JP3090139U - Heat dissipator - Google Patents

Abstract

(57) [Problem] To provide a heat dissipator capable of instantaneously radiating high heat generated when a highly efficient CPU operates. SOLUTION: A base (10), a radiator tube (11),
A heat dissipator comprising a lid (12) and a base (10)
Is installed on the upper surface of the CPU (30), and a through hole (101) is formed at a position corresponding to the lower CPU (30) in the center thereof, and the radiating pipe (11) has an appropriate amount of working fluid inside. The hollow body to be injected is in a vacuum state, and the bottom is installed in a through hole (101) in the upper surface of the base (10), and the lid (12) is sealed at the upper end.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a heat dissipator used for a high-efficiency central processing unit (CPU) and the like, and more particularly to a heat dissipator capable of instantaneously radiating heat generated when a CPU is operated.

[0002]

[Prior art]

 With the development of electronic technology such as semiconductors, a technology for providing an electronic circuit on an integrated circuit having a limited volume has been developed. For example, integrated circuits such as SOC (System on a chip) and SOAC (System on a application chip) have been developed. This is an example. By providing all the systems in one circuit, not only these integrated circuits can achieve multi-functions but also reduce the distance between wirings, so that signal transfer can be performed at high speed. Therefore, such integrated circuits are typically used in central processing units having frequencies above GHz.

[0003] Although the integrated circuit can achieve an increase in the speed of arithmetic processing, energy consumption is relatively high due to the high degree of integration of the circuit, and especially during operation, energy consumption is severe, and high heat is generated. , Temperature limits. Therefore, an excellent heat treatment effect can be achieved by using a suitable heat dissipator to operate the CPU in a normal state against the high heat normally generated during the operation of the CPU.

[0004]

[Problems to be solved by the invention]

 However, the frequency of the latest CPU has already reached GHz or more. For example, the temperature of heat generated when the Pentium (registered trademark) 4 CPU released from Intel (registered trademark) operates is much higher than that of the conventional CPU. high. Therefore, conventional heat dissipators do not have sufficient heat dissipation efficiency, and it is necessary to develop heat dissipators with higher heat dissipation efficiency.

[0005]

Means for Solving the Problems The present invention is a heat dissipator including a base (10), a radiator tube (11), and a lid (12), and the base (10) is an upper surface of the CPU (30). In addition, a through hole (101) is formed at a position corresponding to the lower CPU (30) in the center thereof, and the radiator tube (11) is a hollow in a vacuum state into which an appropriate amount of working fluid is injected. A heat dissipator, characterized in that the heat dissipator is characterized in that its bottom is installed in a through-hole (101) in the upper surface of the base (10), and a lid (12) is sealed at the top.

[0006]

[Action]

 The present invention solves the above-mentioned problem, and the base of the base is installed so as to correspond to the upper end surface of the CPU, and the radiating pipe is installed so as to abut the CPU, so that the CPU operates when the CPU operates. Since the generated heat is radiated by the heat radiating tube, the operating temperature of the CPU can be normally maintained. Further, a plurality of heat radiating fins are provided on the outer peripheral edge of the heat radiating tube, and a fan is combined with the heat fin. By improving the heat radiation efficiency of the heat radiation fins and lowering the temperature of the CPU, it is possible to prevent a decrease in the operation efficiency of the CPU due to a high temperature.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is an exploded perspective view of a first embodiment of the heat dissipator according to the present invention, and FIG. 2 is a perspective view of the first embodiment of the heat dissipator according to the present invention after assembly. FIG. 3 is a perspective view showing a state in which a fan is combined with the first embodiment of the heat dissipator according to the present invention, and FIG. 4 is a perspective view of a second embodiment of the heat dissipator according to the present invention. FIG. 5 is a side sectional view of a second embodiment of the heat dissipator according to the present invention, and FIG. 6 is a perspective view showing a state where a fan is combined with the second embodiment of the heat dissipator according to the present invention. is there.

[0009]

[Preferred Embodiment of Invention]

 The present invention is a heat dissipator capable of achieving excellent heat dissipation efficiency in a short time. As shown in FIG. 1, the first embodiment of the present invention comprises a base (10), a hollow heat dissipation pipe (11), a lid, The base (10) has a plate shape and is provided on the upper surface of the central processing unit (unsigned), and has a circular shape at the center thereof at a position corresponding to the lower central processing unit. Is formed.

As shown in FIG. 5, the hollow heat radiating pipe (11) is filled with an appropriate amount of working fluid (for example, a heat radiating agent), and the remaining space is evacuated to provide heat transfer. Accelerate speed. Further, the heat radiating tube (11) is installed in the through hole (101) in the base (10), and a capillary structure surface (110) is formed on an inner wall to increase a heat radiating area.

As shown in FIG. 2, when assembling the heat dissipator, the hollow heat radiating pipe (11) is fitted into the through hole (101) of the base (10) and the working fluid is inserted therein. After the injection, the upper opening of the heat radiating pipe (11) is sealed with a lid (12), and the heat radiator (11) is completed in a hermetically closed hollow heat radiating pipe (11).

Further, as shown in FIG. 3, by combining a fan (20) with one side of the base (10) of the present invention, the temperature of the hollow radiating pipe (11) may be reduced more efficiently. .

As shown in FIG. 4, most of the structure of the second embodiment of the present invention is the same as that of the first embodiment. The only difference is that a plurality of heat-radiating fins (13) are superimposed, and a through hole (131) for accommodating the hollow heat-radiating tube (11) is formed at an appropriate position of each of the heat-radiating fins (13). At the same time, a gap for heat exchange is formed between the adjacent radiation fins (13).

As shown in FIG. 5, the bottom of the hollow radiating pipe (11) is provided so as to correspond to the CPU (30) provided thereunder. When the high heat of the part is transferred to the hollow radiating tube (11) and heat is input, the working fluid inside evaporates and the steam moves to the low temperature part, and is condensed in the low temperature part, and the heat is radiated from the tube wall. Is done.

Further, in the embodiment of FIG. 6, a fan (20) can be used in combination on the base (10) at a position corresponding to the radiation fin (13). ) Are installed on one side of the base (10) so as to correspond to the gaps (132) between the respective radiating fins (13), and when the fan (20) is operated, the gap (1) between the radiating fins (13) is set. High heat of the radiation fins (13) is removed by the flow of air through 132). Therefore, the present invention can not only absorb the high heat of the heat radiating pipe (11) by installing the heat radiating fin (13), but also perform the heat radiation more quickly by combining the fan (20). .

[0016]

[Effect of the invention]

 The present invention has the above-described structure, and is generated when the CPU is operated by the base of the base being installed so as to correspond to the upper surface of the CPU and the radiating pipe being installed so as to be in contact with the CPU. Since high heat can be directly absorbed by the radiator tube, the normal operating temperature of the CPU can be maintained. Further, a plurality of radiating fins are provided on the outer peripheral edge of the radiating tube, and by combining a fin with the radiating fins, the radiating efficiency of the radiating fins can be further improved. Therefore, since the temperature of the CPU can be reduced, a decrease in the operation efficiency of the CPU due to a high temperature can be reliably prevented.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a first embodiment of a heat dissipator according to the present invention.

FIG. 2 is a perspective view of the first embodiment of the heat dissipator according to the present invention after assembly.

FIG. 3 is a perspective view showing a state in which a fan is combined with the first embodiment of the heat dissipation device according to the present invention;

FIG. 4 is a perspective view of a second embodiment of the heat dissipator according to the present invention.

FIG. 5 is a side sectional view of a second embodiment of the heat dissipator according to the present invention.

FIG. 6 is a perspective view showing a second embodiment of the heat dissipator according to the present invention in which a fan is combined.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 base 101 through hole 11 radiating tube 110 capillary structure surface 12 lid 13 radiating fin 131 through hole 132 gap 20 fan 30 CPU

Claims (3)

[Utility model registration claims] 1. A heat dissipator comprising a base (10), a radiator tube (11), and a lid (12). The base (10) is installed on the upper surface of the CPU (30) and has a central portion. , A through hole (101) is formed at a position corresponding to the lower CPU (30).
1) is a hollow body in a vacuum state into which an appropriate amount of working fluid is injected, the bottom of which is installed in a through hole (101) in the upper surface of a base (10), and a lid (12) at the upper end.
A heat dissipator, characterized by being sealed. 2. A plurality of radiating fins (13) are superimposed on the outer peripheral edge of the hollow radiating tube (11), and a gap for heat exchange is formed between each of the radiating fins (13). The heat dissipator according to claim 1, wherein a capillary structure surface (110) is formed on an inner wall of the (11). 3. A fan (20) is installed on one side of the base (10), and the radiating fins (13) have a U-shaped cross section, and a through hole (131) is provided at an appropriate position of each of the radiating fins (13). Is formed.
2. The heat dissipator according to 1.