効果】本発明によれば、接着剤層を持たないポ
リイミド層のみからなるテープ巻き絶縁電線を得ること
ができ、さらに、通常のテープ巻き絶縁電線の製造装置
をそのまま用いた連続工程にも容易に適用できるなど、
工業的なテープ巻き絶縁電線の製造方法として好適なも
のである。According to the present invention, it is possible to obtain a tape-wound insulated wire consisting only of a polyimide layer having no adhesive layer, and further to a continuous process using a normal tape-wound insulated wire manufacturing apparatus as it is. Can also be easily applied,
It is suitable as an industrial method of manufacturing a tape wound insulated wire.
Claims (1)
付け加熱・乾燥イミド化することを特徴とするテープ巻
き絶縁電線の製造方法。1. A method for producing a tape-wound insulated wire, comprising winding a polyamic acid tape around the core wire and heating and drying to imidize the tape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03206055A JP3090348B2 (en) | 1991-08-17 | 1991-08-17 | Manufacturing method of tape wound insulated wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03206055A JP3090348B2 (en) | 1991-08-17 | 1991-08-17 | Manufacturing method of tape wound insulated wire |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0547246A JPH0547246A (en) | 1993-02-26 |
JP3090348B2 true JP3090348B2 (en) | 2000-09-18 |
Family
ID=16517120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP03206055A Expired - Fee Related JP3090348B2 (en) | 1991-08-17 | 1991-08-17 | Manufacturing method of tape wound insulated wire |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3090348B2 (en) |
-
1991
- 1991-08-17 JP JP03206055A patent/JP3090348B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0547246A (en) | 1993-02-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |